JP2018527463A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018527463A5 JP2018527463A5 JP2018507595A JP2018507595A JP2018527463A5 JP 2018527463 A5 JP2018527463 A5 JP 2018527463A5 JP 2018507595 A JP2018507595 A JP 2018507595A JP 2018507595 A JP2018507595 A JP 2018507595A JP 2018527463 A5 JP2018527463 A5 JP 2018527463A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- etch resist
- metal
- ink
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 230000004913 activation Effects 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 8
- 239000012190 activator Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 2
- 125000000129 anionic group Chemical group 0.000 claims description 2
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 claims description 2
- 238000007641 inkjet printing Methods 0.000 claims description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 2
- 235000021317 phosphate Nutrition 0.000 claims description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims description 2
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 2
- 229960002218 sodium chlorite Drugs 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 229940055042 chromic sulfate Drugs 0.000 claims 1
- 229910000356 chromium(III) sulfate Inorganic materials 0.000 claims 1
- 235000015217 chromium(III) sulphate Nutrition 0.000 claims 1
- 239000011696 chromium(III) sulphate Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- -1 ferric Substances 0.000 claims 1
- 230000002496 gastric effect Effects 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 claims 1
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021121139A JP7288644B2 (ja) | 2015-08-13 | 2021-07-23 | 金属表面上のエッチレジストパターンの製造方法 |
| JP2023083553A JP7602278B2 (ja) | 2015-08-13 | 2023-05-21 | 金属表面上のエッチレジストパターンの製造方法 |
| JP2024207824A JP2025041637A (ja) | 2015-08-13 | 2024-11-29 | 金属表面上のエッチレジストパターンの製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562204508P | 2015-08-13 | 2015-08-13 | |
| US62/204,508 | 2015-08-13 | ||
| PCT/IL2016/050820 WO2017025949A1 (en) | 2015-08-13 | 2016-07-27 | Methods for producing an etch resist pattern on a metallic surface |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021121139A Division JP7288644B2 (ja) | 2015-08-13 | 2021-07-23 | 金属表面上のエッチレジストパターンの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018527463A JP2018527463A (ja) | 2018-09-20 |
| JP2018527463A5 true JP2018527463A5 (enExample) | 2019-08-29 |
| JP6975463B2 JP6975463B2 (ja) | 2021-12-01 |
Family
ID=57983031
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018507595A Active JP6975463B2 (ja) | 2015-08-13 | 2016-07-27 | 金属表面上のエッチレジストパターンの製造方法 |
| JP2021121139A Active JP7288644B2 (ja) | 2015-08-13 | 2021-07-23 | 金属表面上のエッチレジストパターンの製造方法 |
| JP2023083553A Active JP7602278B2 (ja) | 2015-08-13 | 2023-05-21 | 金属表面上のエッチレジストパターンの製造方法 |
| JP2024207824A Pending JP2025041637A (ja) | 2015-08-13 | 2024-11-29 | 金属表面上のエッチレジストパターンの製造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021121139A Active JP7288644B2 (ja) | 2015-08-13 | 2021-07-23 | 金属表面上のエッチレジストパターンの製造方法 |
| JP2023083553A Active JP7602278B2 (ja) | 2015-08-13 | 2023-05-21 | 金属表面上のエッチレジストパターンの製造方法 |
| JP2024207824A Pending JP2025041637A (ja) | 2015-08-13 | 2024-11-29 | 金属表面上のエッチレジストパターンの製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (5) | US10806035B2 (enExample) |
| EP (2) | EP3866572B1 (enExample) |
| JP (4) | JP6975463B2 (enExample) |
| KR (4) | KR102626521B1 (enExample) |
| CN (2) | CN114397795A (enExample) |
| WO (1) | WO2017025949A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3304197A4 (en) | 2015-06-04 | 2019-01-23 | Kateeva, Inc. | METHOD FOR PRODUCING AN ESTETRESIST PATTERN ON A METALLIC SURFACE |
