JP2007158110A - Substrate treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which can perform heat treatment of a substrate without being affected by a temperature of a chamber, even in the case of changing a set temperature of a thermal treatment plate to a lower target temperature. <P>SOLUTION: The substrate treatment apparatus is provided with the thermal treatment plate, the chamber provided over the thermal treatment plate, and a control unit. The control unit has time information about a necessary time to become a normal state where the thermal treatment plate is stabilized at the target temperature, and the temperature of the chamber is below the target temperature according to the changing condition of the set temperature of the thermal treatment plate. In the case of changing the set temperature T1 of the thermal treatment plate to new lower target temperature T2, the control unit starts the thermal treatment of a substrate W1 when the necessary time has passed (time t5). In this case, the temperature of the chamber is not higher than the target temperature T2, so that the thermal treatment can be performed appropriately without being affected by the temperature of the chamber. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for performing at least a heat treatment on a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk (hereinafter simply referred to as “substrate”), and in particular, a heat treatment. The present invention relates to a technique for performing an appropriate heat treatment on a substrate even when the set temperature of the plate is changed to a lower target temperature.

  In recent years, with the miniaturization of the line width dimension of the pattern formed on the substrate, the required value of the uniformity of the required line width has become stricter. ) Is becoming more important. In addition, with the high-mix low-volume production, it is essential to operate flexible production recipes. In the resist coating and developing apparatus, the multi-system of resist advances, and it is necessary for the heat treatment part mounted on the apparatus to perform heat treatment at various temperatures for each type of resist.

The heat treatment section includes a heat treatment plate and a chamber provided thereabove, and performs heat treatment by placing a substrate on the heat treatment plate in which a heat treatment atmosphere is formed. The heat treatment plate is provided with a heating part and a cooling part, and is configured to be able to respond quickly to changes in the set temperature of the heat treatment plate (see, for example, Patent Document 1).
JP 2003-324139 A

However, the conventional example having such a configuration has the following problems.
That is, even if the temperature of the heat treatment plate changes rapidly, the temperature of the chamber slowly follows by natural heat dissipation, and it takes time for the temperature to stabilize compared to the heat treatment plate.

  FIG. 7 schematically shows the behavior of the temperature of the heat treatment plate and the chamber when the heat treatment plate is changed from the set temperature T1 to a lower target temperature T2 (T2 <T1). Further, the lower part shows a period during which heat treatment is performed on each of the substrates W1, W2, W3, and W4.

  Prior to time t1 when the set temperature T1 is changed, the temperature of the heat treatment plate is stable at the set temperature T1. Moreover, since the chamber does not have its own heat source, it is stable at a lower temperature. Here, when the set temperature T1 is changed to the target temperature T2, cooling of the heat treatment plate is started, and the temperature of the heat treatment plate rapidly decreases after time t1. When it is determined at time t4 that the heat treatment plate is stabilized at the target temperature T2, the cooling is finished. In contrast, the temperature of the chamber gradually decreases from time t1 so as to gently follow the temperature drop of the heat treatment plate. At this time, as shown in the period from time t2 to time t5, the chamber temperature may be higher than the heat treatment plate. Furthermore, even at the time t4 when the heat treatment plate is stabilized at the target temperature T2, the chamber temperature may still be higher than the heat treatment plate.

  Since the heat treatment to each of the substrates W1 to W4 is started when the temperature of the heat treatment plate is stabilized at the target temperature T2, the heat treatment of the substrate W1 is performed from time t4. For this reason, the substrate W1 is heated to a temperature higher than the target temperature T2 due to the influence of the temperature of the chamber, and there is an inconvenience that a pattern having an appropriate line width cannot be resolved on the substrate W1.

  Further, when the chamber is at a lower temperature than the heat treatment plate, the influence of the chamber temperature is small. In other words, the substrates W2, W3, and W4 processed after time t5 can be accurately heated to the target temperature T2 and subjected to appropriate heat treatment. For this reason, the uniformity of the heat treatment between the substrate W1 and the substrates W2 to W4 is not maintained.

