JP2019087605A - Substrate delivery system and substrate delivery method - Google Patents

Abstract

To provide a substrate delivery system and a substrate delivery method capable of preventing a substrate from being scratched when being delivered between multiple lifting members and a support part, while improving throughput of substrate processing, and capable of restraining increase in manufacturing cost of the substrate.SOLUTION: A substrate is delivered between a support part S and multiple lift pins 31, by movement of a coupling member 32 in the vertical direction. In order to set the travel speed of the coupling member 32 at the time of delivering the substrate, a setting member 90 is placed on the support part S. In this state, the coupling member 32 ascends so that the setting member 90 on the support part S is delivered onto the multiple lift pins 31. A reference position is determined base on the value of a pressure applied from the multiple lift pins 31 to the setting member 90, and a speed limit range including the reference position is determined. Travel speed of the coupling member 32 is set so that the travel speed in the speed limit range becomes lower than the travel speed on the outside of the speed limit range.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate delivery system and a substrate delivery method for delivering a substrate between a support portion and a plurality of elevating members.

  Substrate for FPD (Flat Panel Display) such as semiconductor substrate, liquid crystal display device or organic EL (Electro Luminescence) display device, substrate for optical disk, substrate for magnetic disk, substrate for magneto-optical disk, substrate for photomask, substrate for ceramic, solar substrate A heat treatment apparatus is used to heat treat various substrates such as a battery substrate.

  As an example of the heat treatment apparatus, the heat treatment unit described in Patent Document 1 includes a temperature control plate and a lifting device. A plurality of substrate mounting pieces are provided on the upper surface of the temperature control plate. The lifting and lowering apparatus includes a plurality of substrate lifting and lowering pins provided to be able to be lifted and lowered with respect to the temperature control plate.

  In the heat treatment unit, in a state in which the plurality of substrate elevating pins project upward from the temperature control plate, the substrates fed by the transfer device are passed over the upper end portions of the plurality of substrate elevating pins. Thereafter, the plurality of substrate elevating pins are lowered such that the upper ends of the plurality of substrate elevating pins are positioned below the upper ends of the plurality of substrate mounting pieces. As a result, the substrates supported by the plurality of substrate elevating pins are passed over the plurality of substrate mounting pieces of the temperature control plate. In this state, the substrate is heat-treated by the temperature control plate.

  When the heat treatment is completed, the plurality of substrate elevating pins are raised such that the upper ends of the plurality of substrate elevating pins are positioned above the upper ends of the plurality of substrate mounting pieces. Thus, the heat-treated substrate supported by the plurality of substrate elevating pins is supported by the upper end portions of the plurality of substrate elevating pins. Thereafter, the heat-treated substrate is received by the transfer device and transferred to another processing unit.

JP 2005-117007 A

  In the above heat treatment unit, the throughput of substrate processing can be improved by increasing the operation speed of the plurality of substrate elevating pins. On the other hand, when the operation speed of the plurality of substrate elevating pins is high, for example, when a substrate is transferred from the plurality of substrate elevating pins onto the plurality of substrate mounting pieces, the impact is caused when the substrate and the plurality of substrate mounting pieces contact. The substrate may be scratched.

  In order to prevent the substrate from being scratched, it is conceivable to reduce the operating speed of the plurality of substrate elevating pins immediately before the substrate and the plurality of substrate mounting pieces come in contact with each other. However, since there is an error in the positional relationship between the plurality of substrate elevating pins and the plurality of substrate mounting pieces for each heat treatment unit, the plurality of substrate elevating pins when the substrate and the plurality of substrate mounting pieces contact each other. It is difficult to know the exact position.

  On the other hand, the operation of adjusting the timing to reduce the moving speed while checking whether the substrate actually passed from the plurality of substrate lift pins to the plurality of substrate placing pieces is scratched is complicated and takes a long time It takes Therefore, the manufacturing cost of the substrate is increased.

  An object of the present invention is to improve substrate processing throughput while preventing generation of scratches on a substrate at the time of delivery of a substrate between a plurality of lifting members and a support, and also to increase the manufacturing cost of the substrate A substrate delivery system and a substrate delivery method capable of suppressing

  (1) The substrate delivery system according to the first aspect of the present invention comprises a support portion configured to support the lower surface of the substrate at the time of processing the substrate, and a plurality of three or more having upper ends capable of supporting the lower surface of the substrate. A plurality of elevators are provided at the time of delivery of a substrate between a support member and a plurality of lift members, and a connection member configured to connect the lift members and to connect the plurality of lift members and to be movable in the vertical direction with respect to the support portion. A delivery drive for moving the connecting member so that the upper end of the member moves between a position above the upper end of the support and a position below the upper end of the support, and a plurality of lifting members A setting member configured to be supportable, and a moving speed of a detection unit and a coupling member that detect pressure applied to a plurality of portions of the setting member from the plurality of elevating members when the setting member is supported by the plurality of elevating members. When setting The upper end portions of the plurality of elevating members move from a position below the upper end portion of the support portion to a position above the upper end portion of the support portion while the setting member is supported by the support portion by controlling the drive portion Thus, while the movement control unit for moving the connection member and the movement of the connection member by the movement control unit, the plurality of pressures applied to the plurality of portions of the setting member from the plurality of elevation members based on the output signal of the detection unit It is determined whether or not the value of each has reached a plurality of predetermined reference pressure values, and the vertical position of the connecting member when each of the plurality of pressure values reaches a plurality of reference pressure values is used as a reference position. And a range determination unit which determines a partial range including the determined reference position of the movement range of the connecting member at the time of delivery of the substrate as the speed limit range, and A moving speed setting unit for setting a moving speed of the connecting member at the time of delivery of the substrate such that the moving speed of the connecting member is lower than the moving speed of the connecting member outside the speed limit range; And a delivery control unit configured to control the delivery drive unit such that the connecting member moves at the moving speed set by the setting unit.

  In the substrate delivery system, the setting member is supported by the support when setting the moving speed of the connecting member. In this state, the connecting member is moved such that the upper ends of the plurality of elevating members move from a position below the upper end of the support to a position above the upper end of the support.

  In this case, when the upper ends of the plurality of elevating members are positioned at the same height as the upper end of the support, the upper ends of the plurality of elevating members respectively contact the plurality of portions of the lower surface of the setting member. Thereby, pressure is applied to the portions of the setting member. The position of the connecting member in the vertical direction when the plurality of elevating members contact the setting member is determined based on whether or not the plurality of pressure values applied to the plurality of portions of the setting member has reached the plurality of reference pressure values. It is accurately determined as the reference position. A speed limit range including the determined reference position is determined. Further, the moving speed of the connecting member at the time of delivery of the substrate is set such that the moving speed of the connecting member within the speed limit range is lower than the moving speed of the connecting member outside the speed limit range.

  At the time of delivery of the substrate, the delivery drive unit is controlled such that the connecting member moves at the set moving speed. In this case, when the connecting member moves in the speed limit range at a low moving speed, the support portion or the plurality of elevating members contact the lower surface of the substrate. Therefore, since the impact generated by the contact of the support portion or the plurality of elevating members with the lower surface of the substrate is alleviated, the generation of scratches on the lower surface of the substrate is prevented. On the other hand, since the connecting member moves out of the speed limit range at a high moving speed, the time required for delivery of the substrate is shortened.

