JP2019196943A - 計測装置、露光装置及び物品の製造方法 - Google Patents
計測装置、露光装置及び物品の製造方法 Download PDFInfo
- Publication number
- JP2019196943A JP2019196943A JP2018090109A JP2018090109A JP2019196943A JP 2019196943 A JP2019196943 A JP 2019196943A JP 2018090109 A JP2018090109 A JP 2018090109A JP 2018090109 A JP2018090109 A JP 2018090109A JP 2019196943 A JP2019196943 A JP 2019196943A
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- Prior art keywords
- light
- neutral density
- wavelength
- filter
- substrate
- Prior art date
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- Granted
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- 238000002834 transmittance Methods 0.000 claims abstract description 124
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- 230000007935 neutral effect Effects 0.000 claims description 208
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Classifications
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- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
- G02B26/023—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light comprising movable attenuating elements, e.g. neutral density filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
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Abstract
Description
Claims (16)
- 基板のマークを検出して前記基板の位置を計測する計測装置であって、
前記マークを照明するための光を出力する光源と、前記マークを撮像する撮像素子との間の光路に配置され、光を通過させる波長帯が互いに異なる複数の波長フィルタ領域を含む第1フィルタ部と、
前記光源と前記撮像素子との間の光路に配置され、光を減光して通過させる複数の減光フィルタ領域を含む第2フィルタ部と、
前記複数の波長フィルタ領域のそれぞれを通過した光の波長帯に対する前記複数の減光フィルタ領域のそれぞれの透過率を表すデータを取得する取得部と、
前記取得部で取得されたデータに基づいて、前記複数の減光フィルタ領域から、前記複数の波長フィルタ領域のうちの1つの波長フィルタ領域とともに前記光路上に配置される1つの減光フィルタ領域を選択する選択部と、
を有することを特徴とする計測装置。 - 前記選択部は、前記複数の波長フィルタ領域から、前記マークを照明すべき光の波長帯に対応する前記1つの波長フィルタ領域を選択することを特徴とする請求項1に記載の計測装置。
- 前記選択部は、前記1つの減光フィルタ領域を通過して前記マークを照明する光の光量が前記撮像素子で検出可能な光量範囲に収まるように、前記1つの減光フィルタ領域を選択することを特徴とする請求項1又は2に記載の計測装置。
- 前記基板が配置される面に配置された基準マークと、
光量を検出するセンサと、を更に有し、
前記取得部は、前記複数の波長フィルタ領域のそれぞれと前記複数の減光フィルタ領域のそれぞれとの組み合わせを変更しながら、当該組み合わせの波長フィルタ領域及び減光フィルタ領域を通過した光で前記基準マークを照明し、前記基準マークからの光の光量を前記センサで検出することで、前記データを取得することを特徴とする請求項1乃至3のうちいずれか1項に記載の計測装置。 - 前記取得部は、前記基板の位置を計測する前に、前記データを取得することを特徴とする請求項1乃至4のうちいずれか1項に記載の計測装置。
- 前記第1フィルタ部は、前記マークを照明する光の波長帯を400nm以上1200nm以下の範囲で選択可能なように前記複数の波長フィルタ領域を含むことを特徴とする請求項1乃至5のうちいずれか1項に記載の計測装置。
- 前記複数の波長フィルタ領域のそれぞれが通過させる光の波長帯の幅は、100nm以上150nm以下であることを特徴とする請求項1乃至6のうちいずれか1項に記載の計測装置。
- 前記光源の出力及び前記撮像素子の蓄積時間の少なくとも一方を制御することで、前記1つの波長フィルタ領域を通過した光を調光する調光部を更に有することを特徴とする請求項1乃至7のうちいずれか1項に記載の計測装置。
- 前記複数の減光フィルタ領域のそれぞれは、金属層を含む膜で構成されていることを特徴とする請求項1乃至8のうちいずれか1項に記載の計測装置。
- 前記複数の減光フィルタ領域のそれぞれは、互いに異なる開口率を有するメッシュで構成されていることを特徴とする請求項1乃至8のうちいずれか1項に記載の計測装置。
- 前記複数の減光フィルタ領域は、互いに連続的に接続して設けられていることを特徴とする請求項1乃至8のうちいずれか1項に記載の計測装置。
- 前記複数の波長フィルタ領域のうち1つの波長フィルタ領域を選択的に光路上に配置するように前記第1フィルタ部を駆動する第1駆動部と、
前記複数の減光フィルタ領域のうち1つの減光フィルタ領域を選択的に光路上に配置するように前記第2フィルタ部を駆動する第2駆動部と、
入力信号に基づいて、前記1つの波長フィルタ領域を前記光路上に配置すべく前記第1駆動部を制御するとともに、前記選択部によって選択された前記1つの減光フィルタ領域を前記光路上に配置すべく前記第2駆動部を制御する制御部と、
を更に有することを特徴とする請求項1乃至11のうちいずれか1項に記載の計測装置。 - 前記撮像素子からの出力信号に基づいて、前記基板の位置を求める演算部を更に有することを特徴とする請求項1乃至12のうちいずれか1項に記載の計測装置。
- 基板のマークを検出して前記基板の位置を計測する計測装置であって、
前記マークを照明するための光を出力する光源と、前記マークを撮像する撮像素子との間の光路に配置され、光を減光して通過させる複数の減光フィルタ領域を含むフィルタ部と、
前記マークを照明すべき光の波長帯に対する前記複数の減光フィルタ領域のそれぞれの透過率を表すデータを取得し、前記データに基づいて、前記複数の減光フィルタ領域から、前記マークを照明する光の調光に用いる1つの減光フィルタ領域を選択する選択部と、
を有することを特徴とする計測装置。 - レチクルのパターンを基板に投影する投影光学系と、
前記基板を保持するステージと、
前記基板の位置を計測する請求項1乃至14のうちいずれか1項に記載の計測装置と、
前記計測装置の計測結果に基づいて、前記ステージの位置を制御する制御部と、
を有することを特徴とする露光装置。 - 請求項15に記載の露光装置を用いて基板を露光する工程と、
露光した前記基板を現像する工程と、
現像された前記基板から物品を製造する工程と、
を有することを特徴とする物品の製造方法。
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