JP2018196898A - ソルダペースト - Google Patents
ソルダペースト Download PDFInfo
- Publication number
- JP2018196898A JP2018196898A JP2017103253A JP2017103253A JP2018196898A JP 2018196898 A JP2018196898 A JP 2018196898A JP 2017103253 A JP2017103253 A JP 2017103253A JP 2017103253 A JP2017103253 A JP 2017103253A JP 2018196898 A JP2018196898 A JP 2018196898A
- Authority
- JP
- Japan
- Prior art keywords
- mass
- acid
- flux
- solvent
- total amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 47
- 230000004907 flux Effects 0.000 claims abstract description 68
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000002904 solvent Substances 0.000 claims abstract description 49
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 claims abstract description 43
- 238000012644 addition polymerization Methods 0.000 claims abstract description 17
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 13
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims abstract description 12
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 10
- 229940105990 diglycerin Drugs 0.000 claims description 36
- 150000001412 amines Chemical class 0.000 claims description 22
- 235000011187 glycerol Nutrition 0.000 claims description 22
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 12
- 150000007524 organic acids Chemical class 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 10
- 150000002896 organic halogen compounds Chemical class 0.000 claims description 9
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 8
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 8
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims description 8
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 8
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims description 8
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 4
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 4
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 4
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 claims description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 4
- 239000001361 adipic acid Substances 0.000 claims description 4
- 235000011037 adipic acid Nutrition 0.000 claims description 4
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 4
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 4
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 4
- 239000001630 malic acid Substances 0.000 claims description 4
- 235000011090 malic acid Nutrition 0.000 claims description 4
- 235000005985 organic acids Nutrition 0.000 claims description 4
- 235000006408 oxalic acid Nutrition 0.000 claims description 4
- 235000019260 propionic acid Nutrition 0.000 claims description 4
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 4
- 235000002906 tartaric acid Nutrition 0.000 claims description 4
- 239000011975 tartaric acid Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 abstract description 27
- 229920001721 polyimide Polymers 0.000 abstract description 27
- 229920002577 polybenzoxazole Polymers 0.000 abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 17
- 229910052710 silicon Inorganic materials 0.000 abstract description 17
- 239000010703 silicon Substances 0.000 abstract description 17
- 238000006243 chemical reaction Methods 0.000 abstract description 15
- 230000001681 protective effect Effects 0.000 abstract description 12
- 238000002845 discoloration Methods 0.000 abstract description 6
- 230000008961 swelling Effects 0.000 abstract description 6
- 239000000654 additive Substances 0.000 abstract description 5
