JP4835264B2 - Component built-in circuit module board - Google Patents

Description

  The present invention relates to a circuit module board with a built-in component, and more particularly, to a circuit module board with a built-in component that includes a plurality of wiring boards and in which an electronic component mounted on at least one wiring board is sealed with a resin.

  Conventionally, a component built-in circuit module substrate in which an electronic component such as an IC chip is mounted and sealed in a multilayer substrate has been proposed.

  For example, in the component built-in circuit module substrate shown in the sectional view of FIG. 9, a cavity 222 is formed in a ceramic multilayer substrate 210, and an IC chip 230 is mounted in the cavity 222. The cavity 222 is filled with a thermosetting resin 240 to fill a gap in the cavity 222. A resin wiring substrate 270 is bonded onto the ceramic multilayer substrate 210 and the thermosetting resin 240, and an electronic component 280 is mounted on the resin wiring substrate 270 (see, for example, Patent Document 1).

In addition, when the substrate is in close contact with the resin to form a multilayer, the electrode surface on the substrate is a mirror surface, and thus problems such as peeling occur. Therefore, in general, the electrode surface is chemically treated with chemicals, polished, etc. It is intentionally roughened by physical processing.
Japanese Patent Laid-Open No. 2005-45013

  When a semiconductor chip (active element) such as an IC chip mounted on a substrate is molded and sealed with resin, the gap between the semiconductor chip and the substrate on which the semiconductor chip is placed is very small. In addition to the poor flow of the resin during molding, the connecting portions such as bumps between the semiconductor chip and the substrate hinder the flow of the resin, which may cause voids in the resin.

When voids are generated in the resin for sealing such a semiconductor chip, the following problems occur.
(1) The heat generated in the semiconductor chip sealed with resin is not sufficiently diffused, causing the semiconductor chip to fail.
(2) If moisture or gas remains in the gap, the gap expands during reflow, causing separation of the resin or semiconductor chip, or short-circuiting when molten solder enters the peeled portion along with this peeling. Invite a defect.
(3) Due to stress concentration due to the air gap, excessive stress is applied to the resin-encapsulated semiconductor chip and its connection bumps, causing failure.

  In view of such a situation, the present invention is to provide a component built-in circuit module substrate capable of preventing a void from being generated in a resin filled between a wiring board and an electronic component.

  In order to solve the above-mentioned problems, the present invention provides a component built-in circuit module substrate configured as follows.

  The component built-in circuit module substrate includes: (a) a plurality of wiring boards on which conductive patterns are formed and stacked; (b) an electronic component mounted on at least one of the plurality of wiring boards; and (c) the electronic And a sealing resin that is partially filled between the component and the wiring board on which the electronic component is mounted to seal the electronic component. At least one wiring board on which the electronic component is mounted is connected to the electronic component in a region facing the electronic component on a surface on which the electronic component is mounted (hereinafter referred to as a “mounting surface”). The surface roughness of the portion excluding the portion for the purpose (hereinafter referred to as “connection terminal portion”) is larger than the surface roughness of the region other than the region facing the electronic component (hereinafter referred to as “non-opposing region”). small.

  According to the above configuration, when the electronic component mounted on the wiring board is sealed with the sealing resin, the mounting surface on which the electronic component is mounted is connected to the electronic component in the region facing the electronic component. Since the surface roughness of the portion excluding the connection terminal portion is smaller than the surface roughness of the non-opposing region other than the region facing the electronic component, fluidized sealing resin is filled between the wiring board and the electronic component. It becomes easy and it can prevent that a space | gap generate | occur | produces in the fluidized sealing resin.

  Note that various materials such as ceramic and resin can be used for the wiring board. As the wiring board, different materials may be used in combination or only the same material may be used.

Further, the conductive pattern, (i) is formed in the central portion of the region opposite to the electronic component in the mounting surface, the island Joshirubeden pattern that Mashimasu extending away from the connection terminal portion, (ii) said mounting A terminal electrode formed on at least the connection terminal portion in a region facing the electronic component on the surface and surrounding the periphery of the island-shaped conductive pattern . The surface roughness of the island-like conductive pattern is smaller than the surface roughness of the terminal electrode .

In this case, the fluidized sealing resin can easily flow between the island-shaped conductive pattern and the electronic component by relatively reducing the surface roughness of the island-shaped conductive pattern. On the other hand, with respect to the terminal electrode of the conductive pattern formed on the mounting surface, the surface roughness can be relatively increased so that problems such as peeling of the sealing resin do not occur.

