KR102149085B1 - Substrate transferring-and-receiving system and substrate transferring-and-receiving method - Google Patents

Abstract

When the connecting member moves in the vertical direction, the number of substrates is carried out between the support portion and the plurality of lifting pins. In order to set the moving speed of the connecting member when the substrate is supplied, a setting member is placed on the support. In this state, the connecting member is raised so that the setting member on the support portion is passed on the plurality of lifting pins. The reference position is determined based on the value of the pressure applied to the setting member from the plurality of lifting pins, and the speed limiting range including the reference position is determined. The moving speed of the connecting member is set so that the moving speed within the speed limiting range is lower than the moving speed outside the speed limiting range.

Description

Substrate water supply system and substrate water supply method {SUBSTRATE TRANSFERRING-AND-RECEIVING SYSTEM AND SUBSTRATE TRANSFERRING-AND-RECEIVING METHOD}

The present invention relates to a substrate water supply system and a substrate water supply method for transferring a substrate between a support portion and a plurality of lifting members.

FPD (Flat Panel Display) substrates such as semiconductor substrates, liquid crystal displays or organic EL (Electro Luminescence) displays, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates or solar panels In order to perform heat treatment on various substrates such as a battery substrate, a heat treatment apparatus is used.

As an example of a heat treatment apparatus, the heat treatment unit described in Japanese Patent Laid-Open No. 2005-117007 includes a temperature control plate and an elevating device. A plurality of substrate mounting pieces are provided on the upper surface of the temperature control plate. The elevating device includes a plurality of substrate elevating pins provided to be elevating relative to the temperature control plate.

In the heat treatment unit, the substrate transferred by the conveying device is handed over the upper end of the plurality of substrate lifting pins while the plurality of substrate lifting pins protrude upward from the temperature control plate. After that, the plurality of substrate lifting pins are lowered so that the upper ends of the plurality of substrate lifting pins are positioned below the upper ends of the plurality of substrate mounting pieces. Therefore, the substrate supported by the plurality of substrate lifting pins is handed over onto the plurality of substrate mounting pieces of the temperature control plate. In this state, heat treatment is performed on the substrate by the temperature control plate.

When the heat treatment is completed, the plurality of substrate lifting pins are raised so that the upper ends of the plurality of substrate lifting pins are positioned above the upper ends of the plurality of substrate mounting pieces. Therefore, the heat-treated substrate supported by the plurality of substrate lifting pins is supported by the upper end portions of the plurality of substrate lifting pins. Thereafter, the heat-treated substrate is received by a transfer device and transferred to another processing unit.

In the heat treatment unit described above, the throughput of the substrate processing can be improved by increasing the operating speed of the plurality of substrate lifting pins. On the other hand, if the operation speed of the plurality of substrate lifting pins is high, for example, when a substrate is handed over from a plurality of substrate lifting pins onto a plurality of substrate mounting pieces, the substrate may be impacted upon contact between the substrate and the plurality of substrate mounting pieces. There is a possibility of scratching.

In order to prevent the occurrence of scratches on the substrate, it is conceivable to lower the operating speed of the plurality of substrate lifting pins just before the substrate and the plurality of substrate mounting pieces come into contact with each other. However, since there is an error in the positional relationship between the plurality of substrate lifting pins and the plurality of substrate mounting pieces for each heat treatment unit, it is difficult to accurately grasp the positions of the plurality of substrate lifting pins when the substrate and the plurality of substrate mounting pieces are in contact. It is difficult.

On the other hand, the operation of adjusting the timing of lowering the moving speed while checking whether or not a scratch has actually occurred on the substrate handed from the plurality of substrate lifting pins to the plurality of substrate mounting pieces is cumbersome and requires a long time. Therefore, the manufacturing cost of the substrate increases.

It is an object of the present invention to improve the throughput of the substrate processing while preventing the occurrence of scratches on the substrate when the substrate between the plurality of lifting members and the support portion is supplied, and it is possible to suppress an increase in the manufacturing cost of the substrate. It is to provide a substrate water supply system and a substrate water supply method.

(1) A substrate water supply system according to an aspect of the present invention includes a support unit configured to support a lower surface of a substrate during processing of a substrate, a plurality of lifting members each having an upper end capable of supporting the lower surface of the substrate, and a plurality of The connecting member configured to be movable in the vertical direction with respect to the support part while connecting the lifting members of the plurality of lifting members and the upper end of the plurality of lifting members are higher than the upper end of the support part. A water drive unit for moving the connecting member so as to move between the position and a position lower than the upper end of the support unit, a setting member configured to be supported by a plurality of elevating members, and a plurality of setting members when supported by a plurality of elevating members At the time of setting the moving speed of the connecting member and the detection unit that detects the pressure applied to the plurality of portions of the setting member from the lifting member of, by controlling the water drive unit, the plurality of lifting members are supported by the support unit. A movement control unit that moves the connecting member so that the upper end moves from a position lower than the upper end of the support to a position higher than the upper end of the support, and a plurality of elevations based on an output signal of the detection unit during movement of the connection member by the movement control unit. It is determined whether or not the values of the plurality of pressures applied from the member to the plurality of parts of the set member each reached a plurality of predetermined reference pressure values, and the values of the plurality of pressures have reached each of the plurality of reference pressure values. A range in which a partial range including the determined reference position among the moving ranges of the connecting member in the case of the transfer of the substrate and the positioning part that determines the position of the connecting member in the vertical direction at the time as the reference position is determined as the speed limiting range A moving speed setting unit for setting the moving speed of the connecting member during delivery of the substrate so that the moving speed of the connecting member within the speed limiting range is lower than the moving speed of the connecting member outside the speed limiting range; , A water supply control unit for controlling the water supply driving unit so that the connection member moves at a movement speed set by the movement speed setting unit when the substrate is supplied Equipped.

In the substrate water supply system, the setting member is supported by the support portion at the time of setting the moving speed of the connecting member. In this state, the connecting member moves so that the upper end portions of the plurality of lifting members move from a position below the upper end portion of the support portion to a position above the upper end portion of the support portion.

In this case, when the upper end portions of the plurality of lifting members are positioned at the same height as the upper end portions of the support portion, the upper end portions of the plurality of lifting members contact a plurality of portions of the lower surface of the setting member. Therefore, pressure is applied to a plurality of portions of the setting member. Position of the connecting member in the vertical direction at the time when the plurality of lifting members touch the setting member, based on whether or not values of the plurality of pressures applied to the plurality of parts of the setting member have reached a plurality of reference pressure values. Is accurately determined as the reference position. The speed limit range including the determined reference position is determined. Further, the moving speed of the connecting member during delivery of the substrate is set so that the moving speed of the connecting member within the speed limiting range is lower than the moving speed of the connecting member outside the speed limiting range.

During delivery of the substrate, the water supply driver is controlled so that the connecting member moves at a set movement speed. In this case, when the connecting member moves within the speed limiting range at a low moving speed, the support portion or a plurality of lifting members contact the lower surface of the substrate. Accordingly, since the impact caused by the contact of the support portion or the plurality of lifting members on the lower surface of the substrate is alleviated, scratches are prevented from occurring on the lower surface of the substrate. On the other hand, since the connecting member moves outside the speed limiting range at a high moving speed, the time required for the number of substrates is shortened.

In addition, according to the above configuration, regardless of the error in the positional relationship between the supporting portion and the plurality of lifting members, the vertical position of the connecting member at the time when the plurality of lifting members contacted the setting member is exactly as a reference position. Is determined, and the speed limit range is determined. Therefore, the moving speed of the setting member can be changed based on the speed limit range. Accordingly, it becomes unnecessary to adjust the timing of lowering the moving speed of the substrate while confirming whether or not a scratch has actually occurred on the substrate handed to the support from the plurality of lifting members.

