TW200405405A - Vertical movement substrate processing apparatus and substrate processing system having the same - Google Patents

Abstract

The present invention provides a kind of substrate processing apparatus that has the function of conveying substrates from one position toward the other position in the processing line, and has the capability of efficiently processing substrate during the conveying operation. The substrate processing apparatus (10) is composed of the frame shape housing (11), the processing mechanism (20) and the vertical movement mechanism (40). The housing (11) is provided with substrate inlet (11a) and substrate outlet (11b) disposed at both upper and lower positions. The processing mechanism (20) is disposed inside the housing (11) and includes the followings: the conveying support-mechanism for accommodating and supporting the substrate conveyed-into from substrate inlet (11a) as well as the substrate expelled from substrate outlet (11b); the support frame platform (21) for supporting the support and convey mechanism; the substrate inclining mechanism for tilting the substrate which is supported by the conveying support mechanism; and the processing-fluid spurting mechanism, which is disposed above the conveying support mechanism for spurting the processing fluid to the substrate that is tilted through the use of substrate inclining mechanism. The vertical movement mechanism (40) supports the processing mechanism (20) and moves it along the vertical direction, so as to make it pass through the substrate inlet (11a) and substrate outlet (11b).

Description

ZUU4U ^ 4U ^ 发明, Description of the invention: [Technical field to which the invention belongs]: Invented a substrate processing device 'for semiconductor wafers, liquid crystal glass substrates, glass substrates for photomasks, glass substrates for soap, etc. The substrate is subjected to predetermined processing while being moved (transported), and a substrate processing system including a plurality of processing apparatuses. [Prior art] ^ For example, in the manufacturing process of the liquid crystal glass substrate, the application of the developing solution =, the application of the peeling solution for peeling the photoresist film = treatment 'is performed during each wet process treatment Treatment and drying In addition, as a treatment farm for each of the above processes,

: The processing device 'is to place the substrate on a conveying roller, and the substrate is conveyed in the horizontal direction by the above-mentioned conveying J for processing. In addition, the substrate processing system shown in Fig. 15 is also constructed by connecting the processing apparatuses in order to continuously perform the above-mentioned processes. Fig. 15 shows the basic structure of a substrate processing unit according to a conventional example. As shown in Fig. 15, the substrate processing system 2000 is composed of a substrate processing unit 2G5 and a substrate transfer unit 21 (). The substrate casting and discharging unit 201 is composed of a mounting table 202 and a transfer mounting i 204, and the second mounting 202 mounts 2Q3 for accommodating a plurality of substrates. In the interior of 3, the substrates are taken out one by one, and the substrate processing unit 205 'is taken out of the substrate processing unit 205 and the substrates that have finished processing 200405405 are stored in the cassette 203. In addition, the transfer device 204 is generally composed of several robot arms (the robot arm can be moved in the lateral direction of the mounting table 202). The substrate processing section 205 includes a first processing section and a second processing arranged in parallel with each other. Section 207i is composed of two processing lines. As shown in FIG. 16, the i-th processing section moves teeth. The second processing section 207 has a plurality of conveying rollers 208 for conveying the ^ plate in the direction of the arrow. The conveying roller 2 can be used. 〇8, while carrying out the predetermined processing. For example, the first processing section 206 is a processing step for etching, and the etchant is applied on the substrate being transported. In addition, the second processing section m is composed of a water washing processing unit ma and a drying processing unit 07b, and the washing water is supplied to the substrate in the water washing processing unit ma, and the drying processing unit 207b supplies a drying gas to the substrate. The substrate transfer unit 210 is configured to A mechanism for transporting the substrate processed by the first processing unit m to the processing unit m, including: a direction switching device 211 for switching the transport direction of the substrate discharged from the first processing unit, and transporting money; Transporting rollers 212 for transporting the slaves in the discharge direction Switching and loading 9: change the substrates discharged from the set 211; and switch 213 'to switch the transfer direction of the substrates transported by the transport unit 212 and transfer the substrates to the second processing unit 207. As shown in FIG. 7, the square & + 4 direction switch 211 includes: a plurality of first conveying rollers 214 for conveying on the conveying roller 2 of the processing unit 2 of the processing unit 7 + ”楫 成 弟 1” Within the same horizontal plane, the base lifter 215 is transported in the same transport direction, and is arranged between the transport surface ^ up and down H114 of the transport report 214, and is used to return from the first transport 〇 up and down; and the second in the complex array 200405405 The conveying rollers 216 are disposed opposite to each other above the first conveying roller 214 and have a central axis perpendicular to the central axis of the first conveying roller 214 to convey the substrate κ to the conveying roller 212 side. The second conveying rollers can move in directions approaching / removing from each other. In addition, in the figure, reference numeral 21 7 indicates a stopper that prevents the substrate κ from moving. According to the direction switching device 211, the i-th conveying roller 214 will move from the first The substrate κ discharged from the processing unit 206 is conveyed in the above-mentioned discharge direction, Until it comes into contact with the stopper 217. At this time, the lifter 215 is retracted downward from the conveyance surface of the i-th conveyance light 214. Then, the #Descender 215 is raised upward from the conveyance surface of the first conveyance light 214. K rises to the position of the two-point chain line caterer in Fig. 17. At this date, 帛 2 carrying pro 216 is located at a position away from each other: then 1 2 carrying light 216 moves to a position close to each other, and then, U15 rises to P In this way, the substrate K is in the state of being transported by the second branch of the Qin m 6 branch, and then, by the second transport roller 216, in a direction perpendicular to the transport direction of the second transporter 214, that is, toward the transport roller. The side substrate is discharged. In this way, the conveyance direction of the substrate κ is switched. In particular, the direction switching device 213 also has a structure substantially the same as that of the direction switching device. The direction switching device 213 is used to switch the conveyance direction of the substrate ^ conveyed by the conveyance report 2 丄 2 and convey it to the second processing unit 2.7. Not shown. As shown in FIG. 15, in the substrate processing system 2000, the first processing unit slab conveying unit 21 〇 and the second processing unit 207 are arranged in a c-shape in plan view, and the substrate κ taken out from the transfer unit im from £ 203 First, it is invested in the first process 206. Next, the substrate SK is transported in the first processing unit 206 200405405 along the direction of the arrow, and the substrate is subjected to a predetermined treatment (㈣ treatment). Then, the substrate is transferred in the substrate transfer unit 210, and the transfer direction is changed. f 2Processing section 207. Furthermore, the substrate κ is transported in the second processing unit m in the direction of the arrow, and the substrate is subjected to predetermined processing (water treatment and drying processing), and then stored in E 203 by the transfer device 204. [Summary of the Invention] In the first processing unit 206 and the second processing unit 207, if the posture of the 'substrate K changes during transportation, for example, if it is tilted in a direction perpendicular to the ^ relative to the transportation direction, it cannot be A processing step with good accuracy is performed in Miri, as shown in FIG. 16, and protrusions 2G8a are formed on the two ends of the conveying roller 208, and the flange 2G8a can be used to transport the substrate, K Posture control. This situation is also the same for the first conveying roller 214 and the second soil conveying felt 216. However, if such a flange & 08a is provided, the flange portion 208a causes an obstacle, and the conveyance direction of the substrate κ cannot be switched within the conveyance surface of the conveyance roller 208. Then, in the above-mentioned direction ㈣devices 21 and 213 ', the substrate κ ± is lifted above the upper end of the flange portion, and the conveyance direction thereof is switched. In addition, due to the above-mentioned reasons, the substrate transporter 21, which is configured to lower the substrate K #, cannot perform the processing of the substrate κ in this section, and therefore the substrate κ is transported. That is, for example, if the substrate is cleaned in this section, if the substrate K is raised and lowered, a part where the cleaning liquid sprayed from the nozzle is stronger than 200405405 and a part not so strong are generated, and the cleaning effect is different. Therefore, in the current substrate processing system 2000, as described above, the substrate κ is not processed in the substrate transfer unit 210, but on the other hand, the following problems arise due to this situation. That is, for example, as in the example shown in FIG. 15, after the substrate K is etched in the i-th processing section 206, if it is transported without being cleaned, it is sent to the second processing section 2G7. The difference in the carrying time is performed by the button cutting: the degree is not Θ, and it cannot be controlled with high precision. Since the substrate transfer unit 210 has a complicated operation mechanism composed of a mechanism for raising and lowering the substrate κ and a mechanism for moving the second carrier, the transport time is controlled. For example, if the final step of the first processing section is a washing step ^, if the substrate κ is transported without drying under the monthly conditions, it will be unevenly dried or stained. κ becomes defective. Furthermore, in the conventional substrate processing system 2000 described above, the substrate K in the state of a horizontal branch is transported in the direction, and the edge-cutting solution: 7: various processing liquids of the same kind are supplied to the substrate κ, but the flat 7-color is in the shape of the substrate. It is difficult to supply the processing liquid to the substrate κ in the horizontal position on the surface of the substrate κ + LU Sou, Kuang & Kuang, Xie / Xia 'difficult ~ A liquid flow of the processing liquid is generated. On the surface of the substrate, 'it is difficult to replace the continuous supply' liquid, and there are also processing that is time-consuming and cannot be performed. 7Problems of processing On the other hand, the right side supplies a large amount of processing liquid to the substrate K, but a large amount of processing liquid is used. / Night, although it can be changed to an inefficient 20040540 ^ 'Another is the storage of the processing liquid. Larger containers and larger equipment. In the above-mentioned conventional substrate processing system and uniform measuring towel, since two processing lines of a first processing unit 206 and a second processing unit 207 are arranged in parallel, there is a problem that the installation efficiency of the device is poor. The present invention has been developed in view of the above-mentioned actual situation, and an object of the present invention is to provide a substrate processing apparatus having a function of transferring substrates from one processing line to another processing line, and can effectively carry Processing of the substrate; and provide a plate processing system.