  In the process of changing the set temperature of the heat treatment plate from a low temperature to a high temperature, the temperature of the chamber does not become higher than that of the heat treatment plate, so that the above-described disadvantage does not occur.

  The present invention has been made in view of such circumstances, and even when the set temperature of the heat treatment plate is changed to a lower target temperature, the substrate is heat treated without being affected by the temperature of the chamber. It is an object of the present invention to provide a substrate processing apparatus that can perform the above processing.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention described in claim 1 is a substrate processing apparatus for processing a substrate, a heat treatment plate for heat treating the substrate, a cooling means attached to the heat treatment plate for cooling the heat treatment plate, and above the heat treatment plate. When the set temperature of the chamber and the heat treatment plate is changed to a new lower target temperature, the heat treatment plate is cooled to the target temperature by the cooling means, and the heat treatment plate is stabilized at the target temperature. And control means for allowing the substrate to be placed on the heat treatment plate only in a normal state where the temperature of the chamber is equal to or lower than the target temperature.

  [Operation / Effect] According to the invention described in claim 1, when the set temperature of the heat treatment plate is changed to a new lower target temperature, if the chamber temperature is not lower than the target temperature, the substrate becomes the heat treatment plate. It will not be placed. With such a configuration, the substrate on which the heat treatment is performed is not affected by the temperature of the chamber, and is accurately heated to the temperature of the heat treatment plate. Therefore, heat treatment can be performed appropriately.

  In the present invention, the apparatus may further include a transport unit for placing the substrate on the heat treatment plate, and the control unit may operate the transport unit based on a preset time required for the normal state. Preferred (claim 2). Until the substrate is in a normal state, it is possible to easily restrict the placement of the substrate on the heat treatment plate.

  Alternatively, in the present invention, the apparatus further comprises a transfer means for placing the substrate on the heat treatment plate, a plate temperature detection means for detecting the temperature of the heat treatment plate, and a chamber temperature detection means for detecting the temperature of the chamber. The control means preferably operates the conveying means based on the detection results of the plate temperature detecting means and the chamber temperature detecting means (claim 3). It is possible to reliably regulate placing the substrate on the heat treatment plate until the normal state is reached.

  According to a fourth aspect of the present invention, there is provided a substrate processing apparatus for processing a substrate, a heat treatment plate for heat-treating the substrate, a cooling means attached to the heat treatment plate for cooling the heat treatment plate, and the heat treatment plate. When the set temperature of the chamber provided above, at least heat absorbing means for absorbing heat from the chamber, and the set temperature of the heat treatment plate is changed to a lower target temperature, the heat treatment plate is cooled to the target temperature by the cooling means. And operating the heat-absorbing means to bring the temperature of the chamber below the temperature of the heat treatment plate and allowing the substrate to be placed on the heat treatment plate after the heat treatment plate is stabilized at the target temperature. And a control means.

  [Operation / Effect] According to the invention described in claim 4, by providing the heat absorption means, when the set temperature of the heat treatment plate is changed to a new lower target temperature, the temperature drop of the chamber is promoted, The chamber temperature is maintained below the heat treatment plate temperature. With this configuration, the substrate is not affected by the temperature of the chamber and is accurately heated to the temperature of the heat treatment plate. Therefore, heat treatment can be performed appropriately.

  In the present invention, it further comprises a transfer means for placing the substrate on the heat treatment plate, and a plate temperature detection means for detecting the temperature of the heat treatment plate, and the control means is configured to detect the detection result of the plate temperature detection means. It is preferable to operate the conveying means based on the above (claim 5). Since the temperature of the chamber is lower than that of the heat treatment plate, the substrate can be appropriately heat treated if the heat treatment plate is stabilized at the target temperature. According to the present invention, it is possible to reliably restrict the substrate from being placed on the heat treatment plate until this state is reached.