As a result of these, while improving the throughput of the substrate processing, it is possible to prevent the occurrence of scratches on the substrate during delivery of the substrates between the plurality of support members and the support portions, and it becomes possible to suppress an increase in the manufacturing cost of the substrate.

(2) The substrate water supply system calculates a plurality of reference pressure values based on values of a plurality of pressures applied from a plurality of lifting members to a plurality of portions of the setting member in a state in which the setting member is supported by a plurality of lifting members. You may further include a pressure determination unit to determine.

In this case, the plurality of reference pressure values are the same as the values of the plurality of pressures each applied from the plurality of lifting members to the plurality of portions of the setting member while the setting member is actually supported by the plurality of lifting members. Therefore, the reference position of the connecting member can be accurately determined based on a plurality of reference pressure values.

(3) The range determination unit determines the speed limit range when the connecting member descends for the number of substrates as the descending speed limit range, the upper limit of the descending speed limit range is located above the reference position, and the movement speed setting unit , You may set the moving speed of the connecting member so that the moving speed of the connecting member when descending within the lowering speed limit range is lower than the moving speed of the connecting member when descending outside the speed limiting range.

When the substrate is supported by a plurality of lifting members at a position above the upper end of the support, the upper ends of the plurality of lifting members are lowered to a position below the upper end of the support, so that the substrate is passed from the plurality of lifting members to the support. .

According to the above configuration, the upper limit of the descending speed limit range is located above the reference position. Therefore, even when the moving speed when the connecting member descends outside the lowering speed limit range is set to be high, the moving speed of the connecting member until reaching the reference position from the upper limit of the lowering speed limit range when the connecting member descends. Can be made low enough. Accordingly, while improving the throughput of the substrate processing, it is possible to prevent the occurrence of scratches on the substrate.

(4) The range determination unit determines the speed limit range when the connecting member rises for the number of substrates as the rise speed limit range, the lower limit of the rise speed limit range is located below the reference position, and the movement speed setting unit , You may set the moving speed of the connecting member so that the moving speed of the connecting member when ascending within the ascending speed limiting range is lower than the moving speed of the connecting member when ascending outside the ascending speed limiting range.

When the upper end of the support is positioned below the upper end of the support and the substrate is supported by the support, the upper ends of the plurality of lifting members are raised to a position above the upper end of the support, so that the substrate is moved from the support to the plurality of lifting members. Is handed to.

According to the above configuration, the lower limit of the ascending speed limiting range is located below the reference position. Therefore, even when the moving speed when the connecting member ascends outside the ascending speed limit range is set to be high, the moving speed of the connecting member from the lower limit of the ascending speed limit range to the reference position when the connecting member rises is set. Can be made low enough. Accordingly, while improving the throughput of the substrate processing, it is possible to prevent the occurrence of scratches on the substrate.

(5) The setting member may have an external shape similar to that of the substrate.

In this case, since the setting member has the same shape as the substrate, when setting the moving speed of the connecting member, setting between the support portion and the plurality of elevation members in a state close to the case where the substrate is supplied between the support portion and the plurality of elevation members. The number of members is done. Accordingly, it is possible to more easily and appropriately set the moving speed of the connecting member.

(6) The setting member may be formed of resin.

In this case, since the setting member is less susceptible to scratching than the substrate, the setting member is prevented from being damaged when the moving speed is set.

(7) A heat treatment for performing heat treatment on a flat support surface, a plurality of protruding members configured to protrude upward from the support surface and supporting the lower surface of the substrate, and a substrate supported by the plurality of protrusion members. Appliances may be included.

In this case, the substrate is prevented from being scratched by contacting the substrate with the plurality of protruding members, and thus the substrate is prevented from being damaged by performing heat treatment on the scratched substrate. Further, since scratches are prevented from occurring on the substrate by contacting the substrate with the plurality of lifting members, damage to the substrate after heat treatment is suppressed.

(8) A substrate delivery method according to another aspect of the present invention is to provide a substrate between three or more lifting members each having a support portion configured to support a lower surface of the substrate and an upper end portion capable of supporting the lower surface of the substrate. As a substrate water supply method for performing water supply, a plurality of lifting members are connected by a connection member configured to be movable in a vertical direction with respect to the support part, and the connection member is used to transfer the substrate between the support part and the plurality of lifting members. E, the upper ends of the plurality of lifting members are moved to move between a position above the upper end of the support and a position lower than the upper end of the support, and the substrate number method is, when setting the moving speed of the connecting member, the plurality of lifting members Supporting the setting member configured to be supported by the support unit, and while the setting member is supported by the support unit, the upper ends of the plurality of lifting members are moved from a position below the upper end of the support to a position above the upper end of the support. So as to do so, moving the connecting member; detecting pressures applied to the plurality of portions of the setting member from the plurality of elevating members when the setting member is supported by the plurality of elevating members; and during movement of the connecting member, Based on the detection result of the detecting step, it is determined whether or not values of the plurality of pressures applied from the plurality of lifting members to the plurality of portions of the setting member respectively have reached a plurality of predetermined reference pressure values, and the plurality of pressures Determining a position in the vertical direction of the connecting member when the value of is reached each of a plurality of reference pressure values as a reference position, and a part including a reference position determined among the moving ranges of the connecting member when the substrate is supplied Determining the range of as the speed limiting range, and the moving speed of the connecting member at the time of delivery of the substrate so that the moving speed of the connecting member within the speed limiting range is lower than that of the connecting member outside the speed limiting range And, when the substrate is supplied, moving the connection member so that the connection member moves at a moving speed set by the setting step. Do.

In the substrate delivery method, the setting member is supported by the support portion at the time of setting the moving speed of the connecting member. In this state, the connecting member moves so that the upper end portions of the plurality of lifting members move from a position below the upper end portion of the support portion to a position above the upper end portion of the support portion.

In this case, when the upper end portions of the plurality of lifting members are positioned at the same height as the upper end portions of the support portion, the upper end portions of the plurality of lifting members contact a plurality of portions of the lower surface of the setting member. Therefore, pressure is applied to a plurality of portions of the setting member. Position of the connecting member in the vertical direction at the time when the plurality of lifting members touch the setting member, based on whether or not values of the plurality of pressures applied to the plurality of parts of the setting member have reached a plurality of reference pressure values. Is accurately determined as the reference position. The speed limit range including the determined reference position is determined. Further, the moving speed of the connecting member during delivery of the substrate is set so that the moving speed of the connecting member within the speed limiting range is lower than the moving speed of the connecting member outside the speed limiting range.

During delivery of the substrate, the water supply driver is controlled so that the connecting member moves at a set movement speed. In this case, when the connecting member moves within the speed limiting range at a low moving speed, the support portion or a plurality of lifting members contact the lower surface of the substrate. Accordingly, since the impact caused by the contact of the support portion or the plurality of lifting members on the lower surface of the substrate is alleviated, scratches are prevented from occurring on the lower surface of the substrate. On the other hand, since the connecting member moves outside the speed limiting range at a high moving speed, the time required for the number of substrates is shortened.

In addition, according to the above configuration, regardless of the error in the positional relationship between the supporting portion and the plurality of lifting members, the vertical position of the connecting member at the time when the plurality of lifting members contacted the setting member is exactly as a reference position. Is determined, and the speed limit range is determined. Therefore, the moving speed of the setting member can be changed based on the speed limit range. Accordingly, it becomes unnecessary to adjust the timing of lowering the moving speed of the substrate while confirming whether or not a scratch has actually occurred on the substrate handed to the support from the plurality of lifting members.