The method and the present invention for achieving the above-mentioned object are related to a lifting type substrate processing apparatus 'characterized by having a frame-shaped case' having a substrate input port and a substrate discharge side by side; a processing mechanism, which is internally installed Inside the housing; it has a transfer support mechanism to store and support the substrate carried in from the substrate input port, and to discharge the substrate from the substrate discharge port; a support stand to support the transfer support mechanism; a substrate tilt mechanism, It is used to tilt the substrate of the branch of the branch mechanism being transported; the Lulu processing fluid ejection mechanism is provided above the transport support mechanism to spray the processing fluid onto the substrate tilted by the substrate tilt mechanism; and the lifting mechanism , Used to support the processing mechanism, and make the processing mechanism rise and fall in the up-down direction, so that the processing mechanism passes through the substrate input port and the substrate discharge port. According to the above-mentioned lifting-type substrate processing apparatus, the processing mechanism is moved up and down by the lifting mechanism, and passes through the substrate input port and the substrate discharge port. Furthermore, when the processing mechanism passes through the substrate input port, the substrate discharged from the processing unit in the previous step is taken up and supported from the substrate input port, and sprayed from the processing fluid at a predetermined time before moving to the substrate discharge port. The ejection mechanism 'ejects the processing fluid onto the substrate. Thereby, after the substrate is processed in a predetermined place, it is discharged from the substrate discharge port and transferred to the processing unit in the next step. In addition, while the processing fluid is being ejected and a predetermined process is performed, the substrate is tilted by a predetermined angle with respect to the horizontal plane through the substrate tilting mechanism. In this way, according to the lifting substrate,

The board supporting mechanism and the entire processing mechanism constituted by the processing fluid ejection mechanism that ejects the processing fluid onto the supported substrate. The position relationship between the substrate and the processing fluid ejection mechanism does not change when the substrate is moved. Therefore, "for example, when the substrate is cleaned, the cleaning liquid A ejected from the processing body discharge mechanism can be uniformly supplied to each of the points on the substrate," which enables uniform cleaning.

In addition, since the processing mechanism can be lifted and lowered by the lifting mechanism, the speed of the substrate can be easily controlled. Therefore, it can be controlled with high accuracy even in the case of processing such as "order money engraving". . To: Surface HI ejects the processing fluid to the substrate that has been tilted, so the processing fluid on one side is produced by the tilt of the substrate ... The liquid level, through this liquid flow, the new processing fluid produced by the processing on the substrate surface is replaced . This ：：： 斤 由 CW # is used to replace the bamboo dagger and the amount of processing fluid through the processing fluid, and the treatment is performed on a shorter surface. 'Homogeneous also has substrates. In recent years, with the increase in the size of substrates, there has been a tendency that the amount of processing fluid used to process them and the processing time will increase, μ = said; 'Processing it can reduce the use of processing flow' to achieve the purpose of miniaturization of the device and reduce processing costs. In this specification, the above-mentioned processing fluid includes a developer, a bath, a peeling liquid for peeling a photoresist film, a washing water for washing, a gas for dry welding, and the like. For various fluids, the above-mentioned various processing fluids can be supplied to a substrate and processed.

However, the inclination angle of the substrate is used to control the speed at which the liquid flow flows down the substrate surface. In other words, it is used to control the residence time of the processing liquid on the substrate surface. When the speed is appropriate, the desired processing effect can be obtained. According to this meaning, in a case where the processing liquid ejection mechanism is configured to eject a last name liquid as a processing fluid, the substrate inclined by the substrate tilting mechanism preferably has an inclination angle with respect to a horizontal plane]. To 7.5. Range (more preferably in the range of 2. to 5.). The reason for adopting this range is that if the above-mentioned tilt angle exceeds 7_5. , The speed of the flow is too fast,

That is, the residence time of the etchant on the substrate surface is too short, and conversely, the inclination angle is less than one. In the case of 'the speed of the liquid flow is too slow, that is, the button liquid on the substrate surface stays for a long time', in any case, the treatment cannot be performed sufficiently, and the amount of the etchant used increases. In addition, the inclination angle of the substrate is within a range. To 7.5. If it is changed to the acceleration of the money engraving liquid flowing down on the surface of the substrate, the acceleration is in the range of 0.88 to 0.13 times the acceleration of gravity. In the better 2. To 5. In the case of within the range, the acceleration 疋 of the etching solution is within the range of 0 · M times to 0 · ⑽ times the acceleration of gravity. 13 200405405 In addition, the processing fluid 喰 屮 and the discharge mechanism 疋 are treated as ejectable. In the case of a square cleaning solution of a fluid washing liquid or a peeling liquid, the tilt angle of the substrate tilted by the substrate tilting mechanism with respect to y and water is preferably 45. To 75. Range (more preferably in the range of 5 to 70). The reason for adopting this range is that if the tilt angle above 75 °. , The speed of the liquid flow is too fast ', that is, the retention time of the washing solution or the stripping solution on the substrate surface is too high. ^' Otherwise ', the tilt angle is less than 45. The speed of the flow

Slow, that is, the last name engraving solution on the substrate surface stays for a long time, and in either case, the treatment cannot be sufficiently performed. Mainly, the inclination angle of the substrate is 45. To 75. Under the conditions of f in the range of '', it is changed to the acceleration of the cleaning solution and the stripping solution flowing on the surface of the substrate. Then, the acceleration is in the range of 0.7 times to 0.97 of the acceleration of gravity. Good 5 5 To 7 0. In the case of within the range, the acceleration of the washing liquid and the peeling liquid is in the range of OM times to 0.94 times the acceleration of gravity. The above-mentioned processing mechanism may be provided with a swing mechanism, a processing fluid discharge mechanism, and a direction in which the processing fluid is discharged from the substrate, that is, the inclined direction is parallel to the plane perpendicular to the substrate. Swing inside, swing between the tilted top and bottom of the board. In this case, when the ejection direction of the processing fluid is directed toward the inclined upper side of the substrate, " through the above-mentioned swing, the initial application θ of the process fluid remaining on the substrate surface is large " and when the ejection direction of the processing fluid is directed toward the substrate. Under the inclination of 14 200405405 = 2 degrees of processing fluid left on the surface of the substrate by moving through the money: large, the retention and flow of the processing liquid is repeated on the entire surface of the substrate, and it can be transmitted in a shorter time. Within a short period of time, the entire substrate surface is treated with a smaller amount of processing fluid. In addition, the conveyance selection mechanism is used to move the stored substrates along the substrate carrying / discharging direction after the substrates are stored. It moves back and forth repeatedly: As mentioned above, in the lifting type substrate processing apparatus, the processing fluid ejected from the processing stream and the discharge mechanism can be substantially uniformly supplied to each part on the substrate. In the processing fluid itself, there are cases where unevenness occurs, such as a part where the pressure is relatively low and a part where the pressure is low, but in this case, 'the substrate cannot be strictly sensed. The homogenization square

