CN1484279A - Lifting/lowering type substrate proless device and substrate process system having same - Google Patents

Lifting/lowering type substrate proless device and substrate process system having same Download PDF

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Publication number
CN1484279A
CN1484279A CNA031537138A CN03153713A CN1484279A CN 1484279 A CN1484279 A CN 1484279A CN A031537138 A CNA031537138 A CN A031537138A CN 03153713 A CN03153713 A CN 03153713A CN 1484279 A CN1484279 A CN 1484279A
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China
Prior art keywords
substrate
board treatment
mentioned
substrate board
elevation type
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CN100479092C (en
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水川茂
利
中田胜利
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SUMITOMO PRECISION INDUSTRY Co Ltd
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SUMITOMO PRECISION INDUSTRY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The substrate treatment apparatus 10 includes a housing shape cover 11 having a substrate input port 11a and a substrate discharge port 11b provided in parallel in a vertical direction, and a treatment mechanism 20 mounted in the cover 11. The apparatus 10 further includes the treatment mechanism 20 having a conveying/supporting means for receiving and supporting the substrate conveyed from the input port 11a and discharging the substrate from the port 11b, a support substrate 21 for supporting the conveying/supporting means, a substrate inclining means for inclining the substrate supported by the conveying/supporting means, and a treatment fluid discharge means arranged above the substrate/supporting means to discharge a treatment fluid on the substrate inclined by the substrate inclining means, and a lifting means 40 for supporting the treatment mechanism 20, lifting the treatment mechanism 20 in a vertical direction and making the treatment mechanism 20 pass via the port 11a and the port 11b.

Description

Elevation type substrate board treatment and have the base plate processing system of this device
Technical field
The present invention relates to a kind of for semiconductor (silicon) wafer, liquid crystal glass base, photomask with glass substrate, CD with various substrates such as substrates, carrying out the processing unit of predetermined processing and connecting the base plate processing system that a plurality of processing unit constitutes on one side while moving it (transmission).
Background technology
Such as, in the manufacturing process of liquid crystal glass base, carry out the coating of coating, the etching solution of developer solution, the wet process of coating that is used to peel off the stripper of etchant resist is handled, and during each wet process is handled, cleans processing and dried.
In addition, as being used for above-mentioned each processing unit of handling, at present, people know the processing unit that constitutes in the following manner, this mode is: substrate is positioned on the transfer roller, and by above-mentioned transfer roller, on one side the transmission of substrate along continuous straight runs is handled it on one side.In addition, people know base plate processing system shown in Figure 15, and in order to carry out above-mentioned each processing continuously, this system is according to each processing unit ways of connecting is constituted.
Figure 15 is the plane graph of basic comprising of the base plate processing system of expression conventional example, and as shown in Figure 15, this base plate processing system 200 is made of substrate input/discharge portion 201, processing substrate portion 205 and substrate transport unit 210.Aforesaid substrate input/discharge portion 201 is made of mounting table 202 and transfer device 204, these mounting table 202 mountings are held the box 203 of a plurality of substrates, the inside of this transfer device 204 box 203 on 202 from mounting in mounting table, one by one take out substrate, it is put into processing substrate portion 205, take out the substrate of end process from processing substrate portion 205, it is stored in the box 203.In addition, above-mentioned transfer device 204 is made of manipulator (robot) usually, and this manipulator can vertically moving along mounting table 202.
Aforesaid substrate handling part 205 by in parallel to each other and the 1st handling part of establishing 206 and the 2nd handling part 207 these 2 handle lines and constitute, the 1st handling part 206 and the 2nd handling part 207 are as shown in figure 16, have a plurality of transfer rollers 208 that transmit substrate respectively along the direction of arrow, can pass through this transfer roller 208, it be carried out predetermined process while transmit substrate.Such as, the 1st handling part 206 is the handling parts that substrate carried out etch processes, on the substrate in transmission, and the coating etching solution.In addition, the 2nd handling part 207 is made of washing handling part 207a and the 207b of dried portion, in washing handling part 207a, will clean water and be supplied in substrate, in the 207b of dried portion, supplies with drying gas to substrate.
Aforesaid substrate transport unit 210 is to be sent to the mechanism of the 2nd handling part 207 by the substrate of the 1st handling part 206 processing, it is made of following part, this following part comprises: direction switching device shifter 211, this direction switching device shifter 211 switches from the direction of transfer of the substrate of the 1st handling part 206 discharges, and it is transmitted; A plurality of transfer rollers 212, these a plurality of transfer rollers 212 transmit the substrate of discharging from direction switching device shifter 211 along above-mentioned discharge direction; Direction switching device shifter 213, this direction switching device shifter 213 switches the direction of transfer of the substrate that transmits by transfer roller 212 and this substrate is sent to the 2nd handling part 207.
As shown in figure 17, above-mentioned direction switching device shifter 211 is made of following part, this following part comprises: a plurality of the 1st transfer rollers 214, and these a plurality of the 1st transfer rollers 214 transmit substrate K along identical direction of transfer in the horizontal plane identical with the transmission plane of the transfer roller 208 that constitutes the 1st handling part 206; Lifter 215, this lifter 215 are arranged between the 1st transfer roller 214, from the transmission plane of the 1st transfer roller 214, and outstanding along the vertical direction returning; Many group the 2nd transfer rollers 216, these many group the 2nd transfer rollers 216 are arranged at the top of the 1st transfer roller 214 opposed to each other, have and the perpendicular central shaft of the central shaft of the 1st transfer roller 214, and substrate K is sent to above-mentioned transfer roller 212 sides.In addition, mutually opposed the 2nd transfer roller 216 can move along approaching mutually/direction of leaving.In addition, in the drawings, the retainer that label 217 expressions prevent substrate K to move.
According to this direction switching device shifter 211, will transmit along above-mentioned discharge direction from the substrate K that the 1st handling part 206 is discharged by the 1st transfer roller 214, until contacting with retainer 217.At this moment, lifter 215 is return towards the below from the transmission plane of the 1st transfer roller 214.Then, lifter 215 is outstanding towards the top from the transmission plane of the 1st transfer roller 214, thus, makes substrate K rise to the position shown in the double dot dash line among Figure 17.At this moment, the 2nd transfer roller 216 is positioned at the position of leaving mutually.Then, the 2nd transfer roller 216 moves to approaching position mutually, and then, lifter 215 descends.Thus, substrate K is in the state of being supported by the 2nd transfer roller 216, then, by the 2nd transfer roller 216, along with the perpendicular direction of the direction of transfer of the 1st transfer roller 214, promptly transmit towards transfer roller 212 sides, discharges substrate.Like this, switched the direction of transfer of substrate K.
Particularly, above-mentioned direction switching device shifter 213 also possesses and above-mentioned direction switching device shifter 211 essentially identical formations, switches the direction of transfer of the substrate K that is transmitted by transfer roller 212, is sent to the 2nd handling part 207, though this point is not shown in the drawings.
As shown in figure 15, in this base plate processing system 200, the 1st handling part 206, substrate transport unit 210 and the 2nd handling part 207 are seen from the plane and are the setting of C font, from the substrate K that box 203 takes out, at first put into the 1st handling part 206 by transfer device 204.Then, an edge direction of arrow transmits substrate K in the 1st handling part 206, Yi Bian this substrate is carried out predetermined process (etch processes), then, in substrate transport unit 210, switch its direction of transfer, and this substrate is fed into the 2nd handling part 207.And an edge direction of arrow transmits substrate K in the 2nd handling part 207, on one side this substrate is carried out predetermined process (washing is handled and dried), then, once more it is stored in the box 203 by transfer device 204.
If but in the 1st handling part 206 and the 2nd handling part 207, if in transmission, the posture of substrate K changes, and such as when tilting towards the direction perpendicular with it with respect to direction of transfer, then can not carry out the good processing of precision.So, at present, as shown in figure 16, on the roller at the both ends of above-mentioned transfer roller 208, forming flange part 208a, can control the posture of the substrate K in transmitting by this flange part 208a.This situation also is identical for above-mentioned the 1st transfer roller 214 and the 2nd transfer roller 216.But if such flange part 208a is set, then this flange part 208a counteracts, and can not switch the direction of transfer of substrate K in the transmission plane of transfer roller 208.So, in above-mentioned direction switching device shifter 211,213,, can switch its direction of transfer with lifting to the upper end of flange part 208a on the substrate K.
In addition, for above-mentioned reasons,, therefore, only carry out the transmission of substrate K so that in the substrate transport unit 210 that the mode of substrate K lifting constitutes, can not carry out the processing of substrate K in this one.That is, when carrying out substrate clean in this one,, then produce and make, clean effect and produce difference from the detergent remover of nozzle ejection stronger position and so not strong position if make substrate K lifting.