As a result of these, while improving the throughput of the substrate processing, it is possible to prevent the occurrence of scratches on the substrate during delivery of the substrates between the plurality of support members and the support portions, and it becomes possible to suppress an increase in the manufacturing cost of the substrate.

1 is a schematic side view showing a configuration of a heat treatment apparatus according to an embodiment of the present invention.
2 is a schematic plan view of the heat treatment apparatus of FIG. 1.
3 is a schematic plan view of a setting member and a transmission device in FIG. 1.
Fig. 4 is a schematic side view of a setting member and a transmission device in Fig. 1;
Fig. 5 is a schematic side view showing a specific example of setting the moving speed of the connecting member when the substrate is supplied.
Fig. 6 is a schematic side view showing a specific example of setting the moving speed of the connecting member when the substrate is supplied.
Fig. 7 is a schematic side view showing a specific setting example of the moving speed of the connecting member when the substrate is supplied.
Fig. 8 is a schematic side view showing a specific setting example of the moving speed of the connecting member when the substrate is supplied.
Fig. 9 is a schematic side view showing a specific example of setting the moving speed of the connecting member when the substrate is supplied.
Fig. 10 is a schematic side view showing a specific example of setting the moving speed of the connecting member when the substrate is supplied.
Fig. 11 is a schematic side view showing a state in which the connecting member descends after setting the moving speed of the connecting member and the substrate is handed over from a plurality of lifting pins to the support portion.
Fig. 12 is a schematic side view showing a state in which the connecting member is raised after setting the moving speed of the connecting member and the substrate is handed over from the support portion onto a plurality of lifting pins.
13 is a flowchart showing an example of movement speed setting processing.
14 is a schematic block diagram showing an example of a substrate processing apparatus including the heat treatment apparatus of FIG. 1.

Hereinafter, a substrate water supply system and a substrate water supply method according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a substrate for a flat panel display (FPD) such as a semiconductor substrate, a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, It refers to a photomask substrate, a ceramic substrate, or a solar cell substrate. In the following description, a heat treatment apparatus for performing heat treatment on a substrate as an example of a substrate water supply system will be described.

(1) Configuration of heat treatment device

1 is a schematic side view showing a configuration of a heat treatment apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic plan view of a heat treatment apparatus 100 of FIG. 1. As shown in FIG. 1, the heat treatment apparatus 100 mainly includes a support S, an elevating device 30, a control device 40, a transmission device 60, a reception device 70, and a setting member 90. Equipped. In addition, in FIG. 2, the illustration of the control device 40, the transmission device 60, and the reception device 70 among the plurality of constituent elements shown in FIG. 1 is omitted.

The support portion S includes a heat treatment plate 10, a plurality of protrusion members 11, a plurality of guide members 12, and a heat generating element 20, and is used as a hot plate. The heat treatment plate 10 is, for example, a heat transfer plate having a disk shape, and has an outer diameter larger than the outer diameter of a substrate to be subjected to heat treatment. In the heat treatment plate 10, a heat generating element 20 is provided. The heating element 20 is formed of, for example, a mica heater or a Peltier element. The heat generating drive circuit 21 is connected to the heat generating element 20. The heat generating drive circuit 21 drives the heat generating element 20 based on the control of the temperature adjusting unit 46 described later. For this reason, the heating element 20 generates heat during the heat treatment of the substrate.

As shown in Fig. 2, on the flat upper surface of the heat treatment plate 10, a plurality of (10 in this example) protrusion members 11 and a plurality of (4 in this example) guide members 12 are provided. have.

The plurality of protrusion members 11 are discretely disposed in a central region of the upper surface of the heat treatment plate 10 excluding the outer circumferential edge and the vicinity thereof, and cover the substrate to be processed or the lower surface of the setting member 90 to be described later. Support. Each protrusion member 11 is a spherical proximal ball, and is formed of, for example, ceramic.

The plurality of guide members 12 are arranged at equiangular intervals on the periphery of the upper surface of the heat treatment plate 10. On the upper part of each guide member 12, when the substrate or setting member 90 is passed from the plurality of lifting pins 31 to be described later to the plurality of protruding members 11, the outer peripheral end of the substrate or setting member 90 An inclined surface is formed for leading the to a predetermined position. Therefore, it is prevented that the substrate or the setting member 90 is supported by the plurality of protrusion members 11 in a state that is shifted from a predetermined position. Each guide member 12 is formed of resin having high heat resistance, such as PEEK (polyether ketone).

The heat treatment plate 10 is formed with a plurality of (three in this example) through holes 13 penetrating in the thickness direction. The plurality of through holes 13 are formed on a predetermined virtual circle based on the center of the heat treatment plate 10 at equiangular intervals.

As shown in Fig. 1, the lifting device 30 includes a plurality of (three in this example) lifting pins 31, a connecting member 32, a feed shaft 33, a motor 34, and a motor drive circuit ( 35). The plurality of lifting pins 31 are rod-shaped members that can be respectively inserted into the plurality of through holes 13 formed in the heat treatment plate 10, and are formed of, for example, ceramic. In addition, the plurality of lifting pins 31 are connected to each other by the connection member 32, and a part of the plurality of lifting pins 31 is inserted into the plurality of through holes 13 of the heat treatment plate 10, respectively. It is maintained to extend in the vertical direction in the state.

In the vicinity of the heat treatment plate 10, a feed shaft 33, a motor 34, and a motor drive circuit 35 extending in the vertical direction are provided. The feed shaft 33 is, for example, a ball screw, and is connected to the rotation shaft of the motor 34. In this state, a part of the connecting member 32 is attached to the feed shaft 33. In addition, in the connecting member 32, a guide member (not shown) that guides the connecting member 32 so that the connecting member 32 moves in the vertical direction along the conveying shaft 33 when the conveying shaft 33 rotates. Is attached.

The motor drive circuit 35 drives the motor 34 based on the control of the movement control unit 44 or the water supply control unit 45 described later. Therefore, the transport shaft 33 rotates in one direction or the opposite direction. When the transport shaft 33 rotates in one direction, the plurality of lifting pins 31 rise (or fall) together with the connection member 32. As the transport shaft 33 rotates in the reverse direction, the plurality of lifting pins 31 descend (or rise) together with the connecting member 32.

In this case, the moving speed of the plurality of lifting pins 31 and the connecting member 32 depends on the rotation speed of the feed shaft 33. As the rotational speed of the transfer shaft 33 increases, the moving speed of the plurality of lifting pins 31 and the connecting member 32 increases. On the other hand, as the rotational speed of the transport shaft 33 decreases, the moving speed of the plurality of lifting pins 31 and the connecting member 32 decreases.

In this embodiment, a stepping motor is used as the motor 34. An encoder (not shown) is incorporated in the motor 34. The output signal from the encoder of the motor 34 is applied to the position detection unit 43 to be described later.

In the heat treatment apparatus 100 according to the present embodiment, it is necessary to set the vertical movement speed of the connecting member 32 between the support portion S and the plurality of lifting pins 31 during delivery of the substrate. It is possible. The transmitting device 60, the receiving device 70, and the setting member 90 are used to set the moving speed of the connecting member 32. 3 is a schematic plan view of the setting member 90 and the transmission device 60 of FIG. 1, and FIG. 4 is a schematic side view of the setting member 90 and the transmission device 60 of FIG. 1.

