JP2018522483A5 - - Google Patents
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- Publication number
- JP2018522483A5 JP2018522483A5 JP2018500891A JP2018500891A JP2018522483A5 JP 2018522483 A5 JP2018522483 A5 JP 2018522483A5 JP 2018500891 A JP2018500891 A JP 2018500891A JP 2018500891 A JP2018500891 A JP 2018500891A JP 2018522483 A5 JP2018522483 A5 JP 2018522483A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- component
- heat
- conductive material
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910003465 moissanite Inorganic materials 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181183A JP2022020759A (ja) | 2015-07-13 | 2021-11-05 | 熱排出が改善された構成素子 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015111307.4A DE102015111307A1 (de) | 2015-07-13 | 2015-07-13 | Bauelement mit verbesserter Wärmeableitung |
| DE102015111307.4 | 2015-07-13 | ||
| PCT/EP2016/063748 WO2017008981A1 (de) | 2015-07-13 | 2016-06-15 | Bauelement mit verbesserter wärmeableitung |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021181183A Division JP2022020759A (ja) | 2015-07-13 | 2021-11-05 | 熱排出が改善された構成素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018522483A JP2018522483A (ja) | 2018-08-09 |
| JP2018522483A5 true JP2018522483A5 (enExample) | 2019-06-27 |
| JP7000308B2 JP7000308B2 (ja) | 2022-01-19 |
Family
ID=56137321
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018500891A Active JP7000308B2 (ja) | 2015-07-13 | 2016-06-15 | 熱排出が改善された構成素子 |
| JP2021181183A Withdrawn JP2022020759A (ja) | 2015-07-13 | 2021-11-05 | 熱排出が改善された構成素子 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021181183A Withdrawn JP2022020759A (ja) | 2015-07-13 | 2021-11-05 | 熱排出が改善された構成素子 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11303263B2 (enExample) |
| EP (1) | EP3323200B1 (enExample) |
| JP (2) | JP7000308B2 (enExample) |
| KR (1) | KR102667425B1 (enExample) |
| CN (1) | CN107710609B (enExample) |
| BR (1) | BR112018000747B1 (enExample) |
| DE (1) | DE102015111307A1 (enExample) |
| WO (1) | WO2017008981A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10574208B2 (en) * | 2017-06-20 | 2020-02-25 | Skyworks Solutions, Inc. | Acoustic wave filters with thermally conductive sheet |
| DE102018108605A1 (de) * | 2018-04-11 | 2019-10-17 | RF360 Europe GmbH | SAW-Resonator mit verbesserter Leistungsbeständigkeit und Wärmeresistenz und SAW-Resonator umfassendes HF-Filter |
| CN111934649B (zh) * | 2020-09-16 | 2021-02-23 | 苏州日月新半导体有限公司 | 集成电路装置及其制造方法 |
| US20240063773A1 (en) * | 2022-08-17 | 2024-02-22 | Skyworks Solutions, Inc. | Multilayer piezoelectric substrate packaging |
| JP2024062540A (ja) * | 2022-10-25 | 2024-05-10 | 三安ジャパンテクノロジー株式会社 | 弾性波デバイス、および、弾性波デバイスの製造方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459368A (en) * | 1993-08-06 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device mounted module |
| EP1139412A1 (de) | 2000-03-30 | 2001-10-04 | Infineon Technologies AG | Flip-chip Halbleiterbauelement mit Rückseitenkontaktierung |
