JP2019160958A - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP2019160958A
JP2019160958A JP2018044188A JP2018044188A JP2019160958A JP 2019160958 A JP2019160958 A JP 2019160958A JP 2018044188 A JP2018044188 A JP 2018044188A JP 2018044188 A JP2018044188 A JP 2018044188A JP 2019160958 A JP2019160958 A JP 2019160958A
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JP
Japan
Prior art keywords
discharge nozzle
liquid
discharge
pipe
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018044188A
Other languages
English (en)
Japanese (ja)
Inventor
雄二 菅原
Yuji Sugawara
雄二 菅原
克栄 東
Katsue Higashi
克栄 東
佑介 竹松
Yusuke Takematsu
佑介 竹松
宏樹 温井
Hiroki Nukui
宏樹 温井
拓 青木
Hiroshi Aoki
拓 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2018044188A priority Critical patent/JP2019160958A/ja
Priority to TW107147186A priority patent/TWI697950B/zh
Priority to KR1020190012210A priority patent/KR20190107566A/ko
Priority to CN201910151440.XA priority patent/CN110262198A/zh
Publication of JP2019160958A publication Critical patent/JP2019160958A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Nozzles (AREA)
JP2018044188A 2018-03-12 2018-03-12 基板処理装置および基板処理方法 Pending JP2019160958A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018044188A JP2019160958A (ja) 2018-03-12 2018-03-12 基板処理装置および基板処理方法
TW107147186A TWI697950B (zh) 2018-03-12 2018-12-26 基板處理裝置以及基板處理方法
KR1020190012210A KR20190107566A (ko) 2018-03-12 2019-01-30 기판 처리 장치 및 기판 처리 방법
CN201910151440.XA CN110262198A (zh) 2018-03-12 2019-02-28 基板处理装置以及基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018044188A JP2019160958A (ja) 2018-03-12 2018-03-12 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
JP2019160958A true JP2019160958A (ja) 2019-09-19

Family

ID=67911890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018044188A Pending JP2019160958A (ja) 2018-03-12 2018-03-12 基板処理装置および基板処理方法

Country Status (4)

Country Link
JP (1) JP2019160958A (ko)
KR (1) KR20190107566A (ko)
CN (1) CN110262198A (ko)
TW (1) TWI697950B (ko)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001191006A (ja) * 1999-10-26 2001-07-17 Tokyo Electron Ltd 液処理装置
JP2004082038A (ja) * 2002-08-28 2004-03-18 Seiko Epson Corp 超音波洗浄方法、超音波洗浄装置および、超音波洗浄ノズルのノズル部の製造方法
JP2004337858A (ja) * 2004-07-08 2004-12-02 Dainippon Screen Mfg Co Ltd 洗浄ノズル及び基板洗浄装置
JP2012209513A (ja) * 2011-03-30 2012-10-25 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2014078630A (ja) * 2012-10-11 2014-05-01 Tokyo Electron Ltd 液処理装置
JP2015109335A (ja) * 2013-12-04 2015-06-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2015192980A (ja) * 2014-03-26 2015-11-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、ノズルおよび基板処理方法
JP2017073467A (ja) * 2015-10-07 2017-04-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3939077B2 (ja) * 2000-05-30 2007-06-27 大日本スクリーン製造株式会社 基板洗浄装置
US10464107B2 (en) * 2013-10-24 2019-11-05 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus
CN105914167B (zh) * 2015-02-25 2018-09-04 株式会社思可林集团 基板处理装置
JP6496171B2 (ja) * 2015-03-30 2019-04-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6377030B2 (ja) 2015-09-01 2018-08-22 東京エレクトロン株式会社 基板処理装置
US10141206B2 (en) * 2016-02-17 2018-11-27 SCREEN Holdings Co., Ltd. Substrate processing apparatus and gap washing method
CN108780746B (zh) * 2016-03-08 2024-03-22 株式会社荏原制作所 基板清洗装置、基板清洗方法、基板处理装置以及基板干燥装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001191006A (ja) * 1999-10-26 2001-07-17 Tokyo Electron Ltd 液処理装置
JP2004082038A (ja) * 2002-08-28 2004-03-18 Seiko Epson Corp 超音波洗浄方法、超音波洗浄装置および、超音波洗浄ノズルのノズル部の製造方法
JP2004337858A (ja) * 2004-07-08 2004-12-02 Dainippon Screen Mfg Co Ltd 洗浄ノズル及び基板洗浄装置
JP2012209513A (ja) * 2011-03-30 2012-10-25 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2014078630A (ja) * 2012-10-11 2014-05-01 Tokyo Electron Ltd 液処理装置
JP2015109335A (ja) * 2013-12-04 2015-06-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2015192980A (ja) * 2014-03-26 2015-11-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、ノズルおよび基板処理方法
JP2017073467A (ja) * 2015-10-07 2017-04-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法

Also Published As

Publication number Publication date
TWI697950B (zh) 2020-07-01
KR20190107566A (ko) 2019-09-20
TW201939602A (zh) 2019-10-01
CN110262198A (zh) 2019-09-20

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