JP2018515782A5 - - Google Patents

Download PDF

Info

Publication number
JP2018515782A5
JP2018515782A5 JP2017560538A JP2017560538A JP2018515782A5 JP 2018515782 A5 JP2018515782 A5 JP 2018515782A5 JP 2017560538 A JP2017560538 A JP 2017560538A JP 2017560538 A JP2017560538 A JP 2017560538A JP 2018515782 A5 JP2018515782 A5 JP 2018515782A5
Authority
JP
Japan
Prior art keywords
optical system
imaging
target
metrology
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017560538A
Other languages
English (en)
Japanese (ja)
Other versions
JP6879939B2 (ja
JP2018515782A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2016/033353 external-priority patent/WO2016187468A1/en
Publication of JP2018515782A publication Critical patent/JP2018515782A/ja
Publication of JP2018515782A5 publication Critical patent/JP2018515782A5/ja
Priority to JP2021077245A priority Critical patent/JP7250064B2/ja
Priority to JP2021077244A priority patent/JP7250063B2/ja
Priority to JP2021077243A priority patent/JP7253006B2/ja
Application granted granted Critical
Publication of JP6879939B2 publication Critical patent/JP6879939B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017560538A 2015-05-19 2016-05-19 オーバレイ計測用トポグラフィック位相制御 Active JP6879939B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021077245A JP7250064B2 (ja) 2015-05-19 2021-04-30 イメージング計量ターゲットおよび計量方法
JP2021077244A JP7250063B2 (ja) 2015-05-19 2021-04-30 光学システム
JP2021077243A JP7253006B2 (ja) 2015-05-19 2021-04-30 光学システム

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562163783P 2015-05-19 2015-05-19
US62/163,783 2015-05-19
US201562222724P 2015-09-23 2015-09-23
US62/222,724 2015-09-23
PCT/US2016/033353 WO2016187468A1 (en) 2015-05-19 2016-05-19 Topographic phase control for overlay measurement

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2021077243A Division JP7253006B2 (ja) 2015-05-19 2021-04-30 光学システム
JP2021077244A Division JP7250063B2 (ja) 2015-05-19 2021-04-30 光学システム
JP2021077245A Division JP7250064B2 (ja) 2015-05-19 2021-04-30 イメージング計量ターゲットおよび計量方法

Publications (3)

Publication Number Publication Date
JP2018515782A JP2018515782A (ja) 2018-06-14
JP2018515782A5 true JP2018515782A5 (https=) 2019-06-13
JP6879939B2 JP6879939B2 (ja) 2021-06-02

Family

ID=57320785

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2017560538A Active JP6879939B2 (ja) 2015-05-19 2016-05-19 オーバレイ計測用トポグラフィック位相制御
JP2021077245A Active JP7250064B2 (ja) 2015-05-19 2021-04-30 イメージング計量ターゲットおよび計量方法
JP2021077244A Active JP7250063B2 (ja) 2015-05-19 2021-04-30 光学システム
JP2021077243A Active JP7253006B2 (ja) 2015-05-19 2021-04-30 光学システム

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2021077245A Active JP7250064B2 (ja) 2015-05-19 2021-04-30 イメージング計量ターゲットおよび計量方法
JP2021077244A Active JP7250063B2 (ja) 2015-05-19 2021-04-30 光学システム
JP2021077243A Active JP7253006B2 (ja) 2015-05-19 2021-04-30 光学システム

Country Status (7)