| DE10136743B4 (de) * | 2001-07-27 | 2013-02-14 | Epcos Ag | Verfahren zur hermetischen Verkapselung eines Bauelementes |
| DE60327962D1 (de) | 2002-04-03 | 2009-07-30 | Panasonic Corp | Eingebautes Halbleitermodul im Millimeterwellenband |
| JP3791459B2 (ja) * | 2002-05-27 | 2006-06-28 | 株式会社デンソー | 半導体装置およびその製造方法 |
| US6825559B2 (en) * | 2003-01-02 | 2004-11-30 | Cree, Inc. | Group III nitride based flip-chip intergrated circuit and method for fabricating |
| JP2005217670A (ja) * | 2004-01-28 | 2005-08-11 | Kyocera Corp | 弾性表面波装置および通信装置 |
| US6992400B2 (en) | 2004-01-30 | 2006-01-31 | Nokia Corporation | Encapsulated electronics device with improved heat dissipation |
| JP4375037B2 (ja) | 2004-02-05 | 2009-12-02 | パナソニック株式会社 | 弾性表面波素子 |
| US7312261B2 (en) | 2004-05-11 | 2007-12-25 | International Business Machines Corporation | Thermal interface adhesive and rework |
| JP4992908B2 (ja) | 2006-11-13 | 2012-08-08 | 株式会社村田製作所 | 弾性境界波素子、弾性境界波装置及び弾性境界波装置の製造方法 |
| JP5188120B2 (ja) * | 2007-08-10 | 2013-04-24 | 新光電気工業株式会社 | 半導体装置 |
| EP2555239A3 (en) * | 2011-08-04 | 2013-06-05 | Sony Mobile Communications AB | Thermal package with heat slug for die stacks |
| JP2013066042A (ja) * | 2011-09-16 | 2013-04-11 | Murata Mfg Co Ltd | 電子装置およびその製造方法ならびに弾性波装置 |
| JP2013131711A (ja) | 2011-12-22 | 2013-07-04 | Taiyo Yuden Co Ltd | 電子部品 |
| US9406579B2 (en) | 2012-05-14 | 2016-08-02 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of controlling warpage in semiconductor package |
| KR20140009731A (ko) * | 2012-07-12 | 2014-01-23 | 삼성전자주식회사 | 방열부를 포함하는 반도체 칩 및 그 반도체 칩 제조 방법 |
| DE102012107668A1 (de) | 2012-08-21 | 2014-03-20 | Epcos Ag | Bauelementanordnung |
| WO2014204447A1 (en) * | 2013-06-18 | 2014-12-24 | Intel Corporation | Integrated thermoelectric cooling |
| KR20150021838A (ko) | 2013-08-21 | 2015-03-03 | 삼성전자주식회사 | Led 구동 장치 및 조명 장치 |
| US10483248B2 (en) * | 2017-03-23 | 2019-11-19 | Skyworks Solutions, Inc. | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias |
| US10574208B2 (en) * | 2017-06-20 | 2020-02-25 | Skyworks Solutions, Inc. | Acoustic wave filters with thermally conductive sheet |
| JP7084744B2 (ja) * | 2018-03-12 | 2022-06-15 | 太陽誘電株式会社 | 弾性波デバイス、モジュールおよびマルチプレクサ |
| JP7057690B2 (ja) * | 2018-03-19 | 2022-04-20 | 株式会社村田製作所 | 弾性波装置 |
| JP2019192729A (ja) * | 2018-04-23 | 2019-10-31 | 株式会社村田製作所 | 半導体装置 |
-
2015
- 2015-07-13 DE DE102015111307.4A patent/DE102015111307A1/de active Pending
-
2016
- 2016-06-15 CN CN201680032975.XA patent/CN107710609B/zh active Active
- 2016-06-15 EP EP16730349.4A patent/EP3323200B1/de active Active
- 2016-06-15 WO PCT/EP2016/063748 patent/WO2017008981A1/de not_active Ceased
- 2016-06-15 US US15/743,984 patent/US11303263B2/en active Active
- 2016-06-15 BR BR112018000747-1A patent/BR112018000747B1/pt active IP Right Grant
- 2016-06-15 KR KR1020177035368A patent/KR102667425B1/ko active Active
- 2016-06-15 JP JP2018500891A patent/JP7000308B2/ja active Active
-
2021
- 2021-11-05 JP JP2021181183A patent/JP2022020759A/ja not_active Withdrawn
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