  Further, the heat generated with the operation of the electronic component can be efficiently diffused through the island-like conductive pattern, and the cooling efficiency of the electronic component can be improved.

  Preferably, in the mounting surface, the surface roughness of the island-shaped conductive pattern is smaller than the surface roughness of a portion of the non-opposing region excluding a portion where the conductive pattern is formed.

  In this case, the fluidized sealing resin can easily flow between the island-shaped conductive pattern and the electronic component by relatively reducing the surface roughness of the island-shaped conductive pattern. On the other hand, the surface roughness of the non-opposing region excluding the portion where the conductive pattern is formed can be relatively increased so that problems such as peeling of the sealing resin do not occur.

  Preferably, the wiring board on which the electronic component is mounted has the mounting surface formed in a recess recessed from the main surface, and the island-shaped conductive pattern is formed on the mounting surface.

  In this case, since the island-like conductive pattern is formed in the recess recessed from the main surface of the wiring board, the main surface of the wiring board is polished without arranging a mask or the like on the surface of the island-like conductive pattern. The surface roughness of the main surface of the wiring board can be increased while maintaining the surface roughness of the conductive pattern. Therefore, problems such as peeling of the wiring board can be prevented.

  In addition, when mounting an electronic component in a recess, when the fluidized sealing resin is filled with a large gap between the electronic component and the island-shaped conductive pattern, the gap between the electronic component and the island-shaped conductive pattern is increased. The fluidity of the sealing resin in the gap can be further improved.

Preferably, the conductive pattern includes at least one of said connecting pin and said island-like conductive pattern is connected.

In this case, the island-like conductive pattern can be prevented from becoming a floating electrode. In particular, connection pattern, when connected to a connection pin to be grounded, an island-like conductive pattern is grounded, it is possible to remove the bad noise adversely affecting the electronic component.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes easy to fill with the fluidized sealing resin between a wiring board and an electronic component, and it can prevent that a space | gap generate | occur | produces in the fluidized sealing resin. Thereby, the reliability of the component built-in circuit module substrate can be improved.

  The present invention will be described below with reference to FIGS.

  Example 1 A component built-in circuit module substrate of Example 1 will be described with reference to FIGS. 1 and 2.

  1A to 1C are cross-sectional views schematically showing a method for manufacturing a component built-in circuit module substrate according to the first embodiment. 1A to 1C show a process of mounting the IC chip 16 on the wiring substrate 10 and then sealing with the sealing resin 20. FIG. 2 is a plan view of the wiring board 10.

  A method for manufacturing the component built-in circuit module substrate of Example 1 will be described.

  As shown in FIG. 1A, an upper surface side wiring layer 12 and island-like electrodes 13 are formed on the upper surface 11 of a wiring substrate 10 such as a printed wiring substrate, a ceramic substrate, or a transfer carrier using a metal material. As shown in FIG. 2, the island-like electrode 13 extends away from the terminal electrode 14 in a portion of the region facing the IC chip 16 to be mounted in a later process, excluding the terminal electrode 14. In FIG. 2, only the terminal electrode 14 included in the upper surface side wiring layer 12 is illustrated.

  The surface roughness of the island-like electrode 13 is formed to be smaller than the surface roughness of other portions of the upper surface 11 of the wiring substrate 10. Specifically, after the upper surface side wiring layer 12 and the island-like electrode 13 are formed on the upper surface 11 of the wiring substrate 10, only the island-like electrode 13 is masked and subjected to chemical treatment, and the surface of the portion other than the island-like electrode 13 is covered. Roughen. For this chemical treatment, for example, a solution obtained by adding hydrogen peroxide to sulfuric acid is used as a chemical solution.

  Even if the upper surface side wiring layer 12 and the island-like electrode 13 are produced by firing together with the ceramic substrate that becomes the wiring substrate 10, after firing the ceramic substrate that becomes the wiring substrate 10, a wiring pattern is formed on the upper surface, You may form by baking again. Alternatively, a conductive film may be formed on the surface of the wiring substrate 10 and the conductive film may be patterned by photolithography to form the upper surface side wiring layer 12 and the island-like electrode 13.