Therefore, in present base plate processing system 200, as mentioned above, in substrate transport unit 210, substrate K is not handled, but then, because this situation but produces the problem that describes below.
That is, such as, example as shown in figure 15 is like that, at the 1st handling part 206, substrate K carried out etch processes after, just it is not transmitted if clean, then owing to deliver to the difference of the delivery time of the 2nd handling part 207, the degree difference that etching is carried out can not be controlled etching accurately.Because substrate transport unit 210 has the actuating mechanism of following complexity, this actuating mechanism is made of mechanism that makes substrate K lifting and mechanism that the 2nd transfer roller 216 is moved, so very difficultly accurately the delivery time is controlled.
In addition, such as, under the situation of final operation for clean operation of the 1st handling part 206, if do not transmit substrate K dryly, then producing dry mottling from the teeth outwards, or produce stain, substrate K becomes bad.
And, in above-mentioned existing base plate processing system 200, along continuous straight runs transmits the substrate K of horizontal status of support on one side, etching solution, the clean so various treatment fluids of water are supplied to this substrate K on one side, but there is following problems, promptly, under the situation of the substrate K that like this treatment fluid is supplied to flat-hand position, be difficult on the surface of substrate K, produce the liquid stream of treatment fluid, the initial treatment fluid of supplying with is stranded on the surface of substrate K, so be difficult to change the new treatment fluid of continuous supply, handle spended time, can't handle uniformly.
On the other hand, if supply with a large amount of treatment fluids to substrate K, though can improve the replaceability of treatment fluid, use a large amount of treatment fluids, efficient is relatively poor, and in addition, the container that causes storing this treatment fluid maximizes, installs and maximize.
In addition, in above-mentioned existing base plate processing system 200 since abreast and establish the 1st handling part 206 and the 2nd handling part 207 these two handle lines, so also there is the inefficient problem of being provided with of device.
Summary of the invention
The present invention be directed to above-mentioned actual conditions and develop, the object of the present invention is to provide a kind of have from wherein one handle function and substrate board treatment of can be effectively the substrate transmitting being handled and the base plate processing system that another processing line of alignment transmits substrate with this device.
Be used to realize a kind of elevation type substrate board treatment that the present invention relates to of above-mentioned purpose, it is characterized in that this elevation type substrate board treatment comprises:
Shell body, this shell body have and are located at substrate input port and the substrate outlet of locating up and down, are frame shaped;
Processing mechanism, this processing mechanism are built in the above-mentioned shell body, and this processing mechanism comprises: the substrate that transmission-supporting mechanism, this transmission-supporting mechanism hold and support to send into from the aforesaid substrate input port, on the other hand, discharge aforesaid substrate from the aforesaid substrate outlet; Support pallet, this support pallet is supported above-mentioned transmission-supporting mechanism; Substrate leaning device, this substrate leaning device tilt the substrate of being supported by above-mentioned transmission-supporting mechanism; Handle fluid ejection mechanism, this processings fluid ejection mechanism is arranged at the top of above-mentioned transmission-supporting mechanism, is ejected on the substrate by the inclination of aforesaid substrate leaning device handling fluid;
Elevating mechanism, this elevating mechanism is supported above-mentioned processing mechanism, and makes the lifting along the vertical direction of this processing mechanism, makes above-mentioned processing mechanism through aforesaid substrate input port and substrate outlet.
According to above-mentioned elevation type substrate board treatment, by elevating mechanism, make processing mechanism lifting along the vertical direction, through substrate input port and substrate outlet.And, when processing mechanism process substrate input port, from the aforesaid substrate input port, hold the substrate of discharging, it is supported, according to moving to the substrate outlet stipulated time before from the handling part of last operation, from handling fluid ejection mechanism, will handle fluid and be ejected on the substrate.Thus, substrate is carried out predetermined process, after processing, it is discharged and be sent to the handling part of subsequent processing from the aforesaid substrate outlet.In addition, handle fluid in ejection, carry out predetermined process during, by the substrate leaning device, make the relative horizontal plane inclination of substrate predetermined angular.
Like this, according to this elevation type substrate board treatment, owing to can make by the transmission-supporting mechanism of support substrate and will handle the integral elevating that processing fluid on the substrate that fluid is ejected into this support sprays the processing mechanism that mechanism constitutes, so when transmitting substrate, position relationshipization between substrate and the processing fluid ejection mechanism, therefore, such as, under the situation that substrate is cleaned, can will be close to the each several part that supplies to equably on the substrate from the detergent remover of handling the ejection of fluid ejection mechanism, what can be speckless cleans.
In addition, owing to can transmit substrate with this single action that makes the processing mechanism lifting by elevating mechanism, so its speed control is easy, therefore, even under the situation of carrying out processing such as etching, still can control it accurately.
And, owing to can handle fluid to the substrate ejection of having tilted, so supply to the liquid stream that the processing fluid on the substrate surface flows downward because of the inclination of substrate produces, by this liquid stream, the processing fluid on the substrate surface is changed by the new processing fluid of continuous supply successively.Like this, handle the replacing effect of fluid by this, can a spot of processing fluid, within a short period of time, equably substrate surface is handled.
Also have, in recent years, follow the maximization of substrate, there are the use amount be used for processing fluid that it is handled, the tendency that the processing time increases, but as mentioned above, tilt by making substrate, it is handled, can reduce to handle the use amount of fluid, reach the purpose of equipment miniaturization, can reduce processing cost.
In the present invention, in above-mentioned processing fluid, comprise developer solution, etching solution, be used to peel off the stripper of etchant resist, the clean water of cleaning usefulness, desiccant gas etc. these handle the various fluids of usefulness to substrate, above-mentioned various processing fluids can be supplied on the substrate, it is handled.
But with regard to the angle of inclination of substrate, in other words the speed that control liquid stream is wandered on substrate surface, the time that control and treatment liquid is detained, when this speed is suitable, can obtain required treatment effect on substrate surface.
According to this implication, in above-mentioned treatment fluid ejection mechanism is under the situation about constituting as the mode of the etching solution of handling fluid with ejection, by the substrate that the aforesaid substrate leaning device tilts, angle of inclination with respect to the horizontal plane is in the scope below 7.5 ° more than 1 ° (more preferably in the scope below 5 ° more than 2 °) preferably.Adopt the reason of this scope to be: if above-mentioned angle of inclination is above 7.5 °, the excessive velocities of liquid stream then, that is, the residence time of the etching solution on the substrate surface is too short, otherwise, under the situation of 1 ° of angle of inclination less than, the speed of liquid stream is slow excessively, promptly, the etching solution of substrate surface is detained the long period, in either case, all can't handle fully, the use amount of etching solution increases.
Also have, under the situation of the angle of inclination of aforesaid substrate in the scope below 7.5 ° more than 1 °, if it is scaled the acceleration of the etching solution of wandering on this substrate surface, then this acceleration is at more than 0.08 times in the scope below 0.13 times of acceleration of gravity, particularly preferred more than 2 ° under the situation in the scope below 5 °, the acceleration of above-mentioned etching solution is at more than 0.03 times in the scope below 0.09 times of acceleration of gravity.
In addition, in above-mentioned processing fluid ejection mechanism is under the situation about constituting in the mode that can spray as the detergent remover of handling fluid or stripper, by the substrate that the aforesaid substrate leaning device tilts, angle of inclination with respect to the horizontal plane is in the scope below 75 ° more than 45 ° (more preferably 55 ° with the scope below 70 ° in) preferably.Adopt the reason of this scope to be: if above-mentioned angle of inclination is above 75 °, the excessive velocities of liquid stream then, that is, the detergent remover on the substrate surface or the residence time of stripper are too short, otherwise, under the situation of 45 ° of angle of inclination less thaies, the speed of liquid stream is slow excessively, promptly, the etching solution of substrate surface is detained the long period, in either case, all can't handle fully, the use amount of detergent remover, stripper increases.
In addition, under the situation of the angle of inclination of aforesaid substrate in 45 °～75 ° scope, if it is scaled the acceleration that detergent remover, stripper are wandered on this substrate surface, then this acceleration is at more than 0.7 times in the scope below 0.97 times of acceleration of gravity, particularly preferred more than 55 ° under the situation in the scope below 70 °, the acceleration of above-mentioned detergent remover, stripper is at more than 0.82 times in the scope below 0.94 times of acceleration of gravity.
In addition, above-mentioned processing mechanism also can possess swing mechanism, this swing mechanism makes the emission direction that is sprayed the processing fluid of mechanism's ejection by above-mentioned processing fluid, parallel with the incline direction of aforesaid substrate and with the perpendicular plane of this substrate in swing, that is, the inclination of substrate upward to and downward direction between swing.
