JP2018204104A - Rfおよびガス供給のための金属化セラミック管を備える基板台座モジュール - Google Patents
Rfおよびガス供給のための金属化セラミック管を備える基板台座モジュール Download PDFInfo
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- JP2018204104A JP2018204104A JP2018101957A JP2018101957A JP2018204104A JP 2018204104 A JP2018204104 A JP 2018204104A JP 2018101957 A JP2018101957 A JP 2018101957A JP 2018101957 A JP2018101957 A JP 2018101957A JP 2018204104 A JP2018204104 A JP 2018204104A
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- semiconductor substrate
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- platen
- stem
- metallized ceramic
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- 239000000758 substrate Substances 0.000 title claims abstract description 183
- 239000000919 ceramic Substances 0.000 title claims abstract description 97
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 239000004065 semiconductor Substances 0.000 claims abstract description 136
- 238000012545 processing Methods 0.000 claims abstract description 96
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 58
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 16
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000013021 overheating Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 2
- 238000001947 vapour-phase growth Methods 0.000 abstract 2
- 239000007789 gas Substances 0.000 description 80
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 238000000151 deposition Methods 0.000 description 11
- 230000008021 deposition Effects 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 9
- 238000000231 atomic layer deposition Methods 0.000 description 7
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 7
- 229910010271 silicon carbide Inorganic materials 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
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- 238000010926 purge Methods 0.000 description 4
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- 239000000956 alloy Substances 0.000 description 3
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- 238000005219 brazing Methods 0.000 description 3
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- 229910052721 tungsten Inorganic materials 0.000 description 3
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
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- 230000007246 mechanism Effects 0.000 description 2
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
