JP2018506595A - プライマーレスハードコート組成物 - Google Patents
プライマーレスハードコート組成物 Download PDFInfo
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- JP2018506595A JP2018506595A JP2017530006A JP2017530006A JP2018506595A JP 2018506595 A JP2018506595 A JP 2018506595A JP 2017530006 A JP2017530006 A JP 2017530006A JP 2017530006 A JP2017530006 A JP 2017530006A JP 2018506595 A JP2018506595 A JP 2018506595A
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- coating composition
- article
- coating
- adhesion promoter
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- 239000000203 mixture Substances 0.000 title claims description 16
- 239000008199 coating composition Substances 0.000 claims abstract description 76
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000001257 hydrogen Substances 0.000 claims abstract description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 5
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims abstract description 4
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 claims abstract description 4
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 4
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 4
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims description 33
- 239000011248 coating agent Substances 0.000 claims description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 21
- -1 polyethylene Polymers 0.000 claims description 18
- 239000008119 colloidal silica Substances 0.000 claims description 16
- 239000003054 catalyst Substances 0.000 claims description 14
- 239000006185 dispersion Substances 0.000 claims description 14
- 229920000515 polycarbonate Polymers 0.000 claims description 11
- 239000004417 polycarbonate Substances 0.000 claims description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 238000009833 condensation Methods 0.000 claims description 9
- 230000005494 condensation Effects 0.000 claims description 9
- 239000011230 binding agent Substances 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 241000270728 Alligator Species 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229920001893 acrylonitrile styrene Polymers 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- MAYCNCJAIFGQIH-UHFFFAOYSA-N buta-1,3-diene 5-phenylpenta-2,4-dienenitrile Chemical compound C=CC=C.N#CC=CC=CC1=CC=CC=C1 MAYCNCJAIFGQIH-UHFFFAOYSA-N 0.000 claims description 2
- 239000003431 cross linking reagent Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 claims description 2
- 229920001897 terpolymer Polymers 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 11
- 239000002904 solvent Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 238000006460 hydrolysis reaction Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 230000007062 hydrolysis Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 5
