JP2019512158A - 真空システムで使用するためのキャリア、真空処理のためのシステム、及び基板の真空処理のための方法 - Google Patents
真空システムで使用するためのキャリア、真空処理のためのシステム、及び基板の真空処理のための方法 Download PDFInfo
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- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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Abstract
Description
Claims (27)
- 真空システム内で使用するためのキャリアであって、
一又は複数の電子デバイスを収容し、前記真空システム内でのキャリア使用中に気体環境を封じ込めるように構成されたハウジングを含み、
前記キャリアは真空処理中に使用される基板及びマスクのうちの少なくとも1つを保持するように構成されている、キャリア。 - 前記ハウジングは開口と前記開口を基本的に真空気密に密閉するように構成された閉鎖要素とを含む、請求項1に記載のキャリア。
- 前記ハウジングを密閉するため、前記閉鎖要素を締結するように構成された締結構成部を更に含む、請求項2に記載のキャリア。
- 前記一又は複数の電子デバイスは、前記キャリアの動きを制御するための第1の制御デバイス、前記キャリアの一又は複数の操作パラメータを制御するための第2の制御デバイス、位置合わせ制御デバイス、無線送信デバイス、圧力センサ、及び電源からなる群から選択される、請求項1から3のいずれか一項に記載のキャリア。
- 前記圧力センサは、前記ハウジング内部の気体圧力を測定するように構成されている、請求項4に記載のキャリア。
- 前記キャリアは、前記真空システム内での非接触浮上及び非接触搬送のうちの少なくとも1つのために構成される、請求項1から5のいずれか一項に記載のキャリア。
- 前記キャリアを浮上させる磁気浮上力を提供するために前記真空システムのガイド構造体と磁気的に相互作用するように構成された第1の磁気ユニットを更に含む、請求項1から6のいずれか一項に記載のキャリア。
- 前記キャリアを搬送方向に動かすための前記真空システムの駆動構造体と磁気的に相互作用するように構成された第2の磁気ユニットを更に含む、請求項1から7のいずれか一項に記載のキャリア。
- 前記基板及び前記マスクのうちの少なくとも1つに作用する引力を提供するように構成された電極構成部を更に含む、請求項1から8のいずれか一項に記載のキャリア。
- 前記ハウジングは前記電極構成部に隣接して提供される、請求項9に記載のキャリア。
- 真空システム内で使用するためのキャリアであって、
マスク又は基板を載せるための受容面と、一又は複数の電子デバイスを内部に収容するための密閉可能な凹部とを有する支持構造体を備える、キャリア。 - 前記密閉可能な凹部は、開口と前記開口を密閉するように構成された閉鎖要素を含む、請求項11に記載のキャリア。
- 前記密閉可能な凹部を密閉するため、前記閉鎖要素を締結するように構成された締結構成部を更に備える、請求項12に記載のキャリア。
- 前記一又は複数の電子デバイスは、前記キャリアの動きを制御するための第1の制御デバイス、前記キャリアの一又は複数の操作パラメータを制御するための第2の制御デバイス、位置合わせ制御デバイス、無線送信デバイス、圧力センサ、及び電源からなる群から選択される、請求項11から13のいずれか一項に記載のキャリア。
- 前記圧力センサは、前記密閉可能な凹部内部の気体圧力を測定するように構成される、請求項14に記載のキャリア。
- 前記キャリアは、真空システム内での非接触浮上及び非接触搬送のうちの少なくとも1つのために構成される、請求項11から15のいずれか一項に記載のキャリア。
- 前記キャリアを浮上させる力を提供するため、磁気浮上の第1の磁気ユニットと搬送システムを更に含む、請求項11から16のいずれか一項に記載のキャリア。
- 前記キャリアを搬送する力を提供するため、磁気浮上の第2の磁気ユニットと搬送システムを更に含む、請求項11から17のいずれか一項に記載のキャリア。
- 前記基板/マスクの受容面は、前記基板及び前記マスクのうちの少なくとも1つに作用する引力を提供するように構成された電極構成部を備える、請求項11から18のいずれか一項に記載のキャリア。
- 前記密閉可能な凹部は、前記電極構成部に隣接して提供される、請求項19に記載のキャリア。
- 真空処理のためのシステムであって、
真空チャンバと、
請求項1から20のいずれか一項に記載のキャリアと、
前記真空チャンバ内で前記キャリアを搬送するように構成された搬送構成部と
を備えるシステム。 - 前記搬送構成部は、前記真空チャンバ内での前記キャリアの非接触浮上及び前記キャリアの非接触搬送のうちの少なくとも1つに対して構成されている、請求項21に記載のシステム。
- 基板を真空処理するための方法であって、
前記基板及びマスクのうちの少なくとも1つを真空チャンバ内のキャリア上に支持することであって、前記キャリアは一又は複数の電子デバイスを収容するハウジングを含む、支持することと、
前記真空チャンバ内での前記基板の前記真空処理中に、前記ハウジング内部に気体環境を封じ込めることと
を含む方法。 - 前記一又は複数の電子デバイスのうちの少なくとも1つの電子デバイスを使用して、前記ハウジング内部の気体圧力を測定することと、
前記気体圧力を前記キャリアから遠く離れているモニタリングデバイスに無線送信することと
を更に含む、請求項13に記載の方法。 - 基板を真空処理するための方法であって、
前記基板及びマスクのうちの少なくとも1つを真空チャンバ内のキャリア上に支持することであって、前記キャリアは一又は複数の電子デバイスを収容する密閉可能な凹部を含む、支持することと、
前記真空チャンバ内での前記基板の前記真空処理中に、前記密閉可能な凹部内部に気体環境を維持することと
を含む方法。 - 前記一又は複数の電子デバイスのうちの少なくとも1つの電子デバイスを使用して、前記密封可能な凹部内部の気体圧力を測定することと、
前記気体圧力を前記キャリアから遠く離れたモニタリングデバイスに無線送信することと
を更に含む、請求項25に記載の方法。 - 前記真空チャンバ内で前記基板を非接触で保持することを更に含む、請求項23又は26に記載の方法。
Applications Claiming Priority (1)
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PCT/EP2017/054354 WO2018153479A1 (en) | 2017-02-24 | 2017-02-24 | Carrier for use in a vacuum system, system for vacuum processing, and method for vacuum processing of a substrate |
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JP2019512158A true JP2019512158A (ja) | 2019-05-09 |
JP6591657B2 JP6591657B2 (ja) | 2019-10-16 |
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JP2018502642A Active JP6591657B2 (ja) | 2017-02-24 | 2017-02-24 | 真空システムで使用するためのキャリア、真空処理のためのシステム、及び基板の真空処理のための方法 |
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US (1) | US20190378742A1 (ja) |