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- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- -1 Si 3 N 4 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- OBOUWLBQUVHNJT-UHFFFAOYSA-N [O-2].[Y+3].[Mo+4] Chemical compound [O-2].[Y+3].[Mo+4] OBOUWLBQUVHNJT-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- VQLOCUKZAJRPAO-UHFFFAOYSA-N aluminum oxygen(2-) tantalum(5+) Chemical compound [O--].[O--].[O--].[O--].[Al+3].[Ta+5] VQLOCUKZAJRPAO-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45536—Use of plasma, radiation or electromagnetic fields
- C23C16/45538—Plasma being used continuously during the ALD cycle
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/45565—Shower nozzles
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C—CHEMISTRY; METALLURGY
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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Abstract
【解決手段】処理時に半導体基板を支持するよう構成された上面を有するセラミック材料で作られたプラテン302を備える基板台座モジュールであって、プラテン302を支持する上部ステムフランジを有するセラミック材料で作られたステム306と、ステム306の内部に位置する金属化セラミック材料で作られた少なくとも1つの裏面ガス管であって、裏面ガスをプラテンの上面に供給し、電力をプラテンに埋設された電極305a、305bに供給するよう構成された裏面ガス管と、を備える基板台座モジュール300と、を備える半導体基板処理装置。
【選択図】図2
Description
本発明は、たとえば、以下のような態様で実現することもできる。
適用例1:
半導体基板を処理するための半導体基板処理装置であって、
半導体基板が処理されうる処理領域を含む真空チャンバと、
プロセスガスを前記真空チャンバに供給するために前記真空チャンバと流体連通するプロセスガス源と、
前記プロセスガス源からのプロセスガスが前記真空チャンバの前記処理領域に供給されるシャワーヘッドモジュールと、
基板台座モジュールであって、
処理時に半導体基板を支持するよう構成された上面を有するセラミック材料で作られたプラテンと、
前記プラテンを支持する上部ステムフランジを有するセラミック材料で作られたステムと、
前記ステムの内部に位置する金属化セラミック材料で作られた裏面ガス管であって、裏面ガスを前記プラテンの前記上面に供給し、電力を前記プラテンに埋設された電極に供給するよう構成される裏面ガス管と、を備える基板台座モジュールと、
を備える、半導体基板処理装置。
適用例2:
適用例1の半導体基板処理装置であって、
前記電極は、静電クランプ電極である、半導体基板処理装置。
適用例3:
適用例1の半導体基板処理装置であって、
前記電極は、RF電極である、半導体基板処理装置。
適用例4:
適用例1の半導体基板処理装置であって、
前記プラテンは、埋設された1つ以上の抵抗発熱体を備え、前記発熱体は、前記ステム内に位置する金属化セラミック供給ロッドまたは金属供給ロッドに電気的に接続される、半導体基板処理装置。
適用例5:
適用例1の半導体基板処理装置であって、
前記基板台座モジュールは、さらに、前記プラテンの温度を測定するよう構成された熱電対を備え、前記熱電対は、前記ステム内の位置で前記プラテンの裏面に取り付けられたセラミック管の内部に位置する、半導体基板処理装置。
適用例6:
適用例1の半導体基板処理装置であって、
前記裏面ガス管、前記プラテン、および前記ステムは、窒化アルミニウムで形成される、半導体基板処理装置。
適用例7:
適用例1の半導体基板処理装置であって、
前記裏面ガス管は、前記ステムの前記内部の中央に位置する、半導体基板処理装置。
適用例8:
適用例1の半導体基板処理装置であって、
前記プラテンは、埋設された外部RF電極、および、埋設された内部静電クランプ(ESC)電極を備え、前記内部ESC電極は、前記外部RF電極と同一平面上にあり、前記外部RF電極は、前記ステム内の金属化セラミック電力供給ロッドに電気的に接続され、前記内部ESC電極のそれぞれは、前記ステム内の一対の金属化セラミック供給ロッドに電気的に接続される、半導体基板処理装置。
適用例9:
適用例1の半導体基板処理装置であって、
前記金属化セラミック管は、応力緩和接続部によって前記電極に接続され、前記応力緩和接続部は、前記金属化セラミック管と前記電極との間の熱膨張差を吸収するように形状を変化させるよう構成される、半導体基板処理装置。
適用例10:
半導体基板が処理されうる処理領域を含む真空チャンバ内で半導体基板を処理するのに有効な半導体基板支持モジュールであって、
処理時に半導体基板を支持するよう構成された上面を有するセラミック材料で作られたプラテンと、