  Furthermore, according to the above configuration, the vertical position of the connecting member at the time when the plurality of lifting members contact the setting member is the reference position regardless of the error in the positional relationship between the support portion and the plurality of lifting members. The speed limit range is determined as Thereby, the moving speed of the setting member can be changed based on the speed limit range. Therefore, it is not necessary to adjust the timing for reducing the moving speed of the substrate while checking whether or not the substrate actually passed from the plurality of elevating members to the support portion is actually scratched.

  As a result, while improving the throughput of substrate processing, it is possible to prevent the substrate from being scratched during delivery of the substrate between the plurality of support members and the support portion, and to suppress an increase in the manufacturing cost of the substrate. It is possible to

  (2) The substrate delivery system performs the plurality of reference pressure values based on the plurality of pressure values respectively applied to the plurality of portions of the setting member from the plurality of elevation members in a state where the setting member is supported by the plurality of elevation members. It may further comprise a pressure determination unit to determine.

  In this case, the plurality of reference pressure values are equal to the values of the plurality of pressures respectively applied to the plurality of portions of the setting member from the plurality of elevating members in a state where the setting member is actually supported by the plurality of elevating members. Thereby, the reference position of the connecting member can be accurately determined based on the plurality of reference pressure values.

  (3) The range determination unit determines the speed limit range when the connecting member moves down for delivery of the substrate as the descent speed limit range, and the upper limit of the descent speed limit range is located above the reference position, The moving speed setting unit sets the moving speed of the connecting member such that the moving speed of the connecting member when moving down in the falling speed limit range is lower than the moving speed of the connecting member when moving down outside the speed limit range. You may

  When the substrate is supported by the plurality of elevation members at a position above the upper end portion of the support portion, the substrate is lowered by lowering the upper end portions of the plurality of elevation members to a position below the upper end portion of the support portion. A plurality of lifting members are passed to the support.

  According to the above configuration, the upper limit of the falling speed limitation range is located above the reference position. As a result, even when the moving speed when the connecting member descends outside the descent speed limit range is set high, the descent speed of the connecting member from the upper limit position of the descent speed limit range to the reference position is reached The moving speed of the connecting member can be made sufficiently low. Therefore, the throughput of substrate processing can be improved, and the generation of scratches on the substrate can be prevented.

  (4) The range determination unit determines the speed limit range when the connecting member ascends to transfer the substrate as the increase speed limit range, and the lower limit of the increase speed limit range is located below the reference position, The moving speed setting unit sets the moving speed of the connecting member such that the moving speed of the connecting member when rising within the rising speed limit range is lower than the moving speed of the connecting member when rising outside the rising speed limit range. It may be set.

  When the upper end portion of the support portion is located below the upper end portion of the support portion and the substrate is supported by the support portion, the upper end portions of the plurality of elevating members rise to a position above the upper end portion of the support portion Thus, the substrate is transferred from the support to the plurality of lifting members.

  According to the above configuration, the lower limit of the rising speed limitation range is located below the reference position. As a result, even when the moving speed when the connecting member rises outside the rising speed limit range is set high, the connecting member moves up to reach the reference position from the position at the lower limit of the rising speed limit range. The moving speed of the connecting member can be made sufficiently low. Therefore, the throughput of substrate processing can be improved, and the generation of scratches on the substrate can be prevented.

  (5) The setting member may have the same outer shape as the substrate.

  In this case, since the setting member has the same shape as the substrate, at the time of setting the moving speed of the connection member, the support and the plurality of elevations are close to a case where the substrate is delivered between the support and the plurality of elevation members. Delivery of the setting member to and from the member is performed. Therefore, the moving speed of the connecting member can be set more easily and appropriately.

  (6) The setting member may be formed of resin.

  In this case, since the setting member is less likely to be damaged compared to the substrate, the setting member is prevented from being damaged when setting the moving speed.

  (7) The supporting portion is provided by a flat supporting surface, a plurality of projecting members provided to project upward from the supporting surface and capable of supporting the lower surface of the substrate, and supported by the plurality of projecting members And a heat treatment mechanism for heat treating the substrate.

  In this case, the substrate is prevented from being damaged by the contact between the substrate and the plurality of projecting members, so that the substrate is prevented from being damaged by applying the heat treatment to the substrate where the film is damaged. . In addition, since the substrate is prevented from being damaged by the contact between the substrate and the plurality of elevating members, breakage of the substrate after heat treatment is suppressed.

  (8) In the substrate delivery method according to the second aspect of the present invention, there is provided a supporting portion configured to support the lower surface of the substrate at the time of processing the substrate, and a plurality of three or more elevations each having an upper end capable of supporting the lower surface of the substrate. A substrate delivery method for delivering a substrate to and from a member, wherein a plurality of elevating members are connected by a connecting member configured to be movable in the vertical direction with respect to a support portion, and the connecting member is supported The upper end of the plurality of elevating members moves between a position above the upper end of the support and a position below the upper end of the support when the substrate is transferred between the unit and the plurality of elevating members The substrate delivery method includes the steps of supporting the setting member configured to be supported by the plurality of lifting members by the support when setting the moving speed of the connection member, and the setting member being supported by the support The upper end of a plurality of elevating members Moving the connecting member such that the moving member moves from a position below the upper end of the support to a position above the upper end of the support, and the setting member is supported by a plurality of lifting members Detecting the pressure applied to the plurality of portions of the setting member from the elevating members, and while moving the connecting member, based on the detection result of the detecting step, the plurality of elevating members to the plurality of portions of the setting member It is determined whether or not the plurality of pressure values to be applied has reached a plurality of predetermined reference pressure values respectively, and the vertical direction of the connecting member when the plurality of pressure values have respectively reached a plurality of reference pressure values And determining a partial range including the determined reference position of the movement range of the connecting member at the time of delivery of the substrate as the speed limit range. Setting the moving speed of the connecting member at the time of delivery of the substrate such that the moving speed of the connecting member within the speed limit range is lower than the moving speed of the connecting member outside the speed limit range; Moving the connecting member so that the connecting member moves at the moving speed set by the setting step.

  In the substrate delivery method, the setting member is supported by the support when setting the moving speed of the connecting member. In this state, the connecting member is moved such that the upper ends of the plurality of elevating members move from a position below the upper end of the support to a position above the upper end of the support.

  In this case, when the upper ends of the plurality of elevating members are positioned at the same height as the upper end of the support, the upper ends of the plurality of elevating members respectively contact the plurality of portions of the lower surface of the setting member. Thereby, pressure is applied to the portions of the setting member. The position of the connecting member in the vertical direction when the plurality of elevating members contact the setting member is determined based on whether or not the plurality of pressure values applied to the plurality of portions of the setting member has reached the plurality of reference pressure values. It is accurately determined as the reference position. A speed limit range including the determined reference position is determined. Further, the moving speed of the connecting member at the time of delivery of the substrate is set such that the moving speed of the connecting member within the speed limit range is lower than the moving speed of the connecting member outside the speed limit range.

  At the time of delivery of the substrate, the delivery drive unit is controlled such that the connecting member moves at the set moving speed. In this case, when the connecting member moves in the speed limit range at a low moving speed, the support portion or the plurality of elevating members contact the lower surface of the substrate. Therefore, since the impact generated by the contact of the support portion or the plurality of elevating members with the lower surface of the substrate is alleviated, the generation of scratches on the lower surface of the substrate is prevented. On the other hand, since the connecting member moves out of the speed limit range at a high moving speed, the time required for delivery of the substrate is shortened.

  Furthermore, according to the above configuration, the vertical position of the connecting member at the time when the plurality of lifting members contact the setting member is the reference position regardless of the error in the positional relationship between the support portion and the plurality of lifting members. The speed limit range is determined as Thereby, the moving speed of the setting member can be changed based on the speed limit range. Therefore, it is not necessary to adjust the timing for reducing the moving speed of the substrate while checking whether or not the substrate actually passed from the plurality of elevating members to the support portion is actually scratched.