  Next, as shown in FIG. 1B, the IC chip 16 is connected to the terminal electrode 14 of the upper surface side wiring layer 12 via the bump 18 by flip chip bonding, and mounted on the wiring substrate 10. The IC chip 16 may be connected to the terminal electrode 14 using a conductive adhesive or the like.

  Next, as shown in FIG. 1C, a thermosetting resin is filled on the wiring substrate 10 and around the IC chip 16 to form a sealing resin 20, and the IC chip 16 is sealed.

  Specifically, the wiring substrate 10 on which the IC chip 16 is mounted is housed in a mold and filled with a thermosetting resin. Alternatively, an uncured thermosetting resin sheet is placed on the wiring substrate 10 and the IC chip 16 and pressed by a vacuum press. Thereby, an uncured thermosetting resin is brought into close contact with the surfaces of the wiring substrate 10 and the IC chip 16. At this time, the island-shaped electrode 13 on the wiring substrate 10 has a smaller surface roughness than the other portions of the wiring substrate 10, so that the space between the surface of the island-shaped electrode 13 and the IC chip 16 is thermally cured. Resin flows without gaps.

  After filling, the thermosetting resin is heated and cured. As the thermosetting resin, epoxy resin, polyimide resin, silicon resin, or the like can be used.

  Next, a resin wiring board (not shown) on which a conductive pattern such as wiring is formed is disposed on the surface 22 of the sealing resin 20 to complete a component built-in circuit module board in which the IC chip 16 is built.

  In the component built-in circuit module substrate according to the first embodiment, an island electrode 13 is formed on the upper surface 11 of the wiring substrate 10 at a position where the IC chip 16 faces, and the surface roughness of the island electrode 13 is smaller than other portions. . Therefore, the fluidity of the thermosetting resin is improved between the island-shaped electrode 13 and the IC chip 16, and the heat-effective resin can be filled so that no voids are generated.

  Therefore, it is possible to prevent the IC chip 16 from being broken due to insufficient diffusion of heat generated in the IC chip 16 due to the air gap. In addition, it is possible to prevent moisture and gas remaining in the gap from expanding during reflow, causing the IC chip 16 and the sealing resin 20 to peel off, or causing a solder flash at the peeled portion to cause a short circuit. . Moreover, it is possible to prevent an excessive stress from being applied to the IC chip 16 and the bump 18 due to the stress concentration due to the air gap.

  Further, since the island-shaped electrode 13 is formed in the vicinity of the IC chip 16, the heat accompanying the operation of the IC chip 16 can be efficiently diffused to the wiring substrate 10 via the sealing resin 20 and the island-shaped electrode 13. Therefore, the cooling efficiency of the IC chip 16 can be improved, and the reliability of the IC chip 16 can be improved.

  On the other hand, since the surface of the wiring substrate 10 other than the island-shaped electrode 13 and the surface of the upper surface side wiring layer 12 are rough surfaces, the adhesion of the sealing resin 20 can be secured, and the sealing resin 20 is secured to the upper surface 11 of the wiring substrate 10. In addition, it does not peel off from the surface of the upper surface side wiring layer 12.

  In the first embodiment, the island-shaped electrode 13 is insulated from the upper surface side wiring layer 12, but may be electrically connected to any one of the terminal electrodes 14 in the upper surface side wiring layer 12. Thereby, it can prevent that the island-like electrode 13 becomes a floating electrode. In particular, noise with respect to the IC chip 16 can be effectively removed by connecting the island electrode 13 to the ground terminal.

  <Example 2> The component built-in circuit module board of Example 2 will be described with reference to FIGS.

  As shown in the cross-sectional view of FIG. 3A and the plan view of FIG. 3B, the component built-in circuit module substrate of Example 2 includes a ceramic multilayer substrate 110 formed of a plurality of ceramic substrates.

  The ceramic multilayer substrate 110 includes a conductive via 114 for interlayer connection formed in the insulating layer 112, an inner layer wiring layer 116, an upper surface side wiring layer 118 and a lower surface side wiring layer 120 respectively connected to the conductive via 114, A cavity 122 for mounting and storing the IC chip 130 is provided on the upper surface side. Since the ceramic multilayer substrate 110 can be fired at a relatively low temperature of about 900 ° C. to 1000 ° C., for example, if a glass ceramic material is used as the insulating layer 112, a material for forming the conductive via 114 and the inner wiring layer 116 is used. It can be produced by simultaneous firing. The upper surface side wiring layer 118 and the lower surface side wiring layer 120 can also be produced by simultaneous firing. However, after the ceramic multilayer substrate 110 is simultaneously fired, wiring patterns are formed on the upper surface and the lower surface, and then fired again. It may be formed.

