JP2019006124A - 電子デバイス - Google Patents
電子デバイス Download PDFInfo
- Publication number
- JP2019006124A JP2019006124A JP2018172190A JP2018172190A JP2019006124A JP 2019006124 A JP2019006124 A JP 2019006124A JP 2018172190 A JP2018172190 A JP 2018172190A JP 2018172190 A JP2018172190 A JP 2018172190A JP 2019006124 A JP2019006124 A JP 2019006124A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pressure chamber
- bump electrode
- adhesive
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 135
- 239000000853 adhesive Substances 0.000 claims abstract description 78
- 230000001070 adhesive effect Effects 0.000 claims abstract description 77
- 238000005452 bending Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 55
- 239000010410 layer Substances 0.000 description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 36
- 229910052710 silicon Inorganic materials 0.000 description 36
- 239000010703 silicon Substances 0.000 description 36
- 239000007788 liquid Substances 0.000 description 35
- 239000013078 crystal Substances 0.000 description 32
- 238000004891 communication Methods 0.000 description 31
- 238000000034 method Methods 0.000 description 20
- 239000010408 film Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 206010034972 Photosensitivity reaction Diseases 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 230000036211 photosensitivity Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000018 DNA microarray Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14274—Structure of print heads with piezoelectric elements of stacked structure type, deformed by compression/extension and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14419—Manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
前記間隔を保持した状態で前記第1の基板と前記第2の基板とを接合する感光性接着剤と、を備え、
前記感光性接着剤は、少なくとも前記バンプ電極と前記駆動領域との間の領域に設けられたことを特徴とする。
前記感光性接着剤は、前記第1の方向に沿って列状に設けられたことが望ましい。
前記感光性接着剤は、前記第1の方向に直交する第2の方向における前記バンプ電極の両側に設けられたことが望ましい。
Claims (5)
- 撓み変形が許容される駆動領域に当該駆動領域を変形させる駆動素子が設けられた第1の基板と、
弾性を有するバンプ電極を介在させた状態で前記第1の基板に対して間隔を開けて配置された第2の基板と、
前記間隔を保持した状態で前記第1の基板と前記第2の基板とを接合する感光性接着剤と、を備え、
前記感光性接着剤は、少なくとも前記バンプ電極と前記駆動領域との間の領域に設けられたことを特徴とする電子デバイス。 - 前記感光性接着剤は、前記バンプ電極の両側に設けられたことを特徴とする請求項1に記載の電子デバイス。
- 前記感光性接着剤と前記バンプ電極とは、離間して設けられたことを特徴とする請求項1又は請求項2に記載の電子デバイス。
- 前記バンプ電極を第1の方向に沿って複数備え、
前記感光性接着剤は、前記第1の方向に沿って列状に設けられたことを特徴とする請求項1から請求項3の何れか一項に記載の電子デバイス。 - 前記駆動素子を前記第1の方向に沿って複数備え、
前記感光性接着剤は、前記第1の方向に直交する第2の方向における前記バンプ電極の両側に設けられたことを特徴とする請求項4に記載の電子デバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015037782 | 2015-02-27 | ||
JP2015037782 | 2015-02-27 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017562154A Division JP6403033B2 (ja) | 2015-02-27 | 2016-01-26 | 電子デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019006124A true JP2019006124A (ja) | 2019-01-17 |
JP2019006124A5 JP2019006124A5 (ja) | 2019-02-28 |
Family
ID=55443279
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017562154A Active JP6403033B2 (ja) | 2015-02-27 | 2016-01-26 | 電子デバイス |
JP2018172190A Pending JP2019006124A (ja) | 2015-02-27 | 2018-09-14 | 電子デバイス |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017562154A Active JP6403033B2 (ja) | 2015-02-27 | 2016-01-26 | 電子デバイス |
