JP2019220614A5 - - Google Patents
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- Publication number
- JP2019220614A5 JP2019220614A5 JP2018118080A JP2018118080A JP2019220614A5 JP 2019220614 A5 JP2019220614 A5 JP 2019220614A5 JP 2018118080 A JP2018118080 A JP 2018118080A JP 2018118080 A JP2018118080 A JP 2018118080A JP 2019220614 A5 JP2019220614 A5 JP 2019220614A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- semiconductor device
- heat conductive
- sheet
- conductive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 64
- 238000001816 cooling Methods 0.000 claims description 12
- 239000011231 conductive filler Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 5
- 239000004917 carbon fiber Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000002788 crimping Methods 0.000 claims description 2
- 238000005304 joining Methods 0.000 claims description 2
- 230000001629 suppression Effects 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018118080A JP7208720B2 (ja) | 2018-06-21 | 2018-06-21 | 半導体装置及び半導体装置の製造方法 |
| PCT/JP2019/024363 WO2019244950A1 (ja) | 2018-06-21 | 2019-06-19 | 半導体装置及び半導体装置の製造方法 |
| KR1020207036260A KR102432180B1 (ko) | 2018-06-21 | 2019-06-19 | 반도체 장치 및 반도체 장치의 제조 방법 |
| US16/973,765 US11329005B2 (en) | 2018-06-21 | 2019-06-19 | Semiconductor device and method of producing the same |
| CN201980036901.7A CN112236857A (zh) | 2018-06-21 | 2019-06-19 | 半导体装置及半导体装置的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018118080A JP7208720B2 (ja) | 2018-06-21 | 2018-06-21 | 半導体装置及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019220614A JP2019220614A (ja) | 2019-12-26 |
| JP2019220614A5 true JP2019220614A5 (OSRAM) | 2021-05-20 |
| JP7208720B2 JP7208720B2 (ja) | 2023-01-19 |
Family
ID=68982615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018118080A Active JP7208720B2 (ja) | 2018-06-21 | 2018-06-21 | 半導体装置及び半導体装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11329005B2 (OSRAM) |
| JP (1) | JP7208720B2 (OSRAM) |
| KR (1) | KR102432180B1 (OSRAM) |
| CN (1) | CN112236857A (OSRAM) |
| WO (1) | WO2019244950A1 (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11240944B2 (en) * | 2019-07-16 | 2022-02-01 | Ford Global Technologies, Llc | Rear method of heat sinking screens and electronics in enclosed areas |
| JP7389635B2 (ja) | 2019-12-05 | 2023-11-30 | カヤバ株式会社 | 作動流体供給システム |
| JP7396204B2 (ja) * | 2020-06-01 | 2023-12-12 | 株式会社デンソー | 冷却装置 |
| CN120581525B (zh) * | 2025-08-01 | 2025-10-28 | 成都天锐星通科技股份有限公司 | 一种屏蔽结构与射频芯片封装器件及电子设备 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06169188A (ja) * | 1992-12-01 | 1994-06-14 | Fujitsu Ltd | 放熱が良好な電子装置 |
| US6111313A (en) * | 1998-01-12 | 2000-08-29 | Lsi Logic Corporation | Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit |
| US6224711B1 (en) * | 1998-08-25 | 2001-05-01 | International Business Machines Corporation | Assembly process for flip chip package having a low stress chip and resulting structure |
| JP3313682B2 (ja) | 1999-11-18 | 2002-08-12 | 北川工業株式会社 | 電磁波シールドケース |
| US7575955B2 (en) * | 2004-01-06 | 2009-08-18 | Ismat Corporation | Method for making electronic packages |
| JP2008166641A (ja) | 2007-01-04 | 2008-07-17 | Oita Univ | 熱伝導性及び電気伝導性を有する電磁シールド用の膨張化炭素繊維複合材料とその製造方法 |
| CN201104378Y (zh) * | 2007-04-04 | 2008-08-20 | 华为技术有限公司 | 屏蔽和散热装置 |
| JP2012164852A (ja) | 2011-02-08 | 2012-08-30 | Murata Mfg Co Ltd | 半導体パッケージのシールド構造 |
| US20130256894A1 (en) * | 2012-03-29 | 2013-10-03 | International Rectifier Corporation | Porous Metallic Film as Die Attach and Interconnect |
| US9420734B2 (en) * | 2014-04-01 | 2016-08-16 | Advanced Micro Devices, Inc. | Combined electromagnetic shield and thermal management device |
| JP6295238B2 (ja) | 2014-10-31 | 2018-03-14 | デクセリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
| JP2016096249A (ja) | 2014-11-14 | 2016-05-26 | 富士通株式会社 | シールドカバー及び電子装置 |
| JP6704229B2 (ja) | 2015-09-14 | 2020-06-03 | リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． | 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法 |
| CN206077940U (zh) * | 2015-10-16 | 2017-04-05 | 莱尔德电子材料(深圳)有限公司 | 导热电磁干扰emi吸收器 |
| CN105828571A (zh) * | 2015-10-21 | 2016-08-03 | 维沃移动通信有限公司 | 一种电子设备芯片的屏蔽散热结构及电子设备 |
| CN205389320U (zh) * | 2016-03-23 | 2016-07-20 | 乐视控股（北京）有限公司 | 一种散热屏蔽装置 |
| EP3440906B1 (en) * | 2016-04-04 | 2021-07-21 | Commscope Technologies LLC | Systems and methods for thermal management for high power density emi shielded electronic devices |
| JP6795375B2 (ja) | 2016-10-26 | 2020-12-02 | リンテック株式会社 | 電波吸収体、半導体装置および複合シート |
| CN206181696U (zh) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技（深圳）有限公司 | 一种低热阻的手机屏蔽散热结构及具有该结构的手机 |
| JP6363687B2 (ja) | 2016-12-26 | 2018-07-25 | デクセリアルズ株式会社 | 半導体装置 |
| JP6800129B2 (ja) * | 2017-11-07 | 2020-12-16 | 古河電気工業株式会社 | フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法 |
-
2018
- 2018-06-21 JP JP2018118080A patent/JP7208720B2/ja active Active
-
2019
- 2019-06-19 US US16/973,765 patent/US11329005B2/en active Active
- 2019-06-19 CN CN201980036901.7A patent/CN112236857A/zh active Pending
- 2019-06-19 WO PCT/JP2019/024363 patent/WO2019244950A1/ja not_active Ceased
- 2019-06-19 KR KR1020207036260A patent/KR102432180B1/ko active Active
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