  The material of the conductive via 114 and the inner wiring layer 116 is silver (Ag), copper (Cu), gold (Au), nickel (Ni), palladium (Pd), silver-palladium alloy and gold-palladium alloy. A conductive material that can be fired simultaneously with the glass ceramic material can be used. In the upper surface side wiring layer 118 and the lower surface side wiring layer 120, not only a wiring pattern is formed, but also a terminal electrode for mounting the component built-in circuit module substrate on the circuit wiring board.

  The cavity 122 is formed in a shape larger than the outer dimension of the IC chip 130. On the bottom surface 123 of the cavity 122, an electrode pad 124 for connecting to the IC chip 130 and an island electrode 125 are formed. The ceramic multilayer substrate 110 having such a cavity 122 is formed by laminating, for example, a green sheet provided with an opening serving as the cavity 122 for accommodating the IC chip 130 and a green sheet on which the electrode pad 124 and the island electrode 125 are formed. Can be produced by firing.

  An IC chip 130 is mounted in the cavity 122. Bumps 132 are formed on the IC chip 130, and the bumps 132 and the electrode pads 124 formed on the bottom surface 123 of the cavity 122 are connected by flip chip bonding.

  The island-shaped electrode 125 in which the cavity 122 is disposed on the surface facing the IC chip 130 is connected to the ground terminal of the inner wiring layer 116.

  The cavity 122 in which the IC chip 130 is mounted is filled with the thermosetting resin 140, and the surface of the thermosetting resin 140 is flattened so as to be substantially flush with the surface of the ceramic multilayer substrate 110.

  A resin wiring board 170 is bonded to the surface of the ceramic multilayer substrate 110. The resin wiring board 170 includes a sheet 150 composed of an insulating adhesive layer 152 and a wiring layer 154, and a lamination sheet 160 composed of an insulating adhesive layer 162 and a wiring layer 164 laminated on the sheet 150. ing. The ceramic multilayer substrate 110 is bonded by an insulating adhesive layer 152 and electrically connected to a terminal electrode which is a part of the upper surface side wiring layer 118 of the ceramic multilayer substrate 110 by a conductive resin 156. . The insulating adhesive layers 152 and 162 also serve as interlayer insulating layers.

  The wiring layers 154 and 164 are formed, for example, by etching a copper foil attached on the insulating adhesive layers 152 and 162. In this case, if the thickness of the copper foil is 10 μm or less, the wiring width and the wiring pitch can be set to 20 μm to 30 μm, respectively, and high-density wiring is possible as compared with the ceramic multilayer substrate 110.

  Further, in this component built-in circuit module substrate, an electronic component 180 is further mounted on the surface of the resin wiring board 170 including the region where the cavity 122 is formed. As the electronic component 180, a passive component such as a chip capacitor or a chip resistor or an IC chip different from the IC chip 130 may be mounted. As a method for mounting these electronic components 180, solder reflow connection or conductive adhesive can be used in the case of passive components, and flip chip mounting, wire bonding mounting, or the like can be used in the case of IC chips. . FIG. 3 shows an example in which a chip capacitor is mounted as the electronic component 180, and the chip capacitor and the wiring layer 164 of the resin wiring board 170 are connected by solder 182.

  In the component built-in circuit module board of the second embodiment, various electronic components can be mounted on the surface of the resin wiring board 170 including the region where the cavity 122 is formed. The IC chip 130 mounted on the electronic component 180 and the electronic component 180 mounted on the resin wiring board 170 can be wired in the shortest distance. As a result, the high frequency characteristics of the component built-in circuit module substrate are improved, and noise generated by a sudden change in current can be suppressed.

  Next, a method for manufacturing the component built-in circuit module substrate of Example 2 will be described with reference to FIGS.

  4A to 4C are cross-sectional views for explaining a process of mounting the IC chip 130 on the ceramic multilayer substrate 110 in which the cavity 122 is formed and filling the thermosetting resin 140 for planarization. It is.