As described above, if the front-back movement is supported and supported on the conveyance support mechanism as described above, the substrate can be homogeneously processed when it touches the substrate. The uniform average processing can also be performed by movement. When the loading / unloading direction repeatedly moves the received substrate back and forth, the pressure of the processing fluid passing through the substrate is uneven and uniform. In addition, the pressure of the processing fluid is not the same as the swinging direction of the discharge direction of the processing fluid. In the above-mentioned lifting substrate processing apparatus, the housing is divided into a driving chamber by a two-member-to-board carrying / discharging direction. There are 12 processing chambers, and a processing mechanism is provided in a processing chamber having a substrate input port and a substrate discharge port, and a driving mechanism is provided in the driving chamber. The knife & member is formed to communicate between the processing chamber and the driving chamber in the vertical direction. The opening part 15 is an opening formed by the partition member. The two edges of the opening ° p in the up-down direction are in the same shape, and the pair of knives μ pair each other in the same shape. The notch groove formed in the upward / downward direction is taken; the supporting frame a of the processing mechanism is taken, and the fish /, σ are connected to the lifting mechanism by the connecting, ..., and ... tools provided in the opening of the partition member; The connecting piece is connected with a strip-shaped sheet body, which is disposed between and is arranged to extend above and below the connecting piece: ::: The edge portions are respectively inserted into the cylindrical portion from the notch grooves; And processing room The partition member, the coupling device, and the sheet body are separated by the rotting shaft 1 * of the developer, liquid, and liquid, etc. * The right car is attached to the lifter and it is ready to be broadcast ... There is a lifting mechanism in Pr. Danger of "damaging" force ^ 彳. Therefore, as described in the ±, if the driving chamber provided with the lifting structure and the processing chamber provided with the processing mechanism are separated by the partition member, the remote gear and the sheet body, the processing fluid used in the processing chamber can be prevented ^ Driving chamber 'It can prevent the damage of the lifting mechanism caused by the hypothesis; ☆ handle the body, especially the' so-called labyrinth structure, in which, it will be along: the opening of the partition member The edge portion in the vertical direction is formed as a tube: The sheet-side edge portion '2' provided in such a manner as to extend upward and downward of the connector is inserted into the tube portion from a notch formed in the tube portion, so that The airtightness of both the driving chamber and the processing chamber is improved. In addition, a plurality of the openings, a connector, and a sheet body may be provided. In addition, if an exhaust mechanism is provided to blow out the gas in the cylindrical portion, the 16 200405405 processing fluid that has penetrated into the cylindrical portion from the gap between the sheet body and the notch groove can be exhausted through the exhaust mechanism. Therefore, it is possible to more reliably prevent the processing fluid from entering the driving chamber. ▲ In addition, the above-mentioned sheet body can form an endless ring. In addition, a coiling / feeding mechanism for picking up / feeding out the sheet body may be provided on the upper side and the lower side of the sheet body, respectively. The movement of the film body can be constituted by the coiling / feeding mechanism for the film entry, which is that the coiling / feeding mechanism + 佶 Μ π soil is taken by the coiling shaft and rotation of the coil The driving mechanism is constituted; the driving mechanism is used to make the braking force act on the winding shaft only when the winding = 'outward rotation', and when the shaft is rotating in the winding direction, it is separated from the winding shaft by friction. Relying on the two / ,,,, and 动力, the power is transmitted ^ According to the / reach mechanism, the film body does not produce relaxation "T Take it up and send it out. The seat is relaxed, but again, the drive mechanism has: a wheel; a driving gear that meshes with a 4t person who has a history of history; a driving gear that meshes with a moving tooth; and a cry · Such as # ^ 7 gangs connected to the power return wheel… rotation shaft connected to the friction clutch; 2 one-way disengagement: respectively connected to both ends of the rotation shaft to allow = to the clutch, to rotate; pulley, transparent The late + rotating shaft only goes to one direction wheel through one of the one-way separations. The great movement wound on the pulley is connected with the condensing shaft; the component; the two one-way openings ... the support of the early-direction coupler + the clutch , It is used to rotate the shaft in the direction of the winding direction, and the square shaft that the axiser rotates the winding shaft in the sending direction ^ ^ The rotating shaft rotates toward the winding mechanism. , ° 疋 'and the drive belt' are lifted and lowered: two lifting substrate processing devices according to the above structure m the following substrate processing system, the structure can be formed ° ° substrate processing system is: up and down 17 200405405 f The first substrate processing apparatus and the second substrate processing apparatus process the substrate while moving the substrate in a horizontal state or an inclined state; the substrate discharge unit of the i-th substrate processing rack and the substrate of the lift-type substrate processing apparatus are put into operation. The connection 'connects the substrate input part of the second substrate processing apparatus and the substrate discharge port of the lifting substrate processing apparatus; and passes the substrate through the first substrate processing apparatus, the lifting substrate processing apparatus, and the second substrate processing apparatus in this order. ^ Compared with the conventional processing system in which the first substrate processing device and the second substrate processing device are arranged in the same horizontal plane, the installation space is small. [Performance Mode]: Specific embodiments of the present invention will be described based on the drawings. FIG. 2 is a top view of a substrate processing system S 2 according to an embodiment of the invention. FIG. 3 is a front cross-sectional view of a schematic configuration of the substrate processing apparatus, and a side cross-sectional view thereof. In addition, a front cross-sectional view of a schematic structure, FIG. 5 is a cross-sectional view, and FIG. 7 is a “3: a plan view in the ㈣ direction in FIG. 5 is a view in FIG. Top sectional view in DD⑽ direction in 7. In addition, FIG. 3 is a cross-sectional view taken along the DD-DD direction. : ° The structure of the substrate processing system 1 of this example. The substrate processing system 1 of this example is composed of a substrate casting processing unit 7, a first substrate processing apparatus 6 and a second substrate, and a lifting substrate processing dream inlet / outlet unit 2 composed of 0. Substrate cast. 4 and a transfer device 3, the mounting table 4 18 200405405 accommodates a plurality of substrates £ 5, the transfer device 3 one by one to take out the substrate from the processing table 4 on the dragon 5 and put it into the first substrate 6 and take out the processed 2 plates from the second substrate processing apparatus 7 and store them in E5. In addition, 'shift 3' can be placed along. , 4 is composed of a robot arm that moves in the long-side direction (the direction shown by the arrow). The cassette 5 is transported by a transport device such as an AGV (not shown). In contrast, the first substrate processing apparatus 6 has a substrate-inclined side that tilts the substrate in a flat state! . To 7.5. The angle (in this example, it is the base-reverse _'sloping mechanism part ', and it also has a tilting conveying part which transports a tilted substrate in a direction not indicated by the arrow while the substrate continues to tilt. On the other hand, the second, the plate processing The device 7 has, in the order indicated by the arrow, a substrate tilting mechanism portion 'for receiving a substrate discharged from the lifting substrate processing apparatus 1Q, and further tilting the substrate to an angle of 45 ° to 75 ° (in this example) It is 70.); The tilting conveyance unit 'is used to transport tilted substrates in the direction shown by the arrow while the substrates continue to tilt; and the tilt return mechanism unit that returns the tilted substrates to the horizontal state. Also, in this case, 1 substrate The processing device is configured to engrav a substrate while conveying the substrate, and the second substrate processing device 7 is configured to clean and dry the substrate while conveying the substrate. As shown in FIG. 3, FIG. 7, and FIG. The above-mentioned lifting substrate processing apparatus 10 is composed of a housing 1 having a frame shape, a processing mechanism 20 and a lifting mechanism 40 provided in the housing 11, and the like. In addition, an opening is formed in the housing 丨 丨. Ua The opening llbl and the opening Ua are in communication with the inside of the i-th substrate processing apparatus 6, and the opening 胄 llb is in communication with the inside of the second substrate processing apparatus 7. In addition, 'the casing 11 is supported by the pillar 12' and the inside of the casing u is divided into 19 200405405 is divided into a processing chamber A and a driving chamber b. A processing mechanism 20 is provided in the processing chamber A, and a lifting mechanism 40 is provided in the driving chamber B. The processing mechanism 20 is supported by the etching device 22 and the supporting etching device 22 The gantry 21 is constituted. As shown in FIGS. 4 to 6, the etching device 22 includes a frame-shaped case 23 ′, one side of which is provided with an opening 23 a for carrying in / discharging a substrate &26; and a plurality of nozzles 29 provided above the conveyance roller 26, and a plurality of nozzles 30 provided under the conveyance roller 26 and the same as the plurality of nozzles 29. On the conveyance roller 26 closest to the opening 23a, A nip roller 27 is provided. The nip roller 27 abuts on the upper portion of the transfer roller 26 to hold the substrate κ. The substrate K is carried in through the opening 23a through the forward and reverse rotation of the transfer roller 26 and the nip roller 27. And discharged from the opening 23a. In addition, the conveying roller 2 The two ends of the rotating shaft 263 of 6 are rotatable square, square, and base 33, and a guide 34 is provided on the base 33, so that the substrate K is in a direction opposite to the transport direction of the base κ. It moves vertically. The central part of the soil 〇33 series is swingably supported by the support member 35 through the connection member (upright in the shell 23 pot + sister from 丞. One end of 33 is transparent ° 38, and the drive cylinder The piston rod 37a of 37 is engaged, and the substrate 33 can be tilted in a direction perpendicular to the conveying direction of the substrate κ. Upper ?: The hydraulic cylinder or air-cylinder is used to move the piston / and substrate K When the direction is perpendicular, the conveyance β9 β is tilted so that the substrate κ on the 椠 26 is also inclined. The inclination of the plane & i is that the outer abutment 33 is angled to the Mito within 10 to 7 + Du 1 main U. In this example, set 20 ^ UU4U5405