If like this, when making the emission direction of handling fluid towards being tilted to direction and swinging of substrate, by above-mentioned swing, handling the effect of fluid retention on substrate surface increases, on the other hand, when making the emission direction of handling fluid when the inclination downward direction of substrate is swung, by this swing, the speed of the processing fluid of wandering on substrate surface increases, and the delay of treatment fluid and wandering on the whole base plate surface produces repeatedly.Like this, by this effect, but by the processing fluid of less amount, equably the whole base plate surface is handled within a short period of time.
In addition, above-mentioned transmission-supporting mechanism can with after holding aforesaid substrate, the substrate that held is constituted along the mode that direction seesaws repeatedly of sending into/discharge of aforesaid substrate.
Such as mentioned above, in the elevation type substrate board treatment, can will be close on the each several part that supplies to equably on the substrate from the processing fluid of handling the ejection of fluid ejection mechanism, but then, existing to resemble has in handling fluid itself such as the higher position of pressure and the lower position uneven situation of generation like this, but under these circumstances, can not carry out proper homogeneous to substrate handles.
So, as mentioned above, if make repeatedly and hold, be held in the mode that the substrate in transmission-supporting mechanism seesaws and constitute according to send into/discharge direction along this, seesawing then by substrate, to inhomogeneous the averaging processing of pressure of the processing fluid of running into substrate, can carry out the processing of homogeneous to substrate.In addition, the swing of handling also emission direction that can be by above-mentioned processing fluid of the uneven equalization of the pressure of this processing fluid is carried out.
In addition, the structure of above-mentioned elevation type substrate board treatment can be: utilize partition member, send into/discharge direction along aforesaid substrate, above-mentioned shell body is divided into drive chamber and such two chambers of process chamber, and in above-mentioned process chamber, above-mentioned processing mechanism is set with aforesaid substrate input port and substrate outlet, on the other hand, above-mentioned elevating mechanism is set in above-mentioned drive chamber;
On above-mentioned partition member, along the vertical direction, form peristome with above-mentioned process chamber and drive chamber's connection;
The two edge portions along the vertical direction that are formed at the peristome on the above-mentioned partition member are tubular respectively, and form gap slot along the vertical direction on mutual opposed of this a pair of each cylindrical portion;
The above-mentioned support pallet of above-mentioned processing mechanism utilizes the connector in the peristome that is arranged at above-mentioned partition member, links with above-mentioned elevating mechanism;
On above-mentioned connector, be connected with banded lamellar body, this lamellar body is arranged between the above-mentioned a pair of cylindrical portion, and is provided with in the mode of extending towards the above and below of above-mentioned connector, and its both side edges portion is inserted in the above-mentioned cylindrical portion from above-mentioned gap slot respectively;
Above-mentioned drive chamber separates institute with process chamber by above-mentioned partition member, connector and lamellar body and becomes.
The corrosivity of the developer solution that comprises in the processing fluid, etching solution, stripper etc. is higher, if it is attached on the elevating mechanism, then has the danger that this elevating mechanism sustains damage, its function suffers damage.So, such as mentioned above, if being provided with the drive chamber of elevating mechanism separates by partition member, connector and lamellar body with the process chamber that is provided with processing mechanism, can prevent that then the employed processing fluid of process chamber from invading drive chamber, can prevent because of handling the situation of the elevating mechanism damage that fluid causes.Particularly, owing to adopt following so-called labyrinth structure, wherein, to form tubular along the edge portion of the above-below direction that is arranged at the peristome on the partition member, and the both side edges portion of the lamellar body that is provided with in the mode of extending towards the above and below of connector, from the gap slot that is formed at above-mentioned cylindrical portion, be inserted in this cylindrical portion, so the two air-tightness of drive chamber and process chamber is improved.
And, also can be provided with many group above-mentioned peristome, connector and lamellar bodies.In addition, if the exhaust gear that the gas in the above-mentioned cylindrical portion is discharged is set, because the processing fluid for invading from the gap between above-mentioned lamellar body and the gap slot in the cylindrical portion can carry out exhaust by above-mentioned exhaust gear, invades drive chamber so can more positively prevent to handle fluid.
In addition, above-mentioned lamellar body can be head, ring-type for no reason.In addition, also can such formation, promptly, upper side and lower side at above-mentioned lamellar body, be provided with respectively above-mentioned lamellar body is reeled/coiling/dispatch mechanism of dispatch, motion along with the lamellar body of lifting by above-mentioned elevating mechanism, carry out the coiling/dispatch of above-mentioned lamellar body by above-mentioned coiling/dispatch mechanism, also can such formation, that is, coiling/dispatch mechanism is made of the wireline reel of coiling lamellar body and the driving mechanism that this wireline reel is rotated, and, the structure of above-mentioned driving mechanism is: at above-mentioned wireline reel when the dispatch direction is rotated, only make braking force act on wireline reel, on the other hand, when above-mentioned wireline reel is rotated in the take-up direction, by friction clutch, give above-mentioned wireline reel with transmission of power.According to this coiling/dispatch mechanism, lamellar body does not produce lax, it can be reeled, dispatch.
Have, above-mentioned driving mechanism can be made of following parts again, and these following parts comprise: driven gear, and this driven gear is connected with above-mentioned wireline reel; Driven wheel, this driven wheel and the engagement of above-mentioned driven gear; Friction clutch, this friction clutch and above-mentioned driven wheel link; Rotating shaft, this rotating shaft and above-mentioned friction clutch link; Two one-way clutch, these two one-way clutch link with the both ends of rotating shaft respectively, allow rotating shaft only along a direction rotation; Pulley, this pulley link with above-mentioned rotating shaft by one of them above-mentioned one-way clutch; Driving belt, this driving belt are wound on the above-mentioned pulley; Holding components, this holding components are supported another above-mentioned one-way clutch; The structure of above-mentioned two one-way clutch can be: allow the rotation of above-mentioned rotating shaft towards the direction that above-mentioned wireline reel is rotated in the take-up direction, on the other hand, limit above-mentioned rotating shaft towards the rotation that makes above-mentioned wireline reel along the direction of dispatch direction rotation; And above-mentioned driving belt is to realize that by above-mentioned elevating mechanism the mode of rotation constitutes.
And, elevation type substrate board treatment according to said structure, can form following base plate processing system, the structure of this base plate processing system is: locating and be provided with the 1st substrate board treatment and the 2nd substrate board treatment of this substrate being handled with level or heeling condition moving substrate up and down on one side on one side; The substrate discharge portion of above-mentioned the 1st substrate board treatment and the substrate input port of above-mentioned elevation type substrate board treatment are connected; On the other hand, the substrate throw-in part of above-mentioned the 2nd substrate board treatment and the substrate outlet of above-mentioned elevation type substrate board treatment are connected; Make substrate successively through the 1st substrate board treatment, elevation type substrate board treatment, the 2nd substrate board treatment.Its with in same horizontal plane and the existing treatment system of establishing the 1st substrate board treatment and the 2nd substrate board treatment compare, the space is set can be less.
Description of drawings
Fig. 1 is the front view of basic comprising of the base plate processing system of expression an embodiment of the invention.
Fig. 2 is the plane graph of basic comprising of the base plate processing system of expression present embodiment.
Fig. 3 is the positive view of basic comprising of the elevation type substrate board treatment of expression present embodiment.
Fig. 4 is the positive view of basic comprising of the Etaching device of expression present embodiment.
Fig. 5 is the sectional view of basic comprising of the Etaching device of expression present embodiment.
Fig. 6 is the flat cutting view along the CC-CC direction among Fig. 5.
Fig. 7 is the flat cutting view along the AA-AA direction among Fig. 3.
Fig. 8 is the flat cutting view along the BB-BB direction among Fig. 3.
Fig. 9 is the sectional view along the GG-GG direction among Fig. 6.
Figure 10 is the flat cutting view of the coiling/dispatch mechanism of present embodiment.
Figure 11 is the positive view of basic comprising of the elevating mechanism of expression other execution mode of the present invention.
Figure 12 is the section plan along the EE-EE direction among Figure 11.
Figure 13 is the plane graph of basic comprising of the base plate processing system of expression other execution mode of the present invention.
Figure 14 is the end view along the FF direction among Figure 13.
Figure 15 is the plane graph of basic comprising of the base plate processing system of expression conventional example.
Figure 16 is the front view of the transfer roller of expression conventional example.
Figure 17 is the schematic diagram of basic comprising of the direction switching device shifter of expression conventional example.