  As a result, while improving the throughput of substrate processing, it is possible to prevent the substrate from being scratched during delivery of the substrate between the plurality of support members and the support portion, and to suppress an increase in the manufacturing cost of the substrate. It is possible to

  According to the present invention, while improving the throughput of substrate processing, it is possible to prevent the substrate from being scratched during delivery of the substrate between the plurality of lifting members and the support portion, and at the same time the manufacturing cost of the substrate is increased. It is possible to suppress the increase.

It is a typical side view showing the composition of the heat treatment equipment concerning the 1 embodiment of the present invention. It is a schematic plan view of the heat processing apparatus of FIG. It is a schematic plan view of the setting member of FIG. 1, and a transmitter. It is a typical side view of the setting member of FIG. 1, and a transmitter. It is a schematic side view which shows the specific setting example of the moving speed of the connection member at the time of delivery of a board | substrate. It is a schematic side view which shows the specific setting example of the moving speed of the connection member at the time of delivery of a board | substrate. It is a schematic side view which shows the specific setting example of the moving speed of the connection member at the time of delivery of a board | substrate. It is a schematic side view which shows the specific setting example of the moving speed of the connection member at the time of delivery of a board | substrate. It is a schematic side view which shows the specific setting example of the moving speed of the connection member at the time of delivery of a board | substrate. It is a schematic side view which shows the specific setting example of the moving speed of the connection member at the time of delivery of a board | substrate. It is a typical side view showing the state where a substrate is passed on a support part from a plurality of elevating pins by descent of a connecting member after setting of moving speed of a connecting member. It is a typical side view showing the state where a substrate is passed on a plurality of raising and lowering pins from a supporter by rising of a connecting member after setting of moving speed of a connecting member. It is a flowchart which shows an example of a movement speed setting process. It is a schematic block diagram which shows an example of a substrate processing apparatus provided with the heat processing apparatus of FIG.

  Hereinafter, a substrate delivery system and a substrate delivery method according to an embodiment of the present invention will be described using the drawings. In the following description, the substrate refers to a substrate for an FPD (Flat Panel Display) such as a semiconductor substrate, a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, A photomask substrate, a ceramic substrate, a solar cell substrate or the like. In the following description, a heat treatment apparatus that heats a substrate will be described as an example of the substrate delivery system.

(1) Configuration of Heat Treatment Apparatus FIG. 1 is a schematic side view showing the configuration of a heat treatment apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic plan view of the heat treatment apparatus 100 of FIG. As shown in FIG. 1, the heat treatment apparatus 100 mainly includes a support portion S, an elevation device 30, a control device 40, a transmission device 60, a reception device 70, and a setting member 90. In FIG. 2, among the plurality of components shown in FIG. 1, the control device 40, the transmission device 60, and the reception device 70 are not shown.

  The support portion S includes a heat treatment plate 10, a plurality of projecting members 11, a plurality of guide members 12 and a heating element 20, and is used as a hot plate. The heat treatment plate 10 is, for example, a heat transfer plate having a disk shape, and has an outer diameter larger than the outer diameter of a substrate to be subjected to heat treatment. The heat treatment plate 10 is provided with a heating element 20. The heating element 20 is formed of, for example, a mica heater or a peltier element. The heat generating drive circuit 21 is connected to the heat generating body 20. The heat generation drive circuit 21 drives the heat generating body 20 based on the control of the temperature adjustment unit 46 described later. As a result, the heating element 20 generates heat during the heat treatment of the substrate.

  As shown in FIG. 2, on the flat upper surface of the heat treatment plate 10, a plurality (10 in this example) of projecting members 11 and a plurality (4 in this example) of guide members 12 are provided.

  The plurality of projecting members 11 are discretely disposed in the central region excluding the outer peripheral edge and its vicinity of the upper surface of the heat treatment plate 10, and supports the substrate to be processed or the lower surface of the setting member 90 described later. Each projecting member 11 is a spherical proximity ball, and is formed of, for example, a ceramic.

  The plurality of guide members 12 are arranged at equal angular intervals on the periphery of the upper surface of the heat treatment plate 10. At the upper part of each guide member 12, when the substrate or setting member 90 is passed from the plurality of elevation pins 31 described later to the plurality of projecting members 11, the outer peripheral end of the substrate or setting member 90 is located at a predetermined position. An inclined surface for guiding is formed. This prevents the substrate or the setting member 90 from being supported by the plurality of projecting members 11 in a state of being deviated from the predetermined position. Each guide member 12 is formed of, for example, a resin having high heat resistance such as PEEK (polyether ketone).

  The heat treatment plate 10 is formed with a plurality of (three in this example) through holes 13 penetrating in the thickness direction. The plurality of through holes 13 are formed at equal angular intervals on a predetermined imaginary circle based on the center of the heat treatment plate 10.

  As shown in FIG. 1, the lifting device 30 includes a plurality of (three in this example) lifting pins 31, a connecting member 32, a feed shaft 33, a motor 34 and a motor drive circuit 35. The plurality of lifting pins 31 are rod-like members that can be inserted into the plurality of through holes 13 formed in the heat treatment plate 10, and are formed of, for example, ceramic. Further, the plurality of lifting pins 31 are mutually connected by the connecting member 32 and extend in the vertical direction in a state in which some of the plurality of lifting pins 31 are respectively inserted into the plurality of through holes 13 of the heat treatment plate 10 It is held.

  In the vicinity of the heat treatment plate 10, a feed shaft 33 extending in the vertical direction, a motor 34 and a motor drive circuit 35 are provided. The feed shaft 33 is, for example, a ball screw, and is connected to the rotation shaft of the motor 34. In this state, a part of the connecting member 32 is attached to the feed shaft 33. Further, a guide member (not shown) for guiding the connecting member 32 is attached to the connecting member 32 so that the connecting member 32 moves up and down along the feed shaft 33 when the feed shaft 33 rotates.

  The motor drive circuit 35 drives the motor 34 based on the control of the movement control unit 44 or the delivery control unit 45 described later. As a result, the feed shaft 33 rotates in one direction or the opposite direction. As the feed shaft 33 rotates in one direction, the plurality of lifting pins 31 ascend (or descend) with the connecting member 32. As the feed shaft 33 rotates in the reverse direction, the plurality of elevation pins 31 move down (or rise) together with the connecting member 32.

  In this case, the moving speeds of the plurality of lifting pins 31 and the connecting member 32 depend on the rotational speed of the feed shaft 33. The higher the rotational speed of the feed shaft 33, the higher the moving speeds of the plurality of lifting pins 31 and the connecting member 32. On the other hand, as the rotational speed of the feed shaft 33 decreases, the moving speeds of the plurality of elevation pins 31 and the connection member 32 decrease.

  In the present embodiment, a stepping motor is used as the motor 34. The motor 34 incorporates an encoder (not shown). An output signal from the encoder of the motor 34 is given to a position detection unit 43 described later.

  In the heat treatment apparatus 100 according to the present embodiment, it is possible to set the moving speed in the vertical direction of the connection member 32 at the time of delivery of the substrate between the support portion S and the plurality of elevation pins 31. The transmitter 60, the receiver 70 and the setting member 90 are used to set the moving speed of the connecting member 32. 3 is a schematic plan view of the setting member 90 and the transmission device 60 of FIG. 1, and FIG. 4 is a schematic side view of the setting member 90 and the transmission device 60 of FIG.

