TW201839886A - 用於基板之真空處理的設備、用於製造具有有機材料之裝置的系統、用於使處理真空腔室和維護真空腔室相互密封的方法 - Google Patents

用於基板之真空處理的設備、用於製造具有有機材料之裝置的系統、用於使處理真空腔室和維護真空腔室相互密封的方法 Download PDF

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Publication number
TW201839886A
TW201839886A TW107109172A TW107109172A TW201839886A TW 201839886 A TW201839886 A TW 201839886A TW 107109172 A TW107109172 A TW 107109172A TW 107109172 A TW107109172 A TW 107109172A TW 201839886 A TW201839886 A TW 201839886A
Authority
TW
Taiwan
Prior art keywords
vacuum chamber
processing
magnetic
opening
maintenance
Prior art date
Application number
TW107109172A
Other languages
English (en)
Chinese (zh)
Inventor
賽巴斯欽甘特 薩恩
安提瑞爾斯 索爾
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201839886A publication Critical patent/TW201839886A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW107109172A 2017-03-17 2018-03-16 用於基板之真空處理的設備、用於製造具有有機材料之裝置的系統、用於使處理真空腔室和維護真空腔室相互密封的方法 TW201839886A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP2017/056372 WO2018166618A1 (en) 2017-03-17 2017-03-17 Apparatus for vacuum processing of a substrate, system for the manufacture of devices having organic materials, and method for sealing a processing vacuum chamber and a maintenance vacuum chamber from each other
??PCT/EP2017/056372 2017-03-17

Publications (1)

Publication Number Publication Date
TW201839886A true TW201839886A (zh) 2018-11-01

Family

ID=58347393

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107109172A TW201839886A (zh) 2017-03-17 2018-03-16 用於基板之真空處理的設備、用於製造具有有機材料之裝置的系統、用於使處理真空腔室和維護真空腔室相互密封的方法

Country Status (6)

Country Link
US (1) US20200240008A1 (https=)
JP (1) JP2019512045A (https=)
KR (1) KR102069665B1 (https=)
CN (1) CN109072412A (https=)
TW (1) TW201839886A (https=)
WO (1) WO2018166618A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI860318B (zh) * 2019-01-04 2024-11-01 美商蘭姆研究公司 分離腔室組件

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110016647B (zh) * 2019-05-29 2020-09-08 昆山国显光电有限公司 蒸镀源清洁设备及蒸镀系统
CN111676454B (zh) * 2020-08-04 2023-09-05 光驰科技(上海)有限公司 一种节省真空镀膜室内空间的蒸发源配置结构及其设计方法
US20220112594A1 (en) * 2020-10-14 2022-04-14 Applied Materials, Inc. Device for sealing a vacuum chamber, vacuum processing system, and method of monitoring a load lock seal

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201107639A (en) * 2007-04-27 2011-03-01 Edwards Japan Ltd Plate rotating device, exhaust path opening degree changing device, exhausted device, transfer device, beam device, and gate valve
WO2009118888A1 (ja) * 2008-03-28 2009-10-01 キヤノンアネルバ株式会社 真空処理装置、当該真空処理装置を用いた画像表示装置の製造方法及び当該真空処理装置により製造される電子装置
JP6328766B2 (ja) * 2013-12-10 2018-05-23 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 有機材料用の蒸発源、真空チャンバの中で有機材料を堆積させるための堆積装置、及び有機材料を蒸発させるための方法
DE102014008170A1 (de) * 2014-06-10 2015-12-17 Mecatronix Ag Verschluss- oder Schleusenvorrichtung für eine Vakuumkammer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI860318B (zh) * 2019-01-04 2024-11-01 美商蘭姆研究公司 分離腔室組件

Also Published As

Publication number Publication date
CN109072412A (zh) 2018-12-21
JP2019512045A (ja) 2019-05-09
WO2018166618A1 (en) 2018-09-20
KR20180116219A (ko) 2018-10-24
KR102069665B1 (ko) 2020-01-23
US20200240008A1 (en) 2020-07-30

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