JP2011249599A5 - - Google Patents

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Publication number
JP2011249599A5
JP2011249599A5 JP2010121789A JP2010121789A JP2011249599A5 JP 2011249599 A5 JP2011249599 A5 JP 2011249599A5 JP 2010121789 A JP2010121789 A JP 2010121789A JP 2010121789 A JP2010121789 A JP 2010121789A JP 2011249599 A5 JP2011249599 A5 JP 2011249599A5
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JP
Japan
Prior art keywords
electrode
semiconductor
central portion
alloy
mounting substrate
Prior art date
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Application number
JP2010121789A
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English (en)
Japanese (ja)
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JP2011249599A (ja
JP5414622B2 (ja
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Priority to JP2010121789A priority Critical patent/JP5414622B2/ja
Priority claimed from JP2010121789A external-priority patent/JP5414622B2/ja
Publication of JP2011249599A publication Critical patent/JP2011249599A/ja
Publication of JP2011249599A5 publication Critical patent/JP2011249599A5/ja
Application granted granted Critical
Publication of JP5414622B2 publication Critical patent/JP5414622B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010121789A 2010-05-27 2010-05-27 半導体実装基板およびそれを用いた実装構造体 Expired - Fee Related JP5414622B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010121789A JP5414622B2 (ja) 2010-05-27 2010-05-27 半導体実装基板およびそれを用いた実装構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010121789A JP5414622B2 (ja) 2010-05-27 2010-05-27 半導体実装基板およびそれを用いた実装構造体

Publications (3)

Publication Number Publication Date
JP2011249599A JP2011249599A (ja) 2011-12-08
JP2011249599A5 true JP2011249599A5 (enExample) 2013-05-09
JP5414622B2 JP5414622B2 (ja) 2014-02-12

Family

ID=45414485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010121789A Expired - Fee Related JP5414622B2 (ja) 2010-05-27 2010-05-27 半導体実装基板およびそれを用いた実装構造体

Country Status (1)

Country Link
JP (1) JP5414622B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6214273B2 (ja) * 2013-08-08 2017-10-18 三菱電機株式会社 金属ナノ粒子を用いた接合構造および金属ナノ粒子を用いた接合方法
TWI505380B (zh) * 2013-12-31 2015-10-21 台灣嘉碩科技股份有限公司 導電封裝結構及其製造方法
JP2020155684A (ja) * 2019-03-22 2020-09-24 株式会社カネカ 太陽電池ストリング、太陽電池モジュール、太陽電池セルの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3893303B2 (ja) * 2002-03-29 2007-03-14 住友ベークライト株式会社 半導体パッケージの製造方法
JP3904210B2 (ja) * 2003-04-28 2007-04-11 株式会社リコー 光学電子デバイスの接合方法及び接合構造
JP4656311B2 (ja) * 2005-07-11 2011-03-23 セイコーエプソン株式会社 電子モジュール
JP4835264B2 (ja) * 2006-05-26 2011-12-14 株式会社村田製作所 部品内蔵回路モジュール基板
JP2009064995A (ja) * 2007-09-07 2009-03-26 Sharp Corp 半導体パッケージおよび電子機器
JP2008263248A (ja) * 2008-08-07 2008-10-30 Sumitomo Electric Ind Ltd 半導体発光素子搭載部材およびその製造方法

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