  As shown in FIGS. 3 and 4, the setting member 90 has a disk shape, and is formed of, for example, a resin having high heat resistance such as PEEK (polyether ketone). The outer shape of the setting member 90 is formed to be substantially the same as the outer shape of the substrate to be processed in the heat treatment apparatus 100. For example, when the outer diameter of the substrate to be processed is 300 mm, the outer diameter of the setting member 90 is also 300 mm.

  The setting member 90 has one surface 90a and the other surface 90b. When setting the moving speed of the connecting member 32, the setting member 90 is supported by the support portion S or the plurality of lifting pins 31 such that the one surface 90a faces upward and the other surface 90b faces downward.

  Here, on the other surface 90b of the setting member 90, as shown in FIG. 4, when setting the moving speed of the connecting member 32, plural (three in this example) should be supported by the plurality of lifting pins 31 of FIG. The supported portion 91 of is fixed. On one surface 90 a of the setting member 90, a plurality of (three in this example) concave portions 92 are formed in a plurality of portions overlapping the plurality of supported portions 91.

  A plurality of pressure sensors 99 are attached to the bottom of the plurality of concave portions 92 so as to be in contact with each other. The pressure sensor 99 of this example is a sensor whose resistance value changes according to the magnitude of the pressure applied to the pressure sensor 99. More specifically, the pressure sensor 99 is a sensor whose resistance decreases as the pressure applied to the pressure sensor 99 increases, and increases as the pressure applied to the pressure sensor 99 decreases. The transmitting device 60 is further attached to the setting member 90. The transmitting device 60 includes a signal output circuit 61, a transmitting circuit 62, and a transmitting antenna 63, as shown in FIG.

  The signal output circuit 61 is electrically connected to the plurality of pressure sensors 99, and outputs an electrical signal corresponding to the resistance value of the plurality of pressure sensors 99. The transmission circuit 62 wirelessly transmits the electric signal output from the signal output circuit 61 as the output signal of the plurality of pressure sensors 99 to the reception device 70 of FIG. 1 through the transmission antenna 63.

  The receiving device 70 includes a receiving antenna and a receiving circuit. As shown in FIG. 1, the receiving device 70 receives the output signals of the plurality of pressure sensors 99 wirelessly transmitted from the transmitting device 60 by the receiving circuit through the receiving antenna, and supplies the signals to the control device 40.

  The controller 40 includes a CPU (central processing unit), a RAM (random access memory) and a ROM (read only memory), and the pressure detector 41, the position determiner 42, the position detector 43, the movement controller 44, A delivery control unit 45, a temperature adjustment unit 46, a pressure determination unit 47, a range determination unit 48, a moving speed setting unit 49, and a storage unit 50 are provided. In the control device 40, each function unit described above is realized by the CPU executing a computer program stored in the ROM or another storage medium. Note that some or all of the functional components of the control device 40 may be realized by hardware such as an electronic circuit.

  The pressure detection unit 41 detects a plurality of pressures respectively applied to the plurality of supported portions 91 of the setting member 90 from the plurality of elevation pins 31 based on the output signals of the plurality of pressure sensors 99 supplied from the receiving device 70. .

  As described later, when the setting of the moving speed of the connecting member 32 is started, the setting member 90 is supported by the plurality of lifting pins 31 in the initial state. In this state, the pressure determination unit 47 determines, as the plurality of reference pressure values, values of the plurality of pressures respectively applied to the plurality of supported portions 91 of the setting member 90 from the plurality of elevation pins 31. At this time, the storage unit 50 stores a plurality of determined reference pressure values.

  The position detection unit 43 detects the vertical position of the connecting member 32 with respect to the heat treatment plate 10 based on the output signal from the encoder of the motor 34.

  As described later, at the time of setting the moving speed of the connecting member 32, the setting member 90 is supported by the support portion S after the plurality of reference pressure values are determined. In this state, the movement control unit 44 controls the motor drive circuit 35 so that the upper end portions of the plurality of elevation pins 31 are higher than the upper end portions of the support portion S from the position below the upper end portions of the support portion S. The connecting member 32 is raised to move to the position of.

  The position determination unit 42 sets values of a plurality of pressures applied to the plurality of supported portions 91 of the setting member 90 based on the detection result of the pressure detection unit 41 while the connection control unit 44 lifts the connection member 32. It is determined whether or not each of the plurality of reference pressure values determined has been reached. Further, based on the detection result of the position detection unit 43, the position determination unit 42 determines the vertical position of the connecting member 32 when the plurality of pressure values reach the plurality of reference pressure values as the reference position. .

  The range determination unit 48 determines a partial range including the reference position determined by the position determination unit 42 in the movement range of the connecting member 32 at the time of delivery of the substrate as the speed limit range. Details of the speed limit range will be described later.

  The movement speed setting unit 49 moves the movement speed of the connection member 32 at the time of delivery of the substrate such that the movement speed of the connection member 32 within the speed restriction range is lower than the movement speed of the connection member 32 outside the speed restriction range. Set At this time, the storage unit 50 stores the set moving speed of the connecting member 32.

  The delivery control unit 45 controls the motor drive circuit 35 so that the connecting member 32 moves at the set moving speed when transferring the substrate, based on the moving speed stored in the storage unit 50.

  The storage unit 50 stores temperature adjustment information for adjusting the temperature of the heating element 20, in addition to the plurality of reference pressure values, the speed limit range, and the set moving speed. The temperature adjustment unit 46 controls the heat generation drive circuit 21 based on the temperature adjustment information.

(2) Setting of Moving Speed of Connecting Member 32 FIGS. 5 to 10 are schematic side views showing a specific setting example of the moving speed of the connecting member 32 at the time of delivery of a substrate. In the following description, the highest position in the movable range in the vertical direction of the connecting member 32 is called the upper position PA, and the lowest position in the movable range in the vertical direction of the connecting member 32 is called the lower position PB.

  First, as shown in FIG. 5, the connecting member 32 moves to the upper position PA. The upper end portions of the plurality of lifting pins 31 are positioned above the upper end portions of the plurality of projecting members 11 of the support portion S in a state where the connecting member 32 is at the upper position PA.

  Next, as shown in FIG. 6, the setting member 90 of FIG. 3 is placed on the upper end portions of the plurality of lifting pins 31. In this state, pressure is applied to the plurality of supported portions 91 (FIG. 4) of the setting member 90 from the plurality of elevation pins 31 respectively. At this time, the values of the plurality of pressures respectively applied to the plurality of supported portions 91 of the setting member 90 from the plurality of elevation pins 31 are detected based on the output signals of the plurality of pressure sensors 99 of FIG. The plurality of pressure values applied to the setting member 90 are represented, for example, by resistance values of the plurality of pressure sensors 99. The plurality of detected pressure values are determined as a plurality of reference pressure values respectively corresponding to the plurality of supported portions 91 of the setting member 90.

  Next, as shown in FIG. 7, the connecting member 32 is moved from the upper position PA to the lower position PB. During this movement, the setting members 90 supported on the plurality of elevation pins 31 are passed over the plurality of projecting members 11 of the support portion S. The upper end portions of the plurality of lifting pins 31 are positioned below the upper end portions of the plurality of projecting members 11 in the state where the connecting member 32 is in the lower position PB.

  Next, as shown in FIG. 8, the connecting member 32 is lifted from the lower position PB toward the upper position PA. At this time, the motor drive circuit 35 of FIG. 1 drives the motor 34 so as to ascend in a so-called step feed, repeating that the connecting member 32 moves and stops by a predetermined minute distance.

