KR20190017684A - 수지 성형품의 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법 - Google Patents

수지 성형품의 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법 Download PDF

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Publication number
KR20190017684A
KR20190017684A KR1020180093172A KR20180093172A KR20190017684A KR 20190017684 A KR20190017684 A KR 20190017684A KR 1020180093172 A KR1020180093172 A KR 1020180093172A KR 20180093172 A KR20180093172 A KR 20180093172A KR 20190017684 A KR20190017684 A KR 20190017684A
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KR
South Korea
Prior art keywords
resin
die
molding
resin molded
molded article
Prior art date
Application number
KR1020180093172A
Other languages
English (en)
Korean (ko)
Inventor
토모노리 히메노
코이치 아라키
타카시 타무라
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20190017684A publication Critical patent/KR20190017684A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1769—Handling of moulded articles or runners, e.g. sorting, stacking, grinding of runners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020180093172A 2017-08-10 2018-08-09 수지 성형품의 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법 KR20190017684A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017155866A JP2019034444A (ja) 2017-08-10 2017-08-10 樹脂成形品の搬送機構、樹脂成形装置及び樹脂成形品の製造方法
JPJP-P-2017-155866 2017-08-10

Publications (1)

Publication Number Publication Date
KR20190017684A true KR20190017684A (ko) 2019-02-20

Family

ID=65418188

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180093172A KR20190017684A (ko) 2017-08-10 2018-08-09 수지 성형품의 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법

Country Status (4)

Country Link
JP (1) JP2019034444A (zh)
KR (1) KR20190017684A (zh)
CN (1) CN109382965A (zh)
TW (1) TW201910088A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7345298B2 (ja) * 2019-07-08 2023-09-15 ソマール株式会社 成形品取出し装置、成形品取出し方法、この成形品取出し装置を用いた成形品の製造方法、および付属部除去装置
JP7341105B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7341106B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7377189B2 (ja) * 2020-12-14 2023-11-09 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、及び、樹脂成形品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05285977A (ja) 1992-04-13 1993-11-02 Apic Yamada Kk トランスファモールド方法およびトランスファモールド装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2098409A1 (en) * 1992-06-22 1993-12-23 Chun P. Lau Automatic molding system
JP6144085B2 (ja) * 2013-03-27 2017-06-07 Ｔｏｗａ株式会社 成形品生産装置、及び成形品生産方法
JP6084502B2 (ja) * 2013-03-28 2017-02-22 日本バルカー工業株式会社 金型成形品の取り出し装置および金型成形品の製造装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05285977A (ja) 1992-04-13 1993-11-02 Apic Yamada Kk トランスファモールド方法およびトランスファモールド装置

Also Published As

Publication number Publication date
JP2019034444A (ja) 2019-03-07
CN109382965A (zh) 2019-02-26
TW201910088A (zh) 2019-03-16

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