  In the present invention, it is preferable that the control means terminates the heat absorption by the heat absorption means based on the detection result of the plate temperature detection means (Claim 6). The heat absorption can be terminated at an appropriate timing without causing unnecessary heat absorption.

  Alternatively, in the present invention, it is preferable that the apparatus further includes chamber temperature detection means for detecting the temperature of the chamber, and the control means terminates the heat absorption by the heat absorption means based on the detection result of the chamber temperature detection means ( Claim 7). The heat absorption can be terminated at an appropriate timing without causing unnecessary heat absorption.

  Further, in the present invention, the transport means includes a holding unit that is movable between a transfer position above the heat treatment plate and a retreat position that is out of the heat treatment plate, and holds the substrate. Preferably, the heat absorbing means is constituted by the holding part, and the holding part absorbs heat at the transfer position without holding the substrate and moves to the retracted position to end the heat absorption (Claim 8). It is possible to prevent the apparatus configuration from becoming complicated.

  In the present invention, it is preferable that the transport means is provided for each of the heat treatment plates. If it is the conveyance means provided for every heat processing plate, when the preset temperature of the heat processing plate is changed, the holding | maintenance part will stand by. Even if heat is absorbed by the holding unit at such timing, the process of transferring the original substrate of the holding unit is not hindered.

  Moreover, in this invention, it is preferable to provide the holding | maintenance part cooling means attached to the said holding | maintenance part and cooling the said holding | maintenance part (Claim 10). The temperature of the chamber can be lowered more quickly.

  According to the substrate processing apparatus of the present invention, when the set temperature of the heat treatment plate is changed to a new lower target temperature, the substrate is placed on the heat treatment plate unless the chamber temperature is lower than the target temperature. There is no. With such a configuration, the substrate on which the heat treatment is performed is not affected by the temperature of the chamber, and is accurately heated to the temperature of the heat treatment plate. Therefore, heat treatment can be performed appropriately.

Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a vertical sectional view showing a schematic configuration of a substrate processing apparatus according to the first embodiment, and FIG. 2 is a plan view showing a schematic configuration of the substrate processing apparatus according to the first embodiment.

  The substrate processing apparatus according to the first embodiment is roughly divided into a heat treatment unit 1 and a transport mechanism 3. The heat treatment unit 1 has a circular shape in plan view, and includes a heat treatment plate 11 that places a substrate W to be processed and performs heat treatment. The heat treatment plate 11 is provided with a heating part (not shown) such as a mica heater and a cooling plate 13. A meandering pipe line 13 a is formed in the cooling plate 13. One end of a supply pipe 15a and a discharge pipe 15b are connected to both ends of the pipe line 13a. The other end side of the supply pipe 15 a is drawn from the heat treatment unit 1 and connected to the cooling water supply source 17. The cooling water supply source 17 is a utility provided in a clean room, for example. An electromagnetic valve 19 is interposed in the supply pipe 15a. The cooling plate 13 corresponds to the cooling means in this invention.

  A temperature sensor 21 for detecting the temperature of the upper surface of the heat treatment plate 11 is embedded. Furthermore, the raising / lowering pin 23 which delivers the board | substrate W between the holding | maintenance parts 31 mentioned later is provided. The elevating pins 23 have a rod shape and are respectively inserted into three through holes formed in the heat treatment plate 11. Each elevating pin 23 is connected to an elevating mechanism (not shown) having a lower end composed of a support base, an air cylinder and the like so as to be able to elevate. The temperature sensor 21 corresponds to the plate temperature detecting means in this invention.

  Further, a chamber 27 for forming a heat treatment atmosphere is provided above the heat treatment plate 11. The chamber 27 is also connected to an elevating mechanism (not shown), and is configured to be able to move up and down above the heat treatment plate 11.

