JP2019061246A - 量子ドット組成物 - Google Patents
量子ドット組成物 Download PDFInfo
- Publication number
- JP2019061246A JP2019061246A JP2018202807A JP2018202807A JP2019061246A JP 2019061246 A JP2019061246 A JP 2019061246A JP 2018202807 A JP2018202807 A JP 2018202807A JP 2018202807 A JP2018202807 A JP 2018202807A JP 2019061246 A JP2019061246 A JP 2019061246A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- polysiloxane
- quantum dot
- polymer
- pdms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002096 quantum dot Substances 0.000 title claims abstract description 55
- 239000000203 mixture Substances 0.000 title claims description 27
- -1 polysiloxanes Polymers 0.000 claims abstract description 50
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 40
- 239000003446 ligand Substances 0.000 claims abstract description 38
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 43
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 28
- 229920000642 polymer Polymers 0.000 claims description 16
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 10
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 9
- 239000011324 bead Substances 0.000 claims description 8
- 229910052793 cadmium Inorganic materials 0.000 claims description 8
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 8
- 125000000524 functional group Chemical group 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 229920006254 polymer film Polymers 0.000 claims description 3
- 150000003973 alkyl amines Chemical class 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 150000007942 carboxylates Chemical class 0.000 claims description 2
- 150000004668 long chain fatty acids Chemical class 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- 229930192474 thiophene Natural products 0.000 claims description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 229920005597 polymer membrane Polymers 0.000 claims 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 claims 1
- 150000003573 thiols Chemical class 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 15
- 229910052710 silicon Inorganic materials 0.000 abstract description 15
- 239000010703 silicon Substances 0.000 abstract description 15
- 239000002105 nanoparticle Substances 0.000 abstract description 10
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 239000011159 matrix material Substances 0.000 abstract description 3
- WLZRMCYVCSSEQC-UHFFFAOYSA-N cadmium(2+) Chemical compound [Cd+2] WLZRMCYVCSSEQC-UHFFFAOYSA-N 0.000 abstract description 2
- 238000000295 emission spectrum Methods 0.000 abstract description 2
- 229910007161 Si(CH3)3 Inorganic materials 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 238000006862 quantum yield reaction Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 239000006185 dispersion Substances 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 239000011162 core material Substances 0.000 description 8
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 7
