JP2018525813A - Led加熱装置を備えた静電チャック - Google Patents
Led加熱装置を備えた静電チャック Download PDFInfo
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- JP2018525813A JP2018525813A JP2017566684A JP2017566684A JP2018525813A JP 2018525813 A JP2018525813 A JP 2018525813A JP 2017566684 A JP2017566684 A JP 2017566684A JP 2017566684 A JP2017566684 A JP 2017566684A JP 2018525813 A JP2018525813 A JP 2018525813A
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- Prior art keywords
- electrostatic chuck
- leds
- led
- dielectric layer
- inner layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Abstract
Description
Claims (15)
- 複数のLEDを備える電気回路を含む密閉容器を備え、前記密閉容器の上面が静電チャックで構成されている、装置。
- 前記静電チャックは、
前記密閉容器と連通する内部層と、
上部誘電体層と、
前記内部層と前記上部誘電体層との間に配置された電極と、
を備える、
請求項1記載の装置。 - 前記複数のLEDは約0.4〜1.0μmの波長で発光する、請求項1記載の装置。
- LED加熱装置を備えた静電チャックであって、
側壁により画成された凹部を有するベース部と、
前記凹部内に配置された、複数のLEDを備える電気回路と、
前記側壁の上に配置された、前記凹部を覆う内部層と、
上部誘電体層と、
前記内部層と前記上部誘電体層との間に配置された電極とを備え、
前記内部層と前記上部誘電体層は前記複数のLEDにより放射される波長において透明である、
静電チャック。 - 前記電気回路はプリント回路板よりなり、前記プリント回路板は前記凹部の上面と熱的に連通している、請求項4記載の静電チャック。
- 前記電気回路は絶縁トレース及び導電性トレースを備え、前記絶縁トレースは前記凹部の上面に直接被着し、前記導電性トレースは前記絶縁トレースの上面に被着され、前記導電性トレースは前記複数のLEDと電気的に連通している、請求項4記載の静電チャック。
- 前記凹部の残存空間を満たす封入材を備え、前記封入材は前記複数のLEDにより放射される前記波長において透明である、請求項4記載の静電チャック。
- 前記複数のLEDは同心円のパターンとして配置され、前記パターンの中心から遠くに位置する同心円は前記パターンの前記中心の近くに位置する同心円より多数のLEDを有する、請求項4記載の静電チャック。
- 前記上部誘電体層、前記内部層及び前記ベース部を貫通し、ガス源と流体連通する導管を備え、前記上部誘電体層と前記静電チャックの上に置かれる基板の底面との間の空間にガスを導入することができる、請求項4記載の静電チャック。
- 前記電極は、前記内部層の表面の25%未満を占めるようにメッシュとして形成されている、請求項4記載の静電チャック。
- 前記電極は、前記複数のLEDにより放射される前記波長において透明である材料を用いて形成されている、請求項4記載の静電チャック。
- LED加熱装置を備えた静電チャックであって、
側壁により画成された凹部を有するベース部と、
前記凹部内に配置された、複数のLEDを備える電気回路と、
密閉容器を形成するために、前記側壁の上に配置された、前記凹部を覆う内部層と、
前記密閉容器の残存空間を満たす封入材と、
上部誘電体層と、
前記内部層と前記上部誘電体層との間に配置された電極とを備え、
前記封入材、前記内部層、前記電極及び前記上部誘電体層は前記複数のLEDにより放射される波長において透明である、
静電チャック。 - 前記電極はドープ半導体よりなる、請求項12記載の静電チャック。
- 前記ベース部、前記封入材、前記内部層及び前記上部誘電体層を貫通し、ガス源と流体連通する導管を更に備え、前記上部誘電体層と前記静電チャックの上に置かれる基板の底面との間の空間にガスを導入することができる、請求項12記載の静電チャック。
- 前記複数のLEDは約0.4〜1.0μmの波長で発光する、請求項12記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/753,870 | 2015-06-29 | ||
US14/753,870 US9728430B2 (en) | 2015-06-29 | 2015-06-29 | Electrostatic chuck with LED heating |
PCT/US2016/039277 WO2017003868A1 (en) | 2015-06-29 | 2016-06-24 | Electrostatic chuck with led heating |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018525813A true JP2018525813A (ja) | 2018-09-06 |
JP2018525813A5 JP2018525813A5 (ja) | 2019-07-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017566684A Pending JP2018525813A (ja) | 2015-06-29 | 2016-06-24 | Led加熱装置を備えた静電チャック |
Country Status (6)
Country | Link |
---|---|
US (1) | US9728430B2 (ja) |
JP (1) | JP2018525813A (ja) |
KR (1) | KR20180014438A (ja) |
CN (1) | CN107810547B (ja) |
TW (1) | TWI693673B (ja) |
WO (1) | WO2017003868A1 (ja) |
Cited By (3)
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JP2020188076A (ja) * | 2019-05-10 | 2020-11-19 | 東京エレクトロン株式会社 | 載置台及び載置台の作製方法 |
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JP7213592B1 (ja) | 2021-08-19 | 2023-01-27 | アダプティブ プラズマ テクノロジー コーポレーション | 多重加熱領域構造の静電チャック |
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-
2015
- 2015-06-29 US US14/753,870 patent/US9728430B2/en active Active
-
2016
- 2016-05-26 TW TW105116396A patent/TWI693673B/zh active
- 2016-06-24 KR KR1020187002527A patent/KR20180014438A/ko not_active Application Discontinuation
- 2016-06-24 JP JP2017566684A patent/JP2018525813A/ja active Pending
- 2016-06-24 CN CN201680037201.6A patent/CN107810547B/zh active Active
- 2016-06-24 WO PCT/US2016/039277 patent/WO2017003868A1/en active Application Filing
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020188076A (ja) * | 2019-05-10 | 2020-11-19 | 東京エレクトロン株式会社 | 載置台及び載置台の作製方法 |
WO2020230674A1 (ja) * | 2019-05-10 | 2020-11-19 | 東京エレクトロン株式会社 | 載置台及び載置台の作製方法 |
JP7336256B2 (ja) | 2019-05-10 | 2023-08-31 | 東京エレクトロン株式会社 | 載置台及び載置台の作製方法 |
US11545384B2 (en) | 2020-01-31 | 2023-01-03 | Shinko Electric Industries Co., Ltd. | Electrostatic chuck and substrate fixing device |
JP7213592B1 (ja) | 2021-08-19 | 2023-01-27 | アダプティブ プラズマ テクノロジー コーポレーション | 多重加熱領域構造の静電チャック |
JP2023028294A (ja) * | 2021-08-19 | 2023-03-03 | アダプティブ プラズマ テクノロジー コーポレーション | 多重加熱領域構造の静電チャック |
Also Published As
Publication number | Publication date |
---|---|
CN107810547A (zh) | 2018-03-16 |
CN107810547B (zh) | 2019-07-30 |
KR20180014438A (ko) | 2018-02-08 |
US9728430B2 (en) | 2017-08-08 |
TW201701398A (zh) | 2017-01-01 |
WO2017003868A1 (en) | 2017-01-05 |
TWI693673B (zh) | 2020-05-11 |
US20160379853A1 (en) | 2016-12-29 |
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