Han 1 π move: Lian Jikun branch Guan He 29 is fixed to a plurality of supply tubes 28 connected to the last name liquid supply source shown by the husband, and will be supplied from: Insect liquid supply source (not shown) Surname to each supply tube

= 上 （W. The above supply pipe 28—in the transport direction of the base W, the two supply pipes are arranged in a row at a predetermined interval, and the supply pipes 28 are arranged to be inclined at the same angle as the base ... Supporting portions formed in multiple rows in the plane and formed at both ends thereof

: 过 ： 承 1〇 " Leather support member_ 支 楼 成 rotatable. Moreover, each supply :: 2 ?: can be rotated forward and backward about its axis center by a swinging device :, so, hunting by the supply direction of the supply camp 9βΑΑτΓ ~ κ is perpendicular to the two = turn 'each nozzle 29 is in contact with The spraying side of the substrate engraving liquid ^ is ^^^ ', and the surname sprayed from each nozzle ^ is shown in Figure 6 and Figure 9 above: swinging between the square and the bottom. ⑴… The above-mentioned swinging device 110 includes: a driving horse driving motor lu on the output shaft 之 a of the rotating plate 112;

112 center position: 乂 It is erected in a way that rotates around the center of the shaft. It is erected in the position deviated from the rotation axis 2: The position of the first drive shaft ⑴, one end of which is set at the housing, "set outside the housing 23; It can be erected in a rotatable manner on the other side of the first rotation shaft 114: 邛, the first link i J 6, 苴 n-from ... to the second drive shaft 118 ,: fixed = _2 lever: 15 Connected in a parallel manner / both & space and below the supply pipe 2 8, 2 8 of the above-mentioned columns; and between the plurality of second links uw / 28 28 At the one end of each of the above-mentioned confessions, a 28-story branch section ... engagement engagement hole 117a is provided, and at the other end, an engagement shaft 11Q 117b is protruded, and the engagement shaft 117b is inserted into the second engagement The shafts U9a, 2 are in the engaging holes U8a; the engaging member 119 is provided with an engaging member: the engaging member 119a, which is engaged with each of the second driving shafts 118, and the supporting member 12. It is fixed to the first driving shaft 忒 as a part to support the engaging member (T 士人 人 仵 119. In addition, FIG. 9 is a side sectional view taken along the GG-GG direction in FIG. 6. 出 轴 、 ι :: #The driving motor 111 rotates, and its rotational driving force passes through the output shaft 111a and is transmitted to the rotating plate M β 2 and its slave rotation, accompanied by the rotating plate 112

Through the 113th and 1st drive shafts ⑴ along the parallel axis V: 16 and the second pole 115, make, 芒 flute], move in the axial direction (reciprocating). In addition, the right brother 1 driving shaft 114 moves back and forth along the straight axis from the direction of the passing axis, and its power passes through the supporting member 丨 2 〇, the engaging member 彳 ^ to transfer the ninth to the second driving shaft 118, so that 2 The drive shaft 118 is driven forward and backward. The forward and backward motion of the second drive shaft is connected to the second drive shaft 1 Μ through the second connection: the second drive shaft 118 -χ ^: = As above, ′ rotates in the forward and reverse directions around the center of the shaft to make the solid

:: Each dysprosium 29 is disposed below the conveying roller 26 in a plane with the substrate; X. & ty, each suga is fixed to a supply source (not shown) connected to the upper nuclear etching liquid A plurality of the supply tubes 31 pass through each of the supply tubes, and the etching solution from the above-mentioned etching solution supply source (not shown) # is sprayed toward the lower surface of the substrate K. 丁丁 Κ ,,,,. In addition, each of the supply pipes 31 is arranged along the substrate in the direction of transportation, and the transmission fixing member ⑽: branch building member 103 branch building. In addition, the support member m: = 'Measuring board] (% of sensors. 22 200405405 In addition, a liquid collecting tank 24 is provided at the lower end portion of the housing 23, and the liquid collecting tanks 24 communicate with each other through the opening 23b. The etching liquid sprayed from each of the nozzles 29 and 30 is recovered in the liquid collecting tank 24, and is appropriately discharged into the driving chamber B through the discharge pipe 25. A bracket 17 is vertically installed, and the bracket 17 is formed by a square tube in a longitudinal grid shape. A lifting mechanism 40 is provided on the bracket 丨 7. In addition, the bracket 17 is mounted on the pillar 12 through the bracket 18. The above-mentioned lifting mechanism 40 includes a lifting table 44 through a link 55, 56 and 57 58 and The support stand 21 is connected; a pair of guides 45 are provided on the surface of the processing chamber a side of the bracket 17 @longitudinal stack; and a sliding member 46 is respectively movable with each guide 45 And fixed to the lifting table 44; the ball screw 41 is rotatably supported on the bracket 17 in a manner that the disk guide is held in parallel; the nut ^ is fixed to the lifting table 44 in a screwed manner with the ball screw; servo Motor 43, fixed on bracket 17, used to rotate and drive the ball screw 41. If the ball screw 41 is rotated through the temple clothes motor 43, the pan = cap 42 moves (lifts) along the ball screw 41, and is connected to the nut 42 4: 口 口 ", through the connecting devices 55, 56 and 57 , 58 are connected to the support stand 21 on the lifting platform, and are supported on the support stand 22; the three are raised and lowered together with the nut 42. The U drive room B and the processing room A pass through the partition member, 14. In the partition member mountain, "Between, and the door knives of the partition members 14, 16: Do not form openings, so that they are located in each of the openings, and they are divided into 55, 5fi β r, and the knife is connected with 8. In addition, 'the openings are formed The partition members 23 ZUU4U ^ 4U ^ 1 4 are formed in a cylindrical shape at each of the edge portions of the two sides, and the partition members opposite to each other are provided with cylindrical members along the edges of the partition structure 4 ！ 3. The cylindrical portion 15 and the cylindrical member of the two side edges of the two facing surfaces of the opposite surface! 3 The knife forms a notch groove in the vertical direction. In addition, the cylindrical member 13 is separated by μ, +, and the cylindrical member 13. The cylindrical parts 15 and the upper 65 and 66 on both side edges of the member 14. The sheet bodies are provided with strip-shaped sheet bodies along the gaps, respectively. 66, the edges of the two sides are respectively inserted from the above-mentioned notch groove 彳 # Λ ~ 形 部 15, the cylindrical member is inserted into the cylinder 58 from the dagger 58, and the inner and outer parts are connected by 55, 56 and 5 ?,