Symbol description: 1 base plate processing system, 2 substrate input/discharge portions, 5 boxes, 6 the 1st substrate board treatments, 7 the 2nd substrate board treatments, 10 elevation type substrate board treatments, 11a, 14,16 partition members, 13 cartridges, 15 cylindrical portion, 20 processing mechanisms, 21 support pallet, 22 Etaching devices, 26 transfer rollers, 29,30 nozzles, 33 base stations, 37 driving cylinders, 40 elevating mechanisms, 41 snap bolts, 42 nuts, 43 servo motors, 65,66 lamellar bodies, 70 coiling/dispatch mechanisms, 72,76 wireline reels, 80 pulleys, 82 driving belts, 85,80 gears, 87,88 one-way clutch, 86 torque retainers, 110 agitating devices, 114 shifting axles, 117 the 2nd connecting rods, 118 the 2nd driving shafts, 119 attachment.
Embodiment
Below with reference to the accompanying drawings, the specific embodiment of the present invention is described.Fig. 1 is the front view of basic comprising of the base plate processing system of expression an embodiment of the invention, and Fig. 2 is its plane graph.In addition, Fig. 3 is the positive view of basic comprising of the elevation type substrate board treatment of expression present embodiment, and Fig. 4 is the positive view of basic comprising of the decontaminating apparatus of expression present embodiment, and Fig. 5 is its sectional view.In addition, Fig. 6 is the flat cutting view along the CC-CC direction among Fig. 5, and Fig. 7 is the flat cutting view along the AA-AA direction among Fig. 3, and Fig. 8 is the flat cutting view along the BB-BB direction among Fig. 3.In addition, Fig. 3 also is the cutaway view along the DD-DD direction among Fig. 7.
At first, the formation to this routine base plate processing system 1 is described.
As depicted in figs. 1 and 2, this routine base plate processing system 1 is by substrate input/discharge portion 2, constitute at the 1st substrate board treatment 6 of locating up and down and establishing and the 2nd substrate board treatment 7 and elevation type substrate board treatment 10.Substrate input/discharge portion 2 is made of mounting table 4 and transfer device 3, placing the box 5 that holds a plurality of substrates on this mounting table 4, this transfer device 3 one by one takes out substrate from being positioned in the box 5 on the mounting table 4, it is dropped into the 1st substrate board treatment 6, on the other hand, take out the substrate of having finished dealing with from the 2nd substrate board treatment 7, it is deposited in the box 5.In addition, transfer device 3 is by constituting along vertical (direction shown in the arrow) of mounting table 4 mobile manipulator.In addition, box 5 transports by the conveyer of not shown AGV etc.
Above-mentioned the 1st substrate board treatment 6 drops into side at its substrate to have and makes substrate with respect to the level 7.5 ° of substrate leaning device portions with lower angle (being 7 ° in this example) more than 1 ° of tilting, and has the inclination transport unit that transmits the substrate that tilts with the continuous tilt state along direction shown in the arrow.On the other hand, the 2nd substrate board treatment 7 has successively along direction shown in the arrow: the substrate of accepting to discharge from elevation type substrate board treatment 10, again this substrate to be tilted significantly be the substrate leaning device portion of the angle below 75 ° more than 45 ° (being 70 ° in this example); Transmit the inclination transport unit of the substrate that tilts along direction shown in the arrow with the continuous tilt state; The substrate that tilts is back to the inclination gigback portion of level.And in this example, while the 1st substrate board treatment substrate carried out etched mode constitute to transmit substrate, while the 2nd substrate board treatment 7 is to transmit this substrate this substrate is cleaned and dry mode constitutes.
As Fig. 3, Fig. 7 and shown in Figure 8, above-mentioned elevation type substrate board treatment 10 by the shell body 11 that is frame shaped, be arranged at processing mechanism 20 in this shell body 11 and elevating mechanism 40 etc. and constitute.In addition, in this shell body 11, be formed with peristome 11a and peristome 11b, the internal communication of this peristome 11a and the 1st substrate board treatment 6, the internal communication of this peristome 11b and the 2nd substrate board treatment 7.In addition, shell body 11 is supported by pillar 12, with the inside of shell body 11, is divided into process chamber A and the B of drive chamber, is provided with processing mechanism 20 in this process chamber A, is provided with elevating mechanism 40 in the B of drive chamber.
Above-mentioned processing mechanism 20 is by Etaching device 22 and support the support pallet 21 of this Etaching device 22 to constitute.This Etaching device 22 is made of following part etc. as Fig. 4～shown in Figure 6, and this following part comprises: shell 23, be provided with the peristome 23a that sends into/discharge substrate K in a side of this shell 23, and this shell 23 is frame shaped; A plurality of transfer rollers 26, these a plurality of transfer rollers 26 are arranged at the inside of above-mentioned shell 23; A plurality of nozzles 29, these a plurality of configurations 29 are arranged at the top of above-mentioned transfer roller 26; A plurality of nozzles 30, these a plurality of nozzles 30 are arranged at the below of transfer roller 26, and are identical with a plurality of nozzle 29.
On the transfer roller 26 of the most approaching above-mentioned peristome 23a, be provided with niproll 27, this niproll 27 contacts with the top of this transfer roller 26, clamping substrate K, by forward and reverse rotation of these transfer rollers 26 and niproll 27, substrate K is sent into from above-mentioned peristome 23a, discharge from this peristome 23a.
In addition, the both ends of the rotating shaft 26a of transfer roller 26 are rotatably propped up and are held on the base station 33, on this base station 33, are provided with guide roller 34, this guide roller 34 with the perpendicular direction of the direction of transfer of substrate K on the moving of restricting substrate K.This base station 33, with can be along the mode that tilts with the perpendicular direction of the direction of transfer of substrate K, its central portion be by link 36, props up swingably to be held on the holding components 35, and one end thereof engages with the piston rod 37a of driving cylinder 37 by attachment 38.
Above-mentioned driving cylinder 37 is made of oil hydraulic cylinder or pneumatic cylinder, by making its piston rod 37a lifting, be fulcrum with the supporting location of above-mentioned link 36, make base station 33 along and the perpendicular direction of the direction of transfer of substrate K tilt, thus, the substrate K on the transfer roller 26 is tilted.In addition, this base station 33 inclination angle with respect to the horizontal plane preferably in 1 °～7.5 ° scope, in this example, is set at 7 °.
Each nozzle 29 that is arranged at the top of transfer roller 26 is individually fixed on a plurality of supply pipes 28 that are connected with not shown etching solution supply source, will be supplied to etching solution (surface) injection above substrate K of each supply pipe 28 from above-mentioned etching solution supply source (not shown).Above-mentioned supply pipe 28 is in the mode of its axis along the direction of transfer of substrate K, two supply pipe interval prescribed distance are arranged in a row, and this supply pipe 28 is listed in in the plane of the angle tilt identical with the above-mentioned inclination angle of above-mentioned base station 33 and be made as multiple row, the 28a of support sector that is formed at its both ends rotatably supports respectively by holding components 100 and by bearing 101.And each supply pipe 28 row can pass through pendulous device 110, around the forward and reverse rotation in its center.Like this, by forward and reverse rotation of this supply pipe 28, each nozzle 29 with the perpendicular plane of the direction of transfer of substrate K in swing, the injection direction of the etching solution that sprays from each nozzle 29 is swung being tilted between direction and the downward direction of substrate K.
As Fig. 6 and shown in Figure 9, above-mentioned pendulous device 110 is made of following parts etc., and these following parts comprise: CD-ROM drive motor 111; Swivel plate 112, this swivel plate 112 are arranged on the output shaft 111a of CD-ROM drive motor 111; The 1st bar 113, the 1 bars 113 are located at the position of leaving with the center of rotating shaft 112 standing around the mode of axle center rotation; One end of the 1st driving shaft 114, the 1 driving shafts 114 is arranged in the shell 23, and the other end is arranged at outside the shell 23; The 2nd bar 115, the 2 bars 115 are founding another distolateral peripheral part of being located at the 1st rotating shaft 114 around the mode of axle center rotation; The 1st connecting rod 116, the 1 connecting rods 116 link together the 1st bar 113 and the 2nd bar 115; Two the 2nd driving shafts 118, these two the 2nd driving shafts 118 are spaced apart with prescribed distance, are arranged at lower position between the supply pipe 28,28 that constitutes above-mentioned each row according to the mode parallel with above-mentioned holding components 100; A plurality of the 2nd connecting rods 117, end at these a plurality of the 2nd connecting rods 117, be formed with conjugate foramen 117a, this conjugate foramen 117a engages with the 28a of support sector of above-mentioned each supply pipe 28 respectively, the other end at these a plurality of the 2nd connecting rods 117, be equipped with engages axle 117b, this engages axle 117b inserts among the conjugate foramen 118a that is formed on above-mentioned the 2nd driving shaft 118 in chimeric mode; Attachment 119, these attachment 119 have engages axle 119a, and this engages axle 119a engages with notch part 118b in being formed at above-mentioned each the 2nd driving shaft 118; Holding components 120, this holding components 120 are fixed in an above-mentioned end of above-mentioned the 1st driving shaft 114, and support above-mentioned attachment 119.In addition, Fig. 9 is the sectional view along the GG-GG direction of Fig. 6.
