JP2019114804A - 支持基板に接合された発光デバイス - Google Patents
支持基板に接合された発光デバイス Download PDFInfo
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Abstract
Description
(付記1) ボディ、及び前記ボディの全体の厚さを貫通する複数のビアを有する支持基板と、
n型領域とp型領域との間に挟まれる発光層を有し、前記支持基板に接合された半導体発光デバイスとを有し、
前記支持基板の幅は、前記半導体発光デバイスの幅以下である、構造体。
(付記2) 前記n型領域は、前記半導体発光デバイスの端から後退している、付記1に記載の構造体。
(付記3) 前記n型領域の端と前記半導体発光デバイスの端との間に配置されたポリマー層をさらに有する、付記2に記載の構造体。
(付記4) 前記n型領域上に配置された金属コンタクトをさらに有する、付記1に記載の構造体。
(付記5) 前記金属コンタクトは、前記n型領域の端の側壁を超えて延在する、付記4に記載の構造体。
(付記6) 前記金属コンタクトは、前記n型領域の端から後退しており、
前記n型領域の外側部分及び側壁上に反射性誘電構造体が配置されている、付記4に記載の構造体。
(付記7) 前記半導体発光デバイスは、少なくとも一つの誘電領域によって分離された複数の金属領域を含む接合層を介して前記支持基板に接続される、付記1に記載の構造体。
(付記8) 前記ボディの全体の厚さを貫通する前記複数のビアは、前記複数の金属領域を露出する、付記7に記載の構造体。
(付記9) 前記半導体発光デバイスは、ポリマーを含む接合層を介して前記支持基板に接合される、付記1に記載の構造体。
(付記10) 前記ボディの全体の厚さを貫通する前記複数のビアは、前記ポリマー接合層を貫通して前記半導体発光デバイス上の金属層まで延在する、付記9に記載の構造体。
(付記11) 前記半導体発光デバイスは、前記半導体発光デバイス上に形成された第一接合層、及び前記支持基板上に形成された第二接合層を介して前記支持基板に接合される、付記1に記載の構造体。
(付記12) 前記第一及び第二接合層は、誘電層である、請求項11に記載の構造体。
(付記13) 前記第一及び第二接合層のうちの少なくとも一つは、ケイ素酸化物を含む、付記11に記載の構造体。
(付記14) 前記ボディの全体の厚さを貫通して延在する前記複数のビアは、前記半導体発光デバイス上の金属層を露出するよう、前記第一及び第二接合層の両方を貫通して延在する、付記11に記載の構造体。
(付記15) 前記半導体発光デバイス上に配置された波長変換層をさらに含む、付記1に記載の構造体。
Claims (7)
- ウェハーレベルLED処理方法であって:
n型領域上で成長したp型領域の少なくとも一部をエッチング除去するステップ;
前記n型領域の少なくとも一部に第1の材料を堆積させるステップ;
前記p型領域の側壁に第1の誘電体をつけるステップ;
前記n型領域の少なくとも一部および前記第1の誘電体と接触するようにn領域コンタクト金属をつけるステップおよび前記p型領域の少なくとも一部と接触するようにp領域コンタクト金属をつけるステップであって、前記n領域コンタクト金属および前記p領域コンタクト金属は第1のポリマーによって互いに離されている、ステップ;
前記n領域コンタクト金属および前記p領域コンタクト金属を誘電層によりキャリア基板に取り付けるステップ;
前記キャリア基板および前記誘電層を通って前記p領域コンタクト金属まで第1のビアをエッチングするステップ;並びに
前記キャリア基板および前記誘電層を通って前記n領域コンタクト金属まで第2のビアをエッチングするステップ;
を含む、
ウェハーレベルLED処理方法。 - サファイア成長基板上で前記p型領域を成長させるステップ;並びに
前記n領域コンタクト金属および前記p領域コンタクト金属を、前記誘電層により前記キャリア基板に取り付けた後に前記サファイア成長基板の少なくとも一部を除去するステップ;
をさらに含む、
請求項1に記載のウェハーレベルLED処理方法。 - n型領域側壁を形成するよう前記n型領域に第1の後退部をエッチングするステップ;並びに
前記第1の後退部を埋めるよう前記n型領域側壁に反射誘電体側壁を堆積させるステップ;
をさらに含む、
請求項1に記載のウェハーレベルLED処理方法。 - n型領域側壁を形成するよう前記n型領域に第1の後退部をエッチングするステップ;
前記第1の後退部を埋め且つ前記n型領域側壁に接触する反射誘電体側壁を堆積させるステップ;および
前記n型領域側壁からの第2の後退部を有するようp型コンタクト金属をつけるステップ;
をさらに含む、
請求項1に記載のウェハーレベルLED処理方法。 - 500℃未満の温度で圧力を加えて前記n領域コンタクト金属および前記p領域コンタクト金属を前記キャリア基板に前記誘電層を使用して取り付けるステップ、
をさらに含む、
請求項1に記載のウェハーレベルLED処理方法。 - 前記n領域コンタクト金属および前記p領域コンタクト金属との電気的コンタクトをそれぞれ形成するよう前記第1のビア及び前記第2のビアにおいて金属層を堆積させるステップ、
をさらに含む、
請求項1に記載のウェハーレベルLED処理方法。 - p型領域に覆われた第1のエリアと前記p型領域に覆われていない第2のエリアを有するn型領域であって、前記n型領域は、n型領域側壁を形成するよう前記n型領域において第1の後退部を有する、n型領域と;
前記第1の後退部を埋め且つ前記n型領域側壁と接触する反射誘電体側壁と;
前記p型領域および前記p型領域によって覆われていない前記第2のエリアを分離するよう配置されたポリマー構造と;