As shown in Figs. 3 and 4, the setting member 90 has a disk shape and is formed of, for example, a resin having high heat resistance such as PEEK (polyether ketone). The outer shape of the setting member 90 is formed so as to be substantially the same as the outer shape of the substrate to be processed in the heat treatment apparatus 100. For example, when the outer diameter of the substrate to be processed is 300 mm, the outer diameter of the setting member 90 is also formed to be 300 mm.

The setting member 90 has one surface 90a and the other surface 90b. At the time of setting the moving speed of the connecting member 32, the setting member 90 has a support S or a plurality of lifting pins so that one surface 90a faces upward and the other surface 90b faces downward. 31).

Here, on the other surface (90b) of the setting member (90), as shown in Fig. 4, when setting the moving speed of the connecting member (32), a plurality of pieces to be supported by the plurality of lifting pins (31) of Fig. (Three in this example) supported portions 91 are defined. On one surface 90a of the setting member 90, a plurality of (three in this example) concave portions 92 are formed in a plurality of portions overlapping with the plurality of supported portions 91, respectively.

A plurality of pressure sensors 99 are attached to the bottoms of the plurality of concave portions 92 so as to contact each other. The pressure sensor 99 of this example is a sensor whose resistance value changes according to the magnitude of the pressure applied to the pressure sensor 99. More specifically, the pressure sensor 99 is a sensor whose resistance value decreases as the pressure applied to the pressure sensor 99 increases, and the resistance value increases as the pressure applied to the pressure sensor 99 decreases. to be. A transmission device 60 is further attached to the setting member 90. The transmission device 60 includes a signal output circuit 61, a transmission circuit 62, and a transmission antenna 63 as shown in FIG. 3.

The signal output circuit 61 is electrically connected to the plurality of pressure sensors 99 and outputs electrical signals corresponding to resistance values of the plurality of pressure sensors 99. The transmission circuit 62 wirelessly transmits the electric signal output from the signal output circuit 61 as an output signal of the plurality of pressure sensors 99 to the reception device 70 of FIG. 1 through the transmission antenna 63 .

The reception device 70 includes a reception antenna and a reception circuit. As shown in FIG. 1, the reception device 70 receives the output signals of the plurality of pressure sensors 99 wirelessly transmitted from the transmission device 60 by a reception circuit through a reception antenna, and the control device 40 To give.

The control device 40 is constituted by a CPU (central processing unit), a RAM (random access memory), and a ROM (lead only memory), and a pressure detection unit 41, a positioning unit 42, and a position detection unit 43 ), a movement control unit 44, a water supply control unit 45, a temperature adjustment unit 46, a pressure determination unit 47, a range determination unit 48, a movement speed setting unit 49, and a storage unit 50. In the control device 40, each of the above functional units is realized by the CPU executing a computer program stored in a ROM or other storage medium. In addition, some or all of the functional components of the control device 40 may be realized by hardware such as an electronic circuit.

The pressure detection unit 41 is based on the output signals of the plurality of pressure sensors 99 provided from the receiving device 70, the plurality of supported units 91 of the setting member 90 from the plurality of lifting pins 31 It detects a plurality of pressures applied to each.

As described later, when the setting of the moving speed of the connecting member 32 is started, the setting member 90 is supported by the plurality of lifting pins 31 in the initial state. In this state, the pressure determination unit 47 determines, as a plurality of reference pressure values, values of a plurality of pressures applied from the plurality of lifting pins 31 to the plurality of supported units 91 of the setting member 90, respectively. do. At this time, the storage unit 50 stores a plurality of determined reference pressure values.

The position detection unit 43 detects the vertical position of the connection member 32 with respect to the heat treatment plate 10 based on an output signal from the encoder of the motor 34.

As described later, at the time of setting the moving speed of the connecting member 32, after the plurality of reference pressure values are determined, the setting member 90 is supported by the support portion S. In this state, the movement control unit 44 controls the motor driving circuit 35 so that the upper ends of the plurality of lifting pins 31 are higher than the upper end of the support S from a position below the upper end of the support S. To move to the position of, the connecting member 32 is raised.

The positioning unit 42 is applied to the plurality of supported units 91 of the setting member 90 based on the detection result of the pressure detection unit 41 while the connection member 32 is raised by the movement control unit 44. It is determined whether or not the values of the plurality of pressures each applied have reached the determined plurality of reference pressure values, respectively. Further, the positioning unit 42 determines the vertical position of the connecting member 32 when the values of the plurality of pressures reach a plurality of reference pressure values, respectively, based on the detection result of the position detection unit 43. It is determined as a reference position.

The range determination unit 48 determines a partial range including the reference position determined by the positioning unit 42 among the moving ranges of the connecting member 32 during delivery of the substrate as the speed limiting range. Details of the speed limiting range will be described later.

The moving speed setting unit 49 is a connecting member in the time of delivery of the substrate so that the moving speed of the connecting member 32 within the speed limiting range is lower than the moving speed of the connecting member 32 outside the speed limiting range. Set the movement speed of (32). At this time, the storage unit 50 stores the set moving speed of the connecting member 32.

The water supply control unit 45 controls the motor drive circuit 35 so that the connecting member 32 moves at a set movement speed when the substrate is delivered, based on the movement speed stored in the storage unit 50.

In the storage unit 50, temperature adjustment information for adjusting the temperature of the heating element 20 is stored in addition to the plurality of reference pressure values, the speed limiting range and the set moving speed. The temperature adjustment unit 46 controls the heat generating drive circuit 21 based on the temperature adjustment information.

(2) Setting of the moving speed of the connecting member 32

5 to 10 are schematic side views showing a specific example of setting the moving speed of the connecting member 32 when the substrate is supplied. In the following description, the highest position among the movable range of the connecting member 32 in the vertical direction is referred to as the upper position PA, and the lowest position among the movable range of the connecting member 32 in the vertical direction. Is called the downward position (PB).

First, as shown in FIG. 5, the connecting member 32 moves to the upper position PA. In a state in which the connecting member 32 is in the upper position PA, the upper ends of the plurality of lifting pins 31 are positioned above the upper ends of the plurality of protruding members 11 of the support portion S.

Next, as shown in FIG. 6, the setting member 90 of FIG. 3 is mounted on the upper end of the plurality of lifting pins 31. In this state, pressure is applied from the plurality of lifting pins 31 to the plurality of supported portions 91 (FIG. 4) of the setting member 90, respectively. At this time, the values of the plurality of pressures applied from the plurality of lifting pins 31 to the plurality of supported portions 91 of the setting member 90 are detected based on the output signals of the plurality of pressure sensors 99 of FIG. do. The values of the plurality of pressures applied to the setting member 90 are displayed, for example, by resistance values of the plurality of pressure sensors 99. The values of the plurality of detected pressures are determined as a plurality of reference pressure values respectively corresponding to the plurality of supported portions 91 of the setting member 90.

Next, as shown in FIG. 7, the connecting member 32 moves from the upper position PA to the lower position PB. During this movement, the setting members 90 supported on the plurality of lifting pins 31 are handed over the plurality of protruding members 11 of the support portion S. In a state in which the connecting member 32 is in the lower position PB, the upper ends of the plurality of lifting pins 31 are located below the upper ends of the plurality of protruding members 11.

Next, as shown in FIG. 8, the connecting member 32 rises from the lower position PB toward the upper position PA. At this time, the motor drive circuit 35 of FIG. 1 drives the motor 34 so as to rise at a so-called step feed repeating that the connecting member 32 moves and stops at a predetermined minute distance.