Like this, if CD-ROM drive motor 111 rotations, then its rotary driving force is by output shaft 111a, pass to swivel plate 112, its rotation, follow the rotation of this swivel plate 112,, make the 1st driving shaft 114 along its axis direction seesaw (reciprocating motion) by the 1st bar the 113, the 1st connecting rod 116 and the 2nd bar 115.And if the 1st driving shaft 114 seesaws along its axis direction, then its power passes to the 2nd driving shaft 118 by holding components 120, attachment 119, and the 2nd driving shaft 118 front and back are driven.And, follow seesawing of the 2nd driving shaft 118, by the 2nd connecting rod 117, each supply pipe 28 that is connected with the 2nd driving shaft 118 as described above, along forward and reverse around the rotation of its center, make each nozzle 29 of being fixed thereon with the perpendicular plane of the direction of transfer of substrate K in swing.
Above-mentioned each nozzle 30 that is arranged at the below of transfer roller 26 is fixed on a plurality of supply pipes 31 that are connected on the above-mentioned etching solution supply source (not shown), by these each supply pipes 31, will be from etching solution injection below substrate K of above-mentioned etching solution supply source (not shown) supply.In addition, each supply pipe 31 is along substrate K direction of transfer and establish, and supports by the holding components 103 that is fixed on the base station 33 by fixed part 102.In addition, on above-mentioned holding components 103, be provided with the transducer that has or not 32 that detects substrate K.
In addition, in the bottom of above-mentioned shell 23, be provided with collecting tank 24, this collecting tank 24 is interconnected by peristome 23b, and the etching solution that sprays from each nozzle 29,30 is recovered in this collecting tank 24, by discharge pipe 25, suitably discharges.
In the above-mentioned B of drive chamber, the upright support 17 that is provided with, this support 17 are formed by square tube, are vertical clathrate, on this support 17, are provided with above-mentioned elevating mechanism 40.In addition, support 17 is installed on the pillar 12 by carriage 18.
Above-mentioned elevating mechanism 40 is made of following parts etc., and these following parts comprise: lifting platform 44, this lifting platform 44 be by connector 55,56 and 57,58, and supports that pallet 21 is connected; Pair of guide rails 45, this pair of guide rails 45 also is located on the face of above-mentioned process chamber A side of the vertical frame that constitutes above-mentioned support 17; Slide unit 46, this slide unit 46 be according to can engaging with each guide rail 45 respectively along the mode that each guide rail 45 moves, and be fixed on the lifting platform 44; Snap bolt 41, this snap bolt 41 is according to rotatable and prop up with the mode of guide rail 45 keeping parallelisms and to be held on the support 17; Nut 42, this nut 42 is fixed on the lifting platform 44 according to the mode that screws togather with this snap bolt 41; Servo motor 43, this servo motor 43 is fixed on the support 17, rotation, driving snap bolt 41.
If make snap bolt 41 rotations by above-mentioned servo motor 43, the nut 42 that then screws togather with it moves (lifting) along this snap bolt 41, the lifting platform 44 that is connected with this nut 42, is connected in the support pallet 21 on this lifting platform 44 and supports thereon Etaching device 22 and nut 42 1 liftings by connector 55,56 and 57,58.
B of drive chamber and process chamber A separate by partition member 11a, 14,16.Between partition member 11a, 14, and between the partition member 14,16, form peristome respectively,, be respectively arranged with connector 55,56 and 57,58 to be positioned at the mode of each peristome.In addition, the both side edges portion 15 that forms the partition member 14 of each peristome is tubular along its extension, relative with it to partition member 11a, each edge portion of 16, along this edge portion, be respectively arranged with cartridge 13.In addition, relatively on face, form gap slot along the vertical direction in each of the cartridge 13 of the cylindrical portion 15 of the both side edges of partition member 14 respectively.
In addition, between the cylindrical portion 15 and above-mentioned cartridge 13 of the both side edges of above-mentioned partition member 14,, be respectively arranged with banded lamellar body 65,66 along this gap.The both side edges of this lamellar body 65,66 is inserted in cylindrical portion 15, the cartridge 13, to be fixed on them by connector 55,56 and 57,58 modes from the clamping of interior outside respectively from above-mentioned gap slot.And each upper end of lamellar body 65,66 and bottom are wound in respectively in coiling described later/dispatch mechanism 70.In addition, cylindrical portion 15 and cartridge 13 can pass through not shown suitable exhaust gear, and its gas inside is discharged.In addition, in this example, above-mentioned lamellar body 65,66 adopts the sheet of teflon (registered trade mark) system of resistance to wear and excellent corrosion resistance.But, be not limited to this, can adopt lamellar body such as stainless steel.
Like this, above-mentioned B of drive chamber and process chamber A separate by partition member 11a, 14,16, cartridge 13,13, connector 55,56,57,58, lamellar body 65,66 in fact.
Also have, as shown in Figure 7, CD-ROM drive motor 60 is installed on lifting platform 44, and connects balance weight 50.CD-ROM drive motor 60 is fixed on the lifting platform 44 by carriage 62, by driving belt 61, drives the transfer roller 26 of Etaching device 22.On the other hand, balance weight 50 is made of guide post 51 and main body 52, and this guide post 51 is fixed on the support 17 in the mode that parallels with guide rail 45, the mode of this main body 52 moving along above-mentioned guide post 51, engage with above-mentioned guide post 51, and engage with above-mentioned lifting platform 44.
Above-mentioned coiling/dispatch mechanism 70 as shown in Figure 3, be arranged on these two parts of upper and lower of support 17, specifically, as shown in Figure 8, by wireline reel 72,76, constitute with these wireline reel 72,76 the two driving shafts that are connected 71, the gear 85 etc. that drives driving shaft 71.
Above-mentioned wireline reel 72,76 rotatably is supported by carriage 75,79 respectively.And, lamellar body 66 is successively via rotatably propping up the guide roller 73,74 that is held on the carriage 75, its end is wound on the wireline reel 72, and via rotatably propping up the guide roller 77,78 that is held on the above-mentioned carriage 79, its end is wound on the wireline reel 76 lamellar body 65 successively.
Said gear 85 is fixed on the torque retainer (torque keeper) 86 as shown in figure 10.Rotating shaft 81 passes torque retainer 86, and rotating shaft 81 is supported by the bearing 90 and the one-way clutch 87 that are fixed on the carriage 84.In addition, in the end of rotating shaft 81,, be fixed with pulley 80 by one-way clutch 88.In addition, gear 85 and gear 89 engagements of being fixed on the driving shaft 71.In addition, above-mentioned one-way clutch 87,88 has the function of the direction of rotation of the above-mentioned rotating shaft 81 of restriction.In this example, under the situation that is arranged at the coiling on top/dispatch mechanism 70, rotation along the arrow E direction limits to rotating shaft 81, on the other hand, allow the rotation of this rotating shaft 81 along arrow F direction, under the situation of the coiling that is arranged at the bottom/dispatch mechanism 70, the rotation along arrow F direction limits to rotating shaft 81, on the other hand, allow of the rotation of this rotating shaft 81 along the arrow E direction.In addition, torque retainer 86 is so-called friction clutches, and it applies the braking force of regulation to rotating shaft 81.
In addition, as shown in Figure 3, be the driving belt 82 of head for no reason and walk around above-mentioned pulley 80,80 in upper and lower settings, driving belt 82 is kept by the keeper 83 that is fixed on the above-mentioned nut 42.
Action to base plate processing system 1 with above-mentioned formation is described below.In addition, elevation type substrate board treatment 10 be among Fig. 3 with the state shown in the solid line.
At first,, from box 5, take out substrate K successively, it is dropped into the 1st substrate board treatment 6 by transfer device 3.With the substrate K that dropped in the 1st substrate board treatment 6, by substrate leaning device portion, make it with respect to level inclination predetermined angular (being 7 ° in this example), transmit along direction shown in the arrow by the inclination transport unit in heeling condition on one side, it is carried out predetermined process (etch processes) on one side, then, successively it is discharged from the 1st substrate board treatment 6.
Then, the substrate K that has discharged by peristome 11a, the peristome 23a of elevation type substrate board treatment 10, enters in the Etaching device 22 successively, under the effect of transfer roller 26, is sent to inside.