- 239000008393 encapsulating agent Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- 238000009877 rendering Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000003396 thiol group Chemical class [H]S* 0.000 description 3
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000011258 core-shell material Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000007539 photo-oxidation reaction Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical compound C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 description 1
- AZYTZQYCOBXDGY-UHFFFAOYSA-N 2-pyrrolidin-1-ylpyridine Chemical compound C1CCCN1C1=CC=CC=N1 AZYTZQYCOBXDGY-UHFFFAOYSA-N 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- DTGKSKDOIYIVQL-MRTMQBJTSA-N Isoborneol Natural products C1C[C@@]2(C)[C@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-MRTMQBJTSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CKDOCTFBFTVPSN-UHFFFAOYSA-N borneol Natural products C1CC2(C)C(C)CC1C2(C)C CKDOCTFBFTVPSN-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- DTGKSKDOIYIVQL-UHFFFAOYSA-N dl-isoborneol Natural products C1CC2(C)C(O)CC1C2(C)C DTGKSKDOIYIVQL-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001548 drop coating Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005802 health problem Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000103 photoluminescence spectrum Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920006268 silicone film Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- ZGNPLWZYVAFUNZ-UHFFFAOYSA-N tert-butylphosphane Chemical compound CC(C)(C)P ZGNPLWZYVAFUNZ-UHFFFAOYSA-N 0.000 description 1
- 150000003577 thiophenes Chemical class 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- ZMBHCYHQLYEYDV-UHFFFAOYSA-N trioctylphosphine oxide Chemical compound CCCCCCCCP(=O)(CCCCCCCC)CCCCCCCC ZMBHCYHQLYEYDV-UHFFFAOYSA-N 0.000 description 1
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
- C09K11/881—Chalcogenides
- C09K11/883—Chalcogenides with zinc or cadmium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2211/00—Chemical nature of organic luminescent or tenebrescent compounds
- C09K2211/10—Non-macromolecular compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
- Y10S977/774—Exhibiting three-dimensional carrier confinement, e.g. quantum dots
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/778—Nanostructure within specified host or matrix material, e.g. nanocomposite films
- Y10S977/779—Possessing nanosized particles, powders, flakes, or clusters other than simple atomic impurity doping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/949—Radiation emitter using nanostructure
- Y10S977/95—Electromagnetic energy
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
- Optical Filters (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
【解決手段】幾つかのシリコン含有表面修飾リガンドを用いて、ポリシロキサンに対する半導体ナノ粒子(量子ドット)の親和性をより高くでき、ポリシロキサンマトリックス中に分散した量子ドットは、発光デバイスに使用されて、このようなデバイスの発光スペクトルを変更することができる。前記ポリシロキサンは、R−Si(CH3)2−O−(Si(CH3)2−O)n−Si(CH3)3等である。