- 239000002987 primer (paints) Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 229920006352 transparent thermoplastic Polymers 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 239000013500 performance material Substances 0.000 description 4
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 3
- 238000003856 thermoforming Methods 0.000 description 3
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229920004142 LEXAN™ Polymers 0.000 description 2
- 239000004418 Lexan Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000004447 silicone coating Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- WLJVXDMOQOGPHL-PPJXEINESA-N 2-phenylacetic acid Chemical compound O[14C](=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-PPJXEINESA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- 229940106681 chloroacetic acid Drugs 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000001246 colloidal dispersion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000008131 herbal destillate Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CXKWCBBOMKCUKX-UHFFFAOYSA-M methylene blue Chemical compound [Cl-].C1=CC(N(C)C)=CC2=[S+]C3=CC(N(C)C)=CC=C3N=C21 CXKWCBBOMKCUKX-UHFFFAOYSA-M 0.000 description 1
- YYGBVRCTHASBKD-UHFFFAOYSA-M methylene green Chemical compound [Cl-].C1=CC(N(C)C)=C([N+]([O-])=O)C2=[S+]C3=CC(N(C)C)=CC=C3N=C21 YYGBVRCTHASBKD-UHFFFAOYSA-M 0.000 description 1
- 229960000907 methylthioninium chloride Drugs 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000001283 organosilanols Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920005613 synthetic organic polymer Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
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- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
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- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
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Abstract
Description
本出願は、2014年12月23日に出願された米国特許仮出願第62/095,804号の優先権および利益を主張し、この出願の全内容は参照によって本願に取り込まれる。
U−Q−R1−SiR2 gR3 (3−g) (1)
式中、Qは−CH2CH(OH)−CH2−O−または−CH2CH(OH)CH2−NR4−;Uは:
−O−(C6HhR2 (4−h)−CR5−C6HhR2 (4−h)−O−CH2CH(OH)CH2−O)i−C6HhR2 (4−h)−CR5−C6HhR2 (4−h)−O−J;
ここでR2は独立して、C1〜C10アルキル基または置換もしくは非置換のフェニル基から選択され;R3は独立して、アルコキシ、アセトキシ、またはケトオキシムラジカルから選択され;R1はC1〜C4アルキレン;gは0〜2;hは0〜4;R4は水素または−CH2CH(OH)CH2−U−;R5は独立して水素またはアルキル;iは0〜100;そしてJはH、Q−R1−SiR2 hR3 (3−h)、または
であり、ここでmは1〜20である。
U−Q−R1−SiR2 gR3 (3−g) (1)
式中、Qは−CH2CH(OH)−CH2−O−または−CH2CH(OH)CH2−NR4−;Uは:
−O−(C6HhR2 (4−h)−CR5−C6HhR2 (4−h)−O−CH2CH(OH)CH2−O)i−C6HhR2 (4−h)−CR5−C6HhR2 (4−h)−O−J;
ここでR2は独立して、C1〜C10アルキル基または置換もしくは非置換のフェニル基から選択され;R3は独立して、アルコキシ、アセトキシ、またはケトオキシムラジカルから選択され;R1はC1〜C4アルキレン;gは0〜2;hは0〜4;R4は水素または−CH2CH(OH)CH2−U−;R5は独立して水素またはアルキルから選択され;iは0〜100;そしてJはH、Q−R1−SiR2 hR3 (3−h)、または式(2):
であり、ここでmは1〜20である。
またはこれらの組み合わせを有する。
