JP2010530620A5 - - Google Patents

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Publication number
JP2010530620A5
JP2010530620A5 JP2010512589A JP2010512589A JP2010530620A5 JP 2010530620 A5 JP2010530620 A5 JP 2010530620A5 JP 2010512589 A JP2010512589 A JP 2010512589A JP 2010512589 A JP2010512589 A JP 2010512589A JP 2010530620 A5 JP2010530620 A5 JP 2010530620A5
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JP
Japan
Prior art keywords
electrode
semiconductor component
bus
component according
substrate
Prior art date
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Application number
JP2010512589A
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English (en)
Japanese (ja)
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JP2010530620A (ja
JP5586025B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/EP2008/004839 external-priority patent/WO2008155086A1/de
Publication of JP2010530620A publication Critical patent/JP2010530620A/ja
Publication of JP2010530620A5 publication Critical patent/JP2010530620A5/ja
Application granted granted Critical
Publication of JP5586025B2 publication Critical patent/JP5586025B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010512589A 2007-06-18 2008-06-16 基板の平面を全面に渡って覆うバスを備えた半導体部品、その製造方法、及び半導体部品を備えた装置 Expired - Fee Related JP5586025B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007028458.8 2007-06-18
DE102007028458 2007-06-18
PCT/EP2008/004839 WO2008155086A1 (de) 2007-06-18 2008-06-16 Halbleiterbauelement mit ringförmig geschlossener kontaktierung

Publications (3)

Publication Number Publication Date
JP2010530620A JP2010530620A (ja) 2010-09-09
JP2010530620A5 true JP2010530620A5 (enExample) 2011-07-21
JP5586025B2 JP5586025B2 (ja) 2014-09-10

Family

ID=39705044

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010512588A Pending JP2010530619A (ja) 2007-06-18 2008-06-16 垂直コンタクト部を備える電気回路
JP2010512589A Expired - Fee Related JP5586025B2 (ja) 2007-06-18 2008-06-16 基板の平面を全面に渡って覆うバスを備えた半導体部品、その製造方法、及び半導体部品を備えた装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2010512588A Pending JP2010530619A (ja) 2007-06-18 2008-06-16 垂直コンタクト部を備える電気回路

Country Status (4)

Country Link
US (2) US20100182073A1 (enExample)
EP (2) EP2165363B1 (enExample)
JP (2) JP2010530619A (enExample)
WO (2) WO2008155085A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012033174A1 (ja) 2010-09-08 2012-03-15 大日本印刷株式会社 照明装置、投射装置および投写型映像表示装置
KR20130013189A (ko) 2011-07-27 2013-02-06 삼성전자주식회사 파워 반도체 소자
KR102008326B1 (ko) 2015-02-20 2019-08-07 비샤이 제너럴 세미컨덕터 엘엘씨 큰 본드 패드 및 감소된 접촉 저항을 갖는 질화갈륨계 쇼트키 다이오드

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