| KR102626521B1 (ko) * | 2015-08-13 | 2024-01-17 | 카티바, 인크. | 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법 |
| US10398034B2 (en) * | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
| US20200325583A1 (en) * | 2017-10-23 | 2020-10-15 | Mec Company., Ltd. | Method for Producing Film Formation Substrate, Film Formation Substrate, and Surface Treatment Agent |
| GB2583778B (en) * | 2019-03-29 | 2023-05-24 | Pierce Protocols Ltd | Glass etching preparation method and system |
| WO2020250784A1 (ja) * | 2019-06-11 | 2020-12-17 | 三菱瓦斯化学株式会社 | 水性組成物、これを用いたステンレス鋼表面の粗化処理方法、ならびに粗化処理されたステンレス鋼およびその製造方法 |
| CN110468413A (zh) * | 2019-09-10 | 2019-11-19 | 四会富仕电子科技股份有限公司 | 一种金属基表面粗化的方法 |
| CA3191956C (en) * | 2022-03-07 | 2025-11-18 | Catmarks Mfg Llc | Automotive part identification marking system |
| US12371797B2 (en) * | 2023-03-24 | 2025-07-29 | Adrienne Reisinger | Etching a design on a metal surface covered with a pigmented layer |
Family Cites Families (75)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1085860A (en) * | 1965-02-18 | 1967-10-04 | Fuji Photo Film Co Ltd | Method for the formation of metallic images on non-metallic material |
| US4015706A (en) | 1971-11-15 | 1977-04-05 | Chemcut Corporation | Connecting modules for an etching system |
| US4127438A (en) * | 1977-11-07 | 1978-11-28 | International Business Machines Corporation | Adhesion promoter for additively plated printed circuit boards |
| DE3402883A1 (de) | 1984-01-27 | 1985-08-01 | Siemens AG, 1000 Berlin und 8000 München | Leiterplatten aus schichtpressstoffen |
| DE3683194D1 (de) | 1985-06-07 | 1992-02-13 | Sekisui Chemical Co Ltd | Photovernetzbare zusammensetzung. |
| US4946711A (en) | 1987-10-14 | 1990-08-07 | Desoto, Inc. | Masking compositions and method for applying the same |
| JP2585070B2 (ja) | 1988-08-02 | 1997-02-26 | 日本ペイント株式会社 | 画像形成方法 |
| WO1992011322A2 (en) | 1990-12-20 | 1992-07-09 | Exxon Chemical Patents Inc. | Uv/eb curable butyl copolymers for lithographic and corrosion-resistant coating applications |
| JP3799069B2 (ja) * | 1993-12-14 | 2006-07-19 | キヤノン株式会社 | エッチングレジスト性組成物、これを用いたパターン形成方法及び配線基板の製造方法 |
| GB9425031D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
| DE69635203T2 (de) | 1995-07-11 | 2006-06-29 | Delphi Technologies, Inc., Troy | Beschichtungen und Verfahren, insbesondere für Leiterplatten |
| EP0860742B1 (en) | 1997-02-25 | 2001-04-04 | E.I. Du Pont De Nemours And Company | Flexible, flame-retardant, photoimageable composition for coating printing circuits |
| US6222136B1 (en) | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
| IL129307A0 (en) | 1999-04-04 | 2000-02-17 | Scitex Corp Ltd | Process for direct digital printing of circuit boards |
| GB9916060D0 (en) * | 1999-07-08 | 1999-09-08 | Isis Innovation | Printed circuit fabrication |
| JP3622910B2 (ja) | 1999-07-30 | 2005-02-23 | セイコーエプソン株式会社 | 記録媒体に二液を用いて印刷する記録方法 |
| WO2001013179A1 (en) | 1999-08-13 | 2001-02-22 | Board Of Regents, University Of Texas System | Water-processable photoresist compositions |
| TWI284780B (en) | 2000-03-29 | 2007-08-01 | Univ Kanagawa | Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same |
| DE10066028C2 (de) | 2000-07-07 | 2003-04-24 | Atotech Deutschland Gmbh | Kupfersubstrat mit aufgerauhten Oberflächen |
| JP3754303B2 (ja) | 2001-02-16 | 2006-03-08 | 株式会社日立インフォメーションテクノロジー | Ｓｄｒａｍリフレッシュ回路 |
| JP2003012971A (ja) | 2001-06-28 | 2003-01-15 | Konica Corp | インクジェット記録方法 |
| US7150816B2 (en) | 2001-08-31 | 2006-12-19 | Semitool, Inc. | Apparatus and method for deposition of an electrophoretic emulsion |
| US6709962B2 (en) * | 2002-03-19 | 2004-03-23 | N. Edward Berg | Process for manufacturing printed circuit boards |