  The upper ends of the plurality of lifting pins 31 contact the plurality of supported portions 91 (FIG. 4) of the setting member 90 by the lifting of the connecting member 32. At this time, the setting member 90 is passed from the plurality of protruding members 11 of the support portion S to the plurality of elevation pins 31, whereby pressure is applied to the plurality of supported portions 91 of the setting member 90 from the plurality of elevation pins 31. . Thus, the output signals of the plurality of pressure sensors 99 in FIG. 3 change before and after the contact between the plurality of elevation pins 31 and the plurality of supported portions 91.

  Therefore, every time the connecting member 32 moves and stops while the connecting member 32 ascends in step feed, in order to grasp the point in time when the plurality of lift pins 31 contact the plurality of supported portions 91 of the setting member 90. Output signals of the plurality of pressure sensors 99 are acquired. Further, based on the output signals of the plurality of pressure sensors 99, the plurality of pressure values respectively applied to the plurality of supported portions 91 of the setting member 90 from the plurality of elevation pins 31 are set to the plurality of reference pressure values determined. It is determined whether it has reached. Further, as shown in FIG. 9, the upper and lower sides of the connecting member 32 when the values of the plurality of pressures applied to the plurality of supported portions 91 of the setting member 90 respectively reach the determined plurality of reference pressure values. The position in the direction is determined as the reference position RP.

  When the reference position RP is determined, the range in which the moving speed of the connecting member 32 should be limited is limited so that the substrate is not scratched when the substrate is transferred between the support portion S and the plurality of lifting pins 31 Determined as a range.

  In the present embodiment, as shown in FIG. 10, the lowering speed limitation range LR1 corresponding to the lowering of the connecting member 32 for the delivery of the substrate is determined between the upper position PA and the lower position PB. . Further, when the connecting member 32 is lifted for the delivery of the substrate, a corresponding rising speed limit range LR2 is determined between the upper position PA and the lower position PB. The vertical distance between each of the falling speed limit range LR1 and the rising speed limit range LR2 is set to a predetermined distance (for example, 0.5 mm).

  Here, the upper limit of the falling speed limit range LR1 is located above the reference position RP, and the lower limit of the falling speed limit range LR1 is located at the reference position RP. The upper limit of the rising speed limit range LR2 is located at the reference position RP, and the lower limit of the rising speed limit range LR2 is located lower than the reference position RP.

  Thereafter, the movement speed of the connection member 32 is lowered so that the movement speed when falling within the descent speed restriction range LR1 at the time of delivery of the substrate is lower than the movement speed when the connection member 32 falls outside the descent speed restriction range LR1. The speed is set. In addition, the movement speed of the connection member 32 is lower than the movement speed when the connection member 32 rises outside the rising speed restriction range LR2 when the movement speed when rising within the rising speed restriction range LR2 during delivery of the substrate is lower. The speed is set.

  In addition, the moving speed at the time of descent | fall of the connection member 32 in descent | fall speed limit range LR1 may be set to a fixed value, and may be set so that it may change in steps or continuously. Further, the moving speed at the time of lowering of the connection member 32 outside the lowering speed limit range LR1 may be set to a constant value, or may be set to change stepwise or continuously. Furthermore, the moving speed at the time of rising of the connection member 32 within the rising speed limit range LR2 may be set to a constant value, or may be set to change stepwise or continuously. Further, the moving speed at the time of rising of the connecting member 32 outside the rising speed limit range LR2 may also be set to a constant value, or may be set to change stepwise or continuously.

  After the moving speed of the connecting member 32 is set as described above, the setting member 90 is removed from the plurality of lifting pins 31 by raising the connecting member 32 to the upper position PA.

  The lower limit of the falling speed limit range LR1 may be located below the reference position RP, and the upper limit of the rising speed limit range LR2 may be located above the reference position RP. Furthermore, a range from the upper limit of the falling speed limit range LR1 to the lower limit of the rising speed limit range LR2 may be used as a common movement limit range when the connecting member 32 moves up and down.

  FIG. 11 is a schematic side view showing a state in which the substrate is passed from the plurality of elevation pins 31 onto the support portion S by lowering the connection member 32 after setting the moving speed of the connection member 32. When the moving speed of the connecting member 32 is set according to the examples of FIGS. 5 to 10, the connecting member 32 is lowered from the upper position PA while the substrate W is placed on the plurality of lifting pins 31. It descends at a relatively high moving speed up to the upper limit of the range LR1.

  Thereafter, the connecting member 32 reduces the moving speed within the descent speed limit range LR1. At this time, since the upper limit of the falling speed limit range LR1 is located above the reference position RP, the moving speed of the connecting member 32 can be sufficiently lowered until the connecting member 32 reaches the reference position RP. Therefore, since the impact generated by the contact of the plurality of projecting members 11 of the support portion S with the lower surface of the substrate W is sufficiently alleviated, the generation of a scratch on the lower surface of the substrate W is prevented.

  In addition, the movement speed of the substrate W decreases near the upper surface of the heat treatment plate 10, whereby generation of a large pressure in the space between the lower surface of the substrate W and the upper surface of the heat treatment plate 10 is prevented. As a result, the substrate W floats on the support portion S, whereby the substrate W is prevented from being supported by the support portion S in a state of being deviated from the position to be originally supported.

  After the substrate W is transferred from the plurality of lifting pins 31 onto the support portion S, the connecting member 32 is lowered at a relatively high moving speed from the reference position RP which is the lower limit of the lowering speed limit range LR1 to the lower position PB. As described above, by setting the moving speed of the connecting member 32 high when falling outside the lowering speed limit range LR1, the time required for delivery of the substrate W is shortened.

  FIG. 12 is a schematic side view showing a state in which the substrate W is passed from the support portion S onto the plurality of elevation pins 31 by raising the connection member 32 after setting the moving speed of the connection member 32. When the moving speed of the connecting member 32 is set according to the examples of FIGS. 5 to 10, the connecting member 32 is lifted from the lower position PB in the rising speed limit range LR2 in a state where the substrate W is placed on the support portion S. Rising at a relatively high moving speed to the lower limit of

  Thereafter, the connecting member 32 reduces the moving speed within the rising speed limit range LR2. At this time, since the lower limit of the rising speed limit range LR2 is located below the reference position RP, the moving speed of the connecting member 32 can be sufficiently lowered until the connecting member 32 reaches the reference position RP. Therefore, since the impact generated by the contact of the plurality of elevation pins 31 with the lower surface of the substrate W is sufficiently alleviated, the generation of a scratch on the lower surface of the substrate W is prevented.

  After the substrate W is delivered from the plurality of projecting members 11 onto the plurality of lifting pins 31, the connecting member 32 is lifted at a relatively high moving speed from the reference position RP which is the upper limit of the rising speed limit range LR2 to the upper position PA. Do. As described above, by setting the moving speed of the connecting member 32 high when rising outside the rising speed limit range LR2, the time required for delivery of the substrate W is shortened.

  In the example shown in FIGS. 11 and 12, the moving range of the connecting member 32 in the vertical direction from the upper position PA to the lower position PB at the time of delivery of the substrate W between the support portion S and the plurality of elevation pins 31 is However, the present invention is not limited thereto. The connecting member 32 is, when delivering the substrate W, from any position below the upper position PA and above the descent speed limit range LR1, above the lower position PB and below the descent speed limit range LR2. The range may be moved to any position.

