JP2019050260A - ウェーハの加工方法 - Google Patents
ウェーハの加工方法 Download PDFInfo
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- JP2019050260A JP2019050260A JP2017173187A JP2017173187A JP2019050260A JP 2019050260 A JP2019050260 A JP 2019050260A JP 2017173187 A JP2017173187 A JP 2017173187A JP 2017173187 A JP2017173187 A JP 2017173187A JP 2019050260 A JP2019050260 A JP 2019050260A
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- 238000003672 processing method Methods 0.000 title abstract description 6
- 239000003566 sealing material Substances 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000003384 imaging method Methods 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 238000003331 infrared imaging Methods 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 12
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 abstract description 9
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000000565 sealant Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- H—ELECTRICITY
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- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】分割予定ラインによって区画された表面の各領域にデバイスが形成されたウェーハ11の加工方法であって、表面側から分割予定ラインに沿って第1の厚さを有する第1の切削ブレードによってデバイスチップの仕上がり厚さに相当する深さの溝を形成する工程と、表面を封止材20で封止する工程と、表面側から赤外線撮像手段18によって封止材を透過して表面側を撮像しアライメントマークを検出する工程と、表面側から分割予定ラインに沿って第1の切削ブレードの厚さより小さい厚さを有する第2の切削ブレードによって溝中の封止材に仕上がり厚さに相当する深さの溝を形成する工程と、裏面側から仕上がり厚さまで研削して溝を露出させ、封止材によって表面及び4側面が囲繞されたチップに分割する工程と、を有する。
【選択図】図4
Description
(1)半導体ウェーハ(以下、ウェーハと略称することがある)の表面にデバイス(回路)及びバンプと呼ばれる外部接続端子を形成する。
(2)ウェーハの表面側から分割予定ラインに沿ってウェーハを切削し、デバイスチップの仕上がり厚さに相当する深さの切削溝を形成する。
(3)ウェーハの表面をカーボンブラック入りの封止材で封止する。
(4)ウェーハの裏面側をデバイスチップの仕上がり厚さまで研削して切削溝中の封止材を露出させる。
(5)ウェーハの表面はカーボンブラック入りの封止材で封止されているため、ウェーハ表面の外周部分の封止材を除去してターゲットパターン等のアライメントマークを露出させ、このアライメントマークに基づいて切削すべき分割予定ラインを検出するアライメントを実施する。
(6)アライメントに基づいて、ウェーハの表面側から分割予定ラインに沿ってウェーハを切削して、表面及び全側面が封止材で封止された5Sモールドパッケージに分割する。
11 半導体ウェーハ
13 分割予定ライン
14,14A 切削ブレード
15 デバイス
16 アライメントユニット
17 電極バンプ
18 撮像ユニット
20 封止材
23 第1の切削溝
25 第2の切削溝
26 研削ユニット
27 デバイスチップ
34 研削ホイール
38 研削砥石
Claims (2)
- 交差して形成された複数の分割予定ラインによって区画された表面の各領域にそれぞれ複数のバンプを有するデバイスが形成されたウェーハの加工方法であって、
該ウェーハの表面側から該分割予定ラインに沿って第1の厚さを有する第1の切削ブレードによってデバイスチップの仕上がり厚さに相当する深さの第1の切削溝を形成する第1切削溝形成工程と、
該第1切削溝形成工程を実施した後、該第1の切削溝を含む該ウェーハの表面を封止材で封止する封止工程と、
該封止工程を実施した後、該ウェーハの表面側から赤外線撮像手段によって該封止材を透過してウェーハの表面側を撮像してアライメントマークを検出し、該アライメントマークに基づいて切削すべき該分割予定ラインを検出するアライメント工程と、
該アライメント工程を実施した後、該ウェーハの表面側から該分割予定ラインに沿って該第1の切削ブレードの該第1の厚さより小さい第2の厚さを有する第2の切削ブレードによって該第1の切削溝中の該封止材にデバイスチップの仕上がり厚さに相当する深さの第2の切削溝を形成する第2切削溝形成工程と、
該第2切削溝形成工程を実施した後、該ウェーハの表面に保護部材を貼着する保護部材貼着工程と、
該保護部材貼着工程を実施した後、該ウェーハの裏面側から該デバイスチップの仕上がり厚さまで該ウェーハを研削して該第2の切削溝を露出させ、該封止材によって表面及び4側面が囲繞された個々の該デバイスチップに分割する分割工程と、を備え、
該封止工程では、該赤外線撮像手段が受光する赤外線が透過するような透過性を有する封止材によって該ウェーハの表面が封止されることを特徴とするウェーハの加工方法。 - 該アライメント工程で用いる前記赤外線撮像手段はInGaAs撮像素子を含む請求項1記載のウェーハの加工方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017173187A JP6987443B2 (ja) | 2017-09-08 | 2017-09-08 | ウェーハの加工方法 |
KR1020180105975A KR102631711B1 (ko) | 2017-09-08 | 2018-09-05 | 웨이퍼의 가공 방법 |
CN201811035734.8A CN109473392B (zh) | 2017-09-08 | 2018-09-06 | 晶片的加工方法 |
SG10201807749RA SG10201807749RA (en) | 2017-09-08 | 2018-09-07 | Wafer processing method |
TW107131467A TWI772512B (zh) | 2017-09-08 | 2018-09-07 | 晶圓之加工方法 |
DE102018215248.9A DE102018215248A1 (de) | 2017-09-08 | 2018-09-07 | Bearbeitungsverfahren für einen Wafer |
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JP2017173187A JP6987443B2 (ja) | 2017-09-08 | 2017-09-08 | ウェーハの加工方法 |
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JP2019050260A true JP2019050260A (ja) | 2019-03-28 |