| US20030177639A1 (en) * | 2002-03-19 | 2003-09-25 | Berg N. Edward | Process and apparatus for manufacturing printed circuit boards |
| SG107593A1 (en) * | 2002-06-04 | 2004-12-29 | Agency Science Tech & Res | Method for electroless metalisation of polymer substrate |
| GB0221891D0 (en) | 2002-09-20 | 2002-10-30 | Avecia Ltd | Process |
| TWI291726B (en) | 2002-10-25 | 2007-12-21 | Nanya Technology Corp | Process for etching metal layer |
| US7005241B2 (en) | 2003-06-09 | 2006-02-28 | Shinko Electric Industries Co., Ltd. | Process for making circuit board or lead frame |
| JP2005033049A (ja) | 2003-07-08 | 2005-02-03 | Nec Toppan Circuit Solutions Inc | プリント配線板の配線パターン形成方法及びプリント配線板の製造方法 |
| JP2005079479A (ja) | 2003-09-02 | 2005-03-24 | Asahi Kasei Electronics Co Ltd | レジスト直描用レジストインク |
| US7477627B2 (en) | 2003-09-10 | 2009-01-13 | Intel Corporation | Method and device of adaptive control of data rate, fragmentation and request to send protection in wireless networks |
| US20050067378A1 (en) * | 2003-09-30 | 2005-03-31 | Harry Fuerhaupter | Method for micro-roughening treatment of copper and mixed-metal circuitry |
| US7445697B2 (en) | 2003-10-22 | 2008-11-04 | Nexx Systems, Inc. | Method and apparatus for fluid processing a workpiece |
| GB0324947D0 (en) | 2003-10-25 | 2003-11-26 | Avecia Ltd | Process |
| WO2005069705A1 (ja) | 2004-01-15 | 2005-07-28 | Matsushita Electric Industrial Co., Ltd. | 金属パターン及びその製造方法 |
| US7357879B2 (en) | 2004-03-03 | 2008-04-15 | Ibiden Co., Ltd. | Etching solution, method of etching and printed wiring board |
| KR100585138B1 (ko) | 2004-04-08 | 2006-05-30 | 삼성전자주식회사 | 반도체 소자 제조용 마스크 패턴 및 그 형성 방법과 미세패턴을 가지는 반도체 소자의 제조 방법 |
| US20050250052A1 (en) | 2004-05-10 | 2005-11-10 | Nguyen Khe C | Maskless lithography using UV absorbing nano particle |
| GB0414840D0 (en) | 2004-07-02 | 2004-08-04 | Ncr Int Inc | Self-service terminal |
| JP4731135B2 (ja) | 2004-07-02 | 2011-07-20 | ルネサスエレクトロニクス株式会社 | 微細パターン形成材料を用いた電子デバイス装置の製造方法 |
| KR100733920B1 (ko) * | 2004-09-17 | 2007-07-02 | 주식회사 엘지화학 | 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법 |
| GB0510094D0 (en) * | 2005-05-18 | 2005-06-22 | Conductive Inkjet Tech Ltd | Formation of layers on substrates |
| WO2007026366A1 (en) | 2005-08-31 | 2007-03-08 | Printar Ltd. | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
| KR100643934B1 (ko) * | 2005-09-02 | 2006-11-10 | 삼성전기주식회사 | 인쇄회로기판의 회로패턴 형성방법 |
| US7686986B2 (en) | 2006-01-05 | 2010-03-30 | Headwaters Technology Innovation, Llc | Magnesium hydroxide nanoparticles, methods of making same and compositions incorporating same |
| JP2007250884A (ja) * | 2006-03-16 | 2007-09-27 | Shirai Denshi Kogyo Kk | フレキシブルプリント基板およびその製造方法 |
| US20070237899A1 (en) * | 2006-04-05 | 2007-10-11 | David Sawoska | Process for creating a pattern on a copper surface |
| US20080308003A1 (en) | 2007-06-13 | 2008-12-18 | Krol Andrew M | UV inkjet resist |
| JP5454834B2 (ja) | 2007-08-30 | 2014-03-26 | 日立化成株式会社 | 粗化処理装置 |
| JP2009158593A (ja) | 2007-12-25 | 2009-07-16 | Tessera Interconnect Materials Inc | バンプ構造およびその製造方法 |
| JP5126354B2 (ja) | 2008-03-17 | 2013-01-23 | 日立化成工業株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板 |
| KR100986287B1 (ko) | 2008-05-09 | 2010-10-07 | 삼성전기주식회사 | 잉크젯 토출장치 |
| EP2562599B1 (en) | 2009-01-29 | 2014-12-10 | Digiflex Ltd. | Process for producing a photomask on a photopolymeric surface |
| JP2011171323A (ja) * | 2010-02-16 | 2011-09-01 | Mitsubishi Paper Mills Ltd | 銅又は銅合金のエッチング方法 |
| JP2011243256A (ja) | 2010-05-19 | 2011-12-01 | Dainippon Printing Co Ltd | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