- 230000000996 additive effect Effects 0.000 abstract description 4
- -1 hexyl glycol Chemical compound 0.000 description 25
- 230000000694 effects Effects 0.000 description 16
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 10
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 8
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 8
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- OADIZUFHUPTFAG-UHFFFAOYSA-N 2-[2-(2-ethylhexoxy)ethoxy]ethanol Chemical compound CCCCC(CC)COCCOCCO OADIZUFHUPTFAG-UHFFFAOYSA-N 0.000 description 5
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical group CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 5
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- 229940116411 terpineol Drugs 0.000 description 5
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 4
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 4
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 4
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 description 4
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 4
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 4
- 229940051250 hexylene glycol Drugs 0.000 description 4
- 238000012795 verification Methods 0.000 description 4
- 239000012190 activator Substances 0.000 description 3
- 150000001414 amino alcohols Chemical class 0.000 description 3
- 150000004982 aromatic amines Chemical class 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- MELXIJRBKWTTJH-ONEGZZNKSA-N (e)-2,3-dibromobut-2-ene-1,4-diol Chemical compound OC\C(Br)=C(/Br)CO MELXIJRBKWTTJH-ONEGZZNKSA-N 0.000 description 2
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 2
- KIHQZLPHVZKELA-UHFFFAOYSA-N 1,3-dibromopropan-2-ol Chemical compound BrCC(O)CBr KIHQZLPHVZKELA-UHFFFAOYSA-N 0.000 description 2
- PSSRAPMBSMSACN-UHFFFAOYSA-N 1,4-dibromobutan-2-ol Chemical compound BrCC(O)CCBr PSSRAPMBSMSACN-UHFFFAOYSA-N 0.000 description 2
- LWMWZNOCSCPBCH-UHFFFAOYSA-N 1-[bis[2-[bis(2-hydroxypropyl)amino]ethyl]amino]propan-2-ol Chemical compound CC(O)CN(CC(C)O)CCN(CC(O)C)CCN(CC(C)O)CC(C)O LWMWZNOCSCPBCH-UHFFFAOYSA-N 0.000 description 2
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 2
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 2
- PBODPHKDNYVCEJ-UHFFFAOYSA-M 1-benzyl-3-dodecyl-2-methylimidazol-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCCN1C=C[N+](CC=2C=CC=CC=2)=C1C PBODPHKDNYVCEJ-UHFFFAOYSA-M 0.000 description 2
- WEGOLYBUWCMMMY-UHFFFAOYSA-N 1-bromo-2-propanol Chemical compound CC(O)CBr WEGOLYBUWCMMMY-UHFFFAOYSA-N 0.000 description 2
- DMRXISNUOWIOKV-UHFFFAOYSA-N 1-bromobutan-2-ol Chemical compound CCC(O)CBr DMRXISNUOWIOKV-UHFFFAOYSA-N 0.000 description 2
- OXYNQEOLHRWEPE-UHFFFAOYSA-N 2,3-dibromobutane-1,4-diol Chemical compound OCC(Br)C(Br)CO OXYNQEOLHRWEPE-UHFFFAOYSA-N 0.000 description 2
- QWVCIORZLNBIIC-UHFFFAOYSA-N 2,3-dibromopropan-1-ol Chemical compound OCC(Br)CBr QWVCIORZLNBIIC-UHFFFAOYSA-N 0.000 description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 2
- VWSLLSXLURJCDF-UHFFFAOYSA-N 2-methyl-4,5-dihydro-1h-imidazole Chemical compound CC1=NCCN1 VWSLLSXLURJCDF-UHFFFAOYSA-N 0.000 description 2
- BKCCAYLNRIRKDJ-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1h-imidazole Chemical compound N1CCN=C1C1=CC=CC=C1 BKCCAYLNRIRKDJ-UHFFFAOYSA-N 0.000 description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 2
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 2
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 2
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 2
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 2
