KR102432180B1 - 반도체 장치 및 반도체 장치의 제조 방법 - Google Patents

반도체 장치 및 반도체 장치의 제조 방법 Download PDF

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KR102432180B1
KR102432180B1 KR1020207036260A KR20207036260A KR102432180B1 KR 102432180 B1 KR102432180 B1 KR 102432180B1 KR 1020207036260 A KR1020207036260 A KR 1020207036260A KR 20207036260 A KR20207036260 A KR 20207036260A KR 102432180 B1 KR102432180 B1 KR 102432180B1
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conductive
semiconductor device
sheet
conductive sheet
heat conductive
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KR20210010553A (ko
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세르게이 볼로토프
유스케 쿠보
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데쿠세리아루즈 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020207036260A 2018-06-21 2019-06-19 반도체 장치 및 반도체 장치의 제조 방법 Active KR102432180B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018118080A JP7208720B2 (ja) 2018-06-21 2018-06-21 半導体装置及び半導体装置の製造方法
JPJP-P-2018-118080 2018-06-21
PCT/JP2019/024363 WO2019244950A1 (ja) 2018-06-21 2019-06-19 半導体装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20210010553A KR20210010553A (ko) 2021-01-27
KR102432180B1 true KR102432180B1 (ko) 2022-08-16

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KR1020207036260A Active KR102432180B1 (ko) 2018-06-21 2019-06-19 반도체 장치 및 반도체 장치의 제조 방법

Country Status (5)

Country Link
US (1) US11329005B2 (OSRAM)
JP (1) JP7208720B2 (OSRAM)
KR (1) KR102432180B1 (OSRAM)
CN (1) CN112236857A (OSRAM)
WO (1) WO2019244950A1 (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11240944B2 (en) * 2019-07-16 2022-02-01 Ford Global Technologies, Llc Rear method of heat sinking screens and electronics in enclosed areas
JP7389635B2 (ja) 2019-12-05 2023-11-30 カヤバ株式会社 作動流体供給システム
JP7396204B2 (ja) * 2020-06-01 2023-12-12 株式会社デンソー 冷却装置
CN120581525B (zh) * 2025-08-01 2025-10-28 成都天锐星通科技股份有限公司 一种屏蔽结构与射频芯片封装器件及电子设备

Citations (3)

* Cited by examiner, † Cited by third party
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US20060084254A1 (en) * 2004-01-06 2006-04-20 Attarwala Abbas I Method for making electronic packages
JP2017038086A (ja) * 2014-10-31 2017-02-16 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
JP2018073897A (ja) * 2016-10-26 2018-05-10 リンテック株式会社 電波吸収体、半導体装置および複合シート

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JPH06169188A (ja) * 1992-12-01 1994-06-14 Fujitsu Ltd 放熱が良好な電子装置
US6111313A (en) * 1998-01-12 2000-08-29 Lsi Logic Corporation Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit
US6224711B1 (en) * 1998-08-25 2001-05-01 International Business Machines Corporation Assembly process for flip chip package having a low stress chip and resulting structure
JP3313682B2 (ja) 1999-11-18 2002-08-12 北川工業株式会社 電磁波シールドケース
JP2008166641A (ja) 2007-01-04 2008-07-17 Oita Univ 熱伝導性及び電気伝導性を有する電磁シールド用の膨張化炭素繊維複合材料とその製造方法
CN201104378Y (zh) * 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置
JP2012164852A (ja) 2011-02-08 2012-08-30 Murata Mfg Co Ltd 半導体パッケージのシールド構造
US20130256894A1 (en) * 2012-03-29 2013-10-03 International Rectifier Corporation Porous Metallic Film as Die Attach and Interconnect
US9420734B2 (en) * 2014-04-01 2016-08-16 Advanced Micro Devices, Inc. Combined electromagnetic shield and thermal management device
JP2016096249A (ja) 2014-11-14 2016-05-26 富士通株式会社 シールドカバー及び電子装置
JP6704229B2 (ja) 2015-09-14 2020-06-03 リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法
CN206077940U (zh) * 2015-10-16 2017-04-05 莱尔德电子材料(深圳)有限公司 导热电磁干扰emi吸收器
CN105828571A (zh) * 2015-10-21 2016-08-03 维沃移动通信有限公司 一种电子设备芯片的屏蔽散热结构及电子设备
CN205389320U (zh) * 2016-03-23 2016-07-20 乐视控股（北京）有限公司 一种散热屏蔽装置
WO2017176521A1 (en) * 2016-04-04 2017-10-12 Commscope Technologies Llc Systems and methods for thermal management for high power density emi shielded electronic devices
CN206181696U (zh) * 2016-10-28 2017-05-17 中科创达软件科技（深圳）有限公司 一种低热阻的手机屏蔽散热结构及具有该结构的手机
JP6363687B2 (ja) 2016-12-26 2018-07-25 デクセリアルズ株式会社 半導体装置
JP6800129B2 (ja) * 2017-11-07 2020-12-16 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法

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US20060084254A1 (en) * 2004-01-06 2006-04-20 Attarwala Abbas I Method for making electronic packages
JP2017038086A (ja) * 2014-10-31 2017-02-16 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
JP2018073897A (ja) * 2016-10-26 2018-05-10 リンテック株式会社 電波吸収体、半導体装置および複合シート

Also Published As

Publication number Publication date
US20210225777A1 (en) 2021-07-22
WO2019244950A1 (ja) 2019-12-26
CN112236857A (zh) 2021-01-15
JP7208720B2 (ja) 2023-01-19
KR20210010553A (ko) 2021-01-27
JP2019220614A (ja) 2019-12-26
US11329005B2 (en) 2022-05-10

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