The upper ends of 66, 66 are fixed to these members below the heart. Further, the sheet body 65 is constructed. ^ = 1 Shaw is taken up by a winding / feeding machine described later. It is suitable for the exhaust mechanism. ::::::: 1 shape_ ^ The pieces 65 and 66 are exhausted with abrasion resistance / wide rent. In addition, in this example, the produced sheet. However, it is not limited to: Teflon (registered trademark) with good decay, "It is not limited to this, and a sheet 0 made of stainless steel, for example," may be used. The driving chamber B and the processing chamber A substantially pass through the partition member 11 &, 14, 16, the cylindrical members 13, 13, the connectors 55, 56, 57, 58 and the sheet bodies 65, 66 are separated. And, as shown in ® 7, a driving motor 60 is mounted on the lifting table 44 and connected to a weight 5Q. The drive motor 6Q passes through the bracket M and is fixed to the lifting table 44 to drive the transporting unit 26 of the etching device 22 through the transmission belt 61 '. On the other hand, the weight 50 is composed of a guide rod 51 and a main body. The guide rod 51 is fixed to the bracket u in a manner parallel to the guide rail 45. The main body 52 is engaged so as to be movable along the guide rod 51. On the guide rod 24 200405405 51, and is engaged with the lifting table 44. The winding / feeding mechanism 70 is shown in FIG. 3, and the upper and lower parts are specifically, as shown in FIG. Δ, the winding shafts 72 and 76 and the winding shafts 72 and 76. The connected drive shaft η, a gear 85 that drives the drive shaft 71 and the like are configured. The winding shafts 72 and 76 are rotatably passed through the brackets 75 and 79, respectively. In addition, the sheet body 66 sequentially passes the guide rollers 73 and 74 supported on the bracket 75 in a rotatable manner, and its ends are wound on the take-up shaft 72, and the sheet body 65 passes in order to be rotatable. The guide members 77 and 78 ′ supported on the bracket 79 are wound on the take-up shaft 76. As shown in FIG. 10, the gear 85 is fixed to a torque retainer (t0r rotation) 86. The rotation shaft 81 passes through the torque retainer 86, and the rotation shaft η is supported by a bearing 9 fixed to the bracket 84. And one-way clutch 87 is supported. In addition, a pulley 80 is fixed to the end of the rotary shaft 81 through a one-way clutch 88. In addition, the gear 85 meshes with a gear 89 fixed to the drive shaft 71. In addition, the one-way clutches 87 and 88 have a function of restricting the rotation direction of the yaw shaft 81 described above. In this example, in the case of L ^, with the winding / feeding mechanism 7 placed at the upper part; 'restrict the rotation axis 81 to rotate in the direction of arrow E, and allow the rotation axis 81 to rotate in the direction of arrow F, force% W In the case of the take-up / feed-out mechanism 70 provided at the lower portion, the rotation of the rotating shaft 81 is restricted in the direction of arrow F, and the rotation shaft 81 is allowed to rotate in the direction of arrow E. Suspicious rotation. The torque retainer 86 is a so-called friction clutch that applies a predetermined braking force to the rotary shaft 81. In addition, as shown in FIG. 3 ', the endless transmission belt 82 bypasses the above-mentioned slides · 80, 8G, which are provided vertically. The transmission belt 82 is held by a holder 83 fixed to the nut 25 200405405 42. 8. Operation of the substrate processing system 1 having the above-mentioned structure. In addition, the soil plate processing device 10 is in a state shown by a solid line in FIG. 3. Take out the :: d: devices 3 and 5 to sequentially remove the substrate κ 'and the substrate processing agricultural treatment device 6. Put the substrate tile that has been put into the first, pass through the substrate tilt mechanism, and make the substrate relative to (-engraving processing; :::: conveying, and carry out the predetermined processing on it. Sequentially remove it from the first substrate processing device 6 Discharge 1 "both" and "non-existing substrates κ are sequentially transported through the lifting substrate processing device 2" 2. The Γ section 1 enters the ㈣ device 22 and is moved into the interior under the action of W. 'Pre = to Γ : The abutment 33 in Γ22 passes through the above-mentioned device ... The device 6 is centered A _ 7 ° '㈣ oblique 11 from the first substrate processing button engraving device 22 / ^ Κ' is moved into the + state while maintaining the inclined state And slid in the oblique direction. And,-, 'At the same time, the management and the second set: "The end of the supply to the two sources (not shown) to the supply pipes 28, 31, respectively :; nozzle 29 on Γ 28 And set to supply money for engraving. In addition, the reason why the engraving liquid sprays the engraving liquid on the back surface of the substrate ruler is 26 200405405. If this is not the case, the etchant will partially spread from the surface of the substrate κ A stain is formed on the back surface, and the formation of a stain can be prevented by spraying the entire back surface with an etching solution. Furthermore, during the etching, each supply officer 28 is rotated forward and backward about its axis through the swinging device 11 to swing the spraying direction of the etching solution sprayed from each nozzle 29 between the upper and lower sides of the substrate κ. In addition, if the etching is performed for a predetermined time, the supply of the etching solution from an etching solution supply source (not shown) is stopped, and the spray generated by the swinging device 110 is stopped.

Swing of the mouth 29. In addition, the job processing ends in a period before the lowering of the cymbal 22 is completed. On the other hand, the lowering of the etching device 22 is performed by a 40-horizon servo motor driven by a lifting mechanism 43. That is, if the burial snail talent 41 is rotated in the descending direction through the temple clothing motor a, the nut 42 that is screwed with it will be closed along the Qiaozhu screw 41: ° 4 Table 44, through the connection & $ 55, 56 and 57, u coffee — said 々 ^ ^-a support stand 21 connected to the descending table 44, choose to support the stand. The three money engraving devices 22 and the nut 42 are lowered together. If the nut 42 nr π transmission belt 82 I is passed through the holder 83, 56 and 57, 58 connected to the nut 42; rotate in the direction of the moon 'Shuo C. . In addition, if the link 55 and the square are moved, the sheet bodies 65 and 66 fixed to them are directed downward along with this 1, and the sheet H 65 is moved from the coiling / feeding mechanism 70 provided at the upper part to the coiling / feeding. Mechanism: The upper and lower sheets 65 and 66 are taken up and placed on the lower surface of the lower part to be used / sent out. Figure 10 shows the winding in more detail. The rewinding mechanism 10 of the feeding mechanism 70 is a coiling / feeding mechanism provided at the upper and lower portions.