JP (1) | JP6591657B2 (ja) |
KR (1) | KR102123482B1 (ja) |
CN (1) | CN108738365B (ja) |
TW (1) | TWI670789B (ja) |
WO (1) | WO2018153479A1 (ja) |
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KR102389184B1 (ko) | 2018-09-13 | 2022-04-20 | 주식회사 엘지에너지솔루션 | 배터리 모듈, 이러한 배터리 모듈을 포함하는 배터리 팩 및 이러한 배터리 팩을 포함하는 자동차 |
KR102257008B1 (ko) * | 2019-01-11 | 2021-05-26 | 캐논 톡키 가부시키가이샤 | 성막 장치, 성막 방법 및 전자 디바이스 제조방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013016491A (ja) * | 2011-07-04 | 2013-01-24 | Samsung Display Co Ltd | 有機層蒸着装置及びこれを用いる有機発光表示装置の製造方法 |
JP2013163837A (ja) * | 2012-02-09 | 2013-08-22 | Canon Tokki Corp | 蒸着装置並びに蒸着装置を用いた成膜方法 |
KR20150002120A (ko) * | 2013-06-28 | 2015-01-07 | 엘지디스플레이 주식회사 | 정전척 시스템 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4624617A (en) * | 1984-10-09 | 1986-11-25 | David Belna | Linear induction semiconductor wafer transportation apparatus |
DE19882026D2 (de) * | 1997-12-23 | 2000-11-30 | Balzers Hochvakuum | Vakuumbehandlungsanlage |
TW466576B (en) * | 1999-06-15 | 2001-12-01 | Ebara Corp | Substrate processing apparatus |
JP4381909B2 (ja) * | 2004-07-06 | 2009-12-09 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
KR101622415B1 (ko) * | 2008-03-13 | 2016-05-18 | 가부시키가이샤 니콘 | 기판홀더, 기판홀더 유니트, 기판반송장치 및 기판접합장치 |
JP4815538B2 (ja) * | 2010-01-15 | 2011-11-16 | シーケーディ株式会社 | 真空制御システムおよび真空制御方法 |
US20120227886A1 (en) * | 2011-03-10 | 2012-09-13 | Taipei Semiconductor Manufacturing Company, Ltd. | Substrate Assembly Carrier Using Electrostatic Force |
KR101909988B1 (ko) * | 2012-05-09 | 2018-10-22 | 세메스 주식회사 | 집적회로 소자의 제조 장치 |
KR102096049B1 (ko) * | 2013-05-03 | 2020-04-02 | 삼성디스플레이 주식회사 | 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치 |
EP3102715A1 (en) * | 2014-02-04 | 2016-12-14 | Applied Materials, Inc. | Evaporation source for organic material, apparatus having an evaporation source for organic material, system having an evaporation deposition apparatus with an evaporation source for organic materials, and method for operating an evaporation source for organic material |
JP2017515301A (ja) * | 2014-05-09 | 2017-06-08 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 保護カバーを有する基板キャリアシステム |
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2017
- 2017-02-24 CN CN201780011253.0A patent/CN108738365B/zh active Active
- 2017-02-24 KR KR1020187004302A patent/KR102123482B1/ko active IP Right Grant
- 2017-02-24 WO PCT/EP2017/054354 patent/WO2018153479A1/en active Application Filing
- 2017-02-24 US US15/744,021 patent/US20190378742A1/en not_active Abandoned
- 2017-02-24 JP JP2018502642A patent/JP6591657B2/ja active Active
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- 2018-02-23 TW TW107106124A patent/TWI670789B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013016491A (ja) * | 2011-07-04 | 2013-01-24 | Samsung Display Co Ltd | 有機層蒸着装置及びこれを用いる有機発光表示装置の製造方法 |
JP2013163837A (ja) * | 2012-02-09 | 2013-08-22 | Canon Tokki Corp | 蒸着装置並びに蒸着装置を用いた成膜方法 |
KR20150002120A (ko) * | 2013-06-28 | 2015-01-07 | 엘지디스플레이 주식회사 | 정전척 시스템 |
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KR20180109835A (ko) | 2018-10-08 |
US20190378742A1 (en) | 2019-12-12 |
WO2018153479A1 (en) | 2018-08-30 |
JP6591657B2 (ja) | 2019-10-16 |
CN108738365B (zh) | 2022-03-01 |
TWI670789B (zh) | 2019-09-01 |
KR102123482B1 (ko) | 2020-06-16 |
TW201842611A (zh) | 2018-12-01 |
CN108738365A (zh) | 2018-11-02 |
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