JP2019114534A - 有機発光表示装置及びその製造方法 - Google Patents
有機発光表示装置及びその製造方法 Download PDFInfo
- Publication number
- JP2019114534A JP2019114534A JP2018226338A JP2018226338A JP2019114534A JP 2019114534 A JP2019114534 A JP 2019114534A JP 2018226338 A JP2018226338 A JP 2018226338A JP 2018226338 A JP2018226338 A JP 2018226338A JP 2019114534 A JP2019114534 A JP 2019114534A
- Authority
- JP
- Japan
- Prior art keywords
- seal pattern
- light emitting
- substrate
- organic light
- active area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 144
- 238000007789 sealing Methods 0.000 claims abstract description 90
- 239000000463 material Substances 0.000 claims abstract description 48
- 239000010410 layer Substances 0.000 claims description 108
- 239000010409 thin film Substances 0.000 claims description 29
- 239000010408 film Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 18
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 230000008569 process Effects 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- 239000000872 buffer Substances 0.000 description 6
- 239000011344 liquid material Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
111 ソースリンク配線
112 ゲート電極
113 ゲート金属層
121 バッファー層
122 半導体層
131 ゲート絶縁膜
132 エッチストッパー
133 データ金属層
135 パッド電極
138 層間絶縁膜
141 オーバーコート層
151 第1電極
152 短絡バー配線
153 パッド保護電極
161 バンク
162 第2ダムパターン
163 バンク層
171 有機発光層
181 第2電極
191 保護膜
200 封止基板
200a 凹部
300a 充填シールパターン
210a 第3ダムパターン
210b 第4ダムパターン
220 第1ダムパターン
250 フィル材
300 シールパターン
D1 第1ダム
D2 第2ダム
D ダム
Claims (14)
- 互いに対向するとともに、複数のサブピクセルを含むアクティブ領域と前記アクティブ領域の周りの非アクティブ領域とをそれぞれ有する基板及び封止基板と、
前記封止基板の前記非アクティブ領域の一部に設けられた凹部と、
前記基板と前記封止基板との間の前記非アクティブ領域に閉ループ状に同一の高さで設けられたシールパターンと、
前記シールパターンと同一物質で、前記シールパターンと重畳して前記凹部に満たされた充填シールパターンと、を備える有機発光表示装置。 - 前記シールパターンと前記充填シールパターンは一体型であり、同一幅を有する、請求項1に記載の有機発光表示装置。
- 前記凹部は、前記封止基板に、第1の深さの底部と、前記底部と前記封止基板の内側面の間に前記底部に対して鈍角をなす側面とを含む、請求項1に記載の有機発光表示装置。
- 前記第1の深さは、前記封止基板の前記アクティブ領域の厚さの0.1倍〜0.6倍である、請求項3に記載の有機発光表示装置。
- 前記凹部において、前記側面が前記底部に対してなす前記鈍角は125°〜145°である、請求項3に記載の有機発光表示装置。
- 前記充填シールパターンの垂直断面積は、前記充填シールパターンと連結された前記シールパターンの断面積の0.1倍〜0.4倍である、請求項1に記載の有機発光表示装置。
- 前記サブピクセルは、前記基板上に、少なくとも一つの薄膜トランジスタと、前記薄膜トランジスタを覆うオーバーコート層と、前記オーバーコート層上に前記薄膜トランジスタと電気的に連結されるように形成され、第1電極、有機発光層及び第2電極が積層されてなる有機発光ダイオードとを含む、請求項1に記載の有機発光表示装置。
- 前記サブピクセルの各々に対応して、前記封止基板上にカラーフィルター層をさらに含む、請求項7に記載の有機発光表示装置。
- 前記基板上に、前記有機発光ダイオードを覆う保護膜をさらに含み、
前記保護膜は、前記シールパターンの幅と一部が重畳する、請求項7又は8に記載の有機発光表示装置。 - 前記基板と前記封止基板との間の前記シールパターンの内側領域にフィル材をさらに含む、請求項7又は8に記載の有機発光表示装置。
- 複数サブピクセルを含む第1アクティブ領域と前記第1アクティブ領域の周りの第1非アクティブ領域を有する基板を準備するステップと、
前記基板の前記第1アクティブ領域及び前記第1非アクティブ領域にそれぞれ対応して、第2アクティブ領域及び第2非アクティブ領域を有する封止基板を準備するステップと、
前記第2非アクティブ領域の一部に凹部を設けるステップと、
前記凹部に対応する始点及び終点を有する閉ループ内にシールパターン物質を塗布するステップと、
前記基板上に前記シールパターン物質が対向するように前記基板と前記封止基板とを合着するステップと、
を備える有機発光表示装置の製造方法。 - 前記基板と前記封止基板を合着するステップにおいて、
前記シールパターン物質で前記凹部を満たしてなる充填シールパターンと、
前記充填シールパターンと重畳し、非アクティブ領域に同一の高さを有するシールパターンとを形成する、請求項11に記載の有機発光表示装置の製造方法。 - 前記シールパターン物質を塗布するステップにおいて、
前記シールパターン物質は、前記始点と前記終点に対応して前記凹部を2回通る、請求項11に記載の有機発光表示装置の製造方法。 - 前記凹部を設けるステップにおいては、
前記封止基板に、第1の深さの底部と、前記底部と前記封止基板の内側面の間に前記底部に対して鈍角をなす側面とを備えるように前記凹部を形成する、請求項11に記載の有機発光表示装置の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0176287 | 2017-12-20 | ||
KR1020170176287A KR102515630B1 (ko) | 2017-12-20 | 2017-12-20 | 유기 발광 표시 장치 및 이의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019114534A true JP2019114534A (ja) | 2019-07-11 |
JP6817277B2 JP6817277B2 (ja) | 2021-01-20 |
Family
ID=64606744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018226338A Active JP6817277B2 (ja) | 2017-12-20 | 2018-12-03 | 有機発光表示装置及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10930882B2 (ja) |
EP (1) | EP3503237B1 (ja) |
JP (1) | JP6817277B2 (ja) |
KR (1) | KR102515630B1 (ja) |
CN (1) | CN109994524B (ja) |
TW (1) | TWI686970B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110350013B (zh) * | 2019-07-15 | 2021-09-14 | 京东方科技集团股份有限公司 | 显示装置、显示面板及其制造方法 |
CN110635062B (zh) * | 2019-08-30 | 2021-03-16 | 武汉华星光电半导体显示技术有限公司 | 有机发光二极管显示面板 |
TWI786834B (zh) * | 2021-09-17 | 2022-12-11 | 智晶光電股份有限公司 | 可撓式有機發光二極體封裝結構 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009059532A (ja) * | 2007-08-30 | 2009-03-19 | Toshiba Matsushita Display Technology Co Ltd | 有機el表示装置 |
JP2010055918A (ja) * | 2008-08-28 | 2010-03-11 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
JP2011128481A (ja) * | 2009-12-21 | 2011-06-30 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
CN202145251U (zh) * | 2011-07-22 | 2012-02-15 | 北京京东方光电科技有限公司 | 液晶显示面板 |
US20150028307A1 (en) * | 2013-07-29 | 2015-01-29 | Lg Display Co., Ltd. | Organic light emitting display |
US20170179425A1 (en) * | 2014-11-17 | 2017-06-22 | Boe Technology Group Co., Ltd. | Package substrate and manufacturing method thereof, and oled display device |
KR20170071282A (ko) * | 2015-12-15 | 2017-06-23 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002329576A (ja) * | 2001-04-27 | 2002-11-15 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
JP2003257626A (ja) * | 2002-03-04 | 2003-09-12 | Sanyo Electric Co Ltd | 表示装置及びその製造方法 |
KR100683407B1 (ko) * | 2006-03-13 | 2007-02-22 | 삼성전자주식회사 | 표시장치와 이의 제조방법 |
KR101233144B1 (ko) * | 2006-06-12 | 2013-02-14 | 엘지디스플레이 주식회사 | 유기전계 발광소자 및 그 제조 방법 |
KR100722118B1 (ko) * | 2006-09-04 | 2007-05-25 | 삼성에스디아이 주식회사 | 유기전계발광 표시 장치 |
KR20110007654A (ko) * | 2009-07-17 | 2011-01-25 | 엘지디스플레이 주식회사 | 유기전계 발광소자 및 그 제조 방법 |
KR101710180B1 (ko) * | 2010-09-02 | 2017-03-09 | 삼성디스플레이 주식회사 | 평판 표시 장치 및 평판 표시 장치용 원장기판 |
JP6429465B2 (ja) * | 2013-03-07 | 2018-11-28 | 株式会社半導体エネルギー研究所 | 装置及びその作製方法 |
KR102388711B1 (ko) * | 2015-04-27 | 2022-04-20 | 삼성디스플레이 주식회사 | 표시 장치 |
CN104851904B (zh) * | 2015-05-13 | 2018-01-19 | 合肥鑫晟光电科技有限公司 | 一种有机电致发光显示面板、其制作方法及显示装置 |
CN105140418A (zh) * | 2015-08-25 | 2015-12-09 | 深圳市华星光电技术有限公司 | 有机发光二极管封装件及包括其的显示装置 |
KR102430578B1 (ko) | 2015-11-30 | 2022-08-09 | 엘지디스플레이 주식회사 | 표시장치와 이의 제조방법 |
KR102504073B1 (ko) * | 2015-12-14 | 2023-02-24 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
KR102466959B1 (ko) * | 2015-12-31 | 2022-11-11 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102407869B1 (ko) * | 2016-02-16 | 2022-06-13 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치와, 이의 제조 방법 |
KR102421577B1 (ko) * | 2016-04-05 | 2022-07-18 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
-
2017
- 2017-12-20 KR KR1020170176287A patent/KR102515630B1/ko active IP Right Grant
-
2018
- 2018-11-27 TW TW107142308A patent/TWI686970B/zh active
- 2018-12-03 JP JP2018226338A patent/JP6817277B2/ja active Active