前記p型領域の少なくとも一部に接触するよう配置されたp領域コンタクト金属と;
前記p型領域によって覆われていない前記第2のエリアの少なくとも一部に接触するよう配置されたn領域コンタクト金属と;
前記n領域コンタクト金属および前記p領域コンタクト金属に誘電層により取り付けられたキャリア基板であって、前記キャリア基板および前記誘電層を通って前記p領域コンタクト金属まで画定された第1の金属含有ビア並びに前記キャリア基板および前記誘電層を通って前記n領域コンタクト金属まで画定された第2の金属含有ビアを有する、キャリア基板と;
を有する、
LED構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US201161491920P | 2011-06-01 | 2011-06-01 | |
US61/491,920 | 2011-06-01 |
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JP2017021056A Division JP2017108156A (ja) | 2011-06-01 | 2017-02-08 | 支持基板に接合された発光デバイス |
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JP2014513278A Pending JP2014515560A (ja) | 2011-06-01 | 2012-05-22 | 支持基板に接合された発光デバイス |
JP2017021056A Pending JP2017108156A (ja) | 2011-06-01 | 2017-02-08 | 支持基板に接合された発光デバイス |
JP2019051248A Pending JP2019114804A (ja) | 2011-06-01 | 2019-03-19 | 支持基板に接合された発光デバイス |
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US (1) | US20140077246A1 (ja) |
EP (1) | EP2715807B8 (ja) |
JP (3) | JP2014515560A (ja) |
KR (1) | KR20140034262A (ja) |
CN (2) | CN111509103A (ja) |
RU (1) | RU2604956C2 (ja) |
TW (1) | TWI617055B (ja) |
WO (1) | WO2012164437A2 (ja) |
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CN103650171B (zh) | 2011-07-15 | 2018-09-18 | 亮锐控股有限公司 | 将半导体装置结合到支持衬底的方法 |
US20140209961A1 (en) * | 2013-01-30 | 2014-07-31 | Luxo-Led Co., Limited | Alternating current light emitting diode flip-chip |
KR20160032221A (ko) | 2013-07-18 | 2016-03-23 | 코닌클리케 필립스 엔.브이. | 발광 디바이스들의 웨이퍼의 다이싱 |
JP6256026B2 (ja) * | 2014-01-17 | 2018-01-10 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
DE102014116141B4 (de) | 2014-11-05 | 2022-07-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterchips, optoelektronischer Halbleiterchip sowie optoelektronisches Halbleiterbauelement |
FR3033939B1 (fr) * | 2015-03-20 | 2018-04-27 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a diode electroluminescente |
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JP2017108156A (ja) | 2017-06-15 |
CN103563099A (zh) | 2014-02-05 |
CN111509103A (zh) | 2020-08-07 |
RU2013158689A (ru) | 2015-07-20 |
EP2715807A2 (en) | 2014-04-09 |
EP2715807B8 (en) | 2018-10-24 |
TWI617055B (zh) | 2018-03-01 |
US20140077246A1 (en) | 2014-03-20 |
EP2715807B1 (en) | 2018-05-16 |
KR20140034262A (ko) | 2014-03-19 |
JP2014515560A (ja) | 2014-06-30 |
WO2012164437A3 (en) | 2013-01-17 |
TW201306322A (zh) | 2013-02-01 |
RU2604956C2 (ru) | 2016-12-20 |
WO2012164437A2 (en) | 2012-12-06 |
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