Moreover the base station 33 in the Etaching device 22 by above-mentioned driving cylinder 37, is inclined relative to horizontal 7 ° in advance, and the substrate K so that heeling condition is discharged from the 1st substrate board treatment 6 is fed through under keeping the state of this heeling condition in the Etaching device 22.At this moment, the both sides of substrate K are by guide roller 34 guiding, and substrate K is landing along inclined direction not.And, as if the end of sending into of substrate K, then carry out falling of etch processes and Etaching device 22 simultaneously.
That is, supply with etching solution to supply pipe 28,31 respectively,, spray etching solution respectively, etching is carried out on the surface of substrate K from being arranged at the nozzle 29 and the nozzle 30 that is arranged on the supply pipe 31 on the supply pipe 28 from etching solution supply source (not shown).In addition, the reason of spraying etching solution towards the back side of substrate K is that under not such situation, etching solution partly spreads from the surface of substrate K, forms stain on this back side, by etching solution is brushed at the whole back side, can prevent to form stain.And, in etching,, make each supply pipe 28 around the forward and reverse rotation in its center by pendulous device 110, the injection direction of the etching solution that sprays from each nozzle 29 is swung being tilted between direction and the downward direction of substrate K.
And, if carry out the etching of stipulated time, then stop to supply with etching solution, and stop the swing of the nozzle 29 that produces because of pendulous device 110 from etching solution supply source (not shown).And, this etch processes Etaching device 22 descend before finishing during finish.
On the other hand, the decline of Etaching device 22 is to be undertaken by servo motor 43 drivings of elevating mechanism 40.Promptly, if by servo motor 43, snap bolt 41 is rotated along descent direction, the nut 42 that then screws togather with it descends along snap bolt 41, the lifting platform 44 that connects with nut 42, by connector 55,56 and 57, the 58 support pallets that are connected with this lifting platform 44 21 and be held in an Etaching device 22 and a nut 42 declines on this support pallet 21.
If nut 42 descends, then by keeper 83, the driving belt 82 that is connected with nut 42 rotates in the direction of arrow C.In addition, if connector 55,56 and 57,58 descends, the lamellar body 65,66 that is fixed thereon moves towards the below together, follow this to move, from the coiling/dispatch mechanism 70 that is arranged at top, dispatch lamellar body 65,66 is wound in lamellar body 65,66 in the coiling/dispatch mechanism 70 that is arranged at the bottom.
Below, use Figure 10 that more concrete description is carried out in the coiling/dispatch action of this coiling/dispatch mechanism 70.Figure 10 is the flat cutting view of coiling/dispatch mechanism 70 of being arranged at the upper and lower.In addition, though according to diagram, connector 57,58 and lamellar body 66 are described,,, also be identical for connector 55,56 and lamellar body 65.
At first, the coiling/dispatch mechanism 70 that is arranged at top is described.In being arranged at the coiling on top/dispatch mechanism 70, if connector 57,58 descends, then on lamellar body 66, produce tension force, wireline reel 72 is applied rotary power along the direction shown in the arrow H.This rotary power successively by the driving shaft 71 that is connected with wireline reel 72, the gear 88 that is fixed thereon, with these gear 88 meshed gears 85, the torque retainer 86 of gear 85 is installed, pass to rotating shaft 81.But, because by one-way clutch 87, the rotation along the direction shown in the arrow E of rotating shaft 81 is limited, so the rotation of prevention equidirectional.Thus, the tension force that acts on the lamellar body 66 increases gradually, and the torque that passes to torque retainer 86 increases.
If act on the value of the torque of gear 85 greater than regulation, then torque retainer 86 allows gear 85 to rotate along the torque direction.Thus, gear 85 is along the rotation of the direction shown in the arrow E, and gear 88, driving shaft 71 and wireline reel 72 are respectively along the rotation of the direction shown in the arrow H, from wireline reel 72 dispatch lamellar bodies 66.Like this, owing to dispatch lamellar body 66 under the state of the tension force that produces regulation, so when dispatch, do not produce lax.
On the other hand, if follow the decline of nut 42, driving belt 82 is along arrow C direction rotation shown in Figure 3, then pulley 80 is subjected to the rotary power of arrow E direction, but effect by the one-way clutch 88 between pulley 80 and rotating shaft 81, pulley 80 relative rotation axis 81 rotate freely along direction shown in the arrow E.Pulley 80 rotates along the direction shown in the arrow E not having to follow driving belt 82 under the situation about hindering.One-way clutch 88 restriction rotating shafts 81 still, allow its rotation along direction shown in the arrow F along the rotation of direction shown in the arrow E.Therefore, but one-way clutch 88 relative rotation axis 81 rotate freely along the direction shown in the arrow E.
Below, the coiling/dispatch mechanism 70 that is arranged at the bottom is described.In being arranged at the coiling of bottom/dispatch mechanism 70, if nut 42 descends, driving belt 82 is along the rotation of direction shown in the above-mentioned arrow C, and then pulley 82 is subjected to the rotary power of direction shown in the arrow E.As mentioned above, under the situation that is arranged at the coiling of bottom/dispatch mechanism 70, one-way clutch 87,88 restriction rotating shafts 81 on the other hand, allow its rotation towards direction shown in the arrow E towards the rotation of direction shown in the arrow F.Therefore, if pulley 82 is subjected to the rotary power of direction shown in the arrow E, then rotating shaft 81 rotates along equidirectional.If rotating shaft 81 is along the rotation of direction shown in the arrow E, then its rotary power passes to driving shaft 71 and wireline reel 72 by torque retainer 86, gear 85 and gear 88, makes them along the rotation of direction shown in the arrow H, and lamellar body 66 is wound on the wireline reel 66.
In this example, according to the winding speed of wireline reel 72 mode, set the diameter of axle, the diameter of pulley 80 and the gear ratio between gear 85 and the gear 88 of wireline reel 72 greater than the translational speed of lamellar body 66 and driving belt 82.If the winding speed of wireline reel 72 is greater than the translational speed of lamellar body 66, the tension force that then acts on lamellar body 66 increases gradually, and the torque that passes to torque retainer 86 increases.As mentioned above, if act on the value of the torque of gear 85 greater than regulation, then torque retainer 86 allows gear 85 to rotate along the torque direction.Thus, gear 85 is in slip state with rotating shaft 81, and rotating shaft 81 is followed pulley 80 and rotated along direction shown in the arrow E under the situation that not have obstruction.Like this, owing to lamellar body 66 is reeled under the state of the tension force that produces regulation, so when reeling, do not produce lax.
As above as described in the mask body,, follow the decline of Etaching device 22, can not have under the lax situation coiling and dispatch lamellar body 65,66 if adopt this coiling/dispatch mechanism 70.
In addition, as mentioned above,, then make transfer roller 26, substrate K is discharged from peristome 23a,, this substrate K is sent in the 2nd substrate board treatment 7 from the peristome 11b of shell body 11 along discharging the direction rotation if Etaching device 22 drops to the end that descends.In addition, the double dot dash line among Fig. 3 represents that Etaching device 22 reaches the state of the end that descends.
If the discharge of substrate K is finished, then the servo motor 43 of elevating mechanism 40 drives, and Etaching device 22 is risen.At this moment, by with above-mentioned opposite driving, lamellar body 65,66 is wound in the coiling/dispatch mechanism 70 that is arranged at the bottom, from the coiling/dispatch mechanism 70 that is arranged at the bottom, dispatch lamellar body 65,66.
And, if Etaching device 22 arrives the end that rises, then carry out the later action of sending into of aforesaid substrate K repeatedly.In addition, when Etaching device 22 liftings, can utilize balance weight 50 to alleviate the load that acts on the servo motor 43.
On the other hand, in the 2nd substrate board treatment 7, making the bigger crustal inclination of substrate K of discharging from elevation type substrate board treatment 10 by substrate leaning device portion is 70 ° angle, transmit substrate K in this heeling condition lower edge direction of arrow on one side, on one side it is carried out predetermined process (washing is handled and dried), after the processing, portion turns back to level by the inclination gigback, then, discharge, be stored in once more in the box 5 by transfer device 3 from the 2nd substrate board treatment 7.Like this, in this routine base plate processing system 1, be stored in substrate K in the box 5 successively via the 1st substrate board treatment 6, elevation type substrate board treatment 10 and the 2nd substrate board treatment 7, thus, it is carried out predetermined process, once more it is stored in the inside of box 5.
As above as described in the mask body, because the structure of this routine base plate processing system 1 is, the 1st substrate board treatment 6 and the 2nd substrate board treatment 7 also are located at up and down and are located, by elevation type substrate board treatment 10 they are connected, so compare with the 1st substrate board treatment 6 and the 2nd substrate board treatment 7 and the above-mentioned existing treatment system 200 that is located in the same horizontal plane, it is little that it is provided with spatially-variable, can this system be set efficient well.