  The transport mechanism 3 is provided exclusively for the heat treatment plate 11 and places the substrate W on the heat treatment plate 11. The transport mechanism 3 includes a holding unit 31 for holding the substrate W in a horizontal posture, and a pipe line 31 a through which cooling water passes is formed inside the holding unit 31. At both ends of the conduit 31a, one end of the supply pipe 33a and the discharge pipe 33b are connected in communication with each other at the base end side portion of the holding portion 31. The other end of the supply pipe 33a is connected to a cooling water supply source 35 through a pump or the like (not shown). The holding portion 31 is formed with a plurality of slits 31b so as not to be buffered with the elevating pins 23 at the delivery position. The pipe line 31a corresponds to the holding part cooling means in this invention.

  The transport mechanism 3 further includes an electric motor 41, a rotating body 43 that is rotationally driven around a vertical axis by the electric motor 41, a freely rotatable roller-shaped guide member 45, and the rotating body 43 and the guide member 45. And a belt 47 wound around the belt. The holding portion 31 is connected to the belt 47 via a support arm 49. Then, by forward / reverse rotation driving of the electric motor 41, a delivery position above the heat treatment plate 11 (a position indicated by a one-dot chain line in FIG. 2) and a retreat position (a position indicated by a solid line in FIG. 2) deviated from the heat treatment plate 11. The holding portion 31 is configured to be able to advance and retreat. The transport mechanism 3 corresponds to the transport means in this invention.

  The setting change unit 51 sets or changes the set temperature of the heat treatment plate 11 with reference to the processing recipe. The control unit 53 is connected to the electromagnetic valve 19, the temperature sensor 21, the electric motor 41, and the setting change unit 51. And it is comprised so that an output can be received from the temperature sensor 21 and the setting change part 51, and the solenoid valve 19 and the electric motor 41 can be operated. In addition, a heating unit attached to the heat treatment plate 11 (not shown), an elevating mechanism for elevating the elevating pins 23, an elevating mechanism for elevating the chamber 27, and the like are collectively operated.

  Further, when the control unit 53 is changed to a new target temperature having a lower set temperature (hereinafter simply referred to as “target temperature”), the heat treatment plate 11 is stabilized at the target temperature, and the temperature of the chamber 27 is Time information that is set according to the temperature change condition is stored as the time required to reach a normal state that is equal to or lower than the target temperature (hereinafter simply referred to as “normal state”). This time information is obtained in advance by an experiment or the like, for example.

  The setting change unit 51 and the control unit 53 are a central processing unit (CPU) that reads out and executes a program, a RAM (Random-Access Memory) that stores various information, a storage medium such as a fixed disk, and the like. Composed.

  Next, the operation of the substrate processing apparatus according to the first embodiment when the set temperature of the heat treatment plate 11 is changed to the target temperature will be described. FIG. 3 is a flowchart illustrating the processing procedure of the substrate processing apparatus according to the first embodiment, and FIG. 4 is a diagram schematically illustrating the temperature behavior of the heat treatment plate and the chamber.

  Here, before the set temperature is changed, the heat treatment plate 11 is assumed to be stable at a predetermined set temperature T1, and the chamber 27 is assumed to be stable at a temperature lower than the heat treatment plate 11 (in FIG. 4). Before time t1). Further, it is assumed that the holding unit 31 is in the retracted position.

<Step S1 to Step S3>
The setting change unit 51 changes the set temperature T1 to the target temperature T2 (T2 <T1). Thereby, the control part 53 opens the solenoid valve 19 at time t1. Thereby, the cooling water flows from the cooling water supply source 17 to the pipe line 13a in the cooling plate 13 through the supply pipe 15a. The cooling water that has flowed through the pipe 13a is discharged from the discharge pipe 15b together with the heat transferred from the heat treatment plate 11 (step S1). Therefore, as shown in FIG. 4, the temperature of the heat treatment plate 11 rapidly decreases after time t1. When the heat treatment plate 11 is cooled in this way, the control unit 53 monitors the temperature of the heat treatment plate 11 detected from the temperature sensor 21 and determines whether or not the temperature of the heat treatment plate 11 is stabilized at the target temperature T2. (Step S2). At time t4, it is determined that the heat treatment plate 11 has stabilized at the target temperature T2, and the cooling is finished (step S3).

