JP2018523926A5 - - Google Patents

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Publication number
JP2018523926A5
JP2018523926A5 JP2018507639A JP2018507639A JP2018523926A5 JP 2018523926 A5 JP2018523926 A5 JP 2018523926A5 JP 2018507639 A JP2018507639 A JP 2018507639A JP 2018507639 A JP2018507639 A JP 2018507639A JP 2018523926 A5 JP2018523926 A5 JP 2018523926A5
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JP
Japan
Prior art keywords
treatment tool
chuck
support surface
treatment
load
Prior art date
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Application number
JP2018507639A
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English (en)
Japanese (ja)
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JP6942117B2 (ja
JP2018523926A (ja
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Priority claimed from PCT/US2016/046216 external-priority patent/WO2017030841A1/en
Publication of JP2018523926A publication Critical patent/JP2018523926A/ja
Publication of JP2018523926A5 publication Critical patent/JP2018523926A5/ja
Application granted granted Critical
Publication of JP6942117B2 publication Critical patent/JP6942117B2/ja
Active legal-status Critical Current
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JP2018507639A 2015-08-14 2016-08-09 チャック面から汚染を除去するための方法 Active JP6942117B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562205349P 2015-08-14 2015-08-14
US62/205,349 2015-08-14
PCT/US2016/046216 WO2017030841A1 (en) 2015-08-14 2016-08-09 Method for removing contamination from a chuck surface

Publications (3)

Publication Number Publication Date
JP2018523926A JP2018523926A (ja) 2018-08-23
JP2018523926A5 true JP2018523926A5 (cg-RX-API-DMAC7.html) 2019-09-19
JP6942117B2 JP6942117B2 (ja) 2021-09-29

Family

ID=58051938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018507639A Active JP6942117B2 (ja) 2015-08-14 2016-08-09 チャック面から汚染を除去するための方法

Country Status (4)

Country Link
US (1) US10792778B2 (cg-RX-API-DMAC7.html)
EP (1) EP3334560B1 (cg-RX-API-DMAC7.html)
JP (1) JP6942117B2 (cg-RX-API-DMAC7.html)
WO (1) WO2017030841A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7433594B2 (ja) * 2020-02-20 2024-02-20 株式会社ニイガタマシンテクノ 工作機械の切屑検出装置

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3395797B2 (ja) * 1993-08-31 2003-04-14 株式会社ニコン 露光装置
JPH07171747A (ja) 1993-12-21 1995-07-11 Ricoh Co Ltd 研削研磨装置
US5591068A (en) * 1995-03-13 1997-01-07 Regents Of The University Of California Precision non-contact polishing tool
JPH0936070A (ja) 1995-07-21 1997-02-07 Nippon Steel Corp 半導体ウエハの研磨装置
US6179695B1 (en) 1996-05-10 2001-01-30 Canon Kabushiki Kaisha Chemical mechanical polishing apparatus and method
TW313535B (en) * 1996-10-11 1997-08-21 United Microelectronics Corp Eraser of vacuum chuck of a stepper
US6439986B1 (en) 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US6638144B2 (en) * 2000-04-28 2003-10-28 3M Innovative Properties Company Method of cleaning glass
JP3859937B2 (ja) 2000-06-02 2006-12-20 住友大阪セメント株式会社 静電チャック
US8128861B1 (en) * 2000-07-21 2012-03-06 M Cubed Technologies, Inc. Composite materials and methods for making same
US6682406B2 (en) * 2001-11-30 2004-01-27 Taiwan Semiconductor Manufacturing Co., Ltd Abrasive cleaning tool for removing contamination
US6635844B2 (en) * 2002-01-03 2003-10-21 United Microelectronics Corp. Apparatus for on-line cleaning a wafer chuck with laser
US20030200996A1 (en) * 2002-04-30 2003-10-30 Hiatt William Mark Method and system for cleaning a wafer chuck
JP2004063669A (ja) * 2002-07-26 2004-02-26 Oki Electric Ind Co Ltd 半導体製造装置クリーニングウエハとその製造方法、およびそれを用いたクリーニング方法
US20050101232A1 (en) * 2002-12-13 2005-05-12 Eastman Kodak Company Machine for polishing the surface of a work piece
US7150677B2 (en) 2004-09-22 2006-12-19 Mitsubishi Materials Corporation CMP conditioner
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
JP4756583B2 (ja) 2005-08-30 2011-08-24 株式会社東京精密 研磨パッド、パッドドレッシング評価方法、及び研磨装置
JP5099476B2 (ja) 2006-12-28 2012-12-19 株式会社ニコン 清掃装置及び清掃システム、パターン形成装置、清掃方法及び露光方法、並びにデバイス製造方法
JP4864757B2 (ja) * 2007-02-14 2012-02-01 東京エレクトロン株式会社 基板載置台及びその表面処理方法
JP5018249B2 (ja) 2007-06-04 2012-09-05 株式会社ニコン クリーニング装置、クリーニング方法、露光装置、及びデバイス製造方法
JP2010003739A (ja) * 2008-06-18 2010-01-07 Tokyo Electron Ltd 基板洗浄装置
JP2010153407A (ja) 2008-12-23 2010-07-08 Nikon Corp 清掃方法及び装置、並びに露光方法及び装置
NL2004153A (en) 2009-02-24 2010-08-25 Asml Netherlands Bv Lithographic apparatus, a method for removing material of one or more protrusions on a support surface, and an article support system.
CN102460678B (zh) * 2009-04-14 2015-04-29 国际检测解决方案公司 晶片制造清洗装置、处理和使用方法
US20100330890A1 (en) 2009-06-30 2010-12-30 Zine-Eddine Boutaghou Polishing pad with array of fluidized gimballed abrasive members
CN103782365B (zh) * 2011-09-05 2016-10-05 株式会社东芝 掩模版吸盘洁净器及掩模版吸盘清洁方法
WO2013113569A1 (en) 2012-02-03 2013-08-08 Asml Netherlands B.V. Substrate holder and method of manufacturing a substrate holder
JP6085152B2 (ja) 2012-11-22 2017-02-22 日本特殊陶業株式会社 真空チャック
JP6148850B2 (ja) * 2012-12-05 2017-06-14 日本特殊陶業株式会社 クリーニング用素材およびクリーニング方法
US9669653B2 (en) * 2013-03-14 2017-06-06 Applied Materials, Inc. Electrostatic chuck refurbishment
CN104209863A (zh) * 2013-06-03 2014-12-17 宁波江丰电子材料股份有限公司 抛光垫修整器及其制造方法、抛光垫修整装置及抛光系统
JP2014128877A (ja) 2014-03-03 2014-07-10 Femutekku:Kk 表面加工装置及び方法
CN107206567B (zh) 2014-11-23 2020-12-29 M丘比德技术公司 晶片针钉卡盘制造和修理
US20160288291A1 (en) * 2015-03-30 2016-10-06 Strasbaugh, Inc. Method for grinding wafers by shaping resilient chuck covering
JP7032307B2 (ja) * 2015-08-14 2022-03-08 ツー－シックス デラウェア インコーポレイテッド チャック表面の決定論的な仕上げのための方法
KR102365066B1 (ko) * 2016-04-06 2022-02-18 엠 큐브드 테크놀로지스 다이아몬드 복합 cmp 패드 조절기

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