Country Status (7)
Country | Link |
---|---|
US (1) | US20180250935A1 (ja) |
EP (1) | EP3261845B1 (ja) |
JP (2) | JP6403033B2 (ja) |
KR (1) | KR20170125367A (ja) |
CN (1) | CN107257735B (ja) |
TW (1) | TWI665099B (ja) |
WO (1) | WO2016136139A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6926647B2 (ja) * | 2017-05-09 | 2021-08-25 | セイコーエプソン株式会社 | 実装構造体、超音波デバイス、超音波探触子、超音波装置、及び電子機器 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005305847A (ja) * | 2004-04-22 | 2005-11-04 | Brother Ind Ltd | 記録ヘッドの製造方法及び記録ヘッド |
JP2010069750A (ja) * | 2008-09-19 | 2010-04-02 | Seiko Epson Corp | インクジェット式記録ヘッド及びその製造方法、インクジェット式記録装置 |
JP2010129873A (ja) * | 2008-11-28 | 2010-06-10 | Brother Ind Ltd | 配線部材の接続方法、配線部材の製造方法、及び、配線部材 |
KR20120124034A (ko) * | 2011-04-29 | 2012-11-12 | 제록스 코포레이션 | 연성 회로 및 유전성 언더필을 이용한 인쇄장치용 고밀도 전기 인터커넥트 |
JP2013030789A (ja) * | 2012-09-10 | 2013-02-07 | Seiko Epson Corp | 実装構造体及び実装構造体の製造方法 |
JP2013144360A (ja) * | 2010-04-20 | 2013-07-25 | Konica Minolta Inc | インクジェット式記録ヘッド |
JP2014004724A (ja) * | 2012-06-22 | 2014-01-16 | Canon Inc | 液体吐出ヘッド |
JP2014024325A (ja) * | 2012-06-22 | 2014-02-06 | Canon Inc | 液体吐出装置の製造方法 |
JP2015000484A (ja) * | 2013-06-13 | 2015-01-05 | キヤノン株式会社 | 液体吐出ヘッド |
JP2015024533A (ja) * | 2013-07-25 | 2015-02-05 | キヤノン株式会社 | 液体吐出ヘッドとその駆動方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4182921B2 (ja) * | 2004-06-08 | 2008-11-19 | セイコーエプソン株式会社 | ノズルプレートの製造方法 |
JP4337723B2 (ja) * | 2004-12-08 | 2009-09-30 | セイコーエプソン株式会社 | 液滴吐出ヘッドの製造方法及び液滴吐出ヘッド並びに液滴吐出装置 |
JP4349273B2 (ja) * | 2004-12-17 | 2009-10-21 | セイコーエプソン株式会社 | 成膜方法、液体供給ヘッドおよび液体供給装置 |
JP5282367B2 (ja) * | 2007-03-19 | 2013-09-04 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置 |
JP5003320B2 (ja) * | 2007-07-06 | 2012-08-15 | パナソニック株式会社 | 導電性バンプとその製造方法およびそれらを用いた電子部品実装構造体とその製造方法 |
TWI342267B (en) * | 2007-07-13 | 2011-05-21 | Microjet Technology Co Ltd | Micro-droplet spray structure |
JP2009099765A (ja) * | 2007-10-17 | 2009-05-07 | Seiko Epson Corp | 電子部品の実装構造 |
JP2009252882A (ja) * | 2008-04-03 | 2009-10-29 | Seiko Epson Corp | 電子装置及びその製造方法 |
JP4911189B2 (ja) * | 2009-03-30 | 2012-04-04 | ブラザー工業株式会社 | 液体吐出装置およびその製造方法 |
JP2013095088A (ja) * | 2011-11-02 | 2013-05-20 | Konica Minolta Holdings Inc | インクジェットヘッドおよびその製造方法と、インクジェット描画装置 |
JP6044200B2 (ja) | 2012-09-06 | 2016-12-14 | ブラザー工業株式会社 | 液体噴射装置 |
JP5983252B2 (ja) * | 2012-09-28 | 2016-08-31 | ブラザー工業株式会社 | 液体吐出装置、基板の接続構造、及び、液体吐出装置の製造方法 |
CN107000432B (zh) * | 2014-12-09 | 2018-12-18 | 精工爱普生株式会社 | 压电装置、液体喷射头、压电装置的制造方法以及液体喷射头的制造方法 |
-
2016
- 2016-01-26 KR KR1020177027364A patent/KR20170125367A/ko not_active Application Discontinuation
- 2016-01-26 WO PCT/JP2016/000382 patent/WO2016136139A1/en active Application Filing
- 2016-01-26 EP EP16706914.5A patent/EP3261845B1/en active Active
- 2016-01-26 JP JP2017562154A patent/JP6403033B2/ja active Active
- 2016-01-26 CN CN201680010204.0A patent/CN107257735B/zh active Active
- 2016-01-26 US US15/551,801 patent/US20180250935A1/en not_active Abandoned
- 2016-02-24 TW TW105105543A patent/TWI665099B/zh active
