JP6942117B2 - チャック面から汚染を除去するための方法 - Google Patents

チャック面から汚染を除去するための方法 Download PDF

Info

Publication number
JP6942117B2
JP6942117B2 JP2018507639A JP2018507639A JP6942117B2 JP 6942117 B2 JP6942117 B2 JP 6942117B2 JP 2018507639 A JP2018507639 A JP 2018507639A JP 2018507639 A JP2018507639 A JP 2018507639A JP 6942117 B2 JP6942117 B2 JP 6942117B2
Authority
JP
Japan
Prior art keywords
chuck
treatment tool
support surface
treatment
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018507639A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018523926A (ja
JP2018523926A5 (cg-RX-API-DMAC7.html
Inventor
ジェイ． グラトリックス，エドワード
ジェイ． グラトリックス，エドワード
Original Assignee
エム キューブド テクノロジーズ， インコーポレイテッド
エム キューブド テクノロジーズ， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エム キューブド テクノロジーズ， インコーポレイテッド, エム キューブド テクノロジーズ， インコーポレイテッド filed Critical エム キューブド テクノロジーズ， インコーポレイテッド
Publication of JP2018523926A publication Critical patent/JP2018523926A/ja
Publication of JP2018523926A5 publication Critical patent/JP2018523926A5/ja
Application granted granted Critical
Publication of JP6942117B2 publication Critical patent/JP6942117B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2018507639A 2015-08-14 2016-08-09 チャック面から汚染を除去するための方法 Active JP6942117B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562205349P 2015-08-14 2015-08-14
US62/205,349 2015-08-14
PCT/US2016/046216 WO2017030841A1 (en) 2015-08-14 2016-08-09 Method for removing contamination from a chuck surface

Publications (3)

Publication Number Publication Date
JP2018523926A JP2018523926A (ja) 2018-08-23
JP2018523926A5 JP2018523926A5 (cg-RX-API-DMAC7.html) 2019-09-19
JP6942117B2 true JP6942117B2 (ja) 2021-09-29

Family

ID=58051938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018507639A Active JP6942117B2 (ja) 2015-08-14 2016-08-09 チャック面から汚染を除去するための方法

Country Status (4)

Country Link
US (1) US10792778B2 (cg-RX-API-DMAC7.html)
EP (1) EP3334560B1 (cg-RX-API-DMAC7.html)
JP (1) JP6942117B2 (cg-RX-API-DMAC7.html)
WO (1) WO2017030841A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7433594B2 (ja) * 2020-02-20 2024-02-20 株式会社ニイガタマシンテクノ 工作機械の切屑検出装置

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3395797B2 (ja) * 1993-08-31 2003-04-14 株式会社ニコン 露光装置
JPH07171747A (ja) 1993-12-21 1995-07-11 Ricoh Co Ltd 研削研磨装置
US5591068A (en) * 1995-03-13 1997-01-07 Regents Of The University Of California Precision non-contact polishing tool
JPH0936070A (ja) 1995-07-21 1997-02-07 Nippon Steel Corp 半導体ウエハの研磨装置
KR100264228B1 (ko) 1996-05-10 2000-12-01 미다라이 후지오 화학 기계 연마 장치 및 방법
TW313535B (en) 1996-10-11 1997-08-21 United Microelectronics Corp Eraser of vacuum chuck of a stepper
US6439986B1 (en) 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US6638144B2 (en) * 2000-04-28 2003-10-28 3M Innovative Properties Company Method of cleaning glass
JP3859937B2 (ja) 2000-06-02 2006-12-20 住友大阪セメント株式会社 静電チャック
US8128861B1 (en) * 2000-07-21 2012-03-06 M Cubed Technologies, Inc. Composite materials and methods for making same
US6682406B2 (en) 2001-11-30 2004-01-27 Taiwan Semiconductor Manufacturing Co., Ltd Abrasive cleaning tool for removing contamination
US6635844B2 (en) * 2002-01-03 2003-10-21 United Microelectronics Corp. Apparatus for on-line cleaning a wafer chuck with laser
US20030200996A1 (en) * 2002-04-30 2003-10-30 Hiatt William Mark Method and system for cleaning a wafer chuck
JP2004063669A (ja) * 2002-07-26 2004-02-26 Oki Electric Ind Co Ltd 半導体製造装置クリーニングウエハとその製造方法、およびそれを用いたクリーニング方法
US20050101232A1 (en) * 2002-12-13 2005-05-12 Eastman Kodak Company Machine for polishing the surface of a work piece
US7150677B2 (en) 2004-09-22 2006-12-19 Mitsubishi Materials Corporation CMP conditioner
US20060130767A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
JP4756583B2 (ja) 2005-08-30 2011-08-24 株式会社東京精密 研磨パッド、パッドドレッシング評価方法、及び研磨装置
JP5099476B2 (ja) 2006-12-28 2012-12-19 株式会社ニコン 清掃装置及び清掃システム、パターン形成装置、清掃方法及び露光方法、並びにデバイス製造方法
JP4864757B2 (ja) * 2007-02-14 2012-02-01 東京エレクトロン株式会社 基板載置台及びその表面処理方法
JP5018249B2 (ja) 2007-06-04 2012-09-05 株式会社ニコン クリーニング装置、クリーニング方法、露光装置、及びデバイス製造方法
JP2010003739A (ja) * 2008-06-18 2010-01-07 Tokyo Electron Ltd 基板洗浄装置
JP2010153407A (ja) 2008-12-23 2010-07-08 Nikon Corp 清掃方法及び装置、並びに露光方法及び装置
NL2004153A (en) 2009-02-24 2010-08-25 Asml Netherlands Bv Lithographic apparatus, a method for removing material of one or more protrusions on a support surface, and an article support system.
CN102460678B (zh) * 2009-04-14 2015-04-29 国际检测解决方案公司 晶片制造清洗装置、处理和使用方法
US20100330890A1 (en) 2009-06-30 2010-12-30 Zine-Eddine Boutaghou Polishing pad with array of fluidized gimballed abrasive members
WO2013035415A1 (ja) * 2011-09-05 2013-03-14 株式会社 東芝 レチクルチャッククリーナー及びレチクルチャッククリーニング方法
CN109254501A (zh) 2012-02-03 2019-01-22 Asml荷兰有限公司 衬底支架、光刻装置、器件制造方法和制造衬底保持器的方法
JP6085152B2 (ja) 2012-11-22 2017-02-22 日本特殊陶業株式会社 真空チャック
JP6148850B2 (ja) * 2012-12-05 2017-06-14 日本特殊陶業株式会社 クリーニング用素材およびクリーニング方法
US9669653B2 (en) * 2013-03-14 2017-06-06 Applied Materials, Inc. Electrostatic chuck refurbishment
CN104209863A (zh) * 2013-06-03 2014-12-17 宁波江丰电子材料股份有限公司 抛光垫修整器及其制造方法、抛光垫修整装置及抛光系统
JP2014128877A (ja) 2014-03-03 2014-07-10 Femutekku:Kk 表面加工装置及び方法
KR102618488B1 (ko) 2014-11-23 2023-12-27 엠 큐브드 테크놀로지스 웨이퍼 핀 척 제조 및 수리
US20160288291A1 (en) * 2015-03-30 2016-10-06 Strasbaugh, Inc. Method for grinding wafers by shaping resilient chuck covering
WO2017030867A2 (en) * 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Method for deterministic finishing of a chuck surface
CN120080255A (zh) * 2016-04-06 2025-06-03 贰陆特拉华股份有限公司 形成化学-机械平面化垫调节器的方法

Also Published As

Publication number Publication date
JP2018523926A (ja) 2018-08-23
EP3334560B1 (en) 2023-09-13
EP3334560A1 (en) 2018-06-20
US20180099371A1 (en) 2018-04-12
EP3334560A4 (en) 2020-03-11
WO2017030841A1 (en) 2017-02-23
US10792778B2 (en) 2020-10-06

Similar Documents

Publication Publication Date Title
US10242905B2 (en) Wafer pin chuck fabrication and repair
US12122012B2 (en) Machine for finishing a work piece, and having a highly controllable treatment tool
KR20130045188A (ko) 반도체용 유리 기판 및 그의 제조 방법
KR20190110023A (ko) 경취성 재료로 만들어진 가공물의 표면처리 방법
KR102331821B1 (ko) 기판 이면 텍스처링
JP6279734B2 (ja) 作業面クリーニングシステム及び方法
TW200705563A (en) Semiconductor wafer and process for producing a semiconductor wafer
KR102661312B1 (ko) 연마장치 및 연마방법
JP6942117B2 (ja) チャック面から汚染を除去するための方法
SE7900230L (sv) Sett att halla tunna arbetsstycken
JP2020520105A (ja) 浮遊式ウェハチャック
US10953513B2 (en) Method for deterministic finishing of a chuck surface
TWI730240B (zh) 吸盤載台的洗淨裝置以及具有該洗淨裝置的研削裝置
JP2015223669A (ja) 基板処理装置
JP7076346B2 (ja) 異物除去方法、検査方法、露光方法、異物除去装置、検査装置及び露光装置
JP7041051B2 (ja) 摩擦が低減された支持表面を特徴とするウエハチャック
JP6079698B2 (ja) ウェハ平坦度の測定方法
JP2018523926A5 (cg-RX-API-DMAC7.html)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190807

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190807

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201013

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20210113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210312

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210427

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210726

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210831

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210907

R150 Certificate of patent or registration of utility model

Ref document number: 6942117

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250