前記プラテンを支持する上部ステムフランジを有するセラミック材料で作られたステムと、
前記ステムの内部に位置する金属化セラミック材料で作られた少なくとも1つの裏面ガス管であって、裏面ガスを前記プラテンの前記上面に供給し、電力を前記プラテンに埋設された電極に供給するよう構成される少なくとも1つの裏面ガス管と、
を備える、半導体基板支持モジュール。
適用例11:
適用例10の半導体基板支持モジュールであって、
前記電極は、静電クランプ電極である、半導体基板支持モジュール。
適用例12:
適用例10の半導体基板支持モジュールであって、
前記電極は、RF電極である、半導体基板支持モジュール。
適用例13:
適用例10の半導体基板支持モジュールであって、
前記プラテンは、埋設された1つ以上の抵抗発熱体を備え、前記発熱体は、前記ステム内に位置する金属化セラミック供給ロッドまたは金属供給ロッドに電気的に接続される、半導体基板支持モジュール。
適用例14:
適用例10の半導体基板支持モジュールであって、
前記基板台座モジュールは、さらに、前記プラテンの温度を測定するよう構成された熱電対を備え、前記熱電対は、前記ステム内の位置で前記プラテンの裏面に取り付けられたセラミック管の内部に位置する、半導体基板支持モジュール。
適用例15:
適用例10の半導体基板支持モジュールであって、
前記裏面ガス管、前記プラテン、および前記ステムは、窒化アルミニウムで形成される、半導体基板支持モジュール。
適用例16:
適用例10の半導体基板支持モジュールであって、
前記裏面ガス管は、前記ステムの前記内部の中央に位置する、半導体基板支持モジュール。
適用例17:
適用例10の半導体基板支持モジュールであって、
前記プラテンは、埋設された外部RF電極、および、埋設された内部静電クランプ(ESC)電極を備え、前記内部ESC電極は、前記外部RF電極と同一平面上にあり、前記外部RF電極は、前記ステム内の金属化セラミック電力供給ロッドに電気的に接続され、前記内部ESC電極のそれぞれは、前記ステム内の一対の金属化セラミック供給ロッドに電気的に接続される、半導体基板支持モジュール。
適用例18:
適用例10の半導体基板支持モジュールであって、
前記金属化セラミック管は、応力緩和接続部によって前記電極に接続され、前記応力緩和接続部は、前記金属化セラミック管と前記電極との間の熱膨張差を吸収するように形状を変化させるよう構成される、半導体基板支持モジュール。
適用例19:
適用例10の半導体基板支持モジュールであって、
前記金属化セラミック管は、前記ステムの長さより大きい長さを有し、その外面上にだけ導電性被膜を含む、半導体基板支持モジュール。
適用例20:
適用例10の半導体基板支持モジュールであって、
前記少なくとも1つの裏面ガス管は、第1、第2、および第3の金属化セラミック管を備え、前記プラテンは、同一平面上の第1、第2、および第3の電極を備え、前記第1の電極は、前記第1の金属化セラミック管に電気的に接続された斜めに延びる供給ストリップを有する外部リング状電極であり、前記第2および前記第3の電極は、前記第2および前記第3の金属化セラミック管に電気的に接続された内部D字形電極であり、前記第1の金属化セラミック管は、前記斜めに延びる供給ストリップおよび前記プラテンの上面中央の第1の排出口を通って延びる第1のガス経路と流体連通し、前記第2の金属化セラミック管は、前記第1の排出口から第1の距離で、前記第2の電極および前記プラテンの前記上面の第2の排出口を通って延びる第2のガス経路と流体連通し、前記第3の金属化セラミック管は、前記第1の排出口から第2の距離で、前記第3の電極および前記プラテンの前記上面の第3の排出口を通って延びる第3のガス経路と流体連通し、前記第1および前記第2の距離は、約1インチ(2.54センチ)以下である、半導体基板支持モジュール。
Claims (20)
- 半導体基板を処理するための半導体基板処理装置であって、
半導体基板が処理されうる処理領域を含む真空チャンバと、
プロセスガスを前記真空チャンバに供給するために前記真空チャンバと流体連通するプロセスガス源と、
前記プロセスガス源からのプロセスガスが前記真空チャンバの前記処理領域に供給されるシャワーヘッドモジュールと、
基板台座モジュールであって、
処理時に半導体基板を支持するよう構成された上面を有するセラミック材料で作られたプラテンと、
前記プラテンを支持する上部ステムフランジを有するセラミック材料で作られたステムと、
前記ステムの内部に位置する金属化セラミック材料で作られた裏面ガス管であって、裏面ガスを前記プラテンの前記上面に供給し、電力を前記プラテンに埋設された電極に供給するよう構成される裏面ガス管と、を備える基板台座モジュールと、
を備える、半導体基板処理装置。 - 請求項1に記載の半導体基板処理装置であって、
前記電極は、静電クランプ電極である、半導体基板処理装置。 - 請求項1に記載の半導体基板処理装置であって、
前記電極は、RF電極である、半導体基板処理装置。 - 請求項1に記載の半導体基板処理装置であって、
前記プラテンは、埋設された1つ以上の抵抗発熱体を備え、前記発熱体は、前記ステム内に位置する金属化セラミック供給ロッドまたは金属供給ロッドに電気的に接続される、半導体基板処理装置。 - 請求項1に記載の半導体基板処理装置であって、
前記基板台座モジュールは、さらに、前記プラテンの温度を測定するよう構成された熱電対を備え、前記熱電対は、前記ステム内の位置で前記プラテンの裏面に取り付けられたセラミック管の内部に位置する、半導体基板処理装置。 - 請求項1に記載の半導体基板処理装置であって、
前記裏面ガス管、前記プラテン、および前記ステムは、窒化アルミニウムで形成される、半導体基板処理装置。 - 請求項1に記載の半導体基板処理装置であって、
