JP2019042918A - 脆性材料基板の分断装置及びその分断方法 - Google Patents

脆性材料基板の分断装置及びその分断方法 Download PDF

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Publication number
JP2019042918A
JP2019042918A JP2018140280A JP2018140280A JP2019042918A JP 2019042918 A JP2019042918 A JP 2019042918A JP 2018140280 A JP2018140280 A JP 2018140280A JP 2018140280 A JP2018140280 A JP 2018140280A JP 2019042918 A JP2019042918 A JP 2019042918A
Authority
JP
Japan
Prior art keywords
brittle material
material substrate
dividing
moving
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018140280A
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English (en)
Japanese (ja)
Inventor
榮男 金
Eidan Kin
榮男 金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of JP2019042918A publication Critical patent/JP2019042918A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2018140280A 2017-08-29 2018-07-26 脆性材料基板の分断装置及びその分断方法 Pending JP2019042918A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170109478A KR102064891B1 (ko) 2017-08-29 2017-08-29 취성 재료 기판의 분단 장치 및 그 분단 방법
KR10-2017-0109478 2017-08-29

Publications (1)

Publication Number Publication Date
JP2019042918A true JP2019042918A (ja) 2019-03-22

Family

ID=65514562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018140280A Pending JP2019042918A (ja) 2017-08-29 2018-07-26 脆性材料基板の分断装置及びその分断方法

Country Status (4)

Country Link
JP (1) JP2019042918A (ko)
KR (1) KR102064891B1 (ko)
CN (1) CN109421171A (ko)
TW (1) TW201921600A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109968283A (zh) * 2019-03-25 2019-07-05 林华勇 一种拉伸顶压型led灯丝灯的基板条拆分器及其拆分方法
WO2020184254A1 (ja) 2019-03-08 2020-09-17 日東電工株式会社 ギ酸の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW559620B (en) 2001-06-28 2003-11-01 Mitsuboshi Diamond Ind Co Ltd Device and method for breaking fragile material substrate
JP4037169B2 (ja) * 2002-05-28 2008-01-23 中村留精密工業株式会社 硬質脆性板の側辺加工方法
JP4664117B2 (ja) * 2005-03-03 2011-04-06 住友重機械工業株式会社 搬送物浮上ユニット、搬送物浮上装置、及びステージ装置
JP4907104B2 (ja) 2005-05-12 2012-03-28 株式会社シライテック ガラス基板の切断、分断方法及びその装置
JP4996703B2 (ja) 2010-02-09 2012-08-08 三星ダイヤモンド工業株式会社 基板分断装置
JP5550107B2 (ja) * 2010-03-15 2014-07-16 株式会社シライテック Ｌｃｄパネルｕｖ硬化前基板のエッジカット加工装置
CN102363564A (zh) * 2011-06-20 2012-02-29 安徽省银锐玻璃机械有限公司 一种半自动玻璃切割机的气浮式工作台面
CN102363559B (zh) * 2011-06-20 2013-03-27 安徽省银锐玻璃机械有限公司 一种气浮式分片台的顶杆限位装置
CN204689881U (zh) * 2015-05-29 2015-10-07 芜湖东旭光电装备技术有限公司 一种玻璃基板人工切割平台
CN105439437A (zh) * 2015-12-28 2016-03-30 江苏福坤玻璃有限公司 一种玻璃风孔传送台

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020184254A1 (ja) 2019-03-08 2020-09-17 日東電工株式会社 ギ酸の製造方法
CN109968283A (zh) * 2019-03-25 2019-07-05 林华勇 一种拉伸顶压型led灯丝灯的基板条拆分器及其拆分方法
CN109968283B (zh) * 2019-03-25 2024-04-02 林华勇 一种拉伸顶压型led灯丝灯的基板条拆分器及其拆分方法

Also Published As

Publication number Publication date
KR102064891B1 (ko) 2020-01-10
KR20190023556A (ko) 2019-03-08
TW201921600A (zh) 2019-06-01
CN109421171A (zh) 2019-03-05

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