- RQFUZUMFPRMVDX-UHFFFAOYSA-N 3-Bromo-1-propanol Chemical compound OCCCBr RQFUZUMFPRMVDX-UHFFFAOYSA-N 0.000 description 2
- SIBFQOUHOCRXDL-UHFFFAOYSA-N 3-bromopropane-1,2-diol Chemical compound OCC(O)CBr SIBFQOUHOCRXDL-UHFFFAOYSA-N 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 2
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 description 1
- RUFZNDNBXKOZQV-UHFFFAOYSA-N 2,3-dihydro-1h-pyrrolo[1,2-a]benzimidazole Chemical compound C1=CC=C2N(CCC3)C3=NC2=C1 RUFZNDNBXKOZQV-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- ZWOWIAQFWNKRPF-UHFFFAOYSA-N 2-ethenyl-1,3,5-triazine Chemical compound C=CC1=NC=NC=N1 ZWOWIAQFWNKRPF-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- ZXTHWIZHGLNEPG-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=CC=CC=C1 ZXTHWIZHGLNEPG-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- RNRZYVTTXFHQEG-UHFFFAOYSA-N C1CCC2=NC3=C(N21)C=CC=C3.C3(=CC=CC=C3)C=3NC(=C(N3)C)CO Chemical compound C1CCC2=NC3=C(N21)C=CC=C3.C3(=CC=CC=C3)C=3NC(=C(N3)C)CO RNRZYVTTXFHQEG-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QUANRIQJNFHVEU-UHFFFAOYSA-N oxirane;propane-1,2,3-triol Chemical compound C1CO1.OCC(O)CO QUANRIQJNFHVEU-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
(1)検証方法
シリコンウェハに所定の開口が設けられたマスクを形成して、実施例または比較例のソルダペーストを塗布し、マスクを除去した後、窒素雰囲気下にてリフローを行った。リフロー条件は、室温から250℃まで1℃/sの昇温速度で昇温した後、250℃にて30秒保持した。リフロー後のシリコンウェハを、40℃に保温した洗浄液にて浸漬洗浄し、乾燥させた。そして、ウェハの外観検査で、ポリイミド(PI)及びポリベンゾオキサゾール(PBO)の部分に変色・膨潤、あるいは、シリコンウェハからの剥離が確認された場合は、ポリイミド及びポリベンゾオキサゾールとの反応性があると判断した。
(1)検証方法
シリコンウェハに所定の開口が設けられたマスクを形成して、実施例または比較例のソルダペーストを塗布し、マスクを除去した後、窒素雰囲気下にてリフローを行った。リフロー条件は、室温から250℃まで1℃/sの昇温速度で昇温した後、250℃にて30秒保持した。リフロー後のウェハを、40℃に保温した洗浄液にて浸漬洗浄し、乾燥させた。
Claims (4)
- はんだ合金の粉末とフラックスからなるソルダペーストにおいて、
前記フラックスは、前記フラックスの全量を100とした場合に、溶剤を20質量%以上70質量%以下、ベース剤を15質量%以上50質量%以下、有機酸を2質量%超20質量%以下で含み、
前記溶剤は、ジグリセリンにエチレンオキサイドが付加重合されたジグリセリンEO付加物、ジグリセリンにプロピレンオキサイドが付加重合されたジグリセリンPO付加物、グリセリンにエチレンオキサイド及びプロピレンオキサイドが付加重合されたグリセリンEO/PO付加物の何れか、または、2種以上の組み合わせを、前記溶剤の全量を100とした場合に50質量%以上で含む
ことを特徴とするソルダペースト。 - 前記有機酸は、シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、プロピオン酸、2,2−ビスヒロドキシメチルプロピオン酸、2,2−ビスヒロドキシメチルブタン酸、グリコール酸、ジグリコール酸、リンゴ酸、酒石酸の何れか、または2種以上の組み合わせである
ことを特徴とする請求項1に記載のソルダペースト。 - アミン、アミンハロゲン化水素酸塩、有機ハロゲン化合物、界面活性剤の何れか、または、2種以上の組み合わせを、前記フラックスに更に含む
ことを特徴とする請求項1または請求項2に記載のソルダペースト。 - 前記アミンの含有量は、前記フラックスの全量を100とした場合に、0質量%以上15質量%以下、前記アミンハロゲン化水素酸塩の含有量は、前記フラックスの全量を100とした場合に、0質量%以上5質量%以下、前記有機ハロゲン化合物の含有量は、前記フラックスの全量を100とした場合に、0質量%以上5質量%以下、前記界面活性剤の含有量は、前記フラックスの全量を100とした場合に、0質量%以上40質量%以下である
ことを特徴とする請求項3に記載のソルダペースト。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017103253A JP6332525B1 (ja) | 2017-05-25 | 2017-05-25 | ソルダペースト |
TW107114973A TWI667093B (zh) | 2017-05-25 | 2018-05-03 | Solder paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017103253A JP6332525B1 (ja) | 2017-05-25 | 2017-05-25 | ソルダペースト |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6332525B1 JP6332525B1 (ja) | 2018-05-30 |
JP2018196898A true JP2018196898A (ja) | 2018-12-13 |
Family
ID=62238857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017103253A Active JP6332525B1 (ja) | 2017-05-25 | 2017-05-25 | ソルダペースト |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6332525B1 (ja) |
TW (1) | TWI667093B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023084949A1 (ja) * | 2021-11-10 | 2023-05-19 | 千住金属工業株式会社 | 水溶性フラックス及びソルダペースト |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6627949B1 (ja) * | 2018-11-06 | 2020-01-08 | 千住金属工業株式会社 | フラックス、フラックスの塗布方法及びはんだボールの搭載方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59153594A (ja) * | 1983-02-21 | 1984-09-01 | Nippon Genma:Kk | クリ−ムはんだ |
