JP2019056137A5 - - Google Patents

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Publication number
JP2019056137A5
JP2019056137A5 JP2017180414A JP2017180414A JP2019056137A5 JP 2019056137 A5 JP2019056137 A5 JP 2019056137A5 JP 2017180414 A JP2017180414 A JP 2017180414A JP 2017180414 A JP2017180414 A JP 2017180414A JP 2019056137 A5 JP2019056137 A5 JP 2019056137A5
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JP
Japan
Prior art keywords
surface treatment
injection unit
processed
injection
liquid
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JP2017180414A
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English (en)
Japanese (ja)
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JP6995544B2 (ja
JP2019056137A (ja
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Priority claimed from JP2017180414A external-priority patent/JP6995544B2/ja
Priority to JP2017180414A priority Critical patent/JP6995544B2/ja
Priority to US16/648,086 priority patent/US11389818B2/en
Priority to SG11202002497QA priority patent/SG11202002497QA/en
Priority to KR1020207010776A priority patent/KR102401901B1/ko
Priority to EP18858558.2A priority patent/EP3686320A4/en
Priority to CN201880059714.6A priority patent/CN111094635A/zh
Priority to PCT/JP2018/031065 priority patent/WO2019058860A1/ja
Priority to TW107131845A priority patent/TWI745617B/zh
Publication of JP2019056137A publication Critical patent/JP2019056137A/ja
Publication of JP2019056137A5 publication Critical patent/JP2019056137A5/ja
Publication of JP6995544B2 publication Critical patent/JP6995544B2/ja
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JP2017180414A 2017-09-20 2017-09-20 表面処理装置および表面処理方法 Active JP6995544B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2017180414A JP6995544B2 (ja) 2017-09-20 2017-09-20 表面処理装置および表面処理方法
PCT/JP2018/031065 WO2019058860A1 (ja) 2017-09-20 2018-08-23 表面処理装置および表面処理方法
SG11202002497QA SG11202002497QA (en) 2017-09-20 2018-08-23 Surface treatment apparatus and surface treatment method
KR1020207010776A KR102401901B1 (ko) 2017-09-20 2018-08-23 표면 처리 장치 및 표면 처리 방법
EP18858558.2A EP3686320A4 (en) 2017-09-20 2018-08-23 SURFACE TREATMENT DEVICE AND SURFACE TREATMENT METHOD
CN201880059714.6A CN111094635A (zh) 2017-09-20 2018-08-23 表面处理装置及表面处理方法
US16/648,086 US11389818B2 (en) 2017-09-20 2018-08-23 Surface treatment apparatus and surface treatment method
TW107131845A TWI745617B (zh) 2017-09-20 2018-09-11 表面處理裝置及表面處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017180414A JP6995544B2 (ja) 2017-09-20 2017-09-20 表面処理装置および表面処理方法

Publications (3)

Publication Number Publication Date
JP2019056137A JP2019056137A (ja) 2019-04-11
JP2019056137A5 true JP2019056137A5 (https=) 2020-10-08
JP6995544B2 JP6995544B2 (ja) 2022-01-14

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ID=65811125

Family Applications (1)

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JP2017180414A Active JP6995544B2 (ja) 2017-09-20 2017-09-20 表面処理装置および表面処理方法

Country Status (8)

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US (1) US11389818B2 (https=)
EP (1) EP3686320A4 (https=)
JP (1) JP6995544B2 (https=)
KR (1) KR102401901B1 (https=)
CN (1) CN111094635A (https=)
SG (1) SG11202002497QA (https=)
TW (1) TWI745617B (https=)
WO (1) WO2019058860A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7691416B2 (ja) * 2019-09-12 2025-06-11 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー 平形のワークピースを湿式処理するための装置、装置のセル用のデバイスおよび装置を操作する方法
KR102904821B1 (ko) * 2020-03-23 2025-12-29 에이씨엠 리서치 (상하이), 인코포레이티드 도금 장치 및 도금 방법
CN111841967A (zh) * 2020-07-20 2020-10-30 昆山蕴鼎自动化科技有限公司 喷淋装置及电镀机
DE102023128618A1 (de) * 2023-10-18 2025-04-24 SAS Softec GmbH Abscheideanlage mit bewegten Düsen

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US1431022A (en) 1921-03-02 1922-10-03 Jr Thomas H Mumford Agitating apparatus for tanks
JPS592116Y2 (ja) * 1979-09-05 1984-01-20 松下電器産業株式会社 メッキ装置
JPS5642976A (en) 1979-09-17 1981-04-21 Toa Gosei Chem Ind Groundinggresistance reducing agent
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
JPS62274093A (ja) * 1986-05-21 1987-11-28 Hitachi Cable Ltd 帯状体へのメツキ方法
US5421987A (en) * 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US6685817B1 (en) 1995-05-26 2004-02-03 Formfactor, Inc. Method and apparatus for controlling plating over a face of a substrate
JPH11328749A (ja) * 1998-05-12 1999-11-30 Sony Disc Technology:Kk 原盤の電鋳装置と電鋳方法及びメタル原盤
JP3364485B2 (ja) 2001-03-07 2003-01-08 株式会社半導体先端テクノロジーズ めっき装置、及び半導体装置の製造方法
US20040084318A1 (en) * 2002-11-05 2004-05-06 Uri Cohen Methods and apparatus for activating openings and for jets plating
CN101812711B (zh) 2003-03-11 2011-11-16 株式会社荏原制作所 镀覆装置
JP2004359994A (ja) 2003-06-03 2004-12-24 Sumitomo Bakelite Co Ltd 電気めっき装置および電気めっき方法
JP4624738B2 (ja) 2003-08-21 2011-02-02 株式会社荏原製作所 めっき装置
JP2006117966A (ja) * 2004-10-19 2006-05-11 Ebara Corp めっき装置及びめっき方法
DE102007026633B4 (de) * 2007-06-06 2009-04-02 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
JP5731917B2 (ja) 2011-06-30 2015-06-10 上村工業株式会社 表面処理装置およびめっき槽
JP6217312B2 (ja) 2012-12-05 2017-10-25 アイシン精機株式会社 陽極酸化処理装置及び陽極酸化処理方法
KR101494175B1 (ko) * 2013-05-22 2015-02-17 (주)포인텍 도금조의 노즐 요동장치
EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
JP6458760B2 (ja) 2016-03-31 2019-01-30 株式会社豊田自動織機 圧縮機

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