JP6176845B2 - 高熱伝導板 - Google Patents
高熱伝導板 Download PDFInfo
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- JP6176845B2 JP6176845B2 JP2013185537A JP2013185537A JP6176845B2 JP 6176845 B2 JP6176845 B2 JP 6176845B2 JP 2013185537 A JP2013185537 A JP 2013185537A JP 2013185537 A JP2013185537 A JP 2013185537A JP 6176845 B2 JP6176845 B2 JP 6176845B2
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- thermal conductivity
- plate
- base material
- heat
- high thermal
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- 239000000463 material Substances 0.000 claims description 114
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 87
- 239000003575 carbonaceous material Substances 0.000 claims description 51
- 229910052782 aluminium Inorganic materials 0.000 claims description 48
- 230000017525 heat dissipation Effects 0.000 claims description 37
- 239000002131 composite material Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 29
- 239000004065 semiconductor Substances 0.000 description 18
- 238000001816 cooling Methods 0.000 description 14
- 239000002134 carbon nanofiber Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 12
- 229920000049 Carbon (fiber) Polymers 0.000 description 11
- 239000004917 carbon fiber Substances 0.000 description 11
- 229910002804 graphite Inorganic materials 0.000 description 11
- 239000010439 graphite Substances 0.000 description 11
- 230000003014 reinforcing effect Effects 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 239000002041 carbon nanotube Substances 0.000 description 9
- 229910021393 carbon nanotube Inorganic materials 0.000 description 9
- 230000007423 decrease Effects 0.000 description 9
- 238000005245 sintering Methods 0.000 description 9
- 239000000835 fiber Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 230000005855 radiation Effects 0.000 description 8
- 229910021389 graphene Inorganic materials 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000002076 thermal analysis method Methods 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002048 multi walled nanotube Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009291 secondary effect Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229930091051 Arenine Natural products 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002365 multiple layer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 238000002490 spark plasma sintering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
20 シェル
21 第1の薄板部材
22 第2の薄板部材
23 ブロック状補強部
24 柱状部材
25 ねじ孔
29 熱源搭載位置
Claims (2)
- アルミニウム系金属と炭素系材料との板状複合材料からなり板面に平行な方向の熱伝導率λxyが板厚方向の熱伝導率λzより高い高熱伝導性母材と、
前記高熱伝導性母材の両表面に接合され一方が熱源搭載板、他方が放熱側基板とされたアルミニウム系金属主体の薄板部材と、
前記熱源搭載板上の熱源搭載位置直下において前記高熱伝導性母材を板厚方向に貫通し両端が両面側の薄板部材と接合されたアルミニウム系金属主体の柱状部材とを有し、
前記柱状部材の断面積の熱源面積に対する比率y(%)が、前記高熱伝導性母材の板厚方向の熱伝導率λz(W/mK)をxとする下記の対数式により表される高熱伝導板。
記
−35ln(x+9)+160≦y≦−35ln(x−5)+160 - 請求項1に記載の高熱伝導板において、熱源搭載板上の熱源搭載位置が複数箇所にあり、複数の熱源搭載位置の少なくとも一つの直下に前記柱状部材が配置されている高熱伝導板。
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JP2013185537A JP6176845B2 (ja) | 2013-09-06 | 2013-09-06 | 高熱伝導板 |
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JP2013185537A JP6176845B2 (ja) | 2013-09-06 | 2013-09-06 | 高熱伝導板 |
Publications (2)
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JP2015053397A JP2015053397A (ja) | 2015-03-19 |
JP6176845B2 true JP6176845B2 (ja) | 2017-08-09 |
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JP2013185537A Active JP6176845B2 (ja) | 2013-09-06 | 2013-09-06 | 高熱伝導板 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6580385B2 (ja) * | 2015-06-19 | 2019-09-25 | 昭和電工株式会社 | アルミニウムと炭素粒子との複合体及びその製造方法 |
JP6846879B2 (ja) * | 2016-06-07 | 2021-03-24 | 昭和電工株式会社 | ヒートシンクの製造方法 |
EP3806587B1 (en) * | 2018-05-29 | 2024-05-29 | Kyocera Corporation | Electronic element mounting substrate, electronic device, and electronic module |
KR102228431B1 (ko) * | 2019-04-16 | 2021-03-16 | 부경대학교 산학협력단 | 알루미늄계 클래드 방열판의 제조방법 및 이에 의해 제조된 알루미늄계 클래드 방열판 |
JP2021123779A (ja) * | 2020-02-07 | 2021-08-30 | 昭和電工株式会社 | 金属−炭素粒子複合体及び金属−炭素粒子複合体の製造方法 |
JP2021143392A (ja) * | 2020-03-12 | 2021-09-24 | 昭和電工株式会社 | アルミニウム−炭素粒子複合体の製造方法 |
Family Cites Families (5)
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JP5288441B2 (ja) * | 2005-05-10 | 2013-09-11 | 住友精密工業株式会社 | 高熱伝導複合材料とその製造方法 |
US7303005B2 (en) * | 2005-11-04 | 2007-12-04 | Graftech International Holdings Inc. | Heat spreaders with vias |
TW200811411A (en) * | 2006-08-18 | 2008-03-01 | Chin-Fu Horng | Complex architecture for dispersing heat |
JP5279639B2 (ja) * | 2009-07-08 | 2013-09-04 | 京セラ株式会社 | グラファイトシート |
WO2011016082A1 (ja) * | 2009-08-04 | 2011-02-10 | Yoshida Naohiro | ヒートシンク材及びその製造方法 |
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