Country Link
US (5) US10520832B2 (https=)
JP (4) JP6879939B2 (https=)
KR (4) KR102607646B1 (https=)
CN (4) CN112859540B (https=)
SG (3) SG10201912822UA (https=)
TW (4) TWI715582B (https=)
WO (1) WO2016187468A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112859540B (zh) * 2015-05-19 2024-10-18 科磊股份有限公司 成像计量目标及方法
US9989806B2 (en) * 2015-09-10 2018-06-05 Samsung Display Co., Ltd. Color conversion panel and display device including the same
KR102393740B1 (ko) * 2015-12-08 2022-05-02 케이엘에이 코포레이션 편광 타겟 및 편광 조명을 사용한 회절 차수의 진폭 및 위상의 제어
JP7179742B2 (ja) 2017-02-10 2022-11-29 ケーエルエー コーポレイション 散乱計測オーバーレイターゲット及び方法
WO2018226215A1 (en) * 2017-06-06 2018-12-13 Kla-Tencor Corporation Reticle optimization algorithms and optimal target design
EP3454123A1 (en) * 2017-09-06 2019-03-13 ASML Netherlands B.V. Metrology method and apparatus
EP3499312A1 (en) * 2017-12-15 2019-06-19 ASML Netherlands B.V. Metrology apparatus and a method of determining a characteristic of interest
KR102648880B1 (ko) * 2017-11-07 2024-03-15 에이에스엠엘 네델란즈 비.브이. 관심 특성을 결정하는 계측 장치 및 방법
US11085754B2 (en) 2017-12-12 2021-08-10 Kla Corporation Enhancing metrology target information content
EP3521929A1 (en) * 2018-02-02 2019-08-07 ASML Netherlands B.V. Method of determining an optimal focus height for a metrology apparatus
WO2019166190A1 (en) * 2018-02-27 2019-09-06 Stichting Vu Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
WO2019182637A1 (en) * 2018-03-19 2019-09-26 Kla-Tencor Corporation Overlay measurement using multiple wavelengths
US10677588B2 (en) * 2018-04-09 2020-06-09 Kla-Tencor Corporation Localized telecentricity and focus optimization for overlay metrology
US10622238B2 (en) * 2018-06-07 2020-04-14 Kla-Tencor Corporation Overlay measurement using phase and amplitude modeling
US11281111B2 (en) 2018-08-28 2022-03-22 Kla-Tencor Corporation Off-axis illumination overlay measurement using two-diffracted orders imaging
US12130246B2 (en) * 2018-12-31 2024-10-29 Asml Netherlands B.V. Method for overlay metrology and apparatus thereof
JP7254217B2 (ja) 2019-02-14 2023-04-07 ケーエルエー コーポレイション 誘導されたトポグラフィを利用した半導体デバイスウェハの位置ずれを測定するためのシステムと方法
WO2020190318A1 (en) * 2019-03-21 2020-09-24 Kla Corporation Parameter-stable misregistration measurement amelioration in semiconductor devices
US11703460B2 (en) * 2019-07-09 2023-07-18 Kla Corporation Methods and systems for optical surface defect material characterization
US11914290B2 (en) 2019-07-24 2024-02-27 Kla Corporation Overlay measurement targets design
US11346657B2 (en) * 2020-05-22 2022-05-31 Kla Corporation Measurement modes for overlay
KR102825815B1 (ko) * 2020-06-18 2025-06-27 삼성전자주식회사 스루-포커스 이미지 기반 계측 장치, 그것의 동작 방법, 및 그 동작을 실행하는 컴퓨팅 장치
CN112465694B (zh) * 2020-11-27 2024-10-15 中国科学院西安光学精密机械研究所 基于相位变化的医学图像数据增广方法
US11713959B2 (en) * 2021-03-17 2023-08-01 Kla Corporation Overlay metrology using spectroscopic phase
KR20240018489A (ko) * 2021-06-09 2024-02-13 에이에스엠엘 네델란즈 비.브이. 애퍼처 아포디제이션을 갖는 구조적 조명을 이용한 레티클 입자 검출을 위한 검사 시스템
CN113467033A (zh) * 2021-06-24 2021-10-01 南昌欧菲光电技术有限公司 一种摄像头模组及其透镜的定位方法
CN113777731A (zh) * 2021-08-11 2021-12-10 中国工程物理研究院应用电子学研究所 一种共轴反转环型连续变密度衰减器装置及其工作方法
CN113985711B (zh) * 2021-10-28 2024-02-02 无锡卓海科技股份有限公司 一种套刻测量装置
KR102874693B1 (ko) * 2023-08-17 2025-10-29 (주) 오로스테크놀로지 이미지 기반 오버레이 시스템에서 위상 이미지 획득 장치 및 방법
US12411420B2 (en) * 2023-09-29 2025-09-09 Kla Corporation Small in-die target design for overlay measurement