-
2018
- 2018-09-14 JP JP2018172190A patent/JP2019006124A/ja active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005305847A (ja) * | 2004-04-22 | 2005-11-04 | Brother Ind Ltd | 記録ヘッドの製造方法及び記録ヘッド |
JP2010069750A (ja) * | 2008-09-19 | 2010-04-02 | Seiko Epson Corp | インクジェット式記録ヘッド及びその製造方法、インクジェット式記録装置 |
JP2010129873A (ja) * | 2008-11-28 | 2010-06-10 | Brother Ind Ltd | 配線部材の接続方法、配線部材の製造方法、及び、配線部材 |
JP2013144360A (ja) * | 2010-04-20 | 2013-07-25 | Konica Minolta Inc | インクジェット式記録ヘッド |
KR20120124034A (ko) * | 2011-04-29 | 2012-11-12 | 제록스 코포레이션 | 연성 회로 및 유전성 언더필을 이용한 인쇄장치용 고밀도 전기 인터커넥트 |
JP2014004724A (ja) * | 2012-06-22 | 2014-01-16 | Canon Inc | 液体吐出ヘッド |
JP2014024325A (ja) * | 2012-06-22 | 2014-02-06 | Canon Inc | 液体吐出装置の製造方法 |
JP2013030789A (ja) * | 2012-09-10 | 2013-02-07 | Seiko Epson Corp | 実装構造体及び実装構造体の製造方法 |
JP2015000484A (ja) * | 2013-06-13 | 2015-01-05 | キヤノン株式会社 | 液体吐出ヘッド |
JP2015024533A (ja) * | 2013-07-25 | 2015-02-05 | キヤノン株式会社 | 液体吐出ヘッドとその駆動方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6403033B2 (ja) | 2018-10-10 |
TW201643047A (zh) | 2016-12-16 |
CN107257735A (zh) | 2017-10-17 |
US20180250935A1 (en) | 2018-09-06 |
EP3261845A1 (en) | 2018-01-03 |
JP2018505804A (ja) | 2018-03-01 |
CN107257735B (zh) | 2019-08-13 |
WO2016136139A1 (en) | 2016-09-01 |
EP3261845B1 (en) | 2020-10-07 |
KR20170125367A (ko) | 2017-11-14 |
TWI665099B (zh) | 2019-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6443146B2 (ja) | 電子デバイス | |
US9751306B2 (en) | Piezoelectric device, liquid ejecting head and method for manufacturing piezoelectric device | |
US10081161B2 (en) | Electronic device and manufacturing method of electronic device | |
JP6372618B2 (ja) | 圧電デバイス、液体噴射ヘッド、圧電デバイスの製造方法、及び、液体噴射ヘッドの製造方法 | |
TWI610821B (zh) | 墨水噴頭、及噴墨印表機 | |
JP2017045746A (ja) | 接合構造体の製造方法、圧電デバイスの製造方法、及び、液体噴射ヘッドの製造方法 | |
JP6403033B2 (ja) | 電子デバイス | |
US9682549B2 (en) | Electronic device, liquid ejecting head, and method of manufacturing electronic device | |
JP6569358B2 (ja) | 電子デバイス、液体噴射ヘッド、および、電子デバイスの製造方法 | |
JP6729188B2 (ja) | 接合構造体、圧電デバイス、液体噴射ヘッド、液体噴射装置、及び、接合構造体の製造方法 | |
JP6358068B2 (ja) | 圧電デバイス、液体噴射ヘッド、圧電デバイスの製造方法、及び、液体噴射ヘッドの製造方法 | |
KR102017975B1 (ko) | 잉크젯 헤드 및 잉크젯 프린터 | |
JP2016157773A (ja) | 電子デバイス、及び、電子デバイスの製造方法 | |
CN107856415B (zh) | Mems器件、液体喷射头以及液体喷射装置 | |
JP2016172344A (ja) | 電子デバイス、および、電子デバイスの製造方法 | |
JP6520233B2 (ja) | 電子デバイスの製造方法、および、電子デバイス | |
JP2016185602A (ja) | インクジェットヘッドの製造方法 | |
JP2016185601A (ja) | インクジェットヘッド、及び、インクジェットプリンター |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20181107 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190111 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190111 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191126 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200122 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200616 |
|
RD07 | Notification of extinguishment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7427 Effective date: 20200803 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200807 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200825 |