JP7000308B2 - 熱排出が改善された構成素子 - Google Patents

熱排出が改善された構成素子 Download PDF

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Publication number
JP7000308B2
JP7000308B2 JP2018500891A JP2018500891A JP7000308B2 JP 7000308 B2 JP7000308 B2 JP 7000308B2 JP 2018500891 A JP2018500891 A JP 2018500891A JP 2018500891 A JP2018500891 A JP 2018500891A JP 7000308 B2 JP7000308 B2 JP 7000308B2
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Prior art keywords
substrate
constituent element
heat
conductive material
heat conductive
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JP2018500891A
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English (en)
Japanese (ja)
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JP2018522483A (ja
JP2018522483A5 (enExample
Inventor
イェブワ、トマシュ
マイスター、ファイト
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スナップトラック・インコーポレーテッド
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Publication of JP2018522483A publication Critical patent/JP2018522483A/ja
Publication of JP2018522483A5 publication Critical patent/JP2018522483A5/ja
Priority to JP2021181183A priority Critical patent/JP2022020759A/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6489—Compensation of undesirable effects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2018500891A 2015-07-13 2016-06-15 熱排出が改善された構成素子 Active JP7000308B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021181183A JP2022020759A (ja) 2015-07-13 2021-11-05 熱排出が改善された構成素子

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015111307.4A DE102015111307A1 (de) 2015-07-13 2015-07-13 Bauelement mit verbesserter Wärmeableitung
DE102015111307.4 2015-07-13
PCT/EP2016/063748 WO2017008981A1 (de) 2015-07-13 2016-06-15 Bauelement mit verbesserter wärmeableitung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021181183A Division JP2022020759A (ja) 2015-07-13 2021-11-05 熱排出が改善された構成素子

Publications (3)

Publication Number Publication Date
JP2018522483A JP2018522483A (ja) 2018-08-09
JP2018522483A5 JP2018522483A5 (enExample) 2019-06-27
JP7000308B2 true JP7000308B2 (ja) 2022-01-19

Family

ID=56137321

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018500891A Active JP7000308B2 (ja) 2015-07-13 2016-06-15 熱排出が改善された構成素子
JP2021181183A Withdrawn JP2022020759A (ja) 2015-07-13 2021-11-05 熱排出が改善された構成素子

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021181183A Withdrawn JP2022020759A (ja) 2015-07-13 2021-11-05 熱排出が改善された構成素子

Country Status (8)

Country Link
US (1) US11303263B2 (enExample)
EP (1) EP3323200B1 (enExample)
JP (2) JP7000308B2 (enExample)
KR (1) KR102667425B1 (enExample)
CN (1) CN107710609B (enExample)
BR (1) BR112018000747B1 (enExample)
DE (1) DE102015111307A1 (enExample)
WO (1) WO2017008981A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10574208B2 (en) * 2017-06-20 2020-02-25 Skyworks Solutions, Inc. Acoustic wave filters with thermally conductive sheet
DE102018108605A1 (de) * 2018-04-11 2019-10-17 RF360 Europe GmbH SAW-Resonator mit verbesserter Leistungsbeständigkeit und Wärmeresistenz und SAW-Resonator umfassendes HF-Filter
CN111934649B (zh) * 2020-09-16 2021-02-23 苏州日月新半导体有限公司 集成电路装置及其制造方法
US20240063773A1 (en) * 2022-08-17 2024-02-22 Skyworks Solutions, Inc. Multilayer piezoelectric substrate packaging
JP2024062540A (ja) * 2022-10-25 2024-05-10 三安ジャパンテクノロジー株式会社 弾性波デバイス、および、弾性波デバイスの製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347488A (ja) 2002-05-27 2003-12-05 Denso Corp 半導体装置およびその製造方法
JP2005217670A (ja) 2004-01-28 2005-08-11 Kyocera Corp 弾性表面波装置および通信装置
JP2005223580A (ja) 2004-02-05 2005-08-18 Matsushita Electric Ind Co Ltd 弾性表面波素子、弾性表面波デバイス及びその製造方法
JP2005325348A (ja) 2004-05-11 2005-11-24 Internatl Business Mach Corp <Ibm> 熱インターフェース接着剤及び再加工
JP2013066042A (ja) 2011-09-16 2013-04-11 Murata Mfg Co Ltd 電子装置およびその製造方法ならびに弾性波装置
JP2013131711A (ja) 2011-12-22 2013-07-04 Taiyo Yuden Co Ltd 電子部品