27 200405405 Top view of spoon. In addition, although the connection tool 57 8 and the sheet body 66 have been described based on the drawings..., The same is true for the connection tool 55. 56 and sheet body 65 First, the take-up / feed-out mechanism 70 provided at the upper portion will be described. In the take-up / feed-out mechanism 70 provided at the upper part, if the mouthpieces 57 and 58 are swollen, tension is generated on the sheet body 66 and the take-up shaft =: rotational force. The rotation power is transmitted through the gear 72 meshing with the take-up shaft 72, the drive shaft 71, the gear 88 fixed to it, and the gear 88, which is meshed with a return wheel 88. Weep q β / 丄,] Torque keeps gain 86, which is transmitted to the rotating shaft 81. But 疋 ’because of the one-way breakout, 07 is early. From the mouth 87, the rotation axis 81 is restricted from rotating in the direction not indicated by the arrow ε, so the phase is prevented from rotating in the direction @. Thereby, the tension acting on the sheet body β Θ gradually increases, and the torque transmitted to the torque retainer 86 increases. If the torque acting on the gear 85 recognizes that the torque is greater than a predetermined value, the torque retainer 86 allows the gear 85 to inversely rotate in the torque direction 1 r A ^. With this, the gear 85 rotates in the direction shown by the arrow E, and the teeth & ττ _ wheel 88, the drive shaft 71, and the take-up shaft 72 are rotated in the directions shown by the front head, respectively. The take-up shaft 72 sends out the sheet body 66. Forcibly, because the sheet body 66 is sent out under a predetermined tension state, no looseness is generated when it is sent out. On the other hand, if the descent of the snail 3 -® 人士 ', head 42 is lowered, the transmission belt 82 is spin-dried in the direction of the front C as shown in FIG. 3, and then' the pulley 80 receives the rotational power in the direction of the arrow E '. But through the action of the one-way separation between the sliding man-〇〇AA m, the wheel 80 and the rotation axis 81 'the pulley only η ,,, ^ Μ # recognize the relative rotation axis 81, along the arrow E Free rotation in the direction shown. When the pulley 80 is obstructed again, with the transmission belt 28 200405405 82, the pulley 80 rotates in the direction shown by the arrow E. 81 The rotation in the direction shown by the arrow E, the direction of rotation. Therefore, the direction shown by the one-way clutch arrow E is free to rotate. . The early clutch 88 restricts the rotation axis. However, it is allowed to be opposed to the rotation axis 81 along the arrow F as shown by the arrow F.

The lower coiling / feeding mechanism 7 takes: a reaching mechanism 70. In the setting east 82, the square cymbal 42 shown by the above-mentioned arrow w descends, and the rotational power in the direction of the leather zen is transmitted. As shown above, the pulley 82 is subjected to the arrow μ out of the machine ... In the case of 1 to 2 away: the coiling placed in the lower part / the direction indicated by the arrow F, and the capacity is allowed to rotate. Therefore, if the pulley 82 is subjected to a known rotation in a direction not indicated by the arrow E, the rotation is performed in the same direction. If the rotation axis: direction :, rotation power 'then, ^ s 1 turns along the arrow F + ancient direction, then its rotation power is transmitted to the drive shaft 71 through the torque retainer, I gear 8 ... wheel 88 " ^ Rotate in the direction shown in the

In this example, 'the winding speed of the winding shaft 72 is greater than the moving speed of the plate 66 and the transmission speed 82, and the shaft diameter of the winding shaft 2 and the diameter of the slip = 0 and the gear 85 and gear 88 are set. Gear ratio between. If the winding speed of the volume two 72 is greater than the moving speed of the plate body 66, the tension acting on the plate 66 gradually increases, and the torque transmitted to the torque holder 增大 increases as described above. If the torque is greater than a predetermined value, then the turn = retainer 86 allows the gear 85 to rotate in the torque acting direction. Thereby, the tooth = 5 and the rotating shaft 81 are in a sliding state, and the rotating shaft 8m rotates in the direction shown by the arrow E with the pulley 80 through the unobstructed brother. In this way, since the sheet body 66 is wound up with a predetermined tension from 29 200405405, there is no slack in the winding up. $ As described in detail above, the lowering of the device 22, the body 65, 66 〇 If the take-up / feed-out mechanism 70 is used, the accompanying eclipse can take up and send out the film without loosening it. In addition, as described above, If the etching device 22 ^ is lowered to the descending end, the roller 266 is rotated in the discharge direction to discharge a cup ^ ... the sub-bulk opening 23 & the opening 1 1 b ， H will be 4c; Γ h to transport the substrate U to the second substrate s

In device 7. In addition, in Fig. 3 at J 2 ", the fi key wire indicates the state of the falling end of the etching device 22 to a. / The servo motor 43 of u to 4 40 passes the winding / feeding mechanism 70 'opposite to the above. The sheet body 65 is ejected and the right substrate K is ejected. Then, the lifting mechanism is driven to raise the etching device 22. At this time, the sheet body 65 and 66 are driven to be wound on the lower part 70, and taken from the lower part. / Feeding mechanism, 66 ° and, if the engraving device 22 arrives

The board "says the subsequent actions. In addition, 7; then, the above-mentioned use of the weight 50 to repeatedly reduce the load acting on the servo motor 43 when the engraving device 22 is raised and lowered is used. The surface is processed on the second substrate. Device mechanism section from the lifting type '& substrate ·

The tilt is 70. The angle of the substrate K, which is discharged by 10, is larger than that of the J plate. [The edge is moved in the direction of the arrow when it is tilted.] After the processing, the money is returned to Dr. Go to the horizontal state, and then store it in 歴 30 200405405 5 through transfer 13. In this way, in the substrate processing system 1 of this example, the substrate κ is stored in the substrate 5 in order through the first substrate processing device 6, the lifting substrate processing device 10, and the second substrate processing device 7 '. It performs a predetermined process' and stores it inside the cassette 5 again. —As detailed above ', since the structure of the substrate processing system 1 of this example is' the first substrate processing apparatus 6 and the second substrate processing apparatus 7 are installed at the upper and lower positions', they are connected through the lifting substrate processing apparatus 1G, so [Plate] Compared with the conventional processing system 200 in which the substrate processing apparatus 6 and the second substrate processing apparatus 7 are arranged in the same horizontal plane, the installation space can be reduced by 100%, and the system can be efficiently installed. In addition, in the lifting-type substrate processing apparatus of this example, the whole of the etching apparatus 22 constituted by the transporting carrier 26 for transporting and supporting the substrate K and the nozzles 30 for spraying liquid on the substrate κ can be lifted and lowered. Therefore, when the substrate K is conveyed, the positional relationship between the substrate κ and the nozzles 29 and 30 does not change. Therefore, the etching solution sprayed from the nozzles 29 and 30 is supplied to each portion of the substrate κ substantially uniformly, thereby enabling no staining. Etching process. In addition, the substrate κ is conveyed in a single operation of raising and lowering the etching device 22 by the lifting mechanism 40. In addition, the mechanism can be controlled with high precision by a servo motor 43, a ball screw 41, and a nut 42. Since the substrate K is raised and lowered, its speed can be controlled with high accuracy. In addition, since the etchant can be sprayed with respect to the substrate K which has been inclined, the etchant supplied on the surface of the substrate K generates a liquid flow which flows downward due to the inclination of the substrate κ, and passes through the liquid flow. Gradually replaced by the new etching solution that is continuously supplied. Through the replacement effect of this etching solution, the etching solution of 31 200405405 or more can uniformly etch the surface of the substrate κ in a relatively short period of time. also

Furthermore, since the nozzles 29 are swung, the spraying direction of the J liquid sprayed from these nozzles can be swung between the upper and lower slopes of the substrate. Therefore, when the spraying direction of the etching liquid is swung toward the upper slope of the substrate, Through 2 swings, the effect of the etching solution remaining on the surface of the substrate κ is increased. When the swing direction of the etching solution is tilted downward of the substrate κ, the gravity of 1 / 'flows down on the surface of the substrate κ. The speed of Qian Keye's solution will make her stay and flow down over the entire surface of the substrate κ over the entire surface. Through this effect, the substrate κ can be uniformly applied to the substrate κ in a smaller amount of time in a shorter period of time. The entire surface is engraved with money. In addition, "in recent years, with the increase in the size of substrates, the amount of etching solution used to etch them" has increased the etching time. However, the substrate & , Can reduce the amount of 2, the device is miniaturized, and the processing cost can be reduced. ',