【選択図】図1
Description
本願は、2014年3月18日に出願された米国仮出願第61/954,860号の利益を主張する。
本発明は概して、発光半導体量子ドット(QD)を含む材料に関する。より具体的には、本発明は、QDを含むシリコーン系ポリマーに関する。
(1)R−Si(CH3)2−O−(Si(CH3)2−O)n−Si(CH3)3
(2)R−Si(CH3)2−O−(Si(CH3)2−O)n−Si(CH3)2−R1
(3)R−(Si(R2R3)−O)n−(Si(R3R4)−O)m−
モノカルボキシル基末端PDMS(10g、6.67mmol)を、冷却塔と攪拌機が装備された三つ口丸底フラスコに加えた。その後、ラウリルアルコール(1.49g、8mmol)を窒素下でフラスコに加えて、混合物をジクロロメタン(DCM、180mL)に溶解させた。その後、ジシクロヘキシルカルボジイミド(DCCI)(1.376g,6.67mmol)及びピロリジノピリジン(99.8mg、0.667mmol)を加えて、混合物を窒素下で一晩撹拌した。その後、混合物を50℃の水槽を用いて還流させて、その後、脱イオン水で洗浄した(3×250mL)。その後、有機相をNa2SO4で乾燥させて、低圧下でDCMを除去した。そのようにして得られた液体をメタノールで洗浄し、その後、ヘキサンに再溶解させた後、ヘキサン溶液中の不溶部分を濾過して除去した。最後に、真空下でヘキサンを除去して、6.89gの透明な液体を得た。
In、P、Zn、及びSを含んでいるコアと、ZnSを用いたシェルとを有する赤色発光コア/シェル型QDを、米国特許第7,867,556号に開示されているようにして調製した。当該特許の全体は、引用を以て本明細書の一部となる。表面リガンドを加えない場合と加えた場合について、QDを入れた粘性PDMS樹脂(SYLGARD184、ダウコーニング)と、窒素下で24時間50℃で硬化したそれらに対応する膜とを目視比較した。その結果、上記のエステル化反応で得られた表面リガンド(C22H45−PDMS)は、PDMS樹脂及び膜中における赤色量子ドットの分散を明らかに改善していた。
Claims (20)
- 半導体材料を含む少なくとも一つの量子ドットと、
前記量子ドットの表面に配置されており、ポリシロキサンを含む表面リガンドと、
を備える組成物。 - 前記ポリシロキサンは、
R−Si(CH3)2−O−(Si(CH3)2−O)n−Si(CH3)3、
R−Si(CH3)2−O−(Si(CH3)2−O)n−Si(CH3)2−R1、及び
R−(Si(R2R3)−O)n−(Si(R3R4)−O)m−
からなる群から選択された式を有しており、
n及びmは整数であり、R、R1、R2、R3、及びR4は脂肪族基である、請求項1に記載の組成物。 - シリコーンポリマーを更に含む、請求項1に記載の組成物。
- 前記シリコーンポリマーは、ポリシロキサンである、請求項3に記載の組成物。
- 前記量子ドットは、カドミウムフリー量子ドットである、請求項1に記載の組成物。
- R、R1、R2、R3、及びR4の少なくとも一つは、前記量子ドットの表面に化学的に結合している官能基で置換されている、請求項2に記載の組成物。
- 前記官能基は、チオール、カルボキシレート及びアミンからなる群から選択される、請求項6に記載の組成物。
- R乃至R4の少なくとも一つは、置換された(−CH2)n鎖を含む、請求項2に記載の組成物。
- R乃至R4の少なくとも一つは、未置換の(−CH2)n鎖を含む、請求項2に記載の組成物。
- 単位の繰り返し数nは、2乃至30である、請求項2に記載の組成物。
- 前記表面リガンドは、化学式:HOOC−(CH2)10−Si(CH3)2−O−(Si(CH3)2−O)n−Si(CH3)2−C4H9を有する化合物を含む、請求項1に記載の組成物。
- 前記表面リガンドは、化学式:HOOC−C18H37−PDMSを有する化合物を含んでおり、ここで、PDMSは、ポリジメチルシロキサンである、請求項1に記載の組成物。
- 前記量子ドットは、ホスフィン、ホスフィンオキシド、アルキルホスフォン酸、アルキル−アミン、アリール−アミン、ピリジン、長鎖脂肪酸、及びチオフェンからなる群から選択されたキャッピング剤を含む、請求項1に記載の組成物。
- 組成物に封入された発光ダイオード(LED)を備える発光デバイスにおいて、前記組成物は、
半導体材料を含む少なくとも一つの量子ドットと、
前記量子ドットの表面に配置されており、ポリシロキサンを含む表面リガンドと、
を備えている、発光デバイス。 - 組成物が分散したシリコーンポリマーを含むポリマー膜において、前記組成物は、
半導体材料を含む少なくとも一つの量子ドットと、
前記量子ドットの表面に配置されており、ポリシロキサンを含む表面リガンドと、
を備えている、ポリマー膜。 - 前記シリコーンポリマーはポリシロキサンを含む、請求項15に記載のポリマー膜。
- 組成物が分散したシリコーンポリマーを含むポリマービーズにおいて、前記組成物は、
半導体材料を含む少なくとも一つの量子ドットと、
前記量子ドットの表面に配置されており、ポリシロキサンを含む表面リガンドと、
を備えている、ポリマービーズ。 - 前記シリコーンポリマーはポリシロキサンを含む、請求項17に記載のポリマービーズ。
- 前記シリコーンポリマーは本質的にポリシロキサンからなる、請求項17に記載のポリマービーズ。
- 前記ポリシロキサンはポリジメチルシロキサンである、請求項19に記載のポリマービーズ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461954860P | 2014-03-18 | 2014-03-18 | |
US61/954,860 | 2014-03-18 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016558113A Division JP2017514299A (ja) | 2014-03-18 | 2015-03-18 | 量子ドット組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019061246A true JP2019061246A (ja) | 2019-04-18 |
Family
ID=53719794
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016558113A Pending JP2017514299A (ja) | 2014-03-18 | 2015-03-18 | 量子ドット組成物 |
