JP2016172344A - 電子デバイス、および、電子デバイスの製造方法 - Google Patents
電子デバイス、および、電子デバイスの製造方法 Download PDFInfo
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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Abstract
Description
本発明の電子デバイスは、上記目的を達成するために提案されたものであり、第1の基板と第2の基板とが、接合樹脂を間に介在させることで互いに間隔を空けた状態で接合された電子デバイスであって、
前記接合樹脂は、感光性樹脂と、当該感光性樹脂とは異なる接合補強樹脂とが積層されて構成され、
前記感光性樹脂は、前記第1の基板と前記第2の基板のうち少なくとも一方の基板にパターニングされ、
パターニングされた前記感光性樹脂に積層される前記接合補強樹脂は、濡れ広がり又は前記感光性樹脂よりも外側に膨らむ部分を有することを特徴とする。
また、手段1の構成において、前記接合補強樹脂は、感光性を有さず、前記感光性樹脂よりも低粘度の接着剤である構成を採用することが望ましい。
また、上記手段1または手段2の構成に関し、前記他方の基板における前記接合樹脂との接合領域には、前記感光性樹脂または前記接合補強樹脂と同種の樹脂が形成された構成を採用することもできる。
そして、本発明の電子デバイスの製造方法は、第1の基板と第2の基板とが、感光性樹脂および接合補強樹脂の積層からなる接合樹脂を間に介在させることで互いに間隔を空けた状態で接合された電子デバイスの製造方法であって、
前記第1の基板と前記第2の基板のうち、少なくとも一方の基板に、前記感光性樹脂を塗布する工程と、
前記塗布された感光性樹脂を、露光、加熱による仮硬化、および現像を経てパターニングする工程と、
前記パターニングされた感光性樹脂に重ねて、前記接合補強樹脂を塗布する工程と、
前記第1の基板と前記第2の基板との間に前記接合樹脂を挟んだ状態で、前記第1の基板と前記第2の基板とを接合する工程と、
を含むことを特徴とする。
また、手段4の方法において、前記接合補強樹脂を塗布する工程において、前記接合補強樹脂は転写法により塗布される方法を採用することが望ましい。
また、接合補強樹脂44の塗布方法としては、例示した転写法に限られず、例えばディスペンサーを使用して塗布する構成を採用することもできる。
Claims (5)
- 第1の基板と第2の基板とが、接合樹脂を間に介在させることで互いに間隔を空けた状態で接合された電子デバイスであって、
前記接合樹脂は、感光性樹脂と、当該感光性樹脂とは異なる接合補強樹脂とが積層されて構成され、
前記感光性樹脂は、前記第1の基板と前記第2の基板のうち少なくとも一方の基板にパターニングされ、
パターニングされた前記感光性樹脂に積層される前記接合補強樹脂は、濡れ広がり又は前記感光性樹脂よりも外側に膨らむ部分を有することを特徴とする電子デバイス。 - 前記接合補強樹脂は、感光性を有さず、前記感光性樹脂よりも低粘度の接着剤であることを特徴とする請求項1に記載の電子デバイス。
- 前記他方の基板における前記接合樹脂との接合領域には、前記感光性樹脂または前記接合補強樹脂と同種の樹脂が形成されたことを特徴とする請求項1または請求項2に記載の電子デバイス。
- 第1の基板と第2の基板とが、感光性樹脂および接合補強樹脂の積層からなる接合樹脂を間に介在させることで互いに間隔を空けた状態で接合された電子デバイスの製造方法であって、
前記第1の基板と前記第2の基板のうち、少なくとも一方の基板に、前記感光性樹脂を塗布する工程と、
前記塗布された感光性樹脂を、露光、加熱による仮硬化、および現像を経てパターニングする工程と、
前記パターニングされた感光性樹脂に重ねて、前記接合補強樹脂を塗布する工程と、
前記第1の基板と前記第2の基板との間に前記接合樹脂を挟んだ状態で、前記第1の基板と前記第2の基板とを接合する工程と、
を含むことを特徴とする電子デバイスの製造方法。 - 前記接合補強樹脂を塗布する工程において、前記接合補強樹脂は転写法により塗布されることを特徴とする請求項4に記載の電子デバイスの製造方法。
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JP2015052889A JP2016172344A (ja) | 2015-03-17 | 2015-03-17 | 電子デバイス、および、電子デバイスの製造方法 |
EP16157286.2A EP3069880A3 (en) | 2015-03-17 | 2016-02-25 | Electronic device, and method for manufacturing electronic device |
US15/060,211 US9789688B2 (en) | 2015-03-17 | 2016-03-03 | Electronic device, and method for manufacturing electronic device |
CN201610144733.1A CN105984224B (zh) | 2015-03-17 | 2016-03-14 | 电子装置以及电子装置的制造方法 |
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- 2016-03-14 CN CN201610144733.1A patent/CN105984224B/zh active Active
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Also Published As
Publication number | Publication date |
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CN105984224A (zh) | 2016-10-05 |
CN105984224B (zh) | 2018-02-27 |
EP3069880A3 (en) | 2016-11-09 |
US9789688B2 (en) | 2017-10-17 |
US20160271951A1 (en) | 2016-09-22 |
EP3069880A2 (en) | 2016-09-21 |
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