(3) Moving Speed Setting Process The setting of the moving speed of the connecting member 32 is performed by the moving speed setting process shown below by the control device 40 of FIG. The heat treatment apparatus 100 of FIG. 1 is provided with an operation unit (not shown) for the user to give the control device 40 various processing instructions. The moving speed setting process is performed based on, for example, the operation of the operation unit by the user at the start of use of the heat treatment apparatus 100 or at the time of maintenance of the heat treatment apparatus 100 or the like. FIG. 13 is a flowchart showing an example of the moving speed setting process.

  As shown in FIG. 13, first, the movement control unit 44 of FIG. 1 moves the connecting member 32 to the upper position PA by controlling the motor drive circuit 35 (step S101).

  In this state, the setting member 90 of FIG. 3 is placed on the plurality of elevation pins 31 by the user or the substrate transfer device 450 of FIG. 14 described later. Therefore, the pressure detection unit 41 of FIG. 1 sets a plurality of pressures respectively applied from the plurality of elevation pins 31 to the plurality of supported portions 91 of the setting member 90 based on the output signal supplied from the receiving device 70 at a constant cycle. It detects (step S102). The pressure detection process is continued until the moving speed setting process is completed.

  The process of step S102 may be performed, for example, in response to the operation of the operation unit by the user after the setting member 90 is placed on the plurality of elevation pins 31. Alternatively, the process of step S102 may be continuously performed in a constant cycle while the moving speed setting process is performed.

  Next, the pressure determination unit 47 of FIG. 1 is configured to be applied to the plurality of supported portions 91 of the setting member 90 from the plurality of elevation pins 31 based on the values of the plurality of pressures detected in the process of step S102. The value of pressure is determined as a plurality of reference pressure values (step S103). The determined plurality of reference pressure values are stored in the storage unit 50 of FIG.

  Next, the movement control unit 44 in FIG. 1 moves the connecting member 32 to the lower position PB by controlling the motor drive circuit 35 (step S104). Thereafter, the movement control unit 44 controls the motor drive circuit 35 to position the upper ends of the plurality of lifting pins 31 above the upper end of the support S from the position below the upper end of the support S. The connecting member 32 is raised by step feeding so as to move to the next (step S105).

  The position determination unit 42 illustrated in FIG. 1 is configured to receive the plurality of pressures applied to the plurality of supported portions 91 based on the detection of the plurality of pressures by the pressure detection unit 41 while the connection control unit 44 is moving up. It is determined whether the values have reached the plurality of reference pressure values determined in step S103 (step S106).

  The position determination unit 42 repeats the process of step S106 described above until the values of the plurality of pressures applied to the plurality of supported portions 91 reach the determined plurality of reference pressure values. Further, when the values of the plurality of pressures applied to the plurality of supported portions 91 reach the determined plurality of reference pressure values, the position determination unit 42 is detected by the position detection unit 43 of FIG. 1 at that time. The position in the vertical direction of the connecting member 32 is determined as the reference position (step S107).

  Next, the range determination unit 48 of FIG. 1 determines the speed limit range so as to include the determined reference position (step S108). At this time, the range determination unit 48 individually determines, as the speed limit range, the lowering speed limit range LR1 when the plurality of lifting pins 31 are lowered and the rising speed limit range LR2 when the plurality of lifting pins 31 are rising. You may

  Furthermore, the moving speed setting unit 49 of FIG. 1 is configured such that the moving speed of the connecting member 32 within the determined speed limit range is lower than the moving speed of the connecting member 32 outside the speed limit range. The moving speed of the connecting member 32 at the time of delivery is set (step S109). The moving speed of the set connection member 32 is stored in the storage unit 50 of FIG. After that, the moving speed setting process ends.

  When the substrate W is processed in the heat treatment apparatus 100 after the above moving speed setting process, the delivery control unit 45 of FIG. 1 is performed when the substrate W is transferred between the support portion S and the plurality of elevation pins 31. Controls the motor drive circuit 35. As a result, the connecting member 32 moves up and down at the set moving speed.

(4) Effects (a) In the heat treatment apparatus 100 described above, the connection member 32 is in a state where the setting member 90 is supported by the plurality of projecting members 11 of the support portion S after the plurality of reference pressure values are determined. Ascends from the lower position PB.

  In this case, when the upper ends of the plurality of elevation pins 31 are positioned at the same height as the upper ends of the plurality of projecting members 11, the upper ends of the plurality of elevation pins 31 are respectively supported by the plurality of supported portions 91 of the setting member 90. Contact Thereby, pressure is applied to the plurality of supported portions 91. The vertical direction of the connecting member 32 at the time when the plurality of lifting pins 31 contact the setting member 90 based on whether or not the plurality of pressure values applied to the plurality of supported portions 91 have reached the plurality of reference pressure values. Is accurately determined as the reference position RP. A speed limit range (in the example of FIG. 10, the falling speed limit range LR1 and the rising speed limit range LR2) including the determined reference position is determined.

  Thereafter, the moving speed of the connecting member 32 at the time of delivery of the substrate W is set such that the moving speed of the connecting member within the speed limit range is lower than the moving speed of the connecting member 32 outside the speed limit range.

  At the time of delivery of the substrate W, the connecting member 32 moves at a set moving speed. In this case, when the connecting member 32 moves within the speed limit range at a low moving speed, the support portion S or the plurality of lifting pins 31 contact the lower surface of the substrate W. Therefore, since the impact generated by the contact of the support portion S or the plurality of elevation pins 31 with the lower surface of the substrate W is alleviated, the generation of a scratch on the lower surface of the substrate W is prevented. On the other hand, since the connecting member 32 moves out of the speed limit range at a high moving speed, the time required for delivery of the substrate W is shortened.

  Furthermore, according to the above configuration, the reference position RP is accurately determined and the speed limit range is determined regardless of the error in the positional relationship between the support portion S and the plurality of elevation pins 31. Thus, the moving speed of the setting member 90 can be accurately changed based on the speed limit range. Therefore, the operation of adjusting the timing for reducing the moving speed of the substrate W while checking whether the substrate W passed to the support portion S from the plurality of elevation pins 31 is actually scratched becomes unnecessary.

  As a result of these, while improving the throughput of substrate processing, it is possible to prevent the generation of a scratch on the substrate W at the time of delivery of the substrate W between the support portion S and the plurality of elevation pins 31 and manufacturing of the substrate W It becomes possible to suppress the increase in cost.

  (B) In the present embodiment, the plurality of reference pressure values are equal to the values of the plurality of pressures respectively applied to the plurality of supported portions 91 in a state where the setting member 90 is actually supported by the plurality of lifting pins 31 . Thus, when setting the moving speed of the connecting member 32, the reference position of the setting member 90 can be accurately determined based on the plurality of reference pressure values.

  (C) The setting member 90 has the same shape as the substrate W. Thereby, when setting the moving speed of the connecting member 32, between the support portion S and the plurality of elevation pins 31 in a state close to the case where the substrate W is delivered between the support portion S and the plurality of elevation pins 31. Delivery of the setting member 90 is performed. Therefore, the setting of the moving speed of the connecting member 32 can be performed more easily and appropriately.

  (D) The setting member 90 is formed of resin. In this case, since the setting member 90 is less likely to be damaged compared to the substrate W, the setting member 90 is prevented from being damaged when setting the moving speed of the connecting member 32.

  (E) Output signals of the plurality of pressure sensors 99 provided in the setting member 90 are given to the control device 40 by wireless communication using the transmission device 60 and the reception device 70. Thereby, the moving speed of the connecting member 32 can be set by remote control with a simple configuration.