In addition, in this routine elevation type substrate board treatment 10, since can make by transmit, the transfer roller 26 of support substrate K and spray the integral elevating of the Etaching device 22 that the nozzle 29,30 of etching solution constitutes to substrate K, so when transmitting substrate K, therefore the position relationshipization of substrate K and nozzle 29,30, can be close to equably the each several part of the etching solution supplying substrate K that will spray from nozzle 29,30, thus, the etch processes that can not have stain.
In addition, because to make this single action of Etaching device 22 liftings transmit substrate K by elevating mechanism 40, in addition, the mechanism that controls accurately by the carrying out that forms by servo motor 43, snap bolt 41 and nut 42, make this substrate K lifting, so can control its speed accurately.
Also have, because the substrate K that can tilt relatively, spray etching solution, thus the etching solution on supplying substrate K surface, generation because of the inclination of substrate K towards the below liquid flow flowing, by this liquid stream, the etching solution on substrate K surface is changed successively by the new etching solution of continuous supply, by the replacing effect of this etching solution, with a spot of etching solution, but within a short period of time, equably etch processes is carried out on the surface of substrate K.
Have again, owing to make each nozzle 29 swing, can make from the injection direction of the etching solution of these nozzle ejection and swing being tilted between direction and the downward direction of substrate, so when the injection direction that makes etching solution is tilted to direction when swing towards substrate, by this swing, the lip-deep effect that makes etching solution be stranded in substrate K increases, on the other hand, when the injection direction that makes etching solution during towards the swing of the inclination downward direction of substrate K, by this swing, the speed of the etching solution of wandering on the surface of substrate K increases, the delay of etching solution is carried out repeatedly with wandering in the scope on the whole surface of substrate K, by this effect, but within a short period of time, with the etching solution of less amount, equably etch processes is carried out on the whole surface of substrate K.
In addition, in recent years, follow substrate to maximize, exist and be used for tendency that its use amount, etching period of carrying out etching solution for etching is increased, still, tilt, it is carried out etching by making substrate K as described above, can reduce its use amount, make equipment miniaturization, can lower processing cost.
The pendulum angle of said nozzle 29, preferably in the scope below 90 degree above 120 are spent, and the time that swing speed is preferably 1 wobbling action is more than 2 seconds below 10 seconds.
Also have, if the corrosivity of etching solution is high, it flows out from Etaching device 22, is attached on the elevating mechanism 40, then the danger that has this elevating mechanism 40 of damage and its function is suffered damage.According to this routine elevation type substrate board treatment 10, owing to separate the process chamber A that is provided with the B of drive chamber of elevating mechanism 40 and is provided with Etaching device 22 by partition member 11a, 14,16, cartridge 13,13, connector 55,56,57,58, lamellar body 65,66, so can prevent to invade the B of drive chamber, can prevent that etching solution from causing the situation of damage to elevating mechanism 40 from the etching solution that Etaching device 22 flows out.
Particularly owing to the following so-called labyrinth structure of employing, and by exhaust gear exhaust is carried out in the inside of cylindrical portion 15 and cartridge 13, can prevent really that etching solution from invading the inside of the B of drive chamber.This labyrinth structure is, edge portion at the above-below direction that is formed at the peristome between the partition member 11a, 14,16, be respectively arranged with cylindrical portion 15 and cartridge 13, and the both side edges portion that will be fixed in the lamellar body 65,66 on connector 55,56 and 57,58 is inserted into inside from the gap slot that is formed on cylindrical portion 15 and the cartridge 13.
More than an embodiment of the invention are described, but the adoptable concrete form of the present invention is not limited to this.
Such as, in above-mentioned example, corresponding to the lifting of Etaching device 22, by coiling/dispatch mechanism 70 coilings, dispatch lamellar body 65,66, but also can form in the following manner, this mode is: make lamellar body 65,66 be head, ring-type for no reason, corresponding to the lifting of Etaching device 22, they realize rotation.
In addition, in above-mentioned example, constitute in the mode of in elevation type substrate board treatment 10, carrying out etch processes, but also can be not limited to this, clean, other processing such as lift-off processing.In this case, the 1st substrate board treatment 6 and the 2nd processing substrate 7 also are same.
In addition, clean, under the situation of lift-off processing, the angle of inclination of the substrate K that tilts by above-mentioned driving cylinder 37, preferably in the scope below 75 ° more than 45 ° (more preferably more than 55 ° below 70 °).The reason of doing like this is: if the angle of inclination is above 75 °, the excessive velocities of liquid stream then, that is, the detergent remover on substrate K surface, the residence time of stripper are too short, otherwise, if 45 ° of angle of inclination less thaies, then the speed of liquid stream is slow excessively, promptly, detergent remover, stripper are stranded on the substrate K for a long time, under above-mentioned any situation, all can't handle fully, the use amount of detergent remover, stripper increases.
Also have, also can constitute in the following manner, this mode is: in the etch processes of substrate K, forward and reverse rotation of switching transfer roller 26 continuously makes substrate K seesaw with predetermined distance along sending into/discharge direction.If adopt this mode, even under the uneven situation of emitted dose, expulsion pressure of the etching solution that sprays from each nozzle 29,30, by substrate K is seesawed, can make the above-mentioned inhomogeneous equalization above the substrate K, can carry out uniform etch processes to substrate K.
Have again, the processing of in above-mentioned processing mechanism 20, implementing, as mentioned above, subsequent handling after the inapplicable etching, under the situation of the problem that does not cause because of adhering to of etching solution, can will not be divided into above-mentioned process chamber A and the B of drive chamber in the above-mentioned shell body 11 yet, above-mentioned elevating mechanism 40 is changed make Figure 11 and elevating mechanism as shown in Figure 12 130.
That is, this elevating mechanism 130 comprises: CD-ROM drive motor 131; 2 downside rotating shafts 133, these 2 downside rotating shafts 133 are provided with in parallel to each other, at its both ends sprocket wheel 132 are installed; 2 upside rotating shafts 135, these 2 upside rotating shafts 135 are arranged at the top of downside rotating shaft 133 respectively, and sprocket wheel 134 is installed on identical both ends; Power transmission shaft 136, this power transmission shaft 136 pass to each downside rotating shaft 133 by bevel gear with the rotary power of CD-ROM drive motor 131 respectively; Support pallet 139, this supports pallet 139 to support Etaching device 22; 4 guide plates 137, these 4 guide plates 137 are individually fixed on the above-mentioned pillar 12; A plurality of rollers 138, these a plurality of rollers 138 rotatably prop up and are held on the above-mentioned support pallet 139, contact with above-mentioned each guide plate 137, respectively a plurality of rollers 138 are led along this guide plate 137; 4 chains 140, these 4 chains 140 are hung and are around on the sprocket wheel 132,134 of above-mentioned upside and downside, and an end is fixed in the top of supporting pallet 139, and the other end is fixed in the bottom of supporting pallet 139.
According to this elevating mechanism 130, when CD-ROM drive motor 131 is carried out forward and reverse rotation, its rotary power passes to each downside rotating shaft 133 by power transmission shaft 136, and each downside rotating shaft 133 is rotated around the axle center, follow the rotation of above-mentioned rotating shaft 133, by sprocket wheel 132, make chain 140 rotations, the support pallet 139 of supporting Etaching device 22 is by each guide plate 137 and each roller 138 guiding, move above or below the court, even it realizes lifting.
Like this, according to this elevating mechanism 130, compare with the elevating mechanism 40 of last example, but simplified structure can lower its manufacturing cost.
In addition, another form as the base plate processing system that adopts elevation type substrate board treatment of the present invention can exemplify Figure 13 and type shown in Figure 14.As shown in Figure 13, this base plate processing system 150 is made of substrate input/discharger 151, dry process device 160, etching-decontaminating apparatus 170.
Substrate input/discharger 151 is accommodated the mounting table 152 of box 181 of a plurality of substrates by placement and the transfer device 153 that transmits substrate constitutes, and transfer device 153 is by constituting with the transfer robot arm 155 that can be provided with in the mode that track 154 upper edge length directions move.This transfer robot arm 155 possesses the hand (hand) that is movable to the optional position in 3 dimension spaces, with substrate-placing under this state on hand, carry out following processing, promptly, in the box 181 on the mounting table 152, one by one take out substrate, it is put in dry process device 160, the etching-decontaminating apparatus 170, to be stored in once more in the box 181 from the substrate that dry process device 160, etching-decontaminating apparatus 170 are discharged, and between dry process device 160 and etching-decontaminating apparatus 170, transfer the processing of substrate.
