JP2011249599A5 - - Google Patents
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- JP2011249599A5 JP2011249599A5 JP2010121789A JP2010121789A JP2011249599A5 JP 2011249599 A5 JP2011249599 A5 JP 2011249599A5 JP 2010121789 A JP2010121789 A JP 2010121789A JP 2010121789 A JP2010121789 A JP 2010121789A JP 2011249599 A5 JP2011249599 A5 JP 2011249599A5
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- Japan
- Prior art keywords
- electrode
- semiconductor
- central portion
- alloy
- mounting substrate
- Prior art date
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Description
より具体的には、本発明の半導体実装基板は、
基材と、
前記基材上の電極と、を含む半導体実装基板であって、
半導体素子が実装される前記電極の中央部と、
前記電極の中央部の周囲を囲む、前記電極の周縁部とがあり、
前記電極の周縁部の表面粗さが、前記電極の中央部の表面粗さより大きい半導体実装基板を提供する。
More specifically, the semiconductor mounting substrate of the present invention is
A substrate;
An electrode on the substrate; and a semiconductor mounting substrate comprising:
A central portion of the electrode on which a semiconductor element is mounted;
Surrounding the periphery of the central portion of the electrode, and the peripheral edge of the electrode ,
Provided is a semiconductor mounting substrate in which the surface roughness of the peripheral portion of the electrode is larger than the surface roughness of the central portion of the electrode .
Claims (13)
前記基材上の電極と、を含む半導体実装基板であって、
半導体素子が実装される前記電極の中央部と、
前記電極の中央部の周囲を囲む、前記電極の周縁部とがあり、
前記電極の周縁部の表面粗さが、前記電極の中央部の表面粗さより大きい半導体実装基板。 A substrate;
An electrode on the substrate; and a semiconductor mounting substrate comprising:
A central portion of the electrode on which a semiconductor element is mounted;
Surrounding the periphery of the central portion of the electrode, and the peripheral edge of the electrode ,
The semiconductor mounting board whose surface roughness of the peripheral part of the said electrode is larger than the surface roughness of the center part of the said electrode .
或いはＡｇ、またはＡｇ合金、
或いはＣｕ、またはＣｕ合金から構成されていることを特徴とする
請求項１から４のいずれか１項に記載の半導体実装基板。 The center part of the electrode and the peripheral part of the electrode are Au, or an Au alloy,
Or Ag or an Ag alloy,
Alternatively, the semiconductor mounting substrate according to any one of claims 1 to 4 , wherein the substrate is made of Cu or a Cu alloy.
請求項１から５のいずれか１項に記載の半導体実装基板。 The semiconductor mounting board according to any one of 5 from the previous Kimoto material according to claim 1 which is composed of alumina or aluminum nitride.
半導体素子を搭載してなることを特徴とする実装構造体。 A mounting structure comprising a semiconductor element mounted on a central portion of the electrode of the semiconductor mounting substrate according to any one of claims 1 to 6 .
前記半導体素子が封止材料により封止された
請求項７に記載の実装構造体。 A bump for electrically bonding the electrode of the semiconductor mounting substrate and the semiconductor element is formed of a paste,
The mounting structure according to claim 7 , wherein the semiconductor element is sealed with a sealing material.
前記封止材料が存在しない領域を持つ
請求項７または８に記載の実装構造体。 Mounting structure according to claim 7 or 8 having the area where the sealing material is not present between the central portion of the semiconductor mounting substrate electrode and the semiconductor element.
前記封止材料に覆われている
請求項８または９に記載の実装構造体。 Mounting structure according to claim 8 or 9 all surfaces are covered with the sealing material of the peripheral portion of the semiconductor mounting substrate of the electrode.
Ａｕ、またはＡｕ合金、
或いはＡｇ、またはＡｇ合金、
或いはＣｕ、またはＣｕ合金の金属粒子を含むことを特徴とする
請求項８から１０のいずれか１項に記載の実装構造体。 The paste is Au, or an Au alloy,
Or Ag or an Ag alloy,
Or Cu or mounting structure according to claims 8 to any one of 10, which comprises metal particles of Cu alloy.
金属ナノ粒子のペーストであることを特徴とする
請求項８から１１のいずれか１項に記載の実装構造体。 The mounting structure according to any one of 11 claims 8, wherein the paste is a paste of a metal nanoparticle.
請求項８から１２のいずれか１項に記載の実装構造体。 The mounting structure according to any one of the semiconductor device of claims 8, characterized in that is an LED element 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010121789A JP5414622B2 (en) | 2010-05-27 | 2010-05-27 | Semiconductor mounting substrate and mounting structure using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010121789A JP5414622B2 (en) | 2010-05-27 | 2010-05-27 | Semiconductor mounting substrate and mounting structure using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011249599A JP2011249599A (en) | 2011-12-08 |
| JP2011249599A5 true JP2011249599A5 (en) | 2013-05-09 |
| JP5414622B2 JP5414622B2 (en) | 2014-02-12 |
Family
ID=45414485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010121789A Expired - Fee Related JP5414622B2 (en) | 2010-05-27 | 2010-05-27 | Semiconductor mounting substrate and mounting structure using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5414622B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6214273B2 (en) * | 2013-08-08 | 2017-10-18 | 三菱電機株式会社 | Bonding structure using metal nanoparticles and bonding method using metal nanoparticles |
| TWI505380B (en) * | 2013-12-31 | 2015-10-21 | Tai Saw Technology Co Ltd | Conducting packaging structure and manufacturing method thereof |
| JP2020155684A (en) * | 2019-03-22 | 2020-09-24 | 株式会社カネカ | Manufacturing method of solar cell string, solar cell module, and solar cell |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3893303B2 (en) * | 2002-03-29 | 2007-03-14 | 住友ベークライト株式会社 | Manufacturing method of semiconductor package |
| JP3904210B2 (en) * | 2003-04-28 | 2007-04-11 | 株式会社リコー | Joining method and joining structure of optoelectronic device |
| JP4656311B2 (en) * | 2005-07-11 | 2011-03-23 | セイコーエプソン株式会社 | Electronic module |
| JP4835264B2 (en) * | 2006-05-26 | 2011-12-14 | 株式会社村田製作所 | Component built-in circuit module board |
| JP2009064995A (en) * | 2007-09-07 | 2009-03-26 | Sharp Corp | Semiconductor package and electronic device |
| JP2008263248A (en) * | 2008-08-07 | 2008-10-30 | Sumitomo Electric Ind Ltd | Mounting member of semiconductor light-emitting element, and method of manufacturing the same |
-
2010
- 2010-05-27 JP JP2010121789A patent/JP5414622B2/en not_active Expired - Fee Related
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