  First, as shown in FIG. 4A, the ceramic multilayer substrate 110 is provided with an opening serving as a cavity 122 by laser processing, punching processing, or the like, and wiring is performed using a conductor paste made of silver (Ag), copper (Cu), or the like. A green sheet on which a pattern is formed and a green sheet on which a wiring pattern is similarly formed using a conductor paste are laminated and fired.

  On the bottom surface 123 of the cavity 122, an electrode pad 124 is formed at a position corresponding to the bump 132 of the IC chip 130, and an island electrode 125 is formed at a position facing the surface of the IC chip 130 where the bump 132 is not formed. Form. Further, the inner wiring layer 116, the upper surface side wiring layer 118, the lower surface side wiring layer 120, and the conductive via 114 connecting them are formed at the same time.

  Next, a resist film is formed on the bottom surface 123 of the cavity 122, and this resist film is patterned to remove the remaining part of the resist film on the island-like electrode 125. Then, chemical treatment is performed to roughen the surface of the portion other than the island-shaped electrode 125. For this chemical treatment, for example, a solution obtained by adding hydrogen peroxide to sulfuric acid can be used. After this chemical treatment, the resist film on the island electrode 125 is removed.

  FIG. 4B is a cross-sectional view showing a state where the IC chip 130 is mounted in the cavity 122 by the flip chip mounting method.

  Next, as shown in FIG. 4 (c), a thermosetting resin 140 is filled in the voids in the cavity 122. For filling the thermosetting resin 140, an uncured paste-like thermosetting resin 140 is placed on the cavity 122 and the IC chip 130, and the thermosetting resin 140 is pressurized by a vacuum press so that the thermosetting resin 140 is formed in the cavity of the ceramic substrate. This is performed in close contact with the surface of 122 and the surface of the IC chip 130. At this time, the island-shaped electrode 125 on the bottom surface 123 of the cavity 122 has a smaller surface roughness than the other portions in the cavity 122, so that the space between the surface of the island-shaped electrode 125 and the IC chip 130 is also present. The thermosetting resin 140 flows in without a gap. Thereafter, the thermosetting resin 140 is cured by heating the thermosetting resin 140 to a predetermined temperature. The filling amount of the thermosetting resin 140 is controlled to be an amount corresponding to the difference between the volume of the cavity 122 and the volume of the IC chip 130. Thereby, the step between the surface of the thermosetting resin 140 formed on the cavity 122 and the surface of the ceramic multilayer substrate 110 can be made equal to or less than the thickness of the insulating adhesive layer 152, and the resin wiring board 170 can be formed on the ceramic multilayer substrate 110. Adhesive strength sufficient when adhering to is ensured. Moreover, since the resin wiring board 170 after bonding can have a flat surface, it becomes easy to form the wiring layer 154 by etching the metal layer after bonding. Further, mounting when mounting the electronic component 180 on the resin wiring board 170 is facilitated.

  As the thermosetting resin 140, an epoxy resin, a polyimide resin, a silicon resin, or the like can be used.

  FIGS. 5A to 5C illustrate a process of manufacturing a sheet 150 that is a first-layer resin wiring board formed on the ceramic multilayer substrate 110 flattened by the thermosetting resin 140 as described above. It is sectional drawing for doing.

  As shown in FIG. 5A, using a sheet 150 made of an insulating adhesive layer 152 to which a metal layer 541 made of copper foil, for example, is used, as shown in FIG. Thus, an opening 561 is formed.

  Next, as shown in FIG. 5C, the opening 561 is filled with a conductive resin 156 mainly composed of silver (Ag) or copper (Cu) by a printing method, a drawing method, or the like. Thereby, the sheet 150 in which the opening 561 is filled with the conductive resin 156 is manufactured. Note that the insulating adhesive layer 152 is formed using a thermosetting adhesive material such as an epoxy resin, a polyimide resin, or a silicon resin. This may be used in the form of a sheet to form an insulating adhesive layer 152 and attached to the metal layer 541, or an adhesive material may be applied to the surface of the metal layer 541 to a predetermined thickness to form the insulating adhesive layer 152. Good.

  Next, after the sheet 150 shown in FIG. 5C is aligned with the upper surface of the ceramic multilayer substrate 110 shown in FIG. While adhering to the ceramic multilayer substrate 110, the upper surface side wiring layer 118 and the conductive resin 156 are electrically connected. In addition, if this conductive resin 156 has adhesiveness, stronger connection can be achieved.

