JP2019034444A - 樹脂成形品の搬送機構、樹脂成形装置及び樹脂成形品の製造方法 - Google Patents

樹脂成形品の搬送機構、樹脂成形装置及び樹脂成形品の製造方法 Download PDF

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Publication number
JP2019034444A
JP2019034444A JP2017155866A JP2017155866A JP2019034444A JP 2019034444 A JP2019034444 A JP 2019034444A JP 2017155866 A JP2017155866 A JP 2017155866A JP 2017155866 A JP2017155866 A JP 2017155866A JP 2019034444 A JP2019034444 A JP 2019034444A
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JP
Japan
Prior art keywords
resin
molded product
mold
resin molded
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017155866A
Other languages
English (en)
Japanese (ja)
Inventor
智則 姫野
Tomonori Himeno
智則 姫野
晃一 荒木
Koichi Araki
晃一 荒木
田村　孝司
Koji Tamura
孝司 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2017155866A priority Critical patent/JP2019034444A/ja
Priority to TW107122798A priority patent/TW201910088A/zh
Priority to CN201810899866.9A priority patent/CN109382965A/zh
Priority to KR1020180093172A priority patent/KR20190017684A/ko
Publication of JP2019034444A publication Critical patent/JP2019034444A/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1769—Handling of moulded articles or runners, e.g. sorting, stacking, grinding of runners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2017155866A 2017-08-10 2017-08-10 樹脂成形品の搬送機構、樹脂成形装置及び樹脂成形品の製造方法 Pending JP2019034444A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017155866A JP2019034444A (ja) 2017-08-10 2017-08-10 樹脂成形品の搬送機構、樹脂成形装置及び樹脂成形品の製造方法
TW107122798A TW201910088A (zh) 2017-08-10 2018-07-02 樹脂成型品的搬運機構、樹脂成型裝置以及樹脂成型品的製造方法
CN201810899866.9A CN109382965A (zh) 2017-08-10 2018-08-08 树脂成型品的搬运机构、树脂成型装置以及树脂成型品的制造方法
KR1020180093172A KR20190017684A (ko) 2017-08-10 2018-08-09 수지 성형품의 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017155866A JP2019034444A (ja) 2017-08-10 2017-08-10 樹脂成形品の搬送機構、樹脂成形装置及び樹脂成形品の製造方法

Publications (1)

Publication Number Publication Date
JP2019034444A true JP2019034444A (ja) 2019-03-07

Family

ID=65418188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017155866A Pending JP2019034444A (ja) 2017-08-10 2017-08-10 樹脂成形品の搬送機構、樹脂成形装置及び樹脂成形品の製造方法

Country Status (4)

Country Link
JP (1) JP2019034444A (zh)
KR (1) KR20190017684A (zh)
CN (1) CN109382965A (zh)
TW (1) TW201910088A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021011076A (ja) * 2019-07-08 2021-02-04 ソマール株式会社 成形品取出し装置、成形品取出し方法、この成形品取出し装置を用いた成形品の製造方法、および付属部除去装置
CN114103017A (zh) * 2020-08-28 2022-03-01 东和株式会社 树脂成形装置及树脂成形品的制造方法
JP2022039710A (ja) * 2020-08-28 2022-03-10 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7377189B2 (ja) * 2020-12-14 2023-11-09 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、及び、樹脂成形品の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3200151B2 (ja) 1992-04-13 2001-08-20 アピックヤマダ株式会社 トランスファモールド方法およびトランスファモールド装置
CA2098409A1 (en) * 1992-06-22 1993-12-23 Chun P. Lau Automatic molding system
JP6144085B2 (ja) * 2013-03-27 2017-06-07 Ｔｏｗａ株式会社 成形品生産装置、及び成形品生産方法
JP6084502B2 (ja) * 2013-03-28 2017-02-22 日本バルカー工業株式会社 金型成形品の取り出し装置および金型成形品の製造装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021011076A (ja) * 2019-07-08 2021-02-04 ソマール株式会社 成形品取出し装置、成形品取出し方法、この成形品取出し装置を用いた成形品の製造方法、および付属部除去装置
JP7345298B2 (ja) 2019-07-08 2023-09-15 ソマール株式会社 成形品取出し装置、成形品取出し方法、この成形品取出し装置を用いた成形品の製造方法、および付属部除去装置
CN114103017A (zh) * 2020-08-28 2022-03-01 东和株式会社 树脂成形装置及树脂成形品的制造方法
JP2022039709A (ja) * 2020-08-28 2022-03-10 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP2022039710A (ja) * 2020-08-28 2022-03-10 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7341105B2 (ja) 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7341106B2 (ja) 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Also Published As

Publication number Publication date
CN109382965A (zh) 2019-02-26
KR20190017684A (ko) 2019-02-20
TW201910088A (zh) 2019-03-16

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