JP2019199062A - 複合材の製造方法および複合材 - Google Patents
複合材の製造方法および複合材 Download PDFInfo
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- JP2019199062A JP2019199062A JP2018096233A JP2018096233A JP2019199062A JP 2019199062 A JP2019199062 A JP 2019199062A JP 2018096233 A JP2018096233 A JP 2018096233A JP 2018096233 A JP2018096233 A JP 2018096233A JP 2019199062 A JP2019199062 A JP 2019199062A
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Abstract
Description
(1)樹脂自体にエラストマー粒子を分散させる。
(2)熱可塑性樹脂を層間に導入する。
(3)板厚方向に繊維を配向した3次元織物を適用する。
プリプレグ10には、樹脂層(11a,11b)の間に空隙層12を有する半含浸プリプレグを用いる。半含浸プリプレグについては後に詳しく説明する。プリプレグ10を積層する際、隣り合うプリプレグ10とプリプレグ10との対向面に、複数の短繊維13を配置する。積層後、複数の短繊維13は、プリプレグ10のマトリックス樹脂に接触した状態となる。
複数のプリプレグ10が積層された積層体をバギングフィルム(不図示)に包んで内部を真空引きし、空隙層12を十分に脱気した後、加熱成形する。
繊維強化基材は、繊維束を一方向(長手方向)に引き揃えた一方向材、不織布、織物等ある。繊維強化基材に用いられる繊維は、炭素繊維、ガラス繊維、有機繊維、ガラス以外の無機繊維等である。繊維強化基材の厚さは、0.05mm以上0.5mm以下が好ましい。
マトリックス樹脂には、高耐熱の熱硬化性樹脂を用いる。高耐熱の熱硬化性樹脂は、型材用または治具用として汎用されている樹脂材料から選択されうる。具体的に、熱硬化性樹脂は、エポキシ樹脂、ポリエステル樹脂、ビニルエステル樹脂シアネートエステル樹脂、ポリイミド樹脂等である。「高耐熱」とは、複合材の適用に応じて定義されうる。例えば、航空機の構造部材であれば150℃以上の熱に耐えうることを意味する。
プリプレグは、繊維強化基材に未硬化のマトリックス樹脂を含浸させた中間材料である。図2に、本実施形態で用いられるプリプレグの厚さ方向の断面図を例示する。本実施形態で用いられるプリプレグ10は、半含浸プリプレグである。
短繊維13は、腰が柔らかく、マトリックス樹脂の流動に引き込まれやすい繊維であればよい。具体的に、短繊維13は、ポリアミド繊維(例えばナイロン)、セルロース繊維、ガラス繊維、ポリエステル繊維等である。
10’ プリプレグ(空隙層にマトリックス樹脂含浸済)
11a,11b 樹脂層
12 空隙層
13 短繊維
20,30,40 複合材
21 エラストマー粒子
31 繊維強化層
32 熱可塑性樹脂
Claims (6)
- 繊維強化基材に未硬化のマトリックス樹脂を含浸させた複数のプリプレグを積層し、加熱成形する複合材の製造方法であって、
樹脂を含まない面内方向に連続した空隙層と、前記空隙層の両面に配置された樹脂層と、を備えた前記プリプレグを用い、
隣り合う前記プリプレグと前記プリプレグとの対向面に複数の短繊維を配置し、
積層した前記プリプレグを真空引きして前記空隙層を脱気した後、加熱成形する複合材の製造方法。 - 複数の前記プリプレグは、同じ側の面を同じ方向に向けて積層する請求項1に記載の複合材の製造方法。
- 前記空隙層の両面に配置された樹脂層の厚さが異なる場合、薄い方の樹脂層を積層方向上向きにして複数の前記プリプレグを積層する請求項1または請求項2に記載の複合材の製造方法。
- 前記樹脂層に含まれるマトリックス樹脂は、熱硬化性樹脂、または熱硬化樹脂とその硬化剤からなる請求項1〜3のいずれかに記載の複合材の製造方法。
- 前記短繊維は、前記空隙層の厚さ以上の長さである請求項1〜4のいずれかに記載の複合材の製造方法。
- 複数の繊維強化基材が積層されてなる積層体と、
前記積層体に充填された硬化後のマトリックス樹脂と、
前記繊維強化基材の面内方向とは異なる方向を向き、隣接する前記繊維強化基材間にわたり存在する複数の短繊維と、
を備えた複合材。
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WO2022254587A1 (ja) * | 2021-06-01 | 2022-12-08 | 昭和電工マテリアルズ株式会社 | プリプレグ、積層板、金属張り積層板、プリント配線板、半導体パッケージ並びにプリプレグの製造方法及び金属張り積層板の製造方法 |
WO2024122584A1 (ja) * | 2022-12-07 | 2024-06-13 | 株式会社レゾナック | 金属張積層板、プリント配線板及び半導体パッケージ並びにこれらの製造方法 |
WO2024122587A1 (ja) * | 2022-12-07 | 2024-06-13 | 株式会社レゾナック | プリプレグ、積層板、金属張り積層板、プリント配線板、半導体パッケージ並びにプリプレグの製造方法及び金属張り積層板の製造方法 |
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