JP2019504431A - チップカードモジュール及びチップカードを製造するための方法 - Google Patents
チップカードモジュール及びチップカードを製造するための方法 Download PDFInfo
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
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- G—PHYSICS
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- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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Abstract
Description
第1の主面及び第2の主面を有する基板が、基板の第1の主面上に、接触カードリーダーデバイスと一時的な電気的接続を形成するための接点を有して備えられ、
電子チップが基板に取り付けられ、
少なくとも1つのワイヤーの第1の端部が、チップの接続パッドに直接接続され(「直接」とは、ワイヤーの第1の端部とチップの接続パッドとの間にその他の導体、中間導体または接続ランドが存在しないことを意味する)、
チップ及びワイヤーの第1の端部が樹脂内に封止されるが、ワイヤーの第2の端部が、樹脂の外側に残される、方法によって少なくとも部分的に達成される。
キャリア上にアンテナを製造する段階であって、このアンテナが、それぞれ接続ランドを有して備えられた2つの端部を含む、アンテナを製造する段階と、
モジュールを収容し、アンテナの接続ランドを露出することを意図された、キャリアを少なくとも部分的に覆うカードの少なくとも1つの層内にキャビティを製造する段階と、
少なくとも1つのワイヤーの第1の端部を、チップの接続パッドに直接接続する段階と、
将来的にキャビティ内にモジュールが挿入された後に、このワイヤーの部分をアンテナの接続ランドに直接接続される段階と、を含む。
基板に固定された電子チップと、
チップの接続パッドに、第1の端部によって接続された少なくとも1つのワイヤーと、を含み、
チップ及びワイヤーの第1の端部が、樹脂内に封入される。
2 モジュール
3 下面層
4 アンテナキャリア
5 上面層
6 アンテナ
7 接続ランド7
8 開口部
9 上部層
10 はんだパッド
11 キャビティ
12 金属接点
13 フレキシブル基板
14 第1の主面
15 第2の主面
16 接続ウェル
17 チップ
18 導電性ワイヤー18
19 移設パッド
20 ホットメルト材料
21 開口部
22 窓
23 ワイヤー18の部分
24 縁
25 樹脂
Claims (14)
- チップカード(1)のモジュール(2)を製造するための方法であって、
第1の主面(14)及び第2の主面(15)を有する基板(13)が、前記基板(13)の前記第1の主面(14)上に、接触カードリーダーデバイスと一時的な電気的接続を形成するための接点(12)を有して備えられ、
電子チップ(17)が前記基板(13)に取り付けられ、
少なくとも1つのワイヤー(18)の第1の端部が、前記チップ(17)の接続パッドに直接接続され、前記チップ(17)及び前記ワイヤー(18)の第1の端部が樹脂(25)内に封止され、
前記ワイヤー(18)の第2の端部が、前記樹脂(25)の外側に残されることを特徴とする、方法。 - 前記ワイヤー(18)の前記第2の端部が、前記基板(13)を通して予め形成された接続ウェル(16)を通して移設パッド(19)に固定される段階を含む、請求項1に記載の方法。
- ワイヤー(18)の前記第1の端部に接続されたチップ(17)の周りに切断がなされ、前記切断がモジュール(2)の境界を定め、分離された前記モジュール(2)の最終的な寸法を画定し、内部に前記ワイヤー(18)の前記第2の端部が固定された前記接続ウェル(16)が、切断後に前記モジュール(2)の外側に配置される、請求項2に記載の方法。
- 前記ワイヤー(18)の1つの部分(23)がアクセス可能となり、別の部分が前記基板(13)とホットメルト材料(20)との間に保持されるように、ホットメルト材料(20)が前記基板(13)の第2の主面(15)に適用される段階を含む、請求項1から3のいずれか一項に記載の方法。
- 内側に窓(23)が形成されたホットメルト材料(20)が、前記ワイヤー(18)を前記窓(23)を通してアクセス可能にしたままの状態で、前記基板(13)の前記第2の主面(15)に適用される、請求項4に記載の方法。
- 前記モジュール(2)が最終的な寸法に従ってダイシングすることによって分離され、アクセス可能な状態にされた前記ワイヤー(18)の前記部分(23)が、分離された前記モジュール(2)の上に配置される段階を含む、請求項4または5に記載の方法。
- チップカード(1)を製造するための方法であって、
第1の主面(14)及び第2の主面(15)を有する基板(13)を含むモジュール(2)を製造する段階であって、前記基板(13)の前記第1の主面(14)に、接触カードリーダーデバイスと一時的な電気的接続を形成するための接点(12)を有し、前記基板(13)に取り付けられた電子チップ(17)を含む、モジュール(2)を製造する段階と、
キャリア(4)上にアンテナ(6)を製造する段階であって、前記アンテナ(6)が、それぞれ接続ランド(7)を有して備えられた2つの端部を含む、アンテナ(6)を製造する段階と、
前記モジュール(2)を収容し、前記アンテナ(6)の前記接続ランド(7)を露出するように、前記キャリア(4)を少なくとも部分的に覆う前記カード(1)の少なくとも1つの層(5)内にキャビティ(11)を製造する段階と、
少なくとも1つのワイヤー(18)の第1の端部を、前記チップ(17)の接続パッドに直接接続する段階と、を含み、
前記ワイヤー(18)の1つの部分(23)が、前記アンテナ(6)の接続ランド(7)に直接接続されることを特徴とする、チップカード(1)を製造するための方法。 - 前記ワイヤー(18)の前記第1の端部が、封入樹脂(25)内に封入される、請求項7に記載の方法。
- 前記封入樹脂(25)の外側に、ホットメルト材料(20)を用いて前記基板(13)上に少なくとも部分的に、前記ワイヤー(18)の1つの部分(23)が保持される、請求項8に記載の方法。
- 前記チップ(17)に接続されたワイヤー(18)の1つの部分(23)が、サーモードを、前記基板(13)の前記第1の主面(14)上に配置された接点(12)に取り付けることによって、前記アンテナ(6)の接続ランド(7)にはんだ付けされる、請求項7から9のいずれか一項に記載の方法。
- 第1の主面(14)及び第2の主面(15)を有する基板(13)であって、前記基板(13)の前記第1の主面(14)上に、接触カードリーダーデバイスと一時的な電気的接続を形成するための接点(12)を有する、基板(13)と、
前記基板(13)に固定された電子チップ(17)と、
前記チップ(17)の接続パッドに、第1の端部によって接続された少なくとも1つのワイヤー(18)と、を含み、
前記チップ(17)及び前記ワイヤー(18)の前記第1の端部が、樹脂(25)内に封入され、