前記裏面ガス管は、前記ステムの前記内部の中央に位置する、半導体基板処理装置。 - 請求項1に記載の半導体基板処理装置であって、
前記プラテンは、埋設された外部RF電極、および、埋設された内部静電クランプ(ESC)電極を備え、前記内部ESC電極は、前記外部RF電極と同一平面上にあり、前記外部RF電極は、前記ステム内の金属化セラミック電力供給ロッドに電気的に接続され、前記内部ESC電極のそれぞれは、前記ステム内の一対の金属化セラミック供給ロッドに電気的に接続される、半導体基板処理装置。 - 請求項1に記載の半導体基板処理装置であって、
前記金属化セラミック管は、応力緩和接続部によって前記電極に接続され、前記応力緩和接続部は、前記金属化セラミック管と前記電極との間の熱膨張差を吸収するように形状を変化させるよう構成される、半導体基板処理装置。 - 半導体基板が処理されうる処理領域を含む真空チャンバ内で半導体基板を処理するのに有効な半導体基板支持モジュールであって、
処理時に半導体基板を支持するよう構成された上面を有するセラミック材料で作られたプラテンと、
前記プラテンを支持する上部ステムフランジを有するセラミック材料で作られたステムと、
前記ステムの内部に位置する金属化セラミック材料で作られた少なくとも1つの裏面ガス管であって、裏面ガスを前記プラテンの前記上面に供給し、電力を前記プラテンに埋設された電極に供給するよう構成される少なくとも1つの裏面ガス管と、
を備える、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記電極は、静電クランプ電極である、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記電極は、RF電極である、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記プラテンは、埋設された1つ以上の抵抗発熱体を備え、前記発熱体は、前記ステム内に位置する金属化セラミック供給ロッドまたは金属供給ロッドに電気的に接続される、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記基板台座モジュールは、さらに、前記プラテンの温度を測定するよう構成された熱電対を備え、前記熱電対は、前記ステム内の位置で前記プラテンの裏面に取り付けられたセラミック管の内部に位置する、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記裏面ガス管、前記プラテン、および前記ステムは、窒化アルミニウムで形成される、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記裏面ガス管は、前記ステムの前記内部の中央に位置する、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記プラテンは、埋設された外部RF電極、および、埋設された内部静電クランプ(ESC)電極を備え、前記内部ESC電極は、前記外部RF電極と同一平面上にあり、前記外部RF電極は、前記ステム内の金属化セラミック電力供給ロッドに電気的に接続され、前記内部ESC電極のそれぞれは、前記ステム内の一対の金属化セラミック供給ロッドに電気的に接続される、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記金属化セラミック管は、応力緩和接続部によって前記電極に接続され、前記応力緩和接続部は、前記金属化セラミック管と前記電極との間の熱膨張差を吸収するように形状を変化させるよう構成される、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記金属化セラミック管は、前記ステムの長さより大きい長さを有し、その外面上にだけ導電性被膜を含む、半導体基板支持モジュール。 - 請求項10に記載の半導体基板支持モジュールであって、
前記少なくとも1つの裏面ガス管は、第1、第2、および第3の金属化セラミック管を備え、前記プラテンは、同一平面上の第1、第2、および第3の電極を備え、前記第1の電極は、前記第1の金属化セラミック管に電気的に接続された斜めに延びる供給ストリップを有する外部リング状電極であり、前記第2および前記第3の電極は、前記第2および前記第3の金属化セラミック管に電気的に接続された内部D字形電極であり、前記第1の金属化セラミック管は、前記斜めに延びる供給ストリップおよび前記プラテンの上面中央の第1の排出口を通って延びる第1のガス経路と流体連通し、前記第2の金属化セラミック管は、前記第1の排出口から第1の距離で、前記第2の電極および前記プラテンの前記上面の第2の排出口を通って延びる第2のガス経路と流体連通し、前記第3の金属化セラミック管は、前記第1の排出口から第2の距離で、前記第3の電極および前記プラテンの前記上面の第3の排出口を通って延びる第3のガス経路と流体連通し、前記第1および前記第2の距離は、約1インチ(2.54センチ)以下である、半導体基板支持モジュール。
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CN116153754A (zh) | 2023-05-23 |
US20180350610A1 (en) | 2018-12-06 |
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US20200051822A1 (en) | 2020-02-13 |
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