JP2019046977A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2019046977A JP2019046977A JP2017168940A JP2017168940A JP2019046977A JP 2019046977 A JP2019046977 A JP 2019046977A JP 2017168940 A JP2017168940 A JP 2017168940A JP 2017168940 A JP2017168940 A JP 2017168940A JP 2019046977 A JP2019046977 A JP 2019046977A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 90
- 230000002093 peripheral effect Effects 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000010410 layer Substances 0.000 description 133
- 239000011229 interlayer Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 150000004767 nitrides Chemical class 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Electrodes Of Semiconductors (AREA)
Abstract
Description
12:半導体基板
14:素子領域
16:外周領域
20:ドレイン層
22:ドリフト層
23:ピラー層
24:高濃度ボディ層
26:低濃度ボディ層
28:ソース層
40:ドレイン電極
42:ソース電極
44:ゲート電極
46:ソースコンタクト電極
48:ボディコンタクト電極
50:外周電極
60:層間絶縁膜
62:層間絶縁膜
Claims (1)
- ワイドギャップ半導体基板を備える半導体装置であって、
前記ワイドギャップ半導体基板が、
半導体素子が形成されている素子領域と、
前記素子領域の周囲に配置されている外周領域、
を備えており、
前記外周領域内で前記ワイドギャップ半導体基板にショットキー接触する外周電極を備えている半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017168940A JP2019046977A (ja) | 2017-09-01 | 2017-09-01 | 半導体装置 |
JP2022073728A JP7371724B2 (ja) | 2017-09-01 | 2022-04-27 | 半導体装置とその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017168940A JP2019046977A (ja) | 2017-09-01 | 2017-09-01 | 半導体装置 |
Related Child Applications (1)
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JP2022073728A Division JP7371724B2 (ja) | 2017-09-01 | 2022-04-27 | 半導体装置とその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019046977A true JP2019046977A (ja) | 2019-03-22 |
Family
ID=65813010
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017168940A Pending JP2019046977A (ja) | 2017-09-01 | 2017-09-01 | 半導体装置 |
JP2022073728A Active JP7371724B2 (ja) | 2017-09-01 | 2022-04-27 | 半導体装置とその製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022073728A Active JP7371724B2 (ja) | 2017-09-01 | 2022-04-27 | 半導体装置とその製造方法 |
Country Status (1)
Country | Link |
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JP (2) | JP2019046977A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021125478A (ja) * | 2020-01-31 | 2021-08-30 | 株式会社デンソー | 窒化物半導体装置の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007013367A1 (ja) * | 2005-07-25 | 2007-02-01 | Matsushita Electric Industrial Co., Ltd. | 半導体素子及び電気機器 |
JP2010258329A (ja) * | 2009-04-28 | 2010-11-11 | Fuji Electric Systems Co Ltd | ワイドバンドギャップ半導体素子 |
JP2014017469A (ja) * | 2012-06-13 | 2014-01-30 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
JP2016006854A (ja) * | 2014-05-28 | 2016-01-14 | パナソニックIpマネジメント株式会社 | 半導体素子およびその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5396953B2 (ja) | 2009-03-19 | 2014-01-22 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
JP5310687B2 (ja) | 2010-09-30 | 2013-10-09 | 株式会社デンソー | 接合型電界効果トランジスタを備えた半導体装置およびその製造方法 |
JP2015185646A (ja) | 2014-03-24 | 2015-10-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2017
- 2017-09-01 JP JP2017168940A patent/JP2019046977A/ja active Pending
-
2022
- 2022-04-27 JP JP2022073728A patent/JP7371724B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007013367A1 (ja) * | 2005-07-25 | 2007-02-01 | Matsushita Electric Industrial Co., Ltd. | 半導体素子及び電気機器 |
JP2010258329A (ja) * | 2009-04-28 | 2010-11-11 | Fuji Electric Systems Co Ltd | ワイドバンドギャップ半導体素子 |
JP2014017469A (ja) * | 2012-06-13 | 2014-01-30 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
JP2016006854A (ja) * | 2014-05-28 | 2016-01-14 | パナソニックIpマネジメント株式会社 | 半導体素子およびその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021125478A (ja) * | 2020-01-31 | 2021-08-30 | 株式会社デンソー | 窒化物半導体装置の製造方法 |
JP7363539B2 (ja) | 2020-01-31 | 2023-10-18 | 株式会社デンソー | 窒化物半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
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JP2022100379A (ja) | 2022-07-05 |
JP7371724B2 (ja) | 2023-10-31 |
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