| JPWO2012067107A1 (ja) | 2010-11-17 | 2014-05-12 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| US20120288683A1 (en) | 2011-05-10 | 2012-11-15 | Chin-Te Kuo | Protuberant structure and method for making the same |
| EP2729595B1 (en) * | 2011-07-07 | 2017-02-01 | ATOTECH Deutschland GmbH | Method for providing organic resist adhesion to a copper or copper alloy surface |
| WO2013027220A2 (en) * | 2011-08-24 | 2013-02-28 | Digiflex Ltd. | Process for dry-coating of flexogarphic surfaces |
| EP2753159B1 (en) | 2011-08-29 | 2018-12-19 | NGK Insulators, Ltd. | Laminated sintered ceramic wiring substrate, and semiconductor package containing wiring substrate |
| US9683305B2 (en) * | 2011-12-20 | 2017-06-20 | Apple Inc. | Metal surface and process for treating a metal surface |
| JP6012749B2 (ja) | 2012-01-31 | 2016-10-25 | アグフア−ゲヴエルト | 放射線硬化可能なエッチング抵抗性インキジェットインキ印刷 |
| JP2013162007A (ja) * | 2012-02-07 | 2013-08-19 | Toppan Printing Co Ltd | 微細配線パターンの製造方法 |
| JP5935163B2 (ja) * | 2012-03-30 | 2016-06-15 | ナガセケムテックス株式会社 | レジスト密着性向上剤及び銅配線製造方法 |
| US20140252571A1 (en) | 2013-03-06 | 2014-09-11 | Maxim Integrated Products, Inc. | Wafer-level package mitigated undercut |
| US9562211B2 (en) | 2013-12-06 | 2017-02-07 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
| JP6164614B2 (ja) | 2013-12-06 | 2017-07-19 | メック株式会社 | エッチング液、補給液及び銅配線の形成方法 |
| TWI500806B (zh) | 2014-03-10 | 2015-09-21 | Nat Univ Tsing Hua | 碳化矽薄膜的製造方法 |
| KR20150109932A (ko) | 2014-03-21 | 2015-10-02 | 삼성전기주식회사 | 에칭액 조성물 및 이를 이용한 회로 패턴의 제조방법 |
| JP2015227499A (ja) | 2014-06-03 | 2015-12-17 | 四国化成工業株式会社 | エッチングレジスト材およびプリント配線板の製造方法 |
| JP6579392B2 (ja) | 2014-09-08 | 2019-09-25 | 国立大学法人九州大学 | 有機マイクロディスク構造体の製造方法 |
| GB2538522B (en) | 2015-05-19 | 2019-03-06 | Dst Innovations Ltd | Electronic circuit and component construction |
| EP3304197A4 (en) | 2015-06-04 | 2019-01-23 | Kateeva, Inc. | METHOD FOR PRODUCING AN ESTETRESIST PATTERN ON A METALLIC SURFACE |
| KR102626521B1 (ko) | 2015-08-13 | 2024-01-17 | 카티바, 인크. | 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법 |
| US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
-
2016
- 2016-07-27 KR KR1020237007896A patent/KR102626521B1/ko active Active
- 2016-07-27 CN CN202111517002.4A patent/CN114397795A/zh active Pending
- 2016-07-27 WO PCT/IL2016/050820 patent/WO2017025949A1/en not_active Ceased
- 2016-07-27 US US15/751,866 patent/US10806035B2/en active Active
- 2016-07-27 KR KR1020247001306A patent/KR102748690B1/ko active Active
- 2016-07-27 EP EP21166748.0A patent/EP3866572B1/en active Active
- 2016-07-27 CN CN201680048035.XA patent/CN108027553B/zh active Active
- 2016-07-27 KR KR1020247042731A patent/KR20250008959A/ko active Pending
- 2016-07-27 KR KR1020187007265A patent/KR102508824B1/ko active Active
- 2016-07-27 JP JP2018507595A patent/JP6975463B2/ja active Active
- 2016-07-27 EP EP16834759.9A patent/EP3335079B1/en active Active
-
2020
- 2020-09-24 US US16/948,597 patent/US11255018B2/en active Active
-
2021
- 2021-07-23 JP JP2021121139A patent/JP7288644B2/ja active Active
-
2022
- 2022-01-12 US US17/647,756 patent/US11807947B2/en active Active
-
2023
- 2023-05-21 JP JP2023083553A patent/JP7602278B2/ja active Active
- 2023-10-10 US US18/483,673 patent/US12270111B2/en active Active
-
2024
- 2024-11-29 JP JP2024207824A patent/JP2025041637A/ja active Pending
-
2025
- 2025-02-27 US US19/065,416 patent/US20250198008A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018527463A5 (enExample) | ||
| JP7288644B2 (ja) | 金属表面上のエッチレジストパターンの製造方法 | |
| JP7713254B2 (ja) | 金属表面上のエッチレジストパターンの製造方法 | |
| JP2023139049A (ja) | 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム | |
| JP2017077732A5 (enExample) | ||
| JP2018519677A5 (enExample) | ||
| TWI886572B (zh) | 蝕刻導電特徵之方法 |