Within the swing angle of the nozzle 29, the swing speed is preferably i to 10 seconds. , Preferably at 90. To 12 o. Range of time, the time of the swing action is 2 seconds, and if the rot of # 刻 液 is extremely high, it is attached to the lifting mechanism 40 from the # 刻 装置 22, there is damage to the lifting mechanism 40: and make it Danger of impaired function. According to the lifting type substrate processing device of this example, since the partition members 11a, 14, 16, and the cylindrical member Η are connected; the bindings 55, 56, 57, 58, and the blades 65, 66 are equipped with a lifting mechanism. The driving chamber B of 40 and the etching device 22 are provided to process A, so it can be prevented. 32 200405405 Especially because the cylindrical structure 15 and the cylindrical member 13D = the palace structure are adopted in the following structure, the exhaust gas is left for a while. The liquid invades the drive chamber B, and the internal intake and exhaust can be formed between the female parts Ua, 14, and 16; 1 ° This labyrinth structure is the edge in the vertical direction of the opening of the partition ^ 々, = tube Like member 13 and fixed to the joints w, 56 and 57, 58

The σ,: ^, and J-groove grooves on the cylindrical portion 15 and the cylindrical member 13 are inserted inside. The actual embodiment of the present invention described above is not limited to this. ';' However, the present invention can be used, for example, in the above example, the take-out / feed-out mechanism 70 takes up 65, 66 to form an endless loop, and rotates. Equipped with the lifting and lowering device 22, the sheet body 65, 66 is fed out through the roll, but the sheet body can also be equipped with an etching and lifting 2 2 lifter to make them — in the above example, the substrate is processed in a drop-down type. F 1 〇

Ding's name is engraved, but other treatments such as washing and peeling can also be performed: it is not limited to this. In this case, the 'first substrate processing apparatus 6 and the first substrate processing 7 are the same. In addition, when the cleaning and peeling treatment is performed, it is preferable that the angle of inclination = the inclination of the substrate κ is 45 by driving the cylinder Η. To 75. Range (more 仫 55 to 70.). The reason for this is that if the inclination angle exceeds 75, the speed of the liquid flow is too fast, that is, the residence time of the cleaning liquid and the stripping liquid on the substrate K surface is too short; otherwise, if the inclination angle is less than 45. ， 33 200405405 The speed of the liquid flow is too slow, that is, the cleaning liquid and the peeling liquid are left on the substrate K for a long time 'Under any of the above-mentioned application conditions h' When processed, the amount of washing liquid and peeling liquid used increases. Also, during the processing of the substrate κ, the rotation of the conveyance light 26 can be continuously switched in the forward and reverse directions, so that the substrate can read the movement at a predetermined distance in the loading / unloading direction. If this method is adopted, even when the # 刻 of the liquid is sprayed from each of the nozzles 29, 30, and the pressure is not uniform, the substrate κ can be moved forward and backward by moving the substrate κ forward and backward. The above uneven sentence is averaged, and the substrate K can be uniformly etched. In addition, as described above, the processing performed in the above-mentioned processing mechanism 2G = the next step after two minutes, without the above-mentioned case core being partitioned into a "mouth drive chamber" without being caused by the adhesion of the mash. B 'The lifting mechanism 130 described above is replaced by the lifting mechanism 130. The lifting shaft 130 at the mouth of the gate ^ The lifting mechanism 130 includes: a drive motor ⑶, "under the root side rotation. 2 Sacred River: Mutually lightly" set " And sprocket 132 is installed at both ends: the upper rotating shafts 135 are respectively arranged above the lower rotating shafts ⑶, and sprockets 134 are installed on the same both ends; the driving shaft 136 is driven by the helical gear The rotary knife of the motor 131 penetrates J 33 · 纟 γ and transmits it to each of the lower rotation shafts 3, ^ support stand 139 of the engraving device 22; 4 guide plates 137 of 12 are fixed respectively; a plurality of light 138, square 7 knives do not guide a plurality of rollers 138; four, sprocket—upper, center: frame: =: 34 200405405 'The other end is fixed to the lower part of the support frame 139. According to the lifting mechanism 13, forward and reverse rotations are performed on the driving motor 31. The suspected rotational force is transmitted to the lower rotation shafts 133 through the transmission shafts 1 3 and 6, and each lower rotation shaft 133 is rotated around the center of the shaft. With the revolving of the rotating shaft 133, the chain 140 is rotated through the sprocket 132, and the supporting stand 139 supporting the etching device 22 is guided by each guide plate 137 and each roller 138 and moves upward or downward, that is, makes it rise and fall .足 锒 ’according to the lifting mechanism

It can be constructed more than a car, which can reduce its manufacturing cost. In addition, as another aspect of the base processing system using the lifting substrate processing apparatus of the present invention, the second type diagram shown in FIG. 13 and FIG. 14 can be cited. The 'substrate processing system' system 150 shown in Λ3 is composed of a substrate processing unit for loading / discharging a dry processing device, 60, and an etching / cleaning device. The box 181 /: the loading / discharging unit 151 includes a plurality of substrates on which it is stored. Ε 1 81 constitutes a mounting table, a transfer device 2, and a transfer device 153 for transferring a substrate.

The set shift # is formed by moving the track 154 in the long-side direction to the three-dimensional inner arm 155. The transfer robot f 155 has 1 arm 置于 placed in the two positions of the arm, and the box 181 ′ on the substrate 152 is subjected to the following processing, that is, from the mounting device 1 60, the shoe magic Take out the substrate one by one and put it into the dry shoulder, spider wash, and store the substrate in the dry processing device] fin # again to process the substrate. '' And ⑽ 1 cleaning device 17G 35 200405405 ^ ㈣ type processing device ⑽ for the substrate to remove the photoresist processing, film formation processing netting process. In addition, the entry ㈣a is transferred to and from the mounting base 152 by an automatic truck ⑽. ,, A | J: Firstly set 4 as shown in Figure 14, as shown in Figure 14, with a frame-shaped housing eight inner hulls divided into substrate receiving sections [7], transport section 172, last name engraved section 173, λ The substrate on-board juice conveying section 174, the substrate drying section pushes back a plurality of areas composed of 胄 176, etc., the substrate is transferred into the substrate receiving section m through the transfer parameter 155, and the substrate is discharged from the substrate pushing section 176. The above-mentioned substrate receiving section 171, substrate descending conveying section 172, money engraving section, eight substrate on-board conveying section 174, substrate drying section 175, and substrate ejecting section 7 have a plurality of conveying rollers 208 as shown in FIG. Then, the substrate is conveyed in the direction indicated by the arrow through the conveying means, and is conveyed to the substrate ejection portion 176 in accordance with the substrate descending conveying portion 172, the ridge portion 173, the substrate rising conveying portion 4, the substrate drying # 175. The substrate lowering and conveying unit 172 and the substrate raising and lowering unit ⑺ have substantially the same structures as those of the above-mentioned elevating substrate processing apparatus 10. Furthermore, in the etching-cleaning device] 7n + ifu, the last name engraving process is performed in the substrate lowering conveying section 1 72 and the etching section. The cleaning process is performed in the substrate rising conveying section 1 74 and the substrate drying section 175 Drying is performed in the middle. [Brief Description of the Drawings] (I) Schematic Part FIG. 1 is a front view showing a schematic structure of a substrate processing system according to an embodiment of the present invention. Fig. 2 is a plan view showing a schematic configuration of a substrate processing system according to the present embodiment. Fig. 3 is a front cross-sectional view showing a schematic configuration of a lifting-type substrate processing apparatus according to the present embodiment. Fig. 4 is a front sectional view showing a schematic configuration of an etching apparatus according to this embodiment. Fig. 5 is a side sectional view showing a schematic configuration of an etching apparatus according to this embodiment. FIG. 6 is a top cross-sectional view taken along a cc-cc direction in FIG. 5. FIG. 7 is a top cross-sectional view taken along the AA-AA direction in FIG. 3. FIG. 8 is a top cross-sectional view taken along the BB_BB direction in FIG. 3. FIG. 9 is a side sectional view taken along the gg-GG direction in FIG. 6. FIG. 10 is a plan cross-sectional view of the winding / feeding mechanism according to the present embodiment. Fig. 11 is a front sectional view showing a schematic configuration of a lifting mechanism according to another embodiment of the present invention. FIG. 12 is a plan sectional view taken along the EE_EE direction in FIG. Fig. 13 is a plan view showing a schematic configuration of a substrate processing system according to another embodiment of the present invention. FIG. 14 is a side view along the FF direction in FIG. 13. Fig. 15 is a plan view showing a schematic configuration of a substrate processing system according to a conventional example. FIG. 16 is a front view of a conventional conveyance roller. Figure Π is a schematic diagram showing the general configuration of a conventional direction switching device. 37 200405405 Figure (II) Symbols for components 1 Substrate processing system 2 Substrate loading / discharging unit 5 Cassette 6 First substrate processing device 7 Second substrate processing device 10 Lifting type substrate processing device 11a, 14, 16 partition member 13 cylindrical member 15 cylindrical portion 20 processing mechanism 21 support stand 22 etching device 26 conveying roller 29 ^ 30 nozzle 33 base 37 driving cylinder 40 lifting mechanism 41 ball screw 42 screw Cap 43 Servo motor 65, 66 Sheet body 70 Winding / feeding mechanism 72, 76 Winding shaft 80 Pulley 82 Transmission belt 85 ^ 80 Gear 87, 88 One-way clutch 86 Torque retainer 110 Swing device 114 Moving shaft 117 2nd The link 118 is a second drive shaft 119 engaging member.

