CN203134786U - 半导体封装用导线架条及其模具 - Google Patents
半导体封装用导线架条及其模具 Download PDFInfo
- Publication number
- CN203134786U CN203134786U CN2012207421578U CN201220742157U CN203134786U CN 203134786 U CN203134786 U CN 203134786U CN 2012207421578 U CN2012207421578 U CN 2012207421578U CN 201220742157 U CN201220742157 U CN 201220742157U CN 203134786 U CN203134786 U CN 203134786U
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- CN
- China
- Prior art keywords
- semiconductor
- sealing
- conductive wire
- wire frame
- frame strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012207421578U CN203134786U (zh) | 2012-12-28 | 2012-12-28 | 半导体封装用导线架条及其模具 |
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CN2012207421578U CN203134786U (zh) | 2012-12-28 | 2012-12-28 | 半导体封装用导线架条及其模具 |
Publications (1)
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CN203134786U true CN203134786U (zh) | 2013-08-14 |
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CN2012207421578U Expired - Fee Related CN203134786U (zh) | 2012-12-28 | 2012-12-28 | 半导体封装用导线架条及其模具 |
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CN (1) | CN203134786U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103050472A (zh) * | 2012-12-28 | 2013-04-17 | 日月光封装测试(上海)有限公司 | 半导体封装用导线架条及其模具与封胶方法 |
TWI662480B (zh) * | 2016-01-26 | 2019-06-11 | 法商琳森斯控股公司 | 用於製造晶片卡模組之方法及晶片卡 |
-
2012
- 2012-12-28 CN CN2012207421578U patent/CN203134786U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103050472A (zh) * | 2012-12-28 | 2013-04-17 | 日月光封装测试(上海)有限公司 | 半导体封装用导线架条及其模具与封胶方法 |
CN103050472B (zh) * | 2012-12-28 | 2016-04-20 | 日月光封装测试(上海)有限公司 | 半导体封装用导线架条及其模具与封胶方法 |
TWI662480B (zh) * | 2016-01-26 | 2019-06-11 | 法商琳森斯控股公司 | 用於製造晶片卡模組之方法及晶片卡 |
US10706346B2 (en) | 2016-01-26 | 2020-07-07 | Linxens Holding | Method for manufacturing a smart card module and a smart card |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170208 Address after: 201201 room T3-100201, No. 5001 East Road, Shanghai, Pudong New Area Patentee after: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. Patentee after: ASE Assembly & Test (Shanghai) Limited Address before: Guo Shou Jing Road, Pudong Zhangjiang hi tech park Shanghai city Pudong New Area No. 669 201203 Patentee before: ASE Assembly & Test (Shanghai) Limited |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170410 Address after: 201203 Shanghai city Chinese (Shanghai) free trade zone 669 GuoShouJing Road No. six building Patentee after: ASE Assembly & Test (Shanghai) Limited Address before: 201201 room T3-100201, No. 5001 East Road, Shanghai, Pudong New Area Co-patentee before: ASE Assembly & Test (Shanghai) Limited Patentee before: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 Termination date: 20181228 |