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US5459368A (en) * 1993-08-06 1995-10-17 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module
EP1139412A1 (de) 2000-03-30 2001-10-04 Infineon Technologies AG Flip-chip Halbleiterbauelement mit Rückseitenkontaktierung
DE10136743B4 (de) * 2001-07-27 2013-02-14 Epcos Ag Verfahren zur hermetischen Verkapselung eines Bauelementes
DE60327962D1 (de) 2002-04-03 2009-07-30 Panasonic Corp Eingebautes Halbleitermodul im Millimeterwellenband
US6825559B2 (en) * 2003-01-02 2004-11-30 Cree, Inc. Group III nitride based flip-chip intergrated circuit and method for fabricating
US6992400B2 (en) 2004-01-30 2006-01-31 Nokia Corporation Encapsulated electronics device with improved heat dissipation
JP4992908B2 (ja) 2006-11-13 2012-08-08 株式会社村田製作所 弾性境界波素子、弾性境界波装置及び弾性境界波装置の製造方法
JP5188120B2 (ja) * 2007-08-10 2013-04-24 新光電気工業株式会社 半導体装置
EP2555239A3 (en) * 2011-08-04 2013-06-05 Sony Mobile Communications AB Thermal package with heat slug for die stacks
US9406579B2 (en) 2012-05-14 2016-08-02 STATS ChipPAC Pte. Ltd. Semiconductor device and method of controlling warpage in semiconductor package
KR20140009731A (ko) * 2012-07-12 2014-01-23 삼성전자주식회사 방열부를 포함하는 반도체 칩 및 그 반도체 칩 제조 방법
DE102012107668A1 (de) 2012-08-21 2014-03-20 Epcos Ag Bauelementanordnung
WO2014204447A1 (en) * 2013-06-18 2014-12-24 Intel Corporation Integrated thermoelectric cooling
KR20150021838A (ko) 2013-08-21 2015-03-03 삼성전자주식회사 Led 구동 장치 및 조명 장치
US10483248B2 (en) * 2017-03-23 2019-11-19 Skyworks Solutions, Inc. Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
US10574208B2 (en) * 2017-06-20 2020-02-25 Skyworks Solutions, Inc. Acoustic wave filters with thermally conductive sheet
JP7084744B2 (ja) * 2018-03-12 2022-06-15 太陽誘電株式会社 弾性波デバイス、モジュールおよびマルチプレクサ
JP7057690B2 (ja) * 2018-03-19 2022-04-20 株式会社村田製作所 弾性波装置
JP2019192729A (ja) * 2018-04-23 2019-10-31 株式会社村田製作所 半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347488A (ja) 2002-05-27 2003-12-05 Denso Corp 半導体装置およびその製造方法
JP2005217670A (ja) 2004-01-28 2005-08-11 Kyocera Corp 弾性表面波装置および通信装置
JP2005223580A (ja) 2004-02-05 2005-08-18 Matsushita Electric Ind Co Ltd 弾性表面波素子、弾性表面波デバイス及びその製造方法
JP2005325348A (ja) 2004-05-11 2005-11-24 Internatl Business Mach Corp <Ibm> 熱インターフェース接着剤及び再加工
JP2013066042A (ja) 2011-09-16 2013-04-11 Murata Mfg Co Ltd 電子装置およびその製造方法ならびに弾性波装置
JP2013131711A (ja) 2011-12-22 2013-07-04 Taiyo Yuden Co Ltd 電子部品

Also Published As

Publication number Publication date
BR112018000747A2 (pt) 2018-09-04
EP3323200B1 (de) 2020-08-12
KR102667425B1 (ko) 2024-05-17
US20180219526A1 (en) 2018-08-02
JP2018522483A (ja) 2018-08-09
EP3323200A1 (de) 2018-05-23
WO2017008981A1 (de) 2017-01-19
JP2022020759A (ja) 2022-02-01
KR20180029199A (ko) 2018-03-20
CN107710609B (zh) 2021-03-16
BR112018000747B1 (pt) 2023-03-28
CN107710609A (zh) 2018-02-16
DE102015111307A1 (de) 2017-01-19
US11303263B2 (en) 2022-04-12

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