- 2018-12-04 EP EP18210189.9A patent/EP3503237B1/en active Active
- 2018-12-19 CN CN201811566645.6A patent/CN109994524B/zh active Active
- 2018-12-19 US US16/224,924 patent/US10930882B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009059532A (ja) * | 2007-08-30 | 2009-03-19 | Toshiba Matsushita Display Technology Co Ltd | 有機el表示装置 |
JP2010055918A (ja) * | 2008-08-28 | 2010-03-11 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
JP2011128481A (ja) * | 2009-12-21 | 2011-06-30 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
CN202145251U (zh) * | 2011-07-22 | 2012-02-15 | 北京京东方光电科技有限公司 | 液晶显示面板 |
US20150028307A1 (en) * | 2013-07-29 | 2015-01-29 | Lg Display Co., Ltd. | Organic light emitting display |
US20170179425A1 (en) * | 2014-11-17 | 2017-06-22 | Boe Technology Group Co., Ltd. | Package substrate and manufacturing method thereof, and oled display device |
KR20170071282A (ko) * | 2015-12-15 | 2017-06-23 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
Also Published As
Publication number | Publication date |
---|---|
TWI686970B (zh) | 2020-03-01 |
CN109994524B (zh) | 2023-06-27 |
KR102515630B1 (ko) | 2023-03-29 |
CN109994524A (zh) | 2019-07-09 |
US20190189957A1 (en) | 2019-06-20 |
KR20190074719A (ko) | 2019-06-28 |
JP6817277B2 (ja) | 2021-01-20 |
US10930882B2 (en) | 2021-02-23 |
EP3503237B1 (en) | 2023-04-26 |
EP3503237A1 (en) | 2019-06-26 |
TW201929287A (zh) | 2019-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102582161B1 (ko) | 유기 발광 표시 장치 | |
US9166193B2 (en) | Light emitting device, method of manufacturing the same, and electronic apparatus | |
TWI644425B (zh) | 有機發光顯示裝置 | |
US8363199B2 (en) | Liquid crystal display device | |
JP5189573B2 (ja) | 電気泳動表示素子及びその製造方法 | |
WO2018158953A1 (ja) | 表示装置およびその製造方法 | |
US20110284898A1 (en) | Electro-optic device, method for manufacturing the same, and electronic apparatus | |
JP6817277B2 (ja) | 有機発光表示装置及びその製造方法 | |
JP5961543B2 (ja) | 液晶表示装置及びその製造方法 | |
JPWO2011086624A1 (ja) | 液晶表示装置及びその製造方法 | |
KR102369369B1 (ko) | 유기 발광 표시 장치 및 이의 제조 방법 | |
KR20140089015A (ko) | 표시 장치 및 그 제조 방법 | |
KR20180025058A (ko) | 유기 발광 표시 장치 | |
KR20190047565A (ko) | 표시 장치 | |
JP5143664B2 (ja) | 液晶表示パネル | |
JPH0943616A (ja) | 液晶表示装置 | |
CN107703668A (zh) | 显示装置 | |
KR20120070072A (ko) | 액정 표시 장치 및 그 제조 방법 | |
KR101035915B1 (ko) | 액정 표시 장치 | |
US20230207605A1 (en) | Transparent display device | |
KR20230094856A (ko) | 표시 장치 | |
KR20220080924A (ko) | 전계 발광 표시장치 | |
CN116312263A (zh) | 透明显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181203 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20191017 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191024 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20200124 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200324 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200428 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20200728 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201028 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201126 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201224 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6817277 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |