JP2019212656A5 - - Google Patents

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Publication number
JP2019212656A5
JP2019212656A5 JP2018104652A JP2018104652A JP2019212656A5 JP 2019212656 A5 JP2019212656 A5 JP 2019212656A5 JP 2018104652 A JP2018104652 A JP 2018104652A JP 2018104652 A JP2018104652 A JP 2018104652A JP 2019212656 A5 JP2019212656 A5 JP 2019212656A5
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JP
Japan
Prior art keywords
wiring
thickness direction
support
body base
bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018104652A
Other languages
English (en)
Japanese (ja)
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JP2019212656A (ja
JP6985211B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2018104652A external-priority patent/JP6985211B2/ja
Priority to JP2018104652A priority Critical patent/JP6985211B2/ja
Priority to PCT/JP2019/018713 priority patent/WO2019230334A1/fr
Priority to KR1020207033984A priority patent/KR20210015809A/ko
Priority to CN201980036057.8A priority patent/CN112219455A/zh
Priority to TW108117072A priority patent/TWI823937B/zh
Publication of JP2019212656A publication Critical patent/JP2019212656A/ja
Publication of JP2019212656A5 publication Critical patent/JP2019212656A5/ja
Priority to JP2021191207A priority patent/JP7411621B2/ja
Publication of JP6985211B2 publication Critical patent/JP6985211B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018104652A 2018-05-31 2018-05-31 配線回路基板 Active JP6985211B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2018104652A JP6985211B2 (ja) 2018-05-31 2018-05-31 配線回路基板
PCT/JP2019/018713 WO2019230334A1 (fr) 2018-05-31 2019-05-10 Carte de circuit imprimé à câblage
KR1020207033984A KR20210015809A (ko) 2018-05-31 2019-05-10 배선 회로 기판
CN201980036057.8A CN112219455A (zh) 2018-05-31 2019-05-10 布线电路基板
TW108117072A TWI823937B (zh) 2018-05-31 2019-05-17 配線電路基板
JP2021191207A JP7411621B2 (ja) 2018-05-31 2021-11-25 配線回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018104652A JP6985211B2 (ja) 2018-05-31 2018-05-31 配線回路基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021191207A Division JP7411621B2 (ja) 2018-05-31 2021-11-25 配線回路基板

Publications (3)

Publication Number Publication Date
JP2019212656A JP2019212656A (ja) 2019-12-12
JP2019212656A5 true JP2019212656A5 (fr) 2021-09-16
JP6985211B2 JP6985211B2 (ja) 2021-12-22

Family

ID=68697476

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018104652A Active JP6985211B2 (ja) 2018-05-31 2018-05-31 配線回路基板
JP2021191207A Active JP7411621B2 (ja) 2018-05-31 2021-11-25 配線回路基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021191207A Active JP7411621B2 (ja) 2018-05-31 2021-11-25 配線回路基板

Country Status (5)

Country Link
JP (2) JP6985211B2 (fr)
KR (1) KR20210015809A (fr)
CN (1) CN112219455A (fr)
TW (1) TWI823937B (fr)
WO (1) WO2019230334A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7211930B2 (ja) * 2019-12-17 2023-01-24 日東電工株式会社 配線回路基板の製造方法
JP2022147128A (ja) * 2021-03-23 2022-10-06 日東電工株式会社 配線回路基板の製造方法
JP2023024322A (ja) 2021-08-06 2023-02-16 日東電工株式会社 配線回路基板およびその製造方法
JP2023034728A (ja) 2021-08-31 2023-03-13 日東電工株式会社 配線回路基板
JP2023042068A (ja) 2021-09-14 2023-03-27 日東電工株式会社 配線回路基板
JP2024046955A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板
JP2024046956A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板
JP2024046954A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法
JP2024046953A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55140255A (en) 1979-04-18 1980-11-01 Nec Corp Heat sink structure
JP2001110951A (ja) * 1999-10-08 2001-04-20 Hitachi Ltd 半導体装置およびその製造方法
JP2003321796A (ja) * 2002-04-30 2003-11-14 Nitto Denko Corp めっき装置およびそれを用いた配線基板の製造方法
JPWO2010007704A1 (ja) * 2008-07-16 2012-01-05 イビデン株式会社 フレックスリジッド配線板及び電子デバイス
JP2011198402A (ja) * 2010-03-18 2011-10-06 Dainippon Printing Co Ltd サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
KR101297904B1 (ko) * 2011-05-23 2013-08-22 스미토모 덴키 고교 가부시키가이샤 배선판
JP5747764B2 (ja) * 2011-09-26 2015-07-15 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP6152677B2 (ja) * 2013-03-27 2017-06-28 大日本印刷株式会社 サスペンション用基板
JP6376556B2 (ja) * 2014-06-10 2018-08-22 日東電工株式会社 光電気混載基板

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