  As conditions for pressurization and heating, for example, using a mold, preliminary pressurization and heat treatment at a temperature of 170 ° C. and a pressure of 80 kPa, followed by further pressurization and heating in a reduced pressure atmosphere at a temperature of 200 ° C. and a pressure of 2 MPa. If treated, strong adhesion can be achieved. This state is shown in FIG.

  Thereafter, as shown in FIG. 6B, unnecessary portions of the metal layer 541 on the resin wiring board of the sheet 150 are removed by etching or the like to form a wiring layer 154. As a result, the sheet 150 functions as a resin wiring board having a single-layer structure, and can be used as a component built-in circuit module substrate in this state. Further, by mounting a passive component such as a capacitor or a resistor or a functional component such as an IC on the wiring layer 154, it can be used as a circuit module substrate with a higher function component.

  In Example 2, a component built-in circuit module substrate having a structure in which a multilayered resin wiring board 170 is further laminated on the ceramic multilayer substrate 110 is manufactured.

  FIG. 7 is a cross-sectional view for explaining a process of producing a lamination sheet 160 to be laminated on the sheet 150 to obtain a multilayer structure. The laminating sheet 160 includes a metal layer 641 and an insulating adhesive layer 162, and has the same configuration as the sheet 150 described with reference to FIG. This is shown in FIG.

  Next, an opening 661 is formed at a location where the sheet 150 is connected to the wiring layer 154. The opening 661 can be formed by the same method as that for the sheet 150. FIG. 7B shows a state where the opening 661 is formed. Thereafter, the opening 661 is filled with a conductive resin 166. This filling may be performed by the same material and the same method as those for the sheet 150. FIG. 7C shows a state in which the conductive resin 166 is filled and formed into a shape that can be attached to the sheet 150.

  Next, after aligning a predetermined position of the wiring layer 154 of the sheet 150 and the conductive resin 166 of the laminating sheet 160, it is bonded by applying pressure and heat, and the conductive resin 166 and the wiring layer 154 are bonded together. Make electrical connections. This adhesion can be performed by the same method as that for adhering the sheet 150 onto the ceramic multilayer substrate 110.

  Thereafter, an unnecessary region of the metal layer 641 of the lamination sheet 160 is removed by etching to form a wiring layer 164. This state is shown in FIG. A chip capacitor 180 is mounted on the wiring layer 164 to complete a component built-in circuit module substrate as shown in FIG. Instead of the chip capacitor 180, for example, a passive component such as a capacitor, a resistor or an inductor, or an IC can be mounted.

  In the component built-in circuit module substrate of Example 2, the IC chip 130 is built in the cavity 122 of the ceramic multilayer substrate 110, and various electronic components 180 can be mounted on the surface of the resin wiring board 170 on the cavity 122. In addition, for example, since the IC and the chip capacitor can be connected with the shortest wiring distance, the high-speed operation of the IC and the high-frequency circuit can be easily handled.

  In the component built-in circuit module substrate according to the second embodiment, the island-like electrode 125 is formed on the bottom surface 123 of the cavity 122 at a position where the IC chip 130 faces, and the surface roughness of the island-like electrode 125 is set to be higher than that of other portions. Since the size is reduced, the thermosetting resin 140 can be disposed between the island-shaped electrode 125 and the IC chip 130 without generating a gap. Therefore, it is possible to prevent the IC chip 130 from being damaged due to insufficient diffusion of heat generated in the IC chip 130 due to the air gap. In addition, the moisture and gas accumulated in the gap expand due to heating when the sheets 150 and 160 are pressed to the ceramic multilayer substrate 110, and the IC chip 130 and the thermosetting resin 140 are peeled off. In addition, it is possible to prevent a disadvantage that a solder flash of the bump 132 occurs and causes a short circuit. Further, it is possible to prevent the IC chip 130 and the bump 132 of the IC chip from being damaged by applying an excessive stress.

  Further, since the island-shaped electrode 125 is formed in the vicinity of the IC chip 130, the heat accompanying the operation of the IC chip 130 is efficiently applied to the ceramic multilayer substrate 110 via the thermosetting resin 140 and the island-shaped electrode 125. Can diffuse. Therefore, the cooling efficiency of the IC chip 130 can be improved, and the failure of the IC chip 130 can be further effectively prevented. Further, since the bottom surface 123 of the cavity 122 other than the island-shaped electrode 125 and the surface of the electrode pad 124 are roughened, the adhesive force of the thermosetting resin 140 can be secured, and the thermosetting resin 140 is the bottom of the cavity 122. It does not peel off from the surface 123 or the electrode pad 124.