38

Claims (1)

200405405 Scope of patent application: 1. A lifting type substrate processing device, which is characterized by having: a frame-shaped housing with a substrate input port and a substrate discharge port arranged side by side; a processing mechanism, which is built in m U Ώ 丄, double body, which has: a transport support mechanism to store and support the substrates that are carried in from the substrate into the 舻 double eight port, and to discharge the base support frame from the substrate discharge port to support the transport support Mechanism; the substrate tilting mechanism 'is used to tilt the substrate supported by the transport cutting mechanism; and The processing fluid ejection mechanism is provided above the counter-brown mechanism for conveying the processing fluid onto the substrate tilted by the substrate tilting mechanism; and the elevator is used to support the processing mechanism and make the processing mechanism It moves up and down to pass the processing mechanism through the substrate input port and the substrate discharge port. 2 · For example, in the application of the patent, the first step is to blindly display the step-down substrate processing method of Pei Zhi, in which the processing fluid ejection mechanism is used for the processing fluid that is not used as a processing fluid. Etching solution; the substrate tilting mechanism is used to make the substrate tilt at an angle in the range of 1 ° to 7.5 ° with respect to the horizontal plane. 3. If the lifting substrate processing device of item 1 of the scope of patent application, in which the processing fluid ejection mechanism is used to eject as a ^ fluid ^ etching liquid, the substrate tilting mechanism is used to tilt the substrate into The acceleration of the processing fluid flowing in the oblique direction of the plate is within a range of 0.13 times the acceleration of gravity. · 4. If the scope of patent application is the first! The lifting substrate processing and placement of the item, "" The processing fluid ejection mechanism is used to eject as a processing fluid ;; the liquid cleaning or peeling substrate tilting mechanism is to make the substrate ^ mesh for water number 39 200405405 surface into 45. To 75. Angles within range are tilted. 5. If the lifting type substrate processing device according to item [Scope of the patent application], in the basin, the processing fluid ejection mechanism is used to eject the processing fluid ^ as a cleaning liquid or a peeling liquid; the substrate tilting mechanism is used to make The acceleration of the processing fluid in which the substrate is tilted / flowed in the substrate tilting direction is in a range of a gravity speed = 0.7 times to 0.97 times. 6.? In the liftable substrate of item 6.?, The processing mechanism is provided with a swing mechanism, and the discharge direction of the processing fluid discharged by the mechanism is: ⑽ parallel to the substrate. Swing in the plane of intersection. —1. In the oblique direction of the substrate of the second category of the patent, the conveying support mechanism is to carry in and discharge the substrate along the substrate with clothes ...:, after the inner substrate Outward and backward movements. 8 · As in the patent application, the lift-type substrate processing device Ning Hao styles, is a partitioned component, separated from it by a driving room and a processing room '/ 口 土, ^ 入 / Discharge direction points # 山 十 2 chambers, and set up and infrastructure in the processing room with the board input port and the plate outlet; set the processing mechanism, and set the elevator in the drive room in the partition member, along the upper opening; downward direction Form a cylindrical shape formed by connecting the processing chamber and the driving chamber with a partition member, and in this one :: the two edge portions in the up-down direction are divided into the notch grooves in the up-down direction; each of the same-shaped portions is opposite to each other The supporting frame system forming the processing mechanism on the facing surface is connected to the lifting mechanism by a linking device provided in the opening stand XJt \ ^ 200405405 of the partition member; a band-shaped sheet body is connected to the linking device and is provided in the _ Between, and set to connect and. Shape D day] extended above and below, the hair edge part is inserted into the cylindrical part from the notch groove; a > the driving chamber and the processing chamber must be made of eight. It is divided by the blade partition member, the connection tool, and the sheet body. 9. The lifting substrate processing device such as the item No. 8 of the patent application is provided with a plurality of array openings, the connection tool, and the sheet body. ', 10. The lifting substrate processing apparatus according to item 8 of the scope of patent application has an exhaust mechanism for exhausting gas in the cylindrical portion. ′, 11. For example, in the case of a lifting substrate processing device of the eighth aspect of the patent application, the sheet body is formed into an endless ring. / 、 12. If the lifting substrate processing device of item 8 of the scope of patent application, and the middle 2 is located on the upper side and the lower side of the σHai sheet, a coiling / feeding mechanism for rolling / unloading the sheet is provided. With the movement of the sheet body raised and lowered by the lifting mechanism *, hunting is performed by the reeling / feeding mechanism to rewind / feed the sheet body. 13. The lifting type substrate processing apparatus according to item 12 of the scope of patent application, wherein the 'β winding / $ out mechanism' is composed of a winding shaft of the winding sheet body and a driving mechanism for rotating the winding shaft; the driving mechanism When the winding shaft is rotated in the sending direction, only the braking force is applied to the winding red, D ^ i, and when the winding shaft is rotated in the broadcasting direction, the power is transmitted through the friction clutch. Give the reel. , Η. For example, the lift-type substrate processing rack of item 13 of the patent application scope, wherein 'the driving mechanism has: a driven window wheel connected to the take-up shaft; and a driving gear of 41 200405405 driven gear $ σ Connected to the drive gear '· Friction clutch with friction clutch 7 hand rub clutch °. Flail shaft; 2 one-way clutches, respectively, the two ends of the shaft of the square shaft, slam & knife and pulley, through the middle sleeve ^ # u 万向 叔叔, · One early one clutch, and rotation Transmission belts of shaft-connected pulleys , Winding, and supporting members supporting another one-way clutch · The winding system holds the winding shaft in the direction that the winding shaft is always sent out == the rotating shaft is oriented toward the 搂 -to the transmission belt 'by the lifting mechanism Swirl. 15. —A substrate processing system, characterized in that it has the lifting substrate processing equipment of item i of the patent application scope; The substrate processing apparatus and the second substrate processing rack are used to process the substrate while moving the substrate in a horizontal state or an inclined state. J ::: 丨 The substrate discharge section of the substrate processing apparatus and the substrate input port of the lifting substrate processing clothes To connect, connect the substrate input part of the second substrate processing device and the substrate discharge port of the lifting substrate processing unit I; pass the substrate in order through the i-th substrate processing device, the lifting substrate processing device, and the second substrate processing device . Pick up, schema: as next page 42