(5) Substrate Processing Apparatus Comprising the Heat Treatment Apparatus 100 of FIG. 1 FIG. 14 is a schematic block diagram showing an example of a substrate processing apparatus comprising the heat treatment apparatus 100 of FIG. As shown in FIG. 14, the substrate processing apparatus 400 is provided adjacent to the exposure apparatus 500, and includes a control unit 410, a coating processing unit 420, a development processing unit 430, a thermal processing unit 440, and a substrate transfer apparatus 450. The thermal processing unit 440 includes a plurality of thermal processing apparatuses 100 of FIG. 1 that perform thermal processing on the substrate W, and a plurality of thermal processing apparatuses (not shown) that perform thermal processing on the substrate W.

  The control unit 410 includes, for example, a CPU and a memory, or a microcomputer, and controls the operations of the coating processing unit 420, the development processing unit 430, the thermal processing unit 440, and the substrate transfer apparatus 450. Further, the control unit 410 instructs the plurality of heat treatment apparatuses 100 to perform the moving speed setting process in the plurality of heat treatment apparatuses 100 of the heat treatment unit 440 at the start of use of the heat treatment apparatus 100 or at the time of maintenance of the heat treatment apparatus 100. Give to.

  The substrate transfer apparatus 450 transfers the substrate W between the coating processing unit 420, the development processing unit 430, the heat processing unit 440, and the exposure apparatus 500 when the substrate processing apparatus 400 processes the substrate W.

  The coating processing unit 420 forms a resist film on one surface of the unprocessed substrate W (coating processing). The exposure processing is performed in the exposure apparatus 500 on the substrate W after the coating processing on which the resist film is formed. The development processing unit 430 performs the development processing of the substrate W by supplying the developing solution to the substrate W after the exposure processing by the exposure device 500. The thermal processing unit 440 performs thermal processing of the substrate W before and after the coating processing by the coating processing unit 420, the development processing by the development processing unit 430, and the exposure processing by the exposure apparatus 500.

  The coating processing unit 420 may form an antireflective film on the substrate W. In this case, the heat treatment unit 440 may be provided with a processing unit for performing an adhesion strengthening process to improve the adhesion between the substrate W and the antireflective film. In addition, the coating processing unit 420 may form a resist cover film on the substrate W for protecting a resist film formed on the substrate W.

  In the substrate processing apparatus 400 described above, the movement speed setting process is performed in each of the plurality of heat treatment apparatuses 100 of the heat treatment unit 440 before the processing of the substrate W, whereby the substrate W is transferred in each heat treatment apparatus 100. The generation of a scratch on the substrate W is prevented. In addition, by shortening the time required for delivery of the substrate W in each heat treatment apparatus 100, the throughput of the substrate processing is improved. As a result, the yield of the product in the substrate processing apparatus 400 is improved, and the manufacturing cost of the substrate W is reduced.

  Here, in the heat treatment section 440, one setting member 90 (FIG. 3) may be commonly used for two or more heat treatment apparatuses 100. In this case, one setting member 90 is sequentially transferred to the plurality of heat treatment apparatuses 100 by the substrate transfer apparatus 450, and the movement speed setting process is sequentially performed in the plurality of heat treatment apparatuses 100. Thereby, it is not necessary to prepare the number of setting members 90 corresponding to all the heat treatment apparatuses 100.

(6) Other Embodiments (a) Although the above-described embodiment is an example in which the substrate delivery system according to the present invention is applied to the heat treatment apparatus 100 for heat treatment, the substrate delivery system according to the present invention You may apply to the heat processing apparatus for processing.

  For example, the heat treatment apparatus 100 may be provided with a cooling device in place of the heating element 20 of FIG. In this case, the support portion S includes the heat treatment plate 10, the plurality of protruding members 11, the plurality of guide members 12, and the cooling device, and is used as a cooling plate. The cooling device may be configured by, for example, a Peltier element, or may be configured by a pipe that circulates the cooling water.

  Also in the heat treatment apparatus 100 for performing the cooling process on the substrate W, the movement speed setting process can be performed to obtain the same effect as that of the above-described embodiment.

  A plurality of heat treatment apparatuses 100 for performing the cooling process on the substrate W may be provided in the heat treatment unit 440 of FIG. 14 together with the plurality of heat treatment apparatuses 100 for performing the heat treatment on the substrate W. In this case, the yield of products in the substrate processing apparatus 400 of FIG. 14 is further improved, and the manufacturing cost of the substrate W is further reduced.

  (B) The substrate processing apparatus 400 shown in FIG. 14 may include a plurality of substrate transfer apparatuses 450. When a substrate placement unit on which a substrate W is temporarily placed is provided between one substrate transfer device 450 and another substrate transfer device 450, a heat treatment configured to perform a cooling process on the substrate The apparatus 100 may be used as a substrate placement unit. In this case, the movement speed setting process is performed in advance in the substrate mounting unit before the processing of the substrate W, and the same effect as that of the above-described embodiment can be obtained.

  (C) In the above embodiment, a plurality of reference pressure values respectively corresponding to the plurality of supported portions 91 of the setting member 90 are determined based on the output signal of the pressure sensor 99 during the moving speed setting process, The present invention is not limited to this. The plurality of reference pressure values may be predetermined as design values.

  (D) In the above embodiment, the output signal of the pressure sensor 99 is given to the pressure detection unit 41 of the control device 40 by wireless communication using the transmission device 60 and the reception device 70, but the present invention is not limited thereto . The output signals of the plurality of pressure sensors 99 provided in the setting member 90 may be given to the pressure detection unit 41 of the control device 40 by wired communication using a wire cable or an optical fiber cable.

  (E) In the above embodiment, three elevating pins 31 are used as the plurality of elevating pins 31, but the number of the plurality of elevating pins 31 may be three or more, or four. It may be five. In this case, it is preferable that the setting member 90 be provided with a number of pressure sensors 99 respectively corresponding to the plurality of lifting pins 31.

  (F) In the above embodiment, the support portion S has the plurality of projection members 11 for supporting the lower surface of the substrate W on the heat treatment plate 10, but the present invention is not limited to this. A resin sheet-like member for supporting the lower surface of the substrate W may be provided on the upper surface of the heat treatment plate 10 of the support portion S instead of the plurality of projecting members 11.

  In this case, when the substrate W is transferred from the plurality of elevation pins 31 to the support portion S, the substrate W is unlikely to be damaged even if the lower surface of the substrate W contacts the sheet-like member. Therefore, when setting the moving speed of the connecting member 32, only the rising speed limit range LR2 may be determined among the falling speed limit range LR1 and the rising speed limit range LR2. That is, the moving speed of the connection member 32 at the time of lowering may not be reduced. Thereby, the time required for delivery of the substrate W can be further shortened.

  (G) In the above embodiment, the plurality of lifting pins 31 are formed of ceramic, but the present invention is not limited to this. The upper end portions of the plurality of lifting pins 31 may be made of resin or rubber instead of ceramic.

  In this case, when the substrate W is transferred from the support portion S to the plurality of lift pins 31, even if the lower surface of the substrate W contacts the plurality of lift pins 31, the substrate W is unlikely to be scratched. Therefore, at the time of setting the moving speed of the connecting member 32, only the falling speed limit range LR1 may be determined among the falling speed limit range LR1 and the rising speed limit range LR2. That is, the moving speed of the connecting member 32 at the time of rising may not be reduced. Thereby, the time required for delivery of the substrate W can be further shortened.

(7) Correspondence Between Each Component of the Claim and Each Element of Embodiment Hereinafter, an example of the correspondence between each component of the claim and each element of the embodiment will be described. It is not limited to the example.