JP2018202807A Pending JP2019061246A (ja) | 2014-03-18 | 2018-10-29 | 量子ドット組成物 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016558113A Pending JP2017514299A (ja) | 2014-03-18 | 2015-03-18 | 量子ドット組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9663710B2 (ja) |
EP (1) | EP3119851B1 (ja) |
JP (2) | JP2017514299A (ja) |
KR (2) | KR101961232B1 (ja) |
CN (2) | CN106103647A (ja) |
TW (1) | TWI586760B (ja) |
WO (1) | WO2015140642A2 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017110060A (ja) * | 2015-12-15 | 2017-06-22 | シャープ株式会社 | 発光性構造体およびそれを用いた発光装置 |
JP6759349B2 (ja) * | 2016-02-12 | 2020-09-23 | ナノコ テクノロジーズ リミテッド | 安定性に優れた量子ドット含有ポリマーフィルム |
KR102601102B1 (ko) | 2016-08-09 | 2023-11-10 | 삼성전자주식회사 | 조성물, 이로부터 제조된 양자점-폴리머 복합체 및 이를 포함하는 소자 |
JP7043727B2 (ja) * | 2017-01-31 | 2022-03-30 | 大日本印刷株式会社 | 光波長変換シートの劣化評価方法、光波長変換シート、バックライト装置、および画像表示装置 |
WO2019083112A1 (ko) | 2017-10-27 | 2019-05-02 | 삼성에스디아이 주식회사 | 양자점 함유 조성물, 양자점 제조방법 및 컬러필터 |
TWI798343B (zh) * | 2018-03-12 | 2023-04-11 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其經固化產物 |
CN111868952A (zh) | 2018-03-26 | 2020-10-30 | 夏普株式会社 | 液体组合物、光电转换元件的制造方法以及光电转换元件 |
CN108441221B (zh) * | 2018-05-10 | 2021-06-01 | 河北工业大学 | 一种与封装硅胶高兼容核壳量子点材料及其制备方法 |
KR102154018B1 (ko) * | 2018-05-29 | 2020-09-09 | 주식회사 신아티앤씨 | 실록산 수지 바인더 및 InP계 양자점을 포함하는 디스플레이용 양자점 필름 및 그 제조방법 |
EP3643765A1 (en) | 2018-10-22 | 2020-04-29 | SABIC Global Technologies B.V. | Stable quantum dot compositions |
JP7179581B2 (ja) * | 2018-10-26 | 2022-11-29 | 住友化学株式会社 | 組成物、フィルム、積層構造体、発光装置及びディスプレイ |
CN111378431A (zh) * | 2018-12-29 | 2020-07-07 | Tcl集团股份有限公司 | 一种量子点膜及其制备方法与应用 |
KR102296792B1 (ko) | 2019-02-01 | 2021-08-31 | 삼성에스디아이 주식회사 | 무용매형 경화성 조성물, 이를 이용하여 제조된 경화막, 상기 경화막을 포함하는 컬러필터, 디스플레이 장치 및 상기 경화막의 제조방법 |
KR20200099930A (ko) | 2019-02-15 | 2020-08-25 | 삼성전자주식회사 | 전계 발광 소자와 이를 포함한 표시 장치 |
KR102360987B1 (ko) | 2019-04-24 | 2022-02-08 | 삼성에스디아이 주식회사 | 양자점 함유 경화성 조성물, 이를 이용한 수지막 및 디스플레이 장치 |
CN110165037A (zh) * | 2019-05-08 | 2019-08-23 | 华南理工大学 | 一种半固化基材的量子点led器件及其制备方法 |
KR102504790B1 (ko) | 2019-07-26 | 2023-02-27 | 삼성에스디아이 주식회사 | 양자점, 이를 포함하는 경화성 조성물, 상기 조성물을 이용하여 제조된 경화막, 상기 경화막을 포함하는 컬러필터, 디스플레이 장치 |
JP7321972B2 (ja) * | 2020-05-25 | 2023-08-07 | 信越化学工業株式会社 | 量子ドット含有重合体とその製造方法 |
CN114574187B (zh) * | 2020-11-30 | 2024-03-05 | 北京京东方技术开发有限公司 | 纳米粒子、纳米粒子层图案化的方法及相关应用 |
JP7355724B2 (ja) * | 2020-12-07 | 2023-10-03 | 信越化学工業株式会社 | 量子ドットの表面処理方法及び表面処理装置 |
EP4183825A1 (en) | 2021-11-23 | 2023-05-24 | SHPP Global Technologies B.V. | Thermoplastic film compositions having improved blue led light stability |
EP4183812A1 (en) | 2021-11-23 | 2023-05-24 | SHPP Global Technologies B.V. | Thermoplastic compositions having improved transmission and haze properties |
JP2024054518A (ja) * | 2022-10-05 | 2024-04-17 | 信越化学工業株式会社 | 感光性樹脂組成物、感光性樹脂皮膜、感光性ドライフィルム、パターン形成方法及び発光素子 |
JP2024054513A (ja) * | 2022-10-05 | 2024-04-17 | 信越化学工業株式会社 | 量子ドット含有組成物とその製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007181810A (ja) * | 2005-11-16 | 2007-07-19 | Samsung Electro Mech Co Ltd | キャップ分子が表面に結合しているナノ粒子用分散剤、これを用いたナノ粒子を分散させる方法、及びこれを含むナノ粒子含有薄膜 |
US7385003B1 (en) * | 2005-10-03 | 2008-06-10 | Sandia Corporation | In-situ formation of nanoparticles within a silicon-based matrix |
JP2012509604A (ja) * | 2008-11-19 | 2012-04-19 | ナノコ テクノロジーズ リミテッド | 半導体ナノ粒子を用いた発光デバイス、関連材料及び方法 |
JP2012525467A (ja) * | 2009-05-01 | 2012-10-22 | ナノシス・インク. | ナノ構造の分散のための官能基を有するマトリックス |
WO2013093631A2 (en) * | 2011-12-22 | 2013-06-27 | Nanoco Technologies, Inc. | Surface modified nanoparticles |
WO2013114254A2 (en) * | 2012-02-03 | 2013-08-08 | Koninklijke Philips N.V. | Novel materials and methods for dispersing nano particles in matrices with high quantum yields and stability |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7645397B2 (en) * | 2004-01-15 | 2010-01-12 | Nanosys, Inc. | Nanocrystal doped matrixes |
US7374807B2 (en) * | 2004-01-15 | 2008-05-20 | Nanosys, Inc. | Nanocrystal doped matrixes |
TW200531315A (en) * | 2004-01-26 | 2005-09-16 | Kyocera Corp | Wavelength converter, light-emitting device, method of producing wavelength converter and method of producing light-emitting device |
GB0522027D0 (en) | 2005-10-28 | 2005-12-07 | Nanoco Technologies Ltd | Controlled preparation of nanoparticle materials |
KR101249078B1 (ko) * | 2006-01-20 | 2013-03-29 | 삼성전기주식회사 | 실록산계 분산제 및 이를 포함하는 나노입자 페이스트조성물 |
JP2009120437A (ja) * | 2007-11-14 | 2009-06-04 | Niigata Univ | シロキサンをグラフト化したシリカ及び高透明シリコーン組成物並びに該組成物で封止した発光半導体装置 |
KR101411196B1 (ko) * | 2008-05-08 | 2014-06-23 | 삼성전자주식회사 | 나노결정-폴리디메틸실록산 복합체 및 그의 제조방법 |
GB0916699D0 (en) * | 2009-09-23 | 2009-11-04 | Nanoco Technologies Ltd | Semiconductor nanoparticle-based materials |
GB0916700D0 (en) * | 2009-09-23 | 2009-11-04 | Nanoco Technologies Ltd | Semiconductor nanoparticle-based materials |
KR20120012642A (ko) * | 2010-08-02 | 2012-02-10 | 삼성전기주식회사 | 나노 복합재 및 이를 포함하는 발광 소자 패키지 |
CN103597568B (zh) * | 2011-04-01 | 2016-08-17 | 纳晶科技股份有限公司 | 白光发光器件 |
JP5909985B2 (ja) * | 2011-10-17 | 2016-04-27 | ソニー株式会社 | 電池および電池の製造方法ならびに電池パック、電子機器、電動車両、蓄電装置および電力システム |
KR101702000B1 (ko) * | 2011-10-21 | 2017-02-03 | 삼성전자 주식회사 | 반도체 나노결정-고분자 복합입자, 이의 제조방법 및 이를 포함하는 복합체 필름 및 광전자 소자 |
TW201329205A (zh) * | 2011-11-30 | 2013-07-16 | Univ Washington Ct Commerciali | 表面鈍化之矽量子點螢光體 |
JP6240092B2 (ja) * | 2012-01-16 | 2017-11-29 | オスラム・シルバニア・インコーポレイテッド | シリコーングラフト化コア−シェル粒子並びにこれを含有するポリマーマトリックス及びled |
US9139770B2 (en) * | 2012-06-22 | 2015-09-22 | Nanosys, Inc. | Silicone ligands for stabilizing quantum dot films |
WO2015101777A1 (en) * | 2014-01-06 | 2015-07-09 | Nanoco Technologies Ltd | Surface-modified nanoparticles |
-
2015
- 2015-03-18 TW TW104108723A patent/TWI586760B/zh active
- 2015-03-18 CN CN201580014184.XA patent/CN106103647A/zh active Pending
- 2015-03-18 CN CN202010372770.4A patent/CN111423875A/zh active Pending
- 2015-03-18 KR KR1020167028807A patent/KR101961232B1/ko active IP Right Grant
- 2015-03-18 JP JP2016558113A patent/JP2017514299A/ja active Pending
- 2015-03-18 EP EP15741595.1A patent/EP3119851B1/en active Active
- 2015-03-18 US US14/661,768 patent/US9663710B2/en active Active
- 2015-03-18 WO PCT/IB2015/000935 patent/WO2015140642A2/en active Application Filing
- 2015-03-18 KR KR1020197005160A patent/KR102056786B1/ko active IP Right Grant
-
2018
- 2018-10-29 JP JP2018202807A patent/JP2019061246A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7385003B1 (en) * | 2005-10-03 | 2008-06-10 | Sandia Corporation | In-situ formation of nanoparticles within a silicon-based matrix |
JP2007181810A (ja) * | 2005-11-16 | 2007-07-19 | Samsung Electro Mech Co Ltd | キャップ分子が表面に結合しているナノ粒子用分散剤、これを用いたナノ粒子を分散させる方法、及びこれを含むナノ粒子含有薄膜 |
JP2012509604A (ja) * | 2008-11-19 | 2012-04-19 | ナノコ テクノロジーズ リミテッド | 半導体ナノ粒子を用いた発光デバイス、関連材料及び方法 |
JP2012525467A (ja) * | 2009-05-01 | 2012-10-22 | ナノシス・インク. | ナノ構造の分散のための官能基を有するマトリックス |
WO2013093631A2 (en) * | 2011-12-22 | 2013-06-27 | Nanoco Technologies, Inc. | Surface modified nanoparticles |
WO2013114254A2 (en) * | 2012-02-03 | 2013-08-08 | Koninklijke Philips N.V. | Novel materials and methods for dispersing nano particles in matrices with high quantum yields and stability |
Also Published As
Publication number | Publication date |
---|---|
US9663710B2 (en) | 2017-05-30 |
KR20190020845A (ko) | 2019-03-04 |
WO2015140642A3 (en) | 2015-12-17 |
TWI586760B (zh) | 2017-06-11 |
KR102056786B1 (ko) | 2020-01-22 |
KR101961232B1 (ko) | 2019-03-22 |
WO2015140642A2 (en) | 2015-09-24 |
CN111423875A (zh) | 2020-07-17 |
EP3119851A2 (en) | 2017-01-25 |
TW201540783A (zh) | 2015-11-01 |
JP2017514299A (ja) | 2017-06-01 |
KR20160135763A (ko) | 2016-11-28 |
EP3119851B1 (en) | 2018-08-29 |
US20150267106A1 (en) | 2015-09-24 |
CN106103647A (zh) | 2016-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2019061246A (ja) | 量子ドット組成物 | |
US10014452B2 (en) | Semiconductor nanoparticle-based light-emitting devices and associated materials and methods | |
JP6537667B2 (ja) | 表面修飾ナノ粒子 | |
US9082941B2 (en) | Semiconductor nanoparticle-based materials for use in light emitting diodes, optoelectronic displays and the like | |
TWI608076B (zh) | 以金屬硫醇聚合物穩定化的量子點 | |
JP6580668B2 (ja) | 量子ドット組成物 | |
US20110068321A1 (en) | Semiconductor nanoparticle-based materials | |
JP2022527600A (ja) | 組成物 | |
TW202024295A (zh) | 奈米粒子 | |
TW202003793A (zh) | 半傳導性奈米顆粒 | |
CN113195678A (zh) | 表面改性的半导体发光纳米颗粒及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181113 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181113 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190808 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190820 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20191107 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200212 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200428 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20200720 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20200925 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20210104 |