TWI560400B - Laminate film and method for manufacturing the same, and laminate structure - Google Patents

Laminate film and method for manufacturing the same, and laminate structure

Info

Publication number
TWI560400B
TWI560400B TW100139214A TW100139214A TWI560400B TW I560400 B TWI560400 B TW I560400B TW 100139214 A TW100139214 A TW 100139214A TW 100139214 A TW100139214 A TW 100139214A TW I560400 B TWI560400 B TW I560400B
Authority
TW
Taiwan
Prior art keywords
laminate
manufacturing
same
laminate film
film
Prior art date
Application number
TW100139214A
Other languages
English (en)
Chinese (zh)
Other versions
TW201231873A (en
Inventor
Grigoriy Basin
Paul Scott Martin
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW201231873A publication Critical patent/TW201231873A/zh
Application granted granted Critical
Publication of TWI560400B publication Critical patent/TWI560400B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y10T428/2486—Intermediate layer is discontinuous or differential with outer strippable or release layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Optical Filters (AREA)
  • Led Devices (AREA)
TW100139214A 2010-10-27 2011-10-27 Laminate film and method for manufacturing the same, and laminate structure TWI560400B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40718010P 2010-10-27 2010-10-27

Publications (2)

Publication Number Publication Date
TW201231873A TW201231873A (en) 2012-08-01
TWI560400B true TWI560400B (en) 2016-12-01

Family

ID=44993634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100139214A TWI560400B (en) 2010-10-27 2011-10-27 Laminate film and method for manufacturing the same, and laminate structure

Country Status (7)

Country Link
US (1) US9351348B2 (enExample)
EP (1) EP2633554A1 (enExample)
JP (3) JP2013541220A (enExample)
KR (1) KR101909299B1 (enExample)
CN (1) CN103180945B (enExample)
TW (1) TWI560400B (enExample)
WO (1) WO2012056378A1 (enExample)

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US9299687B2 (en) 2012-10-05 2016-03-29 Bridgelux, Inc. Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
JP2014075527A (ja) * 2012-10-05 2014-04-24 Nippon Telegr & Teleph Corp <Ntt> 半導体素子構造およびその作製法
DE102012109806A1 (de) * 2012-10-15 2014-04-17 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement
JP6713720B2 (ja) * 2013-08-30 2020-06-24 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びそれを含む車両用照明装置
US20160131328A1 (en) * 2014-11-07 2016-05-12 Lighthouse Technologies Limited Indoor smd led equipped for outdoor usage
CN106449951B (zh) * 2016-11-16 2019-01-04 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法
US11304291B2 (en) * 2017-06-29 2022-04-12 Kyocera Corporation Circuit board and light emitting device including circuit board
EP3794647B1 (en) * 2018-05-18 2023-11-08 Rohm and Haas Electronic Materials LLC Method for producing light emitting diodes (leds) by one step film lamination
US11022791B2 (en) 2018-05-18 2021-06-01 Facebook Technologies, Llc Assemblies of anisotropic optical elements and methods of making
US11527684B2 (en) * 2020-12-04 2022-12-13 Lumileds Llc Patterned downconverter and adhesive film for micro-LED, mini-LED downconverter mass transfer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070096131A1 (en) * 2005-10-28 2007-05-03 Lumileds Lighting U.S. Llc Laminating encapsulant film containing phosphor over LEDS
US20090020779A1 (en) * 2007-06-27 2009-01-22 Namics Corporation Method of preparing a sealed light-emitting diode chip
US20090173960A1 (en) * 2004-06-09 2009-07-09 Koninklijke Philips Electronics N.V. Semiconductor light emitting device with pre-fabricated wavelength converting element
US20100051984A1 (en) * 2008-09-02 2010-03-04 Scott West Phosphor-Converted LED
TW201019395A (en) * 2008-11-13 2010-05-16 Samsung Electro Mech Method of fabricating thin film device

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GB1522145A (en) 1974-11-06 1978-08-23 Marconi Co Ltd Light emissive diode displays
JP4496774B2 (ja) 2003-12-22 2010-07-07 日亜化学工業株式会社 半導体装置の製造方法
US20070267646A1 (en) * 2004-06-03 2007-11-22 Philips Lumileds Lighting Company, Llc Light Emitting Device Including a Photonic Crystal and a Luminescent Ceramic
US7352011B2 (en) * 2004-11-15 2008-04-01 Philips Lumileds Lighting Company, Llc Wide emitting lens for LED useful for backlighting
JP4615981B2 (ja) 2004-12-08 2011-01-19 スタンレー電気株式会社 発光ダイオード及びその製造方法
TWI389337B (zh) 2005-05-12 2013-03-11 松下電器產業股份有限公司 發光裝置與使用其之顯示裝置及照明裝置，以及發光裝置之製造方法
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US8597963B2 (en) * 2009-05-19 2013-12-03 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
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Publication number Priority date Publication date Assignee Title
US20090173960A1 (en) * 2004-06-09 2009-07-09 Koninklijke Philips Electronics N.V. Semiconductor light emitting device with pre-fabricated wavelength converting element
US20070096131A1 (en) * 2005-10-28 2007-05-03 Lumileds Lighting U.S. Llc Laminating encapsulant film containing phosphor over LEDS
US20090020779A1 (en) * 2007-06-27 2009-01-22 Namics Corporation Method of preparing a sealed light-emitting diode chip
US20100051984A1 (en) * 2008-09-02 2010-03-04 Scott West Phosphor-Converted LED
TW201019395A (en) * 2008-11-13 2010-05-16 Samsung Electro Mech Method of fabricating thin film device

Also Published As

Publication number Publication date
CN103180945B (zh) 2016-12-07
KR20130140039A (ko) 2013-12-23
WO2012056378A1 (en) 2012-05-03
JP6595044B2 (ja) 2019-10-23
KR101909299B1 (ko) 2018-10-17
TW201231873A (en) 2012-08-01
US20130221835A1 (en) 2013-08-29
JP2013541220A (ja) 2013-11-07
EP2633554A1 (en) 2013-09-04
JP2018160678A (ja) 2018-10-11
US9351348B2 (en) 2016-05-24
CN103180945A (zh) 2013-06-26
JP2019220720A (ja) 2019-12-26
JP6883632B2 (ja) 2021-06-09

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MM4A Annulment or lapse of patent due to non-payment of fees