When the connecting member 32 is raised, upper ends of the plurality of lifting pins 31 come into contact with the plurality of supported portions 91 (FIG. 4) of the setting member 90. At this time, by passing the setting member 90 to the plurality of lifting pins 31 from the plurality of protruding members 11 of the support portion S, a plurality of lifting and lowering of the plurality of supported portions 91 of the setting member 90 Pressure is applied from the pins 31 respectively. Therefore, the output signals of the plurality of pressure sensors 99 in FIG. 3 change before and after the contact between the plurality of lifting pins 31 and the plurality of supported portions 91.

So, in order to grasp the point in time when the plurality of lifting pins 31 and the plurality of supported portions 91 of the setting member 90 come into contact, while the connecting member 32 ascends in step transfer, the connecting member 32 Output signals of the plurality of pressure sensors 99 are acquired each time is moved or stopped. Further, based on the output signals of the plurality of pressure sensors 99, the plurality of pressure values applied from the plurality of lifting pins 31 to the plurality of supported portions 91 of the setting member 90 are determined. It is determined whether or not each of the reference pressure values has been reached. Thereafter, as shown in Fig. 9, the connection member 32 when the values of the plurality of pressures each applied to the plurality of supported portions 91 of the setting member 90 reach the determined plurality of reference pressure values, respectively. The position in the vertical direction of is determined as the reference position RP.

When the reference position (RP) is determined, the range in which the moving speed of the connecting member 32 should be limited so as not to cause scratches on the substrate when the substrate is supplied between the support portion S and the plurality of lifting pins 31 Is determined as the movement limit range.

In the present embodiment, as shown in Fig. 10, the lowering speed limiting range LR1 corresponding when the connecting member 32 descends for the number of substrates is between the upper position PA and the lower position PB. Is determined from Further, for the number of substrates, when the connecting member 32 ascends, a corresponding ascending speed limiting range LR2 is determined between the upper position PA and the lower position PB. The distances in the vertical direction of each of the descending speed limiting range LR1 and the rising speed limiting range LR2 are set to a predetermined distance (for example, 0.5 mm).

Here, the upper limit of the descending speed limit range LR1 is located above the reference position RP, and the lower limit of the descending speed limit range LR1 is located at the reference position RP. Further, the upper limit of the ascending speed limit range LR2 is located at the reference position RP, and the lower limit of the ascending speed limit range LR2 is located below the reference position RP.

Thereafter, when the substrate is supplied, the moving speed when descending within the descending speed limiting range LR1 is lower than the moving speed when the connecting member 32 descends outside the descending speed limiting range LR1. The moving speed of the member 32 is set. In addition, the connecting member so that the moving speed when the substrate is raised within the ascending speed limiting range LR2 is lower than the moving speed when the linking member 32 rises outside the ascending speed limiting range LR2. The moving speed of (32) is set.

Further, the moving speed of the connecting member 32 at the time of descending within the descending speed limiting range LR1 may be set to a constant value, or may be set to change stepwise or continuously. Further, the moving speed of the connecting member 32 at the time of descending outside the descending speed limit range LR1 may also be set to a constant value, or may be set to change stepwise or continuously. In addition, the moving speed at the time of ascent of the connecting member 32 within the ascending speed limiting range LR2 may be set to a constant value, or may be set to change stepwise or continuously. Further, the moving speed at the time of ascent of the connecting member 32 outside the ascending speed limiting range LR2 may also be set to a constant value, or may be set to change stepwise or continuously.

After the moving speed of the connection member 32 is set as described above, the connection member 32 rises to the upper position PA, so that the setting member 90 is removed from the plurality of lifting pins 31.

Further, the lower limit of the descending speed limit range LR1 may be located below the reference position RP, and the upper limit of the ascending speed limit range LR2 may be located above the reference position RP. Further, a range from the upper limit of the descending speed limiting range LR1 to the lower limit of the ascending speed limiting range LR2 may be used as a common movement limiting range when the connecting member 32 rises and descends.

FIG. 11 is a schematic side view showing a state in which the connecting member 32 descends after the moving speed of the connecting member 32 is set so that the substrate is handed over from the plurality of lifting pins 31 to the support portion S. When the moving speed of the connection member 32 is set according to the example of FIGS. 5 to 10 above, the connection member 32 is upward in a state in which the substrate W is placed on the plurality of lifting pins 31. It descends at a relatively high moving speed from the position PA to the upper limit of the descending speed limit range LR1.

After that, the connecting member 32 lowers the moving speed within the descending speed limiting range LR1. At this time, since the upper limit of the descending speed limit range LR1 is located above the reference position RP, the moving speed of the connecting member 32 is sufficiently low until the connecting member 32 reaches the reference position RP. can do. Accordingly, since the impact caused by the contact of the plurality of protrusion members 11 of the support portion S with the lower surface of the substrate W is sufficiently alleviated, the occurrence of scratches on the lower surface of the substrate W is prevented.

Further, since the moving speed of the substrate W decreases in the vicinity of the upper surface of the heat treatment plate 10, a large pressure is prevented from being generated in the space between the lower surface of the substrate W and the upper surface of the heat treatment plate 10. Therefore, the substrate W is prevented from being supported by the support portion S in a state that is shifted from the position to be supported by the substrate W floating on the support portion S.

After the substrate W is passed from the plurality of lifting pins 31 to the support part S, the connection member 32 is positioned downward from the reference position RP, which is the lower limit of the lowering speed limit range LR1. Descends at a relatively high movement speed. In this way, the moving speed of the connecting member 32 when descending outside the descending speed limit range LR1 is set to be high, so that the time required for water supply of the substrate W is shortened.

12 is a schematic side view showing a state in which the substrate W is passed from the support portion S to the plurality of lifting pins 31 by raising the connecting member 32 after setting the moving speed of the connecting member 32 to be. When the moving speed of the connection member 32 is set according to the example of FIGS. 5 to 10 above, the connection member 32 is in a lower position (PB) while the substrate (W) is placed on the support (S). ) To the lower limit of the ascending speed limit range LR2 at a relatively high moving speed.

After that, the connecting member 32 lowers the moving speed within the ascending speed limiting range LR2. At this time, since the lower limit of the ascending speed limit range LR2 is located below the reference position RP, the moving speed of the connecting member 32 is sufficiently low until the connecting member 32 reaches the reference position RP. can do. Accordingly, the impact caused by the contact of the plurality of lifting pins 31 on the lower surface of the substrate W is sufficiently alleviated, so that scratches are prevented from occurring on the lower surface of the substrate W.

After the substrate W is passed from the plurality of protrusion members 11 to the plurality of lifting pins 31, the connection member 32 is positioned upward from the reference position RP, which is the upper limit of the ascending speed limiting range LR2. Ascend at a relatively high movement speed to (PA). In this way, the moving speed of the connecting member 32 when ascending outside the ascending speed limiting range LR2 is set to be high, so that the time required for water supply of the substrate W is shortened.

In addition, in the example of FIGS. 11 and 12 above, the moving range of the connecting member 32 in the vertical direction when the substrate W between the support part S and the plurality of lifting pins 31 is supplied is upward. Although it is set between the position PA to the lower position PB, the present invention is not limited to this. The connecting member 32 rises further above the lower position PB from an arbitrary position below the upper position PA and above the lowering speed limit range LR1 when the substrate W is supplied. You may move the range to an arbitrary position below the speed limit range LR2.

(3) Movement speed setting processing

The setting of the moving speed of the connecting member 32 is performed by the control device 40 of FIG. 1 executing the moving speed setting process shown below. In the heat treatment apparatus 100 of FIG. 1, an operation unit (not shown) is provided for a user to give commands to the control apparatus 40 for various types of processing. The movement speed setting process is executed at the start of use of the heat treatment apparatus 100 or maintenance of the heat treatment apparatus 100 based on, for example, an operation of the operation unit by the user. 13 is a flowchart showing an example of a movement speed setting process.