4インチ(約100ミリメートル)掛ける6インチ(約150ミリメートル)のポリカーボネート製プラーク(サビック社のLexan登録商標)をイソプロパノールで洗浄し、自然乾燥した。次いで、液状のコーティング材料を、洗浄したプラーク上に流してコーティングした。過剰のコーティング材料は、プラークを垂直に保って、流れ去るようにした。コーティングは少なくとも5分間自然乾燥し、その後120℃のオーブン中で一時間硬化した。
接着性は、ASTM D3359に準拠したクロスハッチ接着試験を用いて測定した。接着性は5B〜0Bの尺度で格付けし、5Bがコーティングの最も高い接着性を示し、0Bがコーティングの完全な喪失を示す。
モメンティブ・スペシャリティー・ケミカルズ社のEPON登録商標828、モメンティブ・パフォーマンス・マテリアルズ社のSilquest A−1100、およびキシレンを、温度計、凝縮器、および窒素流入口を備えた3口丸底フラスコに、以下の表1に特定した量で仕込んだ。この溶液を窒素ガスでパージし、次いで80℃で6時間加熱した。
モメンティブ・スペシャリティー・ケミカルズ社のEPON登録商標828、モメンティブ・パフォーマンス・マテリアルズ社のSilquest A−1100、およびキシレンを、温度計、凝縮器、および窒素流入口を備えた3口丸底フラスコに、以下の表2に特定した量で仕込んだ。この溶液を窒素ガスでパージし、次いで80℃で6時間加熱した。
コーティング配合物を雰囲気条件下で、表3にしたがってブレンドした。120℃で一時間硬化した後、ASTM D3359に準拠して接着性を評価した。長期間の性能を評価するために、コーティングした試料のいくつかについては、65℃の温浴に17日間浸漬した後での接着性試験も行った。結果を以下の表3および表4に示す。
Claims (23)
- トップコート材料と、エポキシ変性接着促進剤とを含む、ハードコートをもたらすのに適したコーティング組成物。
- エポキシ変性接着促進剤が、式(1)を有する少なくとも一つの分子を有し:
U−Q−R1−SiR2 gR3 (3−g) (1)
式中、Qは−CH2CH(OH)CH2−O−または−CH2CH(OH)CH2−NR4−;Uは:
−O−(C6HhR2 (4−h)−CR5−C6HhR2 (4−h)−O−CH2CH(OH)CH2−O)i−C6HhR2 (4−h)−CR5−C6HhR2 (4−h)−O−J;
ここでR2は独立して、C1〜C10アルキル基または置換もしくは非置換のフェニル基から選択され;R3は独立して、アルコキシ、アセトキシ、またはケトオキシムラジカルから選択され;R1はC1〜C4アルキレンであり;gは0〜2;hは0〜4;R4は水素または−CH2CH(OH)CH2−U−;R5は独立して水素またはアルキルから選択され;iは0〜100;そしてJはH、Q−R1SiR2 hR3 (3−h)または
であり、mは1〜20である、請求項1のコーティング。 - 接着促進剤が組成物の重量を基準として約0.1から約50重量パーセントの量で存在する、請求項1〜3のいずれかのコーティング組成物。
- 接着促進剤が組成物の重量を基準として約0.1から約1重量パーセントの量で存在する、請求項1〜3のいずれかのコーティング組成物。
- トップコートが、シリコーントップコート、アクリルトップコート、ビニルワニストップコート、またはこれらの二またはより多くの組み合わせから選択される、請求項1〜5のいずれかのコーティング組成物。
- シリコーントップコートが、シロキサノール樹脂/コロイド状シリカ分散物を含む、請求項6のコーティング組成物。
- 金属酸化物をさらに含む、請求項1〜7のいずれかのコーティング組成物。
- 縮合触媒をさらに含む、請求項1〜8のいずれかのコーティング組成物。
- 平滑化剤をさらに含む、請求項1〜9のいずれかのコーティング組成物。
- シラン架橋剤をさらに含む、請求項1〜10のいずれかのコーティング組成物。
- 酸化防止剤をさらに含む、請求項1〜11のいずれかのコーティング組成物。
- 染料をさらに含む、請求項1〜12のいずれかのコーティング組成物。
- バインダーをさらに含む、請求項1〜13のいずれかのコーティング組成物。
- その表面の少なくとも一部に配置された、請求項1〜14のいずれかのコーティング組成物のコーティングを含む表面を有する物品。
- 物品が、ポリカーボネート、アクリルポリマー、ポリエステル、ポリアミド、ポリイミド、アクリロニトリル−スチレンコポリマー、スチレン−アクリロニトリル−ブタジエンターポリマー、ポリ塩化ビニル、ポリエチレン、またはこれらの二またはより多くの組み合わせを含む、請求項15の物品。
- 前記コーティング組成物が前記物品の前記表面上で予備硬化されている、請求項15〜16のいずれかの物品。
- 前記コーティング組成物が60℃から90℃の範囲の温度で15から60分間予備硬化されている、請求項17の物品。
- 前記コーティング組成物が硬化されて、前記物品の前記表面上に硬化コーティングをもたらしている、請求項18の物品。
- 前記物品が、前記コーティングと前記物品の前記表面との間にプライマー層を含まない、請求項15〜19のいずれかの物品。
- 部分的に硬化しまたは完全に硬化したコーティングを有するコート物品を調製するためのプロセスであって、請求項1〜14のいずれかのコーティング組成物を基材の表面の少なくとも一部に適用し;および、前記組成物を少なくとも部分的に硬化してハードコート層を形成することを含む、プロセス。
- 前記コーティング組成物が約60℃から90℃の温度に約15から60分間加熱されて、前記コーティング組成物が少なくとも部分的に硬化される、請求項21のプロセス。
- 前記コーティングされた基材が約160℃から約180℃の温度に加熱されて、前記コーティング組成物が完全に硬化される、請求項22のプロセス。
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US201462095804P | 2014-12-23 | 2014-12-23 | |
US62/095,804 | 2014-12-23 | ||
PCT/US2015/067529 WO2016106395A1 (en) | 2014-12-23 | 2015-12-22 | Primerless hardcoat composition |
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EP (1) | EP3237119A4 (ja) |
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Citations (5)