  As shown in the figure, when the temperature of the heat treatment plate 11 overshoots below the target temperature T2 at time t3, the heat treatment plate 11 may be appropriately heated by a heating unit (not shown) attached to the heat treatment plate 11. Good.

  At this time, the temperature of the chamber 27 follows the temperature drop of the heat treatment plate 11 and gradually decreases after time t1. And after time t5, it becomes below target temperature T2.

<Step S4 to Step S6>
In parallel with step S1, the control unit 53 operates the electric motor 41 at time t1 to regulate the operation of the transport mechanism 3 so that the substrate W is not placed on the heat treatment plate 11 (step S4). At this time, the required time corresponding to the temperature change condition obtained by referring to the time information is counted to determine whether the required time has elapsed (step S5). If it is determined that the required time has elapsed, the regulation of the transport mechanism 3 is terminated (step S6).

  In the present embodiment, the required time is set as a time required until the heat treatment plate 11 is cooled to the normal state from the start of cooling. For this reason, the time measurement is configured to start from the time when cooling is started (time t1). However, the beginning of the time required to reach the normal state can be set to an appropriate timing.

  Here, it is assumed that the estimation is accurately made based on the required time, and the restriction of the electric motor 41 is finished at time t5. In this case, at time t5, both the processes of step S3 and step S6 are completed, and the process proceeds to step S7.

<Step S <b>7> Performing Heat Treatment on the Substrate At time t <b> 5, the following operation is performed by the operation of the control unit 53. First, the electric motor 41 is rotationally driven, and the holding unit 31 holding the substrate W1 moves to the delivery position. Thereafter, the lift pins 23 are raised to receive the substrate W <b> 1 from the holding part 31. When the substrate W1 is received, the holding unit 31 returns to the retracted position, and the elevating pins 23 are lowered to place the substrate W1 on the heat treatment plate 11. When the substrate W1 is placed, the chamber 27 is lowered to form a heat treatment atmosphere. Then, by maintaining this state for a predetermined time, the substrate W1 is heat-treated at the target temperature T2. When the heat treatment is completed, the chamber 27 is raised, and then the processed substrate W1 is transferred from the lift pins 23 to the holding unit 31 and carried out of the heat treatment unit 1. Thus, the heat treatment of the substrate W1 is completed.

  As described above, when the heat treatment of the substrate W1 is completed, the same processing is repeated for the unprocessed substrates W2, W3, and W4. As a result, the substrates W1 to W4 are heat-treated at the timing as shown in the lower part of FIG.

  Thus, according to the substrate processing apparatus according to the first embodiment, since the control unit 53 is provided, when the set temperature T1 of the heat treatment plate 11 is changed to a new lower target temperature T2, the heat treatment plate 11 Even after time t4 stabilized at the target temperature T2, the substrate W is not placed on the heat treatment plate 11 until time t5 when the temperature of the chamber 27 becomes equal to or lower than the target temperature T2. In other words, after such a change in the set temperature, the substrate W1 to be heat-treated first is accurately heated to the target temperature T2 without being affected by the temperature of the chamber 27, and an appropriate heat treatment is performed. be able to. In addition, the processing quality can be kept uniform between the substrate W1 and the substrates W2 to W4 that are heat-treated at the subsequent timing.

  Moreover, since the control part 53 performs each operation based on the required time set beforehand, it can control easily. Further, the control unit 53 can reliably prevent the substrate W from being placed on the heat treatment plate 11 by restricting the transport mechanism 3.

  Next, Embodiment 2 of the present invention will be described with reference to the drawings. In addition, since the structure of Example 2 is represented with the same block diagram as Example 1, FIG. 1 is referred for convenience. Here, since the time information is not memorize | stored, the control part 54 which concerns on Example 2 attaches | subjects a different code | symbol from Example 1, and distinguishes. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  Next, the operation of the substrate processing apparatus according to the second embodiment when the set temperature T1 of the heat treatment plate 11 is changed to the target temperature T2 (T2 <T1) will be described. FIG. 5 is a flowchart illustrating the processing procedure of the substrate processing apparatus according to the second embodiment, and FIG. 6 is a diagram schematically illustrating the temperature behavior of the heat treatment plate and the chamber. The same processes (steps) as those in the first embodiment are denoted by the same reference numerals and will be described briefly.

  Also in the second embodiment, it is assumed that the heat treatment plate 11 is already at the set temperature T1 and the chamber 27 is stable at a lower temperature than the heat treatment plate 11. It is assumed that the holding unit 31 is in the retracted position without holding the substrate W.

<Step S1 to Step S3>
When the setting temperature T1 is changed to the target temperature T2 by the setting changing unit 51, the control unit 54 starts cooling the heat treatment plate 11 at time t1 (step S1) and monitors the detection result of the temperature sensor 21 (step S1). Step S2). When it is determined at time t4 that the heat treatment plate 11 has stabilized at the target temperature T2, cooling is terminated (step S3).

<Step S14 to Step 16>
In parallel with step S1, the control unit 54 moves the holding unit 31 that is not holding the substrate W to the delivery position at time t1. The holding part 31 absorbs heat from the chamber 27 at the delivery position. The absorbed heat is transmitted to the cooling water flowing in the pipe line 31a in the holding unit 31, and is discharged together with the cooling water. As a result, the chamber 27 after time t1 is absorbed by the holding portion 31, so that the chamber 27 is quickly lowered so as to always be maintained below the temperature of the heat treatment plate 11.

  The holding unit 31 also absorbs heat from the heat treatment plate 11 in the same manner. Further, the radiant heat from the heat treatment plate 11 is shielded.

  When the heat is absorbed by the holding unit 31, the control unit 54 determines whether or not the temperature of the heat treatment plate 11 is at least equal to or lower than the target temperature T2 based on the detection result of the temperature sensor 21 (step S15). This determination is based on whether or not the heat treatment plate 11 has reached the target temperature, not stabilized at the target temperature T2. Therefore, it is determined that the temperature is equal to or lower than the target temperature T2 at time t3, and the holding unit 31 is moved to the retracted position (step S16).

  As a result, at time t4, both step S3 and step S16 are completed, and the process proceeds to step S7.

<Step S5> Heat-treating the substrate After time t4, the substrates W1 to W4 are heat-treated one by one.

  As described above, according to the substrate processing apparatus of the second embodiment, when the set temperature T1 of the heat treatment plate 11 is changed to the target temperature T2, heat is absorbed from the chamber 27. Can always be kept below the temperature of the heat treatment plate 11. Further, by absorbing heat also from the heat treatment plate 11, the temperature lowering of the heat treatment plate 11 can be further accelerated and stabilized at the target temperature T2 at an early stage. Since the temperature of the chamber 27 is equal to or lower than the temperature of the heat treatment plate 11, the heat treatment can be started when the heat treatment plate 11 is stabilized at the target temperature T2, so that the throughput is improved.

  Further, since the heat absorption is configured to be performed using the holding unit 31, there is no possibility that the apparatus configuration becomes complicated. Moreover, since the conveyance mechanism 3 is provided for each heat treatment plate 11, the holding unit 31 is on standby while the temperature of the heat treatment plate 11 is changed. For this reason, the holding part 31 absorbs heat, and the original processing is not hindered. In addition, since the cooling water flows in the holding unit 31, the temperature lowering rate of the chamber 27 can be further promoted. Furthermore, since the temperature of the holding part 31 itself can be prevented from rising even if heat absorption is performed, the substrate W held thereafter is not thermally affected.

  Further, since the heat absorption is terminated when it is determined that the temperature of the heat treatment plate 11 is at least equal to or lower than the target temperature T2, the heat absorption can be terminated at an appropriate timing without causing unnecessary heat absorption. Thereby, the process in which the holding unit 31 holds the substrate W can be quickly transferred.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the above-described first embodiment, the control unit 53 regulates the operation of the transport mechanism 3, but is not limited to this as long as the substrate W is regulated / allowed to be placed on the heat treatment plate 11. For example, in a case where the transport mechanism 3 is omitted from the substrate processing apparatus and the substrate W is loaded by a separate transport mechanism, the control unit 53 moves the substrate W to the separate transport mechanism. You may make it output the signal which controls / allows mounting. Even if the transport mechanism 3 is not provided, it may be realized by a configuration other than the transport mechanism 3 such as closing a substrate carry-in port (not shown) to the heat treatment unit 1.

  (2) In the first embodiment described above, the control unit 53 performs the control based on the preset required time, but is not limited thereto. For example, a chamber temperature sensor for detecting the temperature of the chamber 27 (corresponding to the chamber temperature detecting means in the present invention) may be provided. At this time, the control unit 53 compares the temperature of the chamber 27 detected from the chamber temperature sensor with the target temperature T2, thereby detecting the time point when the temperature of the chamber 27 is equal to or lower than the target temperature. And you may comprise so that it may be determined with a process of step S1-S3 that it is a normal state.

  (3) In the first embodiment described above, the control unit 53 stores a preset required time, but is not limited thereto. For example, the required time may be calculated based on the relational expression of the temperature variation of the heat treatment plate 11 and the chamber 27 according to the temperature change condition.

  (4) In the second embodiment described above, heat is absorbed by the holding unit 31. However, as long as heat can be absorbed from the chamber 27, a dedicated heat absorbing means may be provided. For example, water cooling means may be provided in the chamber 27. In this case, the transport mechanism 3 may be omitted from the substrate processing apparatus, and the substrate W may be loaded by a separate transport mechanism. The control unit 54 is configured to output a signal for regulating / allowing the placement of the substrate W to a separate transport mechanism. Even if the transport mechanism 3 is not provided, it may be realized by a configuration other than the transport mechanism 3 such as closing the substrate carry-in port to the heat treatment unit 1.

  (5) In the above-described second embodiment, the pipe 31a through which the cooling water is passed is formed in the holding unit 31, but if the heat absorbed by the holding unit 31 can be discharged, a known cooling means is appropriately applied. Can do. In addition, the cooling means may be omitted without forming the pipe line 31a in the holding portion 31. Even in this case, the holding unit 31 can absorb heat according to the heat capacity.

  (6) In Example 2 mentioned above, although the control part 54 judged the completion | finish of heat absorption based on the detection result of the temperature sensor 21, it is not restricted to this. For example, it is configured to include a chamber temperature sensor that detects the temperature of the chamber 27, and when the controller 54 determines that the temperature of the chamber 27 detected from the chamber temperature sensor has become equal to or lower than the target temperature T <b> 2, the endotherm is absorbed. You may comprise so that it may complete | finish. This timing corresponds to t2 in FIG. Thereby, heat absorption can be completed at an early stage.

  (7) In the above-described second embodiment, the transport mechanism 3 is dedicated to the heat treatment plate 11, but is not limited to this, and is a shared transport mechanism that transports the substrate W to a separately provided processing unit. May be.

  (8) In each embodiment, the transport mechanism 3 performs the operation of loading the substrate W and unloading the substrate W, but it is sufficient that at least the substrate W can be regulated / allowed to be placed on the heat treatment plate 11. Only the operation of placing the substrate W on the heat treatment plate 11 may be performed, and the substrate W may be carried out by other components.

  (9) In each embodiment, the processing content is only the heat treatment unit 1 that performs the heat treatment on the substrate W. However, a plurality of heat treatment units 1 are provided, and a resist coating processing unit, a development processing unit, and the like are appropriately provided. be able to.