As shown in Fig. 13, first, the movement control unit 44 of Fig. 1 controls the motor drive circuit 35 to move the connecting member 32 to the upper position PA (step S101).

In this state, the setting member 90 of FIG. 3 is mounted on the plurality of lifting pins 31 by the user or the substrate transfer device 450 of FIG. 14 to be described later. Therefore, the pressure detection unit 41 of FIG. 1 is applied from the plurality of lifting pins 31 to the plurality of supported units 91 of the setting member 90, respectively, based on the output signal provided from the receiving device 70. A plurality of pressures to lose are detected at a constant cycle (step S102). This pressure detection process continues until the movement speed setting process ends.

Further, the processing of step S102 may be performed after the setting member 90 is mounted on the plurality of lifting pins 31, for example, in response to an operation of the operation unit by the user. Alternatively, the process of step S102 may be continuously performed at a constant cycle while the movement speed setting process is being executed.

Next, the pressure determining unit 47 of Fig. 1 is based on the values of the plurality of pressures detected in the processing of step S102, from the plurality of lifting pins 31 to the plurality of supported units 91 of the setting member 90. ) Is determined as a plurality of reference pressure values (step S103). The determined plurality of reference pressure values are stored in the storage unit 50 of FIG. 1.

Next, the movement control unit 44 of Fig. 1 controls the motor drive circuit 35 to move the connecting member 32 to the lower position PB (step S104). Thereafter, the movement control unit 44 controls the motor drive circuit 35 so that the upper end portions of the plurality of lifting pins 31 are higher than the upper end portions of the support portion S from a position lower than the upper end portion of the support portion S. In order to move to the position, the connecting member 32 is raised by step transfer (step S105).

The positioning unit 42 in FIG. 1 is a plurality of supported units 91 based on detection of a plurality of pressures by the pressure detection unit 41 while the connecting member 32 is raised by the movement control unit 44. It is determined whether or not the values of the plurality of pressures each applied to each have reached the plurality of reference pressure values determined in step S103 (step S106).

The positioning unit 42 repeats the processing of the above step S106 until the values of the plurality of pressures each applied to the plurality of supported units 91 reach the determined plurality of reference pressure values. In addition, when the values of the plurality of pressures applied to the plurality of supported units 91 reach the determined plurality of reference pressure values, the positioning unit 42 is at that point by the position detection unit 43 of FIG. The position of the detected connecting member 32 in the vertical direction is determined as a reference position (step S107).

Next, the range determination unit 48 in Fig. 1 determines a speed limit range to include the determined reference position (step S108). At this time, the range determination unit 48 includes a descending speed limiting range LR1 when the plurality of lifting pins 31 descend, and a rising speed limiting range LR2 when the plurality of lifting pins 31 rise. May be individually determined as the speed limit range.

In addition, the movement speed setting unit 49 of FIG. 1 is configured such that the movement speed of the connecting member 32 within the determined speed limit range is lower than the movement speed of the connecting member 32 outside the speed limit range. ), the moving speed of the connecting member 32 is set (step S109). The set moving speed of the connecting member 32 is stored in the storage unit 50 in FIG. 1. After that, the movement speed setting process ends.

When the processing is performed on the substrate W in the heat treatment apparatus 100 after the above movement speed setting processing, when the substrate W is transferred between the support portion S and the plurality of lifting pins 31, Fig. The water supply control unit 45 of 1 controls the motor driving circuit 35. Therefore, the connecting member 32 moves in the vertical direction at the set moving speed.

(4) effect

(a) In the heat treatment apparatus 100 described above, after a plurality of reference pressure values are determined, in a state in which the setting member 90 is supported by the plurality of protrusion members 11 of the support portion S, the connection member ( 32) rises from the downward position PB.

In this case, when the upper ends of the plurality of lifting pins 31 are positioned at the same height as the upper ends of the plurality of protruding members 11, the upper ends of the plurality of lifting pins 31 are a plurality of supported parts of the setting member 90 ( 91) respectively. Accordingly, pressure is applied to the plurality of supported portions 91. Based on whether the values of the plurality of pressures applied to the plurality of supported portions 91 have reached the plurality of reference pressure values, the plurality of lifting pins 31 contact the setting member 90 at the time of contact. The position of the connecting member 32 in the vertical direction is accurately determined as the reference position RP. The speed limiting range (in the example of FIG. 10, the falling speed limiting range LR1 and the rising speed limiting range LR2) including the determined reference position is determined.

Thereafter, the moving speed of the connecting member 32 during the delivery of the substrate W so that the moving speed of the connecting member within the speed limiting range is lower than the moving speed of the connecting member 32 outside the speed limiting range. Is set.

When the substrate W is supplied, the connecting member 32 moves at a set movement speed. In this case, when the connecting member 32 moves within the speed limiting range at a low moving speed, the support portion S or the plurality of lifting pins 31 contact the lower surface of the substrate W. Accordingly, since the impact caused by the contact of the support portion S or the plurality of lifting pins 31 on the lower surface of the substrate W is alleviated, the occurrence of scratches on the lower surface of the substrate W is prevented. On the other hand, since the connecting member 32 moves outside the speed limit range at a high moving speed, the time required for water supply of the substrate W is shortened.

Further, according to the above configuration, the reference position RP is accurately determined and the speed limiting range is determined regardless of an error in the positional relationship between the support portion S and the plurality of lifting pins 31. Therefore, the moving speed of the setting member 90 can be accurately changed based on the speed limit range. Therefore, it becomes unnecessary to adjust the timing of lowering the moving speed of the substrate W while checking whether or not a scratch has actually occurred on the substrate W passed to the support portion S from the plurality of lifting pins 31.

As a result of these, while improving the throughput of the substrate processing, it is possible to prevent the occurrence of scratches on the substrate W when the substrate W between the support portion S and the plurality of lifting pins 31 is transferred. It becomes possible to suppress an increase in the manufacturing cost of (W).

(b) In the present embodiment, the plurality of reference pressure values are a plurality of pressures applied to the plurality of supported portions 91, respectively, in a state in which the setting member 90 is actually supported by the plurality of lifting pins 31 Is equal to the value of Therefore, at the time of setting the moving speed of the connecting member 32, the reference position of the setting member 90 can be accurately determined based on a plurality of reference pressure values.

(c) The setting member 90 has the same shape as the substrate W. Therefore, at the time of setting the moving speed of the connecting member 32, in a state close to the case where the substrate W is supplied between the support unit S and the plurality of lifting pins 31, the support unit S and the plurality of The number of setting members 90 between the lifting pins 31 is performed. Therefore, it is possible to more easily and appropriately set the moving speed of the connecting member 32.

(d) The setting member 90 is made of resin. In this case, since the setting member 90 is less susceptible to scratching than the substrate W, the setting member 90 is prevented from being damaged when the moving speed of the connecting member 32 is set.

(e) Output signals from the plurality of pressure sensors 99 provided in the setting member 90 are provided to the control device 40 by wireless communication using the transmission device 60 and the reception device 70. Therefore, it is possible to set the moving speed of the connecting member 32 by remote operation with a simple configuration.

(5) A substrate processing apparatus including the heat treatment apparatus 100 of FIG. 1

FIG. 14 is a schematic block diagram showing an example of a substrate processing apparatus including the heat treatment apparatus 100 of FIG. 1. As shown in FIG. 14, the substrate processing apparatus 400 is provided adjacent to the exposure apparatus 500, and the control unit 410, the coating processing unit 420, the developing processing unit 430, the heat treatment unit 440, and the substrate A transfer device 450 is provided. The heat treatment unit 440 includes a plurality of heat treatment apparatuses 100 of FIG. 1 for performing a heat treatment on the substrate W, and a plurality of heat treatment apparatuses (not shown) for performing a cooling treatment on the substrate W.