前記ワイヤー(18)の1つの部分(23)が前記樹脂(25)の外に延在することを特徴とする、チップカードモジュール。 - 前記基板(13)の前記第2の主面(15)に適用されたホットメルト材料(20)の層を含み、前記ワイヤー(18)の少なくとも1つの部分(23)を、前記ホットメルト材料(20)によって覆われていない状態のままにする、請求項11に記載のモジュール。
- チップ(17)を有するモジュール(2)と、アンテナ(6)と、を含み、前記チップ(17)の接続パッドに直接接続された第1の端部と、前記アンテナ(6)の接続ランド(7)に直接接続された部分(23)とを有する少なくとも1つのワイヤー(18)を含むことを特徴とする、チップカード。
- 前記ワイヤー(18)の前記第1の端部が、前記チップ(17)とともに、樹脂(25)内に封入され、前記封入樹脂(25)の外側の部分(23)が、ホットメルトシート(20)内に形成された開口部(22)を通して、前記アンテナ(6)の接続ランド(7)にはんだ付けされた、請求項13に記載のチップカード。
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Application Number | Priority Date | Filing Date | Title |
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FR1650587 | 2016-01-26 | ||
FR1650587A FR3047101B1 (fr) | 2016-01-26 | 2016-01-26 | Procede de fabrication d’un module de carte a puce et d’une carte a puce |
PCT/FR2017/050172 WO2017129904A1 (fr) | 2016-01-26 | 2017-01-25 | Procédé de fabrication d'un module de carte à puce et d'une carte à puce |
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JP2019504431A true JP2019504431A (ja) | 2019-02-14 |
JP6901207B2 JP6901207B2 (ja) | 2021-07-14 |
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EP (1) | EP3408799B1 (ja) |
JP (1) | JP6901207B2 (ja) |
CN (1) | CN108496187B (ja) |
BR (1) | BR112018014282A2 (ja) |
CL (1) | CL2018002017A1 (ja) |
ES (1) | ES2817578T3 (ja) |
FR (1) | FR3047101B1 (ja) |
MX (1) | MX2018009123A (ja) |
MY (1) | MY197068A (ja) |
SG (2) | SG11201806384RA (ja) |
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FR3063555B1 (fr) * | 2017-03-03 | 2021-07-09 | Linxens Holding | Carte a puce et procede de fabrication d’une carte a puce |
WO2019138260A1 (en) * | 2018-01-12 | 2019-07-18 | Linxens Holding | Method for manufacturing a sim card and sim card |
FR3086098B1 (fr) * | 2018-09-18 | 2020-12-04 | Smart Packaging Solutions | Procede de fabrication d'un module electronique pour objet portatif |
CN111626395A (zh) * | 2020-05-29 | 2020-09-04 | 东信和平科技股份有限公司 | 一种双界面安全芯片卡及制作方法 |
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2016
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- 2017-01-25 US US16/070,814 patent/US10706346B2/en active Active
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- 2017-01-25 BR BR112018014282-4A patent/BR112018014282A2/pt not_active Application Discontinuation
- 2017-01-25 EP EP17707369.9A patent/EP3408799B1/fr active Active
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Also Published As
Publication number | Publication date |
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SG11201806384RA (en) | 2018-08-30 |
CN108496187B (zh) | 2021-12-28 |
US20190026621A1 (en) | 2019-01-24 |
MY197068A (en) | 2023-05-24 |
ES2817578T3 (es) | 2021-04-07 |
MX2018009123A (es) | 2018-11-09 |
FR3047101A1 (fr) | 2017-07-28 |
CN108496187A (zh) | 2018-09-04 |
TWI662480B (zh) | 2019-06-11 |
FR3047101B1 (fr) | 2022-04-01 |
SG10201913048XA (en) | 2020-02-27 |
JP6901207B2 (ja) | 2021-07-14 |
EP3408799B1 (fr) | 2020-07-08 |
TW201732688A (zh) | 2017-09-16 |
WO2017129904A1 (fr) | 2017-08-03 |
US10706346B2 (en) | 2020-07-07 |
EP3408799A1 (fr) | 2018-12-05 |
BR112018014282A2 (pt) | 2018-12-18 |
CL2018002017A1 (es) | 2019-03-08 |
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