Above-mentioned dry process device 160 polishes dry process such as (ashing) processing, film forming processing at substrate.In addition, box 181 is sent on the mounting table 152, and sends from this mounting table 152 by automatic delivery vehicle 180.
Etching-decontaminating apparatus 170 as shown in figure 14, shell body with frame shaped, portion has to divide and forms a plurality of zones that are made of substrate income portion 171, substrate decline transport unit 172, etched part 173, substrate rising transport unit 174, drying substrates portion 175 and substrate release portion 176 etc. within it, by above-mentioned transfer robot arm 155 substrate is sent to substrate income portion 171, portion 176 discharges substrate from the substrate release.
Aforesaid substrate income portion 171, substrate decline transport unit 172, etched part 173, substrate rising transport unit 174, drying substrates portion 175 and substrate release portion 176 are respectively as shown in figure 16, have a plurality of transfer rollers 208, the substrate that is sent to substrate income portion 171 transmits along direction shown in the arrow by transfer roller 208, via substrate decline transport unit 172, etched part 173, substrate rising transport unit 174, drying substrates portion 175, send substrate release portion 176 to successively.
Aforesaid substrate decline transport unit 172 and substrate rising transport unit 174 have and above-mentioned elevation type substrate board treatment 10 intimate identical structures.And, in this etching-decontaminating apparatus 170, in substrate decline transport unit 172 and etched part 173, carry out etch processes, in substrate rising transport unit 174, clean processing, in drying substrates portion 175, carry out dried.

Claims (15)

1. elevation type substrate board treatment is characterized in that: comprising:
Shell body, this shell body have and are located at substrate input port and the substrate outlet of locating up and down, are frame shaped;
Processing mechanism, this processing mechanism are built in the described shell body, and this processing mechanism comprises: the substrate that transmission-supporting mechanism, this transmission-supporting mechanism hold and support to send into from described substrate input port, on the other hand, discharge described substrate from described substrate outlet; Support pallet, this support pallet is supported described transmission-supporting mechanism; Substrate leaning device, this substrate leaning device tilt the substrate of being supported by described transmission-supporting mechanism; Handle fluid ejection mechanism, this processings fluid ejection mechanism is arranged at the top of described transmission-supporting mechanism, is ejected on the substrate by described substrate leaning device inclination handling fluid;
Elevating mechanism, this elevating mechanism is supported described processing mechanism, and makes the lifting along the vertical direction of this processing mechanism, makes described processing mechanism through described substrate input port and substrate outlet.
2. elevation type substrate board treatment according to claim 1 is characterized in that:
Described processing fluid sprays mechanism and constitutes in the mode of ejection as the etching solution of handling fluid;
Described substrate leaning device is so that described substrate is inclined relative to horizontal is that the mode of the angle below 7.5 ° more than 1 ° constitutes.
3. elevation type substrate board treatment according to claim 1 is characterized in that:
Described processing fluid sprays mechanism and constitutes in the mode of ejection as the etching solution of handling fluid;
Described substrate leaning device makes the acceleration of the processing fluid that flows along the incline direction of described substrate at more than 0.02 times in the scope below 0.13 times of acceleration of gravity so that the mode that described substrate tilts constitutes.
4. elevation type substrate board treatment according to claim 1 is characterized in that:
Described processing fluid sprays mechanism and constitutes as the detergent remover of handling fluid or the mode of stripper with ejection;
Described substrate leaning device is so that described substrate is inclined relative to horizontal is that the mode of the angle below 75 ° more than 45 ° constitutes.
5. elevation type substrate board treatment according to claim 1 is characterized in that:
Described processing fluid sprays mechanism and constitutes as the detergent remover of handling fluid or the mode of stripper with ejection;
Described substrate leaning device makes the acceleration of the processing fluid that flows along the incline direction of described substrate at more than 0.7 times in the scope below 0.97 times of acceleration of gravity so that the mode that described substrate tilts constitutes.
6. according to each described elevation type substrate board treatment in the claim 1～5, it is characterized in that:
Described processing mechanism possesses swing mechanism, and this swing mechanism makes the emission direction by the processing fluid of described processing fluid ejection mechanism ejection, parallel with the incline direction of described substrate and with the perpendicular plane of this substrate in swing.
7. according to each described elevation type substrate board treatment in the claim 1～6, it is characterized in that: described transmission-supporting mechanism with after holding described substrate, the substrate that held is constituted along the mode that direction seesaws repeatedly of sending into/discharge of described substrate.
8. according to each described elevation type substrate board treatment in the claim 1～7, it is characterized in that:
Utilize partition member, send into/discharge direction along described substrate, described shell body is divided into drive chamber and such two chambers of process chamber, and in described process chamber, described processing mechanism is set with described substrate input port and substrate outlet, on the other hand, described elevating mechanism is set in described drive chamber;
On described partition member, along the vertical direction, form peristome with described process chamber and drive chamber's connection;
The two edge portions along the vertical direction that are formed at the peristome on the described partition member are tubular respectively, and form gap slot along the vertical direction on mutual opposed of this a pair of each cylindrical portion;
The described support pallet of described processing mechanism utilizes the connector in the peristome that is arranged at described partition member, links with described elevating mechanism;
On described connector, be connected with banded lamellar body, this lamellar body is arranged between the described a pair of cylindrical portion, and is provided with in the mode of extending towards the above and below of described connector, and its both side edges portion is inserted in the described cylindrical portion from described gap slot respectively;
Described drive chamber separates institute with process chamber by described partition member, connector and lamellar body and becomes.
9. elevation type substrate board treatment according to claim 8 is characterized in that: the described peristome of many groups, connector and lamellar body are set become.
10. it is characterized in that according to Claim 8 or 9 described elevation type substrate board treatments: have the exhaust gear of discharging the gas in the described cylindrical portion.
11. each described elevation type substrate board treatment according to Claim 8～10, it is characterized in that: described lamellar body forms head, ring-type for no reason.
12. each described elevation type substrate board treatment according to Claim 8～10 is characterized in that:
Its structure is: respectively in the upper side and the lower side of described lamellar body, be provided with described lamellar body is reeled/coiling/dispatch mechanism of dispatch, along with carrying out the motion of the lamellar body of lifting, described lamellar body is reeled/dispatch by described coiling/dispatch mechanism by described elevating mechanism.
13. elevation type substrate board treatment according to claim 12 is characterized in that:
Described coiling/dispatch mechanism is made of the wireline reel of the described lamellar body of reeling and the driving mechanism that this wireline reel is rotated;
The structure of described driving mechanism is: when the dispatch direction is rotated, only make braking force act on wireline reel at described wireline reel, on the other hand, when described wireline reel is rotated in the take-up direction, by friction clutch, give described wireline reel with transmission of power.
14. elevation type substrate board treatment according to claim 13 is characterized in that:
Described driving mechanism is made of following parts, and these following parts comprise: driven gear, and this driven gear is connected with described wireline reel; Driven wheel, this driven wheel and the engagement of described driven gear; Friction clutch, this friction clutch and described driven wheel link; Rotating shaft, this rotating shaft and described friction clutch link; Two one-way clutch, these two one-way clutch link with the both ends of rotating shaft respectively, allow rotating shaft only along a direction rotation; Pulley, this pulley link with described rotating shaft by one of them described one-way clutch; Driving belt, this driving belt are wound on the described pulley; Holding components, this holding components are supported another described one-way clutch;
The structure of described two one-way clutch is: allow the rotation of described rotating shaft towards the direction that described wireline reel is rotated in the take-up direction, on the other hand, limit described rotating shaft towards the rotation that makes described wireline reel along the direction of dispatch direction rotation;
And described driving belt is to realize that by described elevating mechanism the mode of rotation constitutes.
15. a base plate processing system is characterized in that: the structure of this base plate processing system is:
In possessing claim 1～14 in each described elevation type substrate board treatment;
Locating and be provided with the 1st substrate board treatment and the 2nd substrate board treatment of this substrate being handled with level or heeling condition moving substrate up and down on one side on one side;
The substrate discharge portion of described the 1st substrate board treatment and the substrate input port of described elevation type substrate board treatment are connected;
The substrate throw-in part of described the 2nd substrate board treatment and the substrate outlet of described elevation type substrate board treatment are connected;
Make substrate successively through the 1st substrate board treatment, elevation type substrate board treatment, the 2nd substrate board treatment.
CNB031537138A 2002-08-19 2003-08-18 Lifting/lowering type substrate proless device and substrate process system having same Expired - Fee Related CN100479092C (en)

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CN1827244B (en) * 2005-03-02 2010-12-01 松下电器产业株式会社 Cleaning method and device
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CN109755156B (en) * 2017-11-06 2023-06-23 株式会社斯库林集团 Substrate transfer system and substrate transfer method

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TW200405405A (en) 2004-04-01
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