JP2019220720A5 - - Google Patents

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Publication number
JP2019220720A5
JP2019220720A5 JP2019173665A JP2019173665A JP2019220720A5 JP 2019220720 A5 JP2019220720 A5 JP 2019220720A5 JP 2019173665 A JP2019173665 A JP 2019173665A JP 2019173665 A JP2019173665 A JP 2019173665A JP 2019220720 A5 JP2019220720 A5 JP 2019220720A5
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JP
Japan
Prior art keywords
light emitting
manufacturing
emitting device
support film
flexible support
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JP2019173665A
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English (en)
Japanese (ja)
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JP6883632B2 (ja
JP2019220720A (ja
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Publication of JP2019220720A5 publication Critical patent/JP2019220720A5/ja
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Publication of JP6883632B2 publication Critical patent/JP6883632B2/ja
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JP2019173665A 2010-10-27 2019-09-25 発光デバイスを製造する方法 Active JP6883632B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40718010P 2010-10-27 2010-10-27
US61/407,180 2010-10-27

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2018102950A Division JP6595044B2 (ja) 2010-10-27 2018-05-30 ラミネートフィルム、ラミネート構造及びその製造方法

Publications (3)

Publication Number Publication Date
JP2019220720A JP2019220720A (ja) 2019-12-26
JP2019220720A5 true JP2019220720A5 (enExample) 2020-03-05
JP6883632B2 JP6883632B2 (ja) 2021-06-09

Family

ID=44993634

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2013535553A Pending JP2013541220A (ja) 2010-10-27 2011-10-20 発光デバイスの製造用のラミネート支持フィルム、及びその製造方法
JP2018102950A Active JP6595044B2 (ja) 2010-10-27 2018-05-30 ラミネートフィルム、ラミネート構造及びその製造方法
JP2019173665A Active JP6883632B2 (ja) 2010-10-27 2019-09-25 発光デバイスを製造する方法

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP2013535553A Pending JP2013541220A (ja) 2010-10-27 2011-10-20 発光デバイスの製造用のラミネート支持フィルム、及びその製造方法
JP2018102950A Active JP6595044B2 (ja) 2010-10-27 2018-05-30 ラミネートフィルム、ラミネート構造及びその製造方法

Country Status (7)

Country Link
US (1) US9351348B2 (enExample)
EP (1) EP2633554A1 (enExample)
JP (3) JP2013541220A (enExample)
KR (1) KR101909299B1 (enExample)
CN (1) CN103180945B (enExample)
TW (1) TWI560400B (enExample)
WO (1) WO2012056378A1 (enExample)

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US9299687B2 (en) 2012-10-05 2016-03-29 Bridgelux, Inc. Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
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DE102012109806A1 (de) 2012-10-15 2014-04-17 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement
JP6713720B2 (ja) * 2013-08-30 2020-06-24 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びそれを含む車両用照明装置
US20160131328A1 (en) * 2014-11-07 2016-05-12 Lighthouse Technologies Limited Indoor smd led equipped for outdoor usage
CN106449951B (zh) * 2016-11-16 2019-01-04 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法
CN110800118B (zh) * 2017-06-29 2022-10-28 京瓷株式会社 电路基板以及具备该电路基板的发光装置
CN112424957B (zh) * 2018-05-18 2024-09-06 罗门哈斯电子材料有限责任公司 用于通过一步膜层压生产led的方法
US11022791B2 (en) * 2018-05-18 2021-06-01 Facebook Technologies, Llc Assemblies of anisotropic optical elements and methods of making
US11527684B2 (en) * 2020-12-04 2022-12-13 Lumileds Llc Patterned downconverter and adhesive film for micro-LED, mini-LED downconverter mass transfer

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JP4615981B2 (ja) 2004-12-08 2011-01-19 スタンレー電気株式会社 発光ダイオード及びその製造方法
TWI389337B (zh) 2005-05-12 2013-03-11 松下電器產業股份有限公司 發光裝置與使用其之顯示裝置及照明裝置，以及發光裝置之製造方法
JP2007019096A (ja) * 2005-07-05 2007-01-25 Toyoda Gosei Co Ltd 発光装置及びその製造方法
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