JP2019220720A - ラミネートフィルム、ラミネート構造及びその製造方法 - Google Patents
ラミネートフィルム、ラミネート構造及びその製造方法 Download PDFInfo
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- JP2019220720A JP2019220720A JP2019173665A JP2019173665A JP2019220720A JP 2019220720 A JP2019220720 A JP 2019220720A JP 2019173665 A JP2019173665 A JP 2019173665A JP 2019173665 A JP2019173665 A JP 2019173665A JP 2019220720 A JP2019220720 A JP 2019220720A
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- Prior art keywords
- light emitting
- film
- elements
- support film
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000005001 laminate film Substances 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 claims abstract description 63
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000010408 film Substances 0.000 claims description 54
- 239000013039 cover film Substances 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 13
- 238000006243 chemical reaction Methods 0.000 abstract description 12
- 239000004020 conductor Substances 0.000 abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 20
- 239000000463 material Substances 0.000 description 12
- 238000003475 lamination Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
- Y10T428/2486—Intermediate layer is discontinuous or differential with outer strippable or release layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Optical Filters (AREA)
Abstract
Description
Claims (6)
- 支持フィルムを用意する工程と、
少なくとも複数の光学素子を形成するよう、パターンに従って前記支持フィルムの表面に1つ以上の層を付加する工程であり、該パターンは、前記支持フィルムの前記表面に垂直な少なくとも1つの層の高さに変化を生じさせ、該パターンは別個の基板上の複数の発光デバイスの配置に対応する、工程と
を有する方法。 - 前記複数の光学素子を前記複数の発光デバイスに貼り付ける工程、を含む請求項1に記載の方法。
- 前記複数の発光デバイスに貼り付けられた前記複数の光学素子を残して前記支持フィルムを除去する工程、を含む請求項2に記載の方法。
- 支持フィルムと、
前記支持フィルム上の1つ以上のラミネート層であり、該ラミネート層のうちの少なくとも1つの層が、別個の基板上の複数の発光デバイスの位置に対応するパターンに従って前記支持フィルム上に配置された複数の光学素子を含み、該パターンは、前記支持フィルムの表面に垂直な前記少なくとも1つの層の高さに変化を生じさせる、ラミネート層と
を有する、
ラミネートフィルム。 - 前記支持フィルムの反対側で前記複数の光学素子を覆うカバーフィルム層、を含む請求項4に記載のラミネートフィルム。
- 複数の発光デバイスを含むタイル;及び
ラミネートフィルムであり、
支持フィルムと、
前記タイル上で前記複数の発光デバイスの位置に対応する位置で前記支持フィルムの表面に配置された複数の光学素子であり、前記支持フィルムの前記表面に垂直な方向に平坦でないプロファイルを形成する光学素子と、
を含むラミネートフィルム;
を有するラミネート構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40718010P | 2010-10-27 | 2010-10-27 | |
US61/407,180 | 2010-10-27 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018102950A Division JP6595044B2 (ja) | 2010-10-27 | 2018-05-30 | ラミネートフィルム、ラミネート構造及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019220720A true JP2019220720A (ja) | 2019-12-26 |
JP2019220720A5 JP2019220720A5 (ja) | 2020-03-05 |
JP6883632B2 JP6883632B2 (ja) | 2021-06-09 |
Family
ID=44993634
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013535553A Pending JP2013541220A (ja) | 2010-10-27 | 2011-10-20 | 発光デバイスの製造用のラミネート支持フィルム、及びその製造方法 |
JP2018102950A Active JP6595044B2 (ja) | 2010-10-27 | 2018-05-30 | ラミネートフィルム、ラミネート構造及びその製造方法 |
JP2019173665A Active JP6883632B2 (ja) | 2010-10-27 | 2019-09-25 | 発光デバイスを製造する方法 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
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JP2013535553A Pending JP2013541220A (ja) | 2010-10-27 | 2011-10-20 | 発光デバイスの製造用のラミネート支持フィルム、及びその製造方法 |
JP2018102950A Active JP6595044B2 (ja) | 2010-10-27 | 2018-05-30 | ラミネートフィルム、ラミネート構造及びその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9351348B2 (ja) |
EP (1) | EP2633554A1 (ja) |
JP (3) | JP2013541220A (ja) |
KR (1) | KR101909299B1 (ja) |
CN (1) | CN103180945B (ja) |
TW (1) | TWI560400B (ja) |
WO (1) | WO2012056378A1 (ja) |
Families Citing this family (10)
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JP2014075527A (ja) * | 2012-10-05 | 2014-04-24 | Nippon Telegr & Teleph Corp <Ntt> | 半導体素子構造およびその作製法 |
US9299687B2 (en) * | 2012-10-05 | 2016-03-29 | Bridgelux, Inc. | Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration |
DE102012109806A1 (de) * | 2012-10-15 | 2014-04-17 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
JP6713720B2 (ja) * | 2013-08-30 | 2020-06-24 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ及びそれを含む車両用照明装置 |
US20160131328A1 (en) * | 2014-11-07 | 2016-05-12 | Lighthouse Technologies Limited | Indoor smd led equipped for outdoor usage |
CN106449951B (zh) * | 2016-11-16 | 2019-01-04 | 厦门市三安光电科技有限公司 | 一种发光二极管封装结构的制作方法 |
JP6815507B2 (ja) * | 2017-06-29 | 2021-01-20 | 京セラ株式会社 | 回路基板およびこれを備える発光装置 |
WO2019218336A1 (en) | 2018-05-18 | 2019-11-21 | Rohm And Haas Electronic Materials Llc | Method for producing led by one step film lamination |
US11022791B2 (en) * | 2018-05-18 | 2021-06-01 | Facebook Technologies, Llc | Assemblies of anisotropic optical elements and methods of making |
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-
2011
- 2011-10-20 WO PCT/IB2011/054684 patent/WO2012056378A1/en active Application Filing
- 2011-10-20 KR KR1020137013389A patent/KR101909299B1/ko active IP Right Grant
- 2011-10-20 US US13/879,639 patent/US9351348B2/en active Active
- 2011-10-20 JP JP2013535553A patent/JP2013541220A/ja active Pending
- 2011-10-20 EP EP11784784.8A patent/EP2633554A1/en not_active Withdrawn
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JP2005183777A (ja) * | 2003-12-22 | 2005-07-07 | Nichia Chem Ind Ltd | 半導体装置及びその製造方法 |
JP2007019096A (ja) * | 2005-07-05 | 2007-01-25 | Toyoda Gosei Co Ltd | 発光装置及びその製造方法 |
WO2010027672A2 (en) * | 2008-09-02 | 2010-03-11 | Bridgelux, Inc. | Phosphor-converted led |
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Publication number | Publication date |
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KR20130140039A (ko) | 2013-12-23 |
EP2633554A1 (en) | 2013-09-04 |
JP2018160678A (ja) | 2018-10-11 |
JP6883632B2 (ja) | 2021-06-09 |
WO2012056378A1 (en) | 2012-05-03 |
TW201231873A (en) | 2012-08-01 |
TWI560400B (en) | 2016-12-01 |
JP2013541220A (ja) | 2013-11-07 |
KR101909299B1 (ko) | 2018-10-17 |
CN103180945B (zh) | 2016-12-07 |
JP6595044B2 (ja) | 2019-10-23 |
US20130221835A1 (en) | 2013-08-29 |
CN103180945A (zh) | 2013-06-26 |
US9351348B2 (en) | 2016-05-24 |
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