The control unit 410 includes, for example, a CPU and a memory, or a microcomputer, and controls the operation of the coating processing unit 420, the developing processing unit 430, the heat treatment unit 440, and the substrate transfer device 450. In addition, the control unit 410 performs a movement speed setting process in the plurality of heat treatment units 100 of the heat treatment unit 440 at the time of start of use of the heat treatment unit 100 or maintenance of the heat treatment unit 100. A command for doing so is given to the plurality of heat treatment apparatuses 100.

When the substrate W is processed by the substrate processing apparatus 400, the substrate transfer device 450 applies the substrate W to a coating processing unit 420, a developing processing unit 430, a heat treatment unit 440, and an exposure apparatus. It conveys among 500.

The coating processing unit 420 forms a resist film on one surface of the untreated substrate W (coating processing). The substrate W after the coating treatment on which the resist film has been formed is subjected to exposure treatment in the exposure apparatus 500. The developing processing unit 430 supplies a developing solution to the substrate W after exposure processing by the exposure apparatus 500 to perform a developing process on the substrate W. The heat treatment unit 440 performs heat treatment of the substrate W before and after the application treatment by the coating treatment unit 420, the development treatment by the development treatment unit 430, and the exposure treatment by the exposure apparatus 500.

Further, the coating processing unit 420 may form an antireflection film on the substrate W. In this case, the heat treatment unit 440 may be provided with a processing unit for performing an adhesion reinforcement treatment for improving the adhesion between the substrate W and the antireflection film. Further, the coating processing unit 420 may form a resist cover film on the substrate W for protecting the resist film formed on the substrate W.

In the substrate processing apparatus 400 described above, the movement speed setting process is performed in each of the plurality of heat treatment apparatuses 100 of the heat treatment unit 440 prior to the processing of the substrate W, so that in each heat treatment apparatus 100 During the water supply of the substrate W, the occurrence of scratches on the substrate W is prevented. In addition, the time required for the number of substrates W in each heat treatment apparatus 100 is shortened, thereby improving the throughput of the substrate processing. As a result, while the yield of the product in the substrate processing apparatus 400 is improved, the manufacturing cost of the substrate W is reduced.

Here, in the heat treatment unit 440, one setting member 90 (FIG. 3) may be used in common with two or more of a plurality of heat treatment apparatuses 100. In this case, one setting member 90 is sequentially conveyed to the plurality of heat treatment apparatuses 100 by the substrate transfer apparatus 450, and movement speed setting processing is sequentially performed in the plurality of heat treatment apparatuses 100. Therefore, it is not necessary to prepare the number of setting members 90 corresponding to all the heat treatment apparatuses 100.

(6) other embodiments

(a) The above embodiment is an example in which the substrate water supply system according to the present invention is applied to the heat treatment apparatus 100 for heat treatment, but the substrate water supply system according to the present invention may be applied to the heat treatment apparatus for cooling treatment. .

For example, a cooling device may be provided in the heat treatment device 100 instead of the heat generating element 20 of FIG. 1. In this case, the support part S includes the heat treatment plate 10, the plurality of protrusion members 11, the plurality of guide members 12, and a cooling device, and is used as a cooling plate. The cooling device may be constituted by, for example, a Peltier element, or may be constituted by a pipe for circulating cooling water.

In the heat treatment apparatus 100 for performing a cooling treatment on the substrate W, or by performing a movement speed setting process, the same effect as in the above embodiment can be obtained.

Further, even if a plurality of heat treatment apparatuses 100 for performing cooling treatment on the substrate W are provided in the heat treatment unit 440 in FIG. 14 together with a plurality of heat treatment apparatuses 100 for performing heat treatment on the substrate W do. In this case, while the yield of the product in the substrate processing apparatus 400 of FIG. 14 is further improved, the manufacturing cost of the substrate W is further reduced.

(b) The substrate processing apparatus 400 shown in FIG. 14 may include a plurality of substrate transfer apparatuses 450. When a substrate mounting unit on which a substrate W is temporarily placed is provided between one substrate transfer device 450 and another substrate transfer device 450, the heat treatment device 100 configured to perform cooling treatment on the substrate You may use it as a mounting part. In this case, the same effect as in the above embodiment can be obtained by performing the movement speed setting process in the substrate mounting unit in advance before the processing of the substrate W.

(c) In the above embodiment, a plurality of reference pressure values respectively corresponding to the plurality of supported portions 91 of the setting member 90 are determined based on the output signal of the pressure sensor 99 during the moving speed setting process. However, the present invention is not limited to this. A plurality of reference pressure values may be previously determined as design values.

(d) In the above embodiment, the output signal of the pressure sensor 99 is given to the pressure detection unit 41 of the control device 40 by wireless communication using the transmission device 60 and the reception device 70, , The present invention is not limited to this. The output signals of the plurality of pressure sensors 99 provided in the setting member 90 may be provided to the pressure detection unit 41 of the control device 40 by wired communication using an electric wire cable or an optical fiber cable.

(e) In the above embodiment, three lifting pins 31 are used as the plurality of lifting pins 31, but the number of the plurality of lifting pins 31 may be 3 or more, or may be 4, There may be five. In this case, it is preferable that the setting member 90 is provided with a number of pressure sensors 99 corresponding to each of the plurality of lifting pins 31.

(f) In the above embodiment, the support portion S has a plurality of protruding members 11 for supporting the lower surface of the substrate W on the heat treatment plate 10, but the present invention is not limited thereto. Does not. On the upper surface of the heat treatment plate 10 of the support part S, instead of the plurality of protruding members 11, a sheet-like member made of a resin for supporting the lower surface of the substrate W may be provided.

In this case, when the substrate W is passed from the plurality of lifting pins 31 to the support portion S, even if the lower surface of the substrate W comes into contact with the sheet-like member, scratches hardly occur on the substrate W. Therefore, at the time of setting the moving speed of the connecting member 32, only the ascending speed limiting range LR2 may be determined among the falling speed limiting range LR1 and the ascending speed limiting range LR2. That is, it is not necessary to lower the moving speed of the connecting member 32 at the time of descending. Therefore, the time required for the number of substrates W can be further shortened.

(g) In the above embodiment, the plurality of lifting pins 31 are formed of ceramic, but the present invention is not limited thereto. In the plurality of lifting pins 31, their upper ends may be made of resin or rubber instead of ceramic.

In this case, when the substrate W is passed from the support portion S to the plurality of lifting pins 31, even if the lower surface of the substrate W contacts the plurality of lifting pins 31, scratches are generated on the substrate W. Difficult to do. Therefore, at the time of setting the moving speed of the connecting member 32, only the descending speed limiting range LR1 may be determined among the descending speed limiting range LR1 and the ascending speed limiting range LR2. That is, it is not necessary to lower the moving speed of the connecting member 32 at the time of ascending. Therefore, the time required for the number of substrates W can be further shortened.

(7) Correspondence between each component of the claim and each element of the embodiment

Hereinafter, examples of correspondence between each component of the claims and each of the embodiments will be described, but the present invention is not limited to the following examples.

In the above embodiment, the support part S is an example of the support part, the plurality of lifting pins 31 is an example of a plurality of lifting members, the connecting member 32 is an example of a connecting member, and the transfer shaft 33, The motor 34 and the motor drive circuit 35 are examples of the water drive unit, the setting member 90 is an example of the setting member, and a plurality of pressure sensors 99, a transmission device 60, a reception device 70, and The pressure detection unit 41 is an example of the detection unit.