  Further, since the island electrode 125 is connected to the ground terminal of the inner wiring layer 116, the island electrode 125 can be prevented from becoming a floating electrode, and noise to the IC chip 130 can be effectively removed.

  In the second embodiment, the case where only one IC is mounted in the cavity has been described. However, the present invention is not limited to this. For example, ICs and passive components may be mixed and mounted, or a plurality of ICs may be mounted. Further, the number of cavities is not limited to one, and a plurality of cavities may be arranged.

  Moreover, although Example 2 demonstrated the case of the single layer structure and the two-layer structure as a resin wiring board, this invention is not limited to this. Further, even a configuration with multiple layers can be manufactured by the same method. Further, the ceramic multilayer substrate is not limited to the method of manufacturing two green sheets bonded together. For example, three or more green sheets may be bonded together to form a multilayer ceramic multilayer substrate.

  <Summary> As described above, in the component built-in circuit module, the island-shaped electrode having a small surface roughness is formed on the surface facing the IC chip mounted on the substrate. It is possible to prevent the generation of voids in the resin filled in between.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

It is the schematic cross section which showed the manufacturing method of the component built-in circuit module board. (Example 1) It is a top view of a ceramic substrate. (Example 1) It is (a) sectional drawing and (b) top view of a component built-in circuit module board. (Example 2) It is sectional drawing explaining the process of mounting an IC chip on a ceramic multilayer substrate, and filling a thermosetting resin. (Example 2) It is sectional drawing which shows the process of producing the 1st layer resin wiring board. (Example 2) It is sectional drawing which shows the state which adhered the sheet | seat on the ceramic multilayer substrate. (Example 2) It is sectional drawing which shows the process of producing the 2nd layer resin wiring board. (Example 2) It is sectional drawing which shows the state which the resin wiring board of the 2nd layer was adhere | attached and completed. (Example 2) It is sectional drawing of a component built-in circuit module board. (Conventional example)

Explanation of symbols

10 Wiring board (ceramic board)
11 Upper surface (mounting surface)
12 Upper wiring layer (conductive pattern)
13 Island-shaped electrode (conductive pattern, island-shaped conductive pattern)
16 IC chip (electronic parts)
18 Bump 20 Sealing resin 122 Cavity (concave)
123 Bottom surface (mounting surface)
125 Island-shaped electrode (conductive pattern, island-shaped conductive pattern)
130 IC chip (electronic component)

Claims (4)

A plurality of wiring boards in which a conductive pattern is formed and stacked;
An electronic component mounted on at least one of the plurality of wiring boards;
A component built-in circuit module substrate comprising a sealing resin that is partially filled between the electronic component and the wiring board on which the electronic component is mounted to seal the electronic component,
At least one wiring board on which the electronic component is mounted is connected to the electronic component in a region facing the electronic component on a surface on which the electronic component is mounted (hereinafter referred to as a “mounting surface”). The surface roughness of the portion excluding the portion for the purpose (hereinafter referred to as “connection terminal portion”) is larger than the surface roughness of the region other than the region facing the electronic component (hereinafter referred to as “non-opposing region”). rather small,
The conductive pattern,
Formed in a central portion of the region opposite to the electronic component in the mounting surface, the island Joshirubeden pattern that Mashimasu extending away from the connection terminal portion,
A terminal electrode that is formed on at least the connection terminal portion in a region facing the electronic component on the mounting surface and surrounds the periphery of the island-shaped conductive pattern;
Including
The island surface roughness of the conductive pattern is characterized by smaller than the surface roughness of the terminal electrodes, parts products internal circuit module board. In the mounting surface, the surface roughness of the island-like conductive pattern is characterized in that the smaller than the surface roughness of the portion except for the portion where the conductive pattern is formed of the non-facing regions, to claim 1 The component built-in circuit module board described. The wiring board in which the electronic component is mounted is the mounting surface is formed in a recess set back from the main surface, wherein the island-like conductive pattern on the mounting surface is formed, according to claim 2 The circuit module board with built-in components according to 1. The conductive pattern is characterized in that at least one of said connecting pin and said island-like conductive pattern is connected, component built-in circuit module board according to any one of claims 1 to 3.

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