JP6987443B2 JP6987443B2 (ja) | 2022-01-05 |
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JP2017173187A Active JP6987443B2 (ja) | 2017-09-08 | 2017-09-08 | ウェーハの加工方法 |
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JP (1) | JP6987443B2 (ja) |
KR (1) | KR102631711B1 (ja) |
CN (1) | CN109473392B (ja) |
DE (1) | DE102018215248A1 (ja) |
SG (1) | SG10201807749RA (ja) |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020189135A1 (en) | 2019-03-18 | 2020-09-24 | Ricoh Company, Ltd. | Contacting member, drying device, and printing apparatus |
JP2020181876A (ja) * | 2019-04-24 | 2020-11-05 | 株式会社ディスコ | デバイスパッケージの製造方法 |
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CN111403315B (zh) * | 2020-03-03 | 2022-03-18 | 上海华力集成电路制造有限公司 | 晶圆切边装置和方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000260734A (ja) * | 1999-03-11 | 2000-09-22 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2000294519A (ja) * | 1999-04-09 | 2000-10-20 | Oki Electric Ind Co Ltd | 半導体装置、半導体装置の製造方法、およびその実装方法 |
JP2000323439A (ja) * | 1999-05-14 | 2000-11-24 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP2005150523A (ja) * | 2003-11-18 | 2005-06-09 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2009538538A (ja) * | 2006-05-25 | 2009-11-05 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 裏面ウェーハダイシング |
JP2015023078A (ja) * | 2013-07-17 | 2015-02-02 | 株式会社ディスコ | ウエーハの加工方法 |
JP2017005056A (ja) * | 2015-06-08 | 2017-01-05 | 株式会社ディスコ | ウエーハの加工方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080083980A1 (en) * | 2006-10-06 | 2008-04-10 | Advanced Chip Engineering Technology Inc. | Cmos image sensor chip scale package with die receiving through-hole and method of the same |
JP5948034B2 (ja) | 2011-09-27 | 2016-07-06 | 株式会社ディスコ | アライメント方法 |
JP2016015438A (ja) | 2014-07-03 | 2016-01-28 | 株式会社ディスコ | アライメント方法 |
JP2017028160A (ja) * | 2015-07-24 | 2017-02-02 | 株式会社ディスコ | ウエーハの加工方法 |
JP2017084932A (ja) * | 2015-10-27 | 2017-05-18 | 株式会社ディスコ | ウエーハの加工方法 |
JP2017092125A (ja) | 2015-11-05 | 2017-05-25 | 株式会社ディスコ | ウエーハの加工方法 |
JP2017108089A (ja) * | 2015-12-04 | 2017-06-15 | 株式会社東京精密 | レーザ加工装置及びレーザ加工方法 |
JP6608694B2 (ja) * | 2015-12-25 | 2019-11-20 | 株式会社ディスコ | ウエーハの加工方法 |
-
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000260734A (ja) * | 1999-03-11 | 2000-09-22 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2000294519A (ja) * | 1999-04-09 | 2000-10-20 | Oki Electric Ind Co Ltd | 半導体装置、半導体装置の製造方法、およびその実装方法 |
JP2000323439A (ja) * | 1999-05-14 | 2000-11-24 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP2005150523A (ja) * | 2003-11-18 | 2005-06-09 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2009538538A (ja) * | 2006-05-25 | 2009-11-05 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 裏面ウェーハダイシング |
JP2015023078A (ja) * | 2013-07-17 | 2015-02-02 | 株式会社ディスコ | ウエーハの加工方法 |
JP2017005056A (ja) * | 2015-06-08 | 2017-01-05 | 株式会社ディスコ | ウエーハの加工方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020189135A1 (en) | 2019-03-18 | 2020-09-24 | Ricoh Company, Ltd. | Contacting member, drying device, and printing apparatus |
JP2020181876A (ja) * | 2019-04-24 | 2020-11-05 | 株式会社ディスコ | デバイスパッケージの製造方法 |
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KR102631711B1 (ko) | 2024-01-30 |
SG10201807749RA (en) | 2019-04-29 |
TW201913782A (zh) | 2019-04-01 |
TWI772512B (zh) | 2022-08-01 |
CN109473392B (zh) | 2023-07-07 |
DE102018215248A1 (de) | 2019-03-14 |
CN109473392A (zh) | 2019-03-15 |
KR20190028321A (ko) | 2019-03-18 |
JP6987443B2 (ja) | 2022-01-05 |
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