In addition, the movement control unit 44 is an example of a movement control unit, the positioning unit 42 is an example of a positioning unit, the range determination unit 48 is an example of a range determination unit, and the movement speed setting unit 49 is a movement speed It is an example of the setting unit 49, the speed limit range, the falling speed limit range LR1, and the rising speed limit range LR2 are examples of the speed limit range, the water supply control unit 45 is an example of the water control unit, and the heat treatment device 100 is an example of a substrate water supply system.

In addition, the pressure determination unit 47 is an example of a pressure determination unit, the falling speed limiting range LR1 is an example of the falling speed limiting range, the rising speed limiting range LR2 is an example of the rising speed limiting range, and the heat treatment plate ( The upper surface of 10) is an example of the supporting surface, the plurality of protruding members 11 are examples of the plurality of protruding members, and the heating element 20 is an example of a heat treatment mechanism.

As each component of the claim, various other components having the configuration or function described in the claim may be used.

[Industrial availability]

The present invention can be effectively used for processing various substrates.

Claims (14)

A support configured to support a lower surface of the substrate during processing of the substrate, and
A plurality of elevating members each having an upper end capable of supporting a lower surface of the substrate;
A connecting member configured to be movable in a vertical direction with respect to the support portion while connecting the plurality of lifting members,
When the substrate is transferred between the support portion and the plurality of elevating members, the upper ends of the plurality of elevating members move between a position above the upper end of the support and a position below the upper end of the support, A water driving part for moving the connecting member,
A setting member configured to be supported by the plurality of lifting members,
A detection unit that detects pressure applied to a plurality of portions of the setting member from the plurality of elevation members when the setting member is supported by the plurality of elevation members;
At the time of setting the moving speed of the connecting member, the upper end of the plurality of lifting members from a position lower than the upper end of the support, in a state in which the setting member is supported by the support by controlling the water drive A movement control unit for moving the connection member so as to move to an upper position,
A plurality of reference pressures in which values of a plurality of pressures applied to the plurality of portions of the setting member from the plurality of elevating members are predetermined during movement of the connection member by the movement control unit based on an output signal of the detection unit A positioning unit that determines whether or not a value has been reached, and determines a vertical position of the connecting member as a reference position when the values of the plurality of pressures reach each of the plurality of reference pressure values,
A range determining unit for determining a partial range including the determined reference position among the moving ranges of the connecting member during the delivery of the substrate as a speed limiting range;
Movement speed setting for setting the moving speed of the connecting member during delivery of the substrate so that the moving speed of the connecting member within the speed limiting range is lower than the moving speed of the connecting member outside the speed limiting range Wealth,
And a water supply control unit for controlling the water supply driving unit so that the connection member moves at a movement speed set by the movement speed setting unit when the substrate is supplied. The method according to claim 1,
Determining the plurality of reference pressure values based on values of a plurality of pressures each applied to the plurality of portions of the setting member from the plurality of lifting members while the setting member is supported by the plurality of lifting members A substrate water supply system further comprising a pressure determination unit. The method according to claim 1 or 2,
The range determination unit determines a speed limit range when the connecting member descends for the number of substrates as a descending speed limit range,
The upper limit of the lowering speed limit range is located above the reference position,
The moving speed setting unit adjusts the moving speed of the connecting member so that the moving speed of the connecting member when descending within the lowering speed limit range is lower than the moving speed of the connecting member when descending outside the speed limiting range. To set up, the substrate water system. The method according to claim 1 or 2,
The range determination unit determines a speed limit range when the connecting member rises for the number of substrates as a rise speed limit range,
The lower limit of the ascending speed limit range is located below the reference position,
The moving speed setting unit may include a moving speed of the connecting member so that a moving speed of the connecting member when ascending within the ascending speed limiting range is lower than a moving speed of the connecting member when ascending outside the ascending speed limiting range. To set up, the substrate water system. The method according to claim 1 or 2,
The substrate water supply system, wherein the setting member has the same shape as the substrate. The method according to claim 1 or 2,
The setting member is a substrate water supply system formed of resin. The method according to claim 1 or 2,
The support part,
With a flat support surface,
A plurality of protrusion members provided to protrude upward from the support surface and configured to support a lower surface of the substrate,
A substrate water supply system comprising a heat treatment mechanism for performing heat treatment on a substrate supported by the plurality of protrusion members. A substrate numbering method for transferring a substrate between a support portion configured to support a lower surface of the substrate and an upper end portion capable of supporting the lower surface of the substrate during processing of a substrate,
The plurality of lifting members are connected by a connecting member configured to be movable in an up-down direction with respect to the support part,
The connecting member is moved between a position above the upper end of the support and a position lower than the upper end of the support when the substrate is supplied between the support and the plurality of lifting members. To move,
The substrate number method,
At the time of setting the moving speed of the connecting member, supporting a setting member configured to be supported by the plurality of lifting members by the support portion;
Moving the connection member so that the upper ends of the plurality of lifting members move from a position below the upper end of the support to a position above the upper end of the support while the setting member is supported by the support;
Detecting a pressure applied to a plurality of portions of the setting member from the plurality of lifting members when the setting member is supported by the plurality of lifting members;
During the movement of the connecting member, based on the detection result of the detecting step, values of a plurality of pressures each applied to the plurality of portions of the setting member from the plurality of lifting members are respectively applied to a plurality of predetermined reference pressure values. Determining whether or not the plurality of pressures has reached, and determining a position in the vertical direction of the connecting member as a reference position when the values of the plurality of pressures reach each of the plurality of reference pressure values;
Determining a partial range including the determined reference position among the moving ranges of the connecting member during the delivery of the substrate as a speed limiting range; and
Setting a moving speed of the connecting member during delivery of the substrate so that a moving speed of the connecting member within the speed limiting range is lower than a moving speed of the connecting member outside the speed limiting range; and
And moving the connection member so that the connection member moves at a moving speed set by the setting step when the substrate is supplied. The method of claim 8,
Determining the plurality of reference pressure values based on values of a plurality of pressures each applied to the plurality of portions of the setting member from the plurality of lifting members while the setting member is supported by the plurality of lifting members The method further comprising a step. The method according to claim 8 or 9,
The step of determining a partial range including the determined reference position as a speed limiting range includes determining a speed limiting range when the connecting member descends for the number of substrates as a descending speed limiting range,
The upper limit of the lowering speed limit range is located above the reference position,
The step of setting the movement speed may include the connection member so that the movement speed of the connection member when descending within the lowering speed limit range is lower than the movement speed of the connection member when descending outside the speed limit range. A method of numbering a substrate comprising setting a moving speed. The method according to claim 8 or 9,
The step of determining a partial range including the determined reference position as a speed limiting range includes determining a speed limiting range when the connecting member ascends for the number of substrates as a rising speed limiting range,
The lower limit of the ascending speed limit range is located below the reference position,
The step of setting the moving speed may include: the connecting member so that the moving speed of the connecting member when ascending within the ascending speed limiting range is lower than the moving speed of the connecting member when ascending outside the ascending speed limiting range. The method comprising setting the speed of movement of the substrate. The method according to claim 8 or 9,
The setting member has the same shape as the substrate. The method according to claim 8 or 9,
The setting member is formed of resin. The method according to claim 8 or 9,
The support part,
With a flat support surface,
A plurality of protrusion members provided to protrude upward from the support surface and configured to support a lower surface of the substrate,
And a heat treatment mechanism for performing heat treatment on a substrate supported by the plurality of protruding members.

Images