1 is a vertical sectional view showing a schematic configuration of a substrate processing apparatus according to Example 1. FIG. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to Embodiment 1. FIG. 3 is a flowchart illustrating a processing procedure of the substrate processing apparatus according to the first embodiment. It is the figure which showed typically the behavior of the temperature of a heat processing plate and a chamber. 10 is a flowchart illustrating a processing procedure of the substrate processing apparatus according to the second embodiment. It is the figure which showed typically the behavior of the temperature of a heat processing plate and a chamber. It is the figure which showed typically the behavior of the temperature of the heat processing plate and chamber in the conventional substrate processing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Heat processing part 3 ... Conveyance mechanism 11 ... Heat processing plate 13 ... Cooling plate 21 ... Temperature sensor 27 ... Chamber 31 ... Holding part 31a ... Pipe line 53, 54 ... Control part W ... Substrate T1 ... Setting temperature T2 ... Target temperature

Claims (10)

In a substrate processing apparatus for processing a substrate,
A heat treatment plate for heat treating the substrate;
A cooling means attached to the heat treatment plate for cooling the heat treatment plate;
A chamber provided above the heat treatment plate;
When the set temperature of the heat treatment plate is changed to a lower target temperature, the heat treatment plate is cooled to the target temperature by the cooling means, the heat treatment plate is stabilized at the target temperature, and Control means for allowing a substrate to be placed on the heat treatment plate only in a normal state where the temperature is equal to or lower than the target temperature;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
Furthermore, a transport means for placing a substrate on the heat treatment plate is provided,
The substrate processing apparatus, wherein the control means operates the transport means based on a time required until the normal state is set in advance. The substrate processing apparatus according to claim 1,
Furthermore, a conveying means for placing a substrate on the heat treatment plate,
Plate temperature detecting means for detecting the temperature of the heat treatment plate;
Chamber temperature detecting means for detecting the temperature of the chamber;
With
The substrate processing apparatus, wherein the control means operates the transport means based on detection results of the plate temperature detection means and the chamber temperature detection means. In a substrate processing apparatus for processing a substrate,
A heat treatment plate for heat treating the substrate;
A cooling means attached to the heat treatment plate for cooling the heat treatment plate;
A chamber provided above the heat treatment plate;
Heat absorbing means for absorbing heat from at least the chamber;
When the set temperature of the heat treatment plate is changed to a lower target temperature, the heat treatment plate is cooled to the target temperature by the cooling means, and the temperature of the chamber is controlled by operating the heat absorption means. And a control means for allowing a substrate to be placed on the heat treatment plate after the heat treatment plate is stabilized at the target temperature.
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 4,
Furthermore, a conveying means for placing a substrate on the heat treatment plate,
Plate temperature detecting means for detecting the temperature of the heat treatment plate;
With
The substrate processing apparatus, wherein the control means operates the transport means based on a detection result of the plate temperature detection means. The substrate processing apparatus according to claim 5,
The substrate processing apparatus, wherein the control means ends heat absorption by the heat absorption means based on a detection result of the plate temperature detection means. The substrate processing apparatus according to claim 5,
Furthermore, a chamber temperature detecting means for detecting the temperature of the chamber is provided,
The substrate processing apparatus, wherein the control means ends heat absorption by the heat absorption means based on a detection result of the chamber temperature detection means. In the substrate processing apparatus in any one of Claims 5-7,
The transfer means is movable between a delivery position above the heat treatment plate and a retreat position removed from above the heat treatment plate, and includes a holding portion for holding the substrate,
The heat-absorbing means is constituted by the holding portion, and the holding portion absorbs heat at the transfer position without holding the substrate, and moves to the retracted position to end the heat absorption. . The substrate processing apparatus according to claim 8,
The substrate processing apparatus, wherein the transfer means is provided for each of the heat treatment plates. In the substrate processing apparatus of Claim 8 or Claim 9,
Furthermore, the substrate processing apparatus is provided with the holding | maintenance part cooling means attached to the said holding | maintenance part and cooling the said holding | maintenance part.

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