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4644172A (en) * 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
US5666197A (en) * 1996-08-21 1997-09-09 Polaroid Corporation Apparatus and methods employing phase control and analysis of evanescent illumination for imaging and metrology of subwavelength lateral surface topography
JPH10284370A (ja) * 1997-04-03 1998-10-23 Nikon Corp 焦点位置検出装置及び該装置を備えた投影露光装置
JP2001307975A (ja) * 2000-02-18 2001-11-02 Nikon Corp 荷電粒子線露光装置及び半導体デバイスの製造方法
US7317531B2 (en) 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US6891627B1 (en) * 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
JP2002170760A (ja) * 2000-12-01 2002-06-14 Nikon Corp 荷電粒子ビーム露光装置、荷電粒子ビーム露光方法及びデバイス製造方法
US7072502B2 (en) * 2001-06-07 2006-07-04 Applied Materials, Inc. Alternating phase-shift mask inspection method and apparatus
US6794671B2 (en) * 2002-07-17 2004-09-21 Particle Sizing Systems, Inc. Sensors and methods for high-sensitivity optical particle counting and sizing
WO2004053426A1 (en) * 2002-12-05 2004-06-24 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7230704B2 (en) * 2003-06-06 2007-06-12 Tokyo Electron Limited Diffracting, aperiodic targets for overlay metrology and method to detect gross overlay
JP4734261B2 (ja) * 2004-02-18 2011-07-27 ケーエルエー−テンカー コーポレイション 連続変化するオフセットマークと、オーバレイ決定方法
DE102005006724A1 (de) * 2004-10-20 2006-08-10 Universität Stuttgart Verfahren und Anordung zur konfokalen Spektral-Interferometrie, insbesondere auch zur optischen Kohärenz-Tomografie (OCT)und/oder optischen Kohärenz-Mikroskopie (OCM)von biologischen und technischen Objekten
US20060164649A1 (en) * 2005-01-24 2006-07-27 Eliezer Rosengaus Multi-spectral techniques for defocus detection
DE102006016131A1 (de) * 2005-09-22 2007-03-29 Robert Bosch Gmbh Interferometrische Messvorrichtung
JP2007140212A (ja) * 2005-11-18 2007-06-07 Toshiba Corp フォトマスク及び半導体装置の製造方法
JP2009523574A (ja) * 2006-01-18 2009-06-25 ザ ジェネラル ホスピタル コーポレイション 1つ又は複数の内視鏡顕微鏡検査法を使用してデータを生成するシステム及び方法
US7408642B1 (en) * 2006-02-17 2008-08-05 Kla-Tencor Technologies Corporation Registration target design for managing both reticle grid error and wafer overlay
DE102006021557B3 (de) * 2006-05-08 2007-07-12 Carl Mahr Holding Gmbh Vorrichtung und Verfahren zur kombinierten interferometrischen und abbildungsbasierten Geometrieerfassung, insbesondere in der Mikrosystemtechnik
US7528941B2 (en) 2006-06-01 2009-05-05 Kla-Tencor Technolgies Corporation Order selected overlay metrology
KR20100014357A (ko) * 2007-04-12 2010-02-10 가부시키가이샤 니콘 계측 방법, 노광 방법 및 디바이스 제조 방법
JP4966724B2 (ja) * 2007-04-20 2012-07-04 キヤノン株式会社 露光装置及びデバイス製造方法
WO2008134378A1 (en) * 2007-04-26 2008-11-06 Kla-Tencor Corporation Optical gain approach for enhancement of overlay and alignment systems performance
US7869022B2 (en) * 2007-07-18 2011-01-11 Asml Netherlands B.V. Inspection method and apparatus lithographic apparatus, lithographic processing cell, device manufacturing method and distance measuring system
US20090034071A1 (en) * 2007-07-31 2009-02-05 Dean Jennings Method for partitioning and incoherently summing a coherent beam
US8148663B2 (en) * 2007-07-31 2012-04-03 Applied Materials, Inc. Apparatus and method of improving beam shaping and beam homogenization
US9239455B2 (en) * 2007-12-31 2016-01-19 Stc.Unm Structural illumination and evanescent coupling for the extension of imaging interferometric microscopy
NL1036857A1 (nl) 2008-04-21 2009-10-22 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method.
JP5319978B2 (ja) * 2008-07-28 2013-10-16 株式会社日立メディアエレクトロニクス 光ピックアップ装置、光ディスク装置および回折格子
US8531648B2 (en) * 2008-09-22 2013-09-10 Asml Netherlands B.V. Lithographic apparatus, programmable patterning device and lithographic method
JP5361322B2 (ja) * 2008-10-14 2013-12-04 キヤノン株式会社 露光装置及びデバイスの製造方法
DE102009044151B4 (de) * 2009-05-19 2012-03-29 Kla-Tencor Mie Gmbh Vorrichtung zur optischen Waferinspektion
JP5545782B2 (ja) * 2009-07-31 2014-07-09 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置の焦点測定方法、散乱計、リソグラフィシステム、およびリソグラフィセル
CN101699265A (zh) * 2009-10-28 2010-04-28 上海理工大学 动态偏振光散射颗粒测量装置及测量方法
US8896832B2 (en) 2010-06-17 2014-11-25 Kla-Tencor Corp. Discrete polarization scatterometry
KR101793538B1 (ko) 2010-07-19 2017-11-03 에이에스엠엘 네델란즈 비.브이. 오버레이 오차를 결정하는 장치 및 방법
US9927718B2 (en) 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
US9007584B2 (en) * 2010-12-27 2015-04-14 Nanometrics Incorporated Simultaneous measurement of multiple overlay errors using diffraction based overlay
US9104120B2 (en) * 2011-02-10 2015-08-11 Kla-Tencor Corporation Structured illumination for contrast enhancement in overlay metrology
US20120224183A1 (en) * 2011-03-02 2012-09-06 Zygo Corporation Interferometric metrology of surfaces, films and underresolved structures
JP5731063B2 (ja) * 2011-04-08 2015-06-10 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置、プログラマブル・パターニングデバイス、及びリソグラフィ方法
US8582114B2 (en) 2011-08-15 2013-11-12 Kla-Tencor Corporation Overlay metrology by pupil phase analysis
EP2841875A4 (en) * 2012-04-23 2016-01-20 Univ Ben Gurion HIGH-RESOLUTION OPTICAL FULL-FIELD COHERENCE TOMOGRAPHY WITH GENUINE SPECTROSCOPIC DOUBLE MODE USING LIQUID CRYSTAL DEVICES
KR102231730B1 (ko) 2012-06-26 2021-03-24 케이엘에이 코포레이션 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거
US8913237B2 (en) * 2012-06-26 2014-12-16 Kla-Tencor Corporation Device-like scatterometry overlay targets
US9329033B2 (en) 2012-09-05 2016-05-03 Kla-Tencor Corporation Method for estimating and correcting misregistration target inaccuracy
WO2014062972A1 (en) * 2012-10-18 2014-04-24 Kla-Tencor Corporation Symmetric target design in scatterometry overlay metrology
US9581430B2 (en) * 2012-10-19 2017-02-28 Kla-Tencor Corporation Phase characterization of targets
US9875946B2 (en) * 2013-04-19 2018-01-23 Kla-Tencor Corporation On-device metrology
US9189705B2 (en) * 2013-08-08 2015-11-17 JSMSW Technology LLC Phase-controlled model-based overlay measurement systems and methods
CN103411557B (zh) * 2013-08-15 2016-02-03 哈尔滨工业大学 阵列照明的角谱扫描准共焦环形微结构测量装置与方法
WO2015113724A1 (en) * 2014-02-03 2015-08-06 Asml Netherlands B.V. Metrology method and apparatus, substrate, lithographic system and device manufacturing method
WO2015124397A1 (en) * 2014-02-21 2015-08-27 Asml Netherlands B.V. Optimization of target arrangement and associated target
KR102345196B1 (ko) * 2014-04-07 2021-12-29 노바 메주어링 인스트루먼츠 엘티디. 광학 위상 측정 방법 및 시스템
US20150355098A1 (en) * 2014-05-06 2015-12-10 California Institute Of Technology Rotating scattering plane based nonlinear optical spectrometer to study the crystallographic and electronic symmetries of crystals
CN112698551B (zh) 2014-11-25 2024-04-23 科磊股份有限公司 分析及利用景观
CN112859540B (zh) * 2015-05-19 2024-10-18 科磊股份有限公司 成像计量目标及方法

Similar Documents

Publication Publication Date Title
JP2018515782A5 (https=)
JP7250063B2 (ja) 光学システム
CN111433678B (zh) 测量方法、图案化设备以及设备制造方法
JP6346296B2 (ja) メトロロジー方法及び装置、基板、リソグラフィシステム並びにデバイス製造方法
JP6917477B2 (ja) リソグラフィ装置及びリソグラフィ方法
JP2006060214A (ja) 角度分解した分光リソグラフィの特徴付けの方法および装置
JP5816297B2 (ja) マスク上の構造を特徴付ける方法及び方法を実施するためのデバイス
TW201730622A (zh) 物鏡系統
US20150022796A1 (en) Interferometer, lithography apparatus, and method of manufacturing article
US9268124B2 (en) Microscope and method for characterizing structures on an object
TW201001088A (en) Position detection apparatus, position detection method, exposure apparatus, and semiconductor device fabrication method
KR102102242B1 (ko) 리소그래피 장치 정렬 센서 및 방법
US20170176714A1 (en) Focus Monitoring Arrangement and Inspection Apparatus Including Such an Arrangement
US20220172347A1 (en) Detection apparatus for simultaneous acquisition of multiple diverse images of an object
KR20190090861A (ko) 계측 장치로부터의 조명 특성을 모니터링하기 위한 방법
US20090280418A1 (en) Exposure apparatus, correction method, and device manufacturing method
JP2019179237A (ja) リソグラフィマスクのフォーカス位置を決定する方法及びそのような方法を実行するための計測系
US20180299787A1 (en) Method for measuring an angularly resolved intensity distribution and projection exposure apparatus
US11300892B2 (en) Sensor apparatus and method for lithographic measurements
KR101826127B1 (ko) 광학적 웨이퍼 검사 장치
US20110013196A1 (en) Measurement apparatus and method of manufacturing optical system
JP2005127981A (ja) 干渉計測装置
Goldberg et al. Collecting EUV mask images through focus by wavelength tuning
US12572085B2 (en) Device and method for measuring substrates for semiconductor lithography
US20250314975A1 (en) Focus measurment and control in metrology and associated wedge arrangement