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JPH04318021A (ja) * | 1991-01-24 | 1992-11-09 | General Electric Canada Inc | アミン官能性シラン変性エポキシ樹脂組成物及びそれから作ったウエザーストリツプ塗料 |
WO1997011130A1 (fr) * | 1995-09-22 | 1997-03-27 | Daikin Industries, Ltd. | Inhibiteur de deposition de polluants et composition de materiau de revetement |
JP2010528123A (ja) * | 2007-05-18 | 2010-08-19 | エシロール アテルナジオナール カンパニー ジェネラーレ デ オプティック | 帯電防止性・耐摩耗性コートされた物品を提供する硬化性コーティング組成物 |
JP2013509485A (ja) * | 2009-10-28 | 2013-03-14 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | 表面保護コーティング及びその使用方法 |
WO2014126643A1 (en) * | 2013-02-15 | 2014-08-21 | Momentative Performance Materials, Inc. | Antifouling system comprising silicone hydrogel |
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JPS5287454A (en) * | 1976-01-16 | 1977-07-21 | Toray Silicone Co Ltd | Organopolysiloxane resin composition |
US4255468A (en) * | 1979-10-12 | 1981-03-10 | H. B. Fuller Company | Method of marking paved surfaces and curable two-part epoxy systems therefor |
JPH08302142A (ja) * | 1995-05-01 | 1996-11-19 | Kanegafuchi Chem Ind Co Ltd | 硬化性組成物 |
JP3417803B2 (ja) * | 1997-07-07 | 2003-06-16 | リンテック株式会社 | ハードコートシート |
JP4007465B2 (ja) * | 1998-03-29 | 2007-11-14 | 株式会社カネカ | 塗料用硬化性組成物及び塗装物 |
EP1905805A1 (de) * | 2006-09-29 | 2008-04-02 | Sika Technology AG | Wässrige zwei- oder mehrkomponentige wässrige Epoxidharz-Primerzusammensetzung |
KR20140091005A (ko) * | 2011-10-19 | 2014-07-18 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 하드코트 조성물 |
TW201546009A (zh) * | 2014-04-04 | 2015-12-16 | Ppg Ind Ohio Inc | 用於溼式及乾式長絲捲繞之上漿組合物 |
-
2015
- 2015-12-22 US US15/532,603 patent/US20170369729A1/en not_active Abandoned
- 2015-12-22 JP JP2017530006A patent/JP2018506595A/ja active Pending
- 2015-12-22 CN CN201580070475.0A patent/CN107249761A/zh active Pending
- 2015-12-22 EP EP15874356.7A patent/EP3237119A4/en not_active Withdrawn
- 2015-12-22 WO PCT/US2015/067529 patent/WO2016106395A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04318021A (ja) * | 1991-01-24 | 1992-11-09 | General Electric Canada Inc | アミン官能性シラン変性エポキシ樹脂組成物及びそれから作ったウエザーストリツプ塗料 |
WO1997011130A1 (fr) * | 1995-09-22 | 1997-03-27 | Daikin Industries, Ltd. | Inhibiteur de deposition de polluants et composition de materiau de revetement |
JP2010528123A (ja) * | 2007-05-18 | 2010-08-19 | エシロール アテルナジオナール カンパニー ジェネラーレ デ オプティック | 帯電防止性・耐摩耗性コートされた物品を提供する硬化性コーティング組成物 |
JP2013509485A (ja) * | 2009-10-28 | 2013-03-14 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | 表面保護コーティング及びその使用方法 |
WO2014126643A1 (en) * | 2013-02-15 | 2014-08-21 | Momentative Performance Materials, Inc. | Antifouling system comprising silicone hydrogel |
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WO2016106395A1 (en) | 2016-06-30 |
EP3237119A1 (en) | 2017-11-01 |
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