  In the above embodiment, the support portion S is an example of a support portion, the plurality of elevation pins 31 are examples of a plurality of elevation members, and the connection member 32 is an example of a connection member. The motor drive circuit 35 is an example of a delivery drive unit, the setting member 90 is an example of a setting member, and the plurality of pressure sensors 99, the transmitter 60, the receiver 70, and the pressure detector 41 are examples of a detector.

  The movement control unit 44 is an example of a movement control unit, the position determination unit 42 is an example of a position determination unit, the range determination unit 48 is an example of a range determination unit, and the movement speed setting unit 49 is a movement speed setting. In the example of the unit 49, the speed limit range, the falling speed limit range LR1, and the rising speed limit range LR2 are examples of the speed limit range, the delivery control unit 45 is an example of the delivery control unit, and the heat treatment apparatus 100 delivers the substrate. It is an example of a system.

  Further, the pressure determination unit 47 is an example of a pressure determination unit, the falling speed limit range LR1 is an example of a falling speed limit range, and the rising speed limit range LR2 is an example of a rising speed limit range. Is an example of a support surface, the plurality of projecting members 11 is an example of a plurality of projecting members, and the heating element 20 is an example of a heat treatment mechanism.

  As each component of a claim, other various elements having the configuration or function described in the claim can also be used.

  The present invention can be effectively used for processing of various substrates.

  DESCRIPTION OF SYMBOLS 10 Heat treatment plate 11 Protruding member 12 Guide member 13 Through hole 20 Heating element 21 Heat generation driving circuit 30 Lifting device 31 Lifting pin 31 Connecting member 33 Feeding shaft , 34: motor, 35: motor drive circuit, 40: control device, 41: pressure detection unit, 42: position determination unit, 43: position detection unit, 44: movement control unit, 45: delivery control unit, 46: temperature adjustment 5, 47: pressure determination unit, 48: range determination unit, 49: moving speed setting unit, 50: storage unit, 60: transmission device, 61: signal output circuit, 62: transmission circuit, 63: transmission antenna, 70: reception Device, 90: setting member, 90a: one surface, 90b: other surface, 91: supported portion, 92: concave portion, 99: pressure sensor, 100: heat treatment device, 400: substrate processing device, 410: control unit, 420: Coating processing unit, 430 ... present Processing unit 440 Heat treatment unit 450 Substrate transfer device 500 Exposure device LR1 Falling speed restriction range LR2 Rising speed restriction range PA Upper position PB Lower position RP Reference position S Support part, W ... board

Claims (8)

A support configured to support the lower surface of the substrate during processing of the substrate;
Three or more elevating members each having an upper end capable of supporting the lower surface of the substrate;
A connecting member configured to connect the plurality of elevating members and configured to be movable in the vertical direction with respect to the support portion;
At the time of delivery of the substrate between the supporting portion and the plurality of elevating members, upper ends of the plurality of elevating members are located above the upper end of the supporting portion and below the upper end of the supporting portion. A delivery drive for moving the connecting member to move between the positions;
A setting member configured to be supported by the plurality of elevating members;
When setting the moving speed of the connection member, a detection unit that detects the pressure applied to the plurality of portions of the setting member from the plurality of elevating members when the setting member is supported by the plurality of elevating members In a state where the setting member is supported by the support portion by controlling the delivery drive portion, the upper end portions of the plurality of elevating members are lower than the upper end portion of the support portion than the upper end portion of the support portion A movement control unit for moving the connection member to move to the upper position;
During movement of the connection member by the movement control unit, values of a plurality of pressures respectively applied to the plurality of portions of the setting member from the plurality of elevation members based on an output signal of the detection unit are predetermined. It is determined whether or not each of a plurality of reference pressure values has been reached, and a position at which the vertical position of the connecting member when each of the plurality of pressure values reaches each of the plurality of reference pressure values is determined as a reference position. The decision unit,
A range determination unit which determines a partial range including the determined reference position in the movement range of the connection member at the time of delivery of the substrate as the speed limit range;
Movement for setting the movement speed of the connection member at the time of delivery of the substrate such that the movement speed of the connection member within the speed restriction range is lower than the movement speed of the connection member outside the speed restriction range Speed setting unit,
A delivery control unit configured to control the delivery drive unit such that the connection member is moved at the moving speed set by the moving speed setting unit when the substrate is transferred. The plurality of reference pressure values are determined based on values of a plurality of pressures respectively applied to the plurality of portions of the setting member from the plurality of elevating members while the setting member is supported by the plurality of elevating members. The substrate delivery system according to claim 1, further comprising a pressure determination unit. The range determining unit determines a speed limit range when the connecting member is lowered for delivery of the substrate as a lowering speed limit range.
The upper limit of the falling speed limitation range is located above the reference position,
The moving speed setting unit is configured such that the moving speed of the connecting member when moving down within the lowering speed limit range is lower than the moving speed of the connecting member when moving down outside the speed limit range. The substrate delivery system according to claim 1, wherein the moving speed of the member is set. The range determination unit determines a speed limit range when the connection member is raised for delivery of the substrate as a rising speed limit range.
The lower limit of the rising speed limit range is located below the reference position,
The moving speed setting unit is configured such that the moving speed of the connecting member when rising within the rising speed limit range is lower than the moving speed of the connecting member when rising outside the rising speed limit range. The substrate delivery system according to claim 1, wherein a moving speed of the connecting member is set. The substrate delivery system according to any one of claims 1 to 4, wherein the setting member has the same outer shape as the substrate. The said setting member is a board | substrate delivery system as described in any one of Claims 1-5 formed by resin. The support portion is
A flat support surface,
A plurality of projecting members provided so as to project upward from the support surface and capable of supporting the lower surface of the substrate;
The substrate delivery system according to any one of claims 1 to 6, further comprising: a heat treatment mechanism that performs a heat treatment on the substrate supported by the plurality of projecting members. Substrate delivery for delivering a substrate between a support configured to support the lower surface of the substrate at the time of processing the substrate and a plurality of three or more elevation members each having an upper end capable of supporting the lower surface of the substrate Method,
The plurality of elevating members are connected by a connecting member configured to be movable in the vertical direction with respect to the support portion,
In the connection member, when the substrate is transferred between the support portion and the plurality of elevating members, the upper end portion of the plurality of elevating members is located above the upper end portion of the support portion and the upper end of the support portion Move to move to a position lower than the
The substrate delivery method is
Supporting the setting member configured to be supported by the plurality of raising and lowering members by the support portion at the time of setting the moving speed of the connection member;
In a state where the setting member is supported by the support portion, upper end portions of the plurality of elevating members move from a position below the upper end portion of the support portion to a position above the upper end portion of the support portion Moving the connecting member;
Detecting the pressure applied to the plurality of portions of the setting member from the plurality of elevating members when the setting member is supported by the plurality of elevating members;
A plurality of reference pressures in which a plurality of pressure values respectively applied to the plurality of portions of the setting member from the plurality of elevating members based on the detection result of the detecting step while the connecting member is moving Determining whether each of the plurality of pressure values has reached each of the plurality of reference pressure values, as the reference position.
Determining a partial range including the determined reference position of the movement range of the connecting member at the time of delivery of the substrate as the speed limit range;
Setting the moving speed of the connecting member at the time of delivery of the substrate such that the moving speed of the connecting member within the speed limit range is lower than the moving speed of the connecting member outside the speed limit range When,
Moving the connecting member such that the connecting member moves at the moving speed set in the setting step when transferring the substrate.

Images