JPS63286292A (ja) * | 1987-04-29 | 1988-11-22 | ビーエーエスエフ・アクチエンゲゼルシヤフト | 導体板製造における融剤及び再融解液としてのアルキレンオキシド付加物 |
JPS63286291A (ja) * | 1987-04-29 | 1988-11-22 | ビーエーエスエフ・アクチエンゲゼルシヤフト | 導体板製造における融剤及び再融解液としてのアルキレンオキシド付加物 |
JPH03268891A (ja) * | 1990-03-16 | 1991-11-29 | Nippondenso Co Ltd | 水溶性フラックス |
JPH0484690A (ja) * | 1990-07-25 | 1992-03-17 | Sakamoto Yakuhin Kogyo Kk | 水溶性ハンダ付用フラックス |
JP2004158728A (ja) * | 2002-11-08 | 2004-06-03 | Tamura Kaken Co Ltd | 回路基板はんだ付用フラックス及びソルダーペースト |
US20120217289A1 (en) * | 2011-02-25 | 2012-08-30 | International Business Machines Corporation | Flux Composition and Techniques for Use Thereof |
JP2013052439A (ja) * | 2011-08-08 | 2013-03-21 | Jsr Corp | フラックス組成物、電気的接続構造の形成方法、電気的接続構造および半導体装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101052452B1 (ko) * | 2004-03-09 | 2011-07-28 | 센주긴조쿠고교 가부시키가이샤 | 솔더 페이스트 |
TW201607992A (zh) * | 2014-08-29 | 2016-03-01 | 昇貿科技股份有限公司 | 助焊劑組成物 |
-
2017
- 2017-05-25 JP JP2017103253A patent/JP6332525B1/ja active Active
-
2018
- 2018-05-03 TW TW107114973A patent/TWI667093B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59153594A (ja) * | 1983-02-21 | 1984-09-01 | Nippon Genma:Kk | クリ−ムはんだ |
JPS63286292A (ja) * | 1987-04-29 | 1988-11-22 | ビーエーエスエフ・アクチエンゲゼルシヤフト | 導体板製造における融剤及び再融解液としてのアルキレンオキシド付加物 |
JPS63286291A (ja) * | 1987-04-29 | 1988-11-22 | ビーエーエスエフ・アクチエンゲゼルシヤフト | 導体板製造における融剤及び再融解液としてのアルキレンオキシド付加物 |
JPH03268891A (ja) * | 1990-03-16 | 1991-11-29 | Nippondenso Co Ltd | 水溶性フラックス |
JPH0484690A (ja) * | 1990-07-25 | 1992-03-17 | Sakamoto Yakuhin Kogyo Kk | 水溶性ハンダ付用フラックス |
JP2004158728A (ja) * | 2002-11-08 | 2004-06-03 | Tamura Kaken Co Ltd | 回路基板はんだ付用フラックス及びソルダーペースト |
US20120217289A1 (en) * | 2011-02-25 | 2012-08-30 | International Business Machines Corporation | Flux Composition and Techniques for Use Thereof |
JP2013052439A (ja) * | 2011-08-08 | 2013-03-21 | Jsr Corp | フラックス組成物、電気的接続構造の形成方法、電気的接続構造および半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023084949A1 (ja) * | 2021-11-10 | 2023-05-19 | 千住金属工業株式会社 | 水溶性フラックス及びソルダペースト |
Also Published As
Publication number | Publication date |
---|---|
TW201900319A (zh) | 2019-01-01 |
TWI667093B (zh) | 2019-08-01 |
JP6332525B1 (ja) | 2018-05-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6521160B1 (ja) | はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手 | |
KR102246523B1 (ko) | 땜납 합금, 땜납 분말, 땜납 페이스트 및 이들을 사용한 솔더 조인트 | |
TWI686378B (zh) | 助焊劑及焊膏 | |
TW201932226A (zh) | 助焊劑及焊膏 | |
JP6332525B1 (ja) | ソルダペースト | |
WO2019230694A1 (ja) | ソルダペースト用フラックス及びソルダペースト | |
JP2020163456A (ja) | フラックス及びソルダペースト | |
KR102534567B1 (ko) | 솔더 페이스트 | |
CN113614259B (zh) | 软钎焊用树脂组合物、软钎料组合物及树脂芯软钎料、助焊剂及焊膏 | |
JP6332526B1 (ja) | フラックス | |
JP6489274B1 (ja) | フラックス組成物、はんだペースト、はんだ接合部及びはんだ接合方法 | |
WO2020203730A1 (ja) | フラックス及びソルダペースト | |
JP2022041335A (ja) | フラックスおよびソルダペースト | |
JP2020163455A (ja) | フラックス及びソルダペースト | |
JP7021446B1 (ja) | フラックスおよびはんだペースト | |
JP6849934B1 (ja) | フラックス及びソルダペースト | |
JP6663124B1 (ja) | ロジン変性物、はんだ付け用フラックス及びソルダペースト | |
JP2020192545A (ja) | ソルダペースト | |
JP2021079443A (ja) | マレイン酸変性ロジンエステル又はマレイン酸変性ロジンアミドを含むフラックス用組成物、及びそれを含むフラックス、並びにはんだペースト | |
JP2021079442A (ja) | マレイン酸変性ロジンエステル又はマレイン酸変性ロジンアミドを含むフラックス用組成物、及びそれを含むフラックス、並びにはんだペースト |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180226 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180403 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180416 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6332525 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |