JP2018187884A - Mold for resin molding, resin molding apparatus, method for adjusting mold for resin molding, and method for manufacturing resin molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding for resin molding capable of reducing cost and labor when manufacturing resin moldings with different dimensions except thickness.SOLUTION: A mold 10 for resin molding includes: four peripheral wall members 11A-11D each having a first surface 111, a second surface 112 and a third surface 113 being three surfaces orthogonal to each other; and a bottom surface member 12 inserted inside of a rectangular-pole-shaped space C formed by each of the third surfaces 113 of the four peripheral wall members 11A-11D when the four peripheral wall members 11A-11D are arranged so that the first surface 111 of each of the peripheral wall members is arranged on the same plane and the second surface 112 comes into contact with a part of the third surface 113 of the adjacent peripheral wall member, for blocking one bottom portion of the space. A planar shape of a cavity is altered only by shifting the relative position of the four peripheral wall members 11A-11D. Therefore, only one type of the peripheral wall members is enough to be prepared, enabling to reduce cost and labor necessary for securement of storage place and management of the molding.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a resin molding mold, a resin molding apparatus, a resin molding mold adjusting method, and a resin molded product manufacturing method used for manufacturing a resin molded product.

  In order to protect an electronic component from an environment such as light, heat, and moisture, the electronic component is generally sealed with a resin. Therefore, resin molding is performed by a compression molding method, a transfer molding method, or the like. In the compression molding method, a mold consisting of a lower mold and an upper mold is used, resin material is supplied to the cavity of the lower mold, a board with electronic components mounted is attached to the upper mold, and then the lower mold and the upper mold are heated. However, resin molding is performed by clamping both of them. In the transfer molding method, a substrate is attached to one of the cavities of the upper mold and the lower mold, and then the lower mold and the upper mold are heated and both are clamped, and resin is supplied to the cavity with a plunger. Is done.

  In a resin molded product obtained by resin molding, the dimensions of the resin molded product differ depending on the shape, number, arrangement, etc. of the electronic components sealed with the resin. For this reason, a mold according to the dimensions of the resin molded product is produced for each resin molded product. For this purpose, a large number of molds must be prepared. If it does so, cost will be required for manufacture of a shaping | molding die, and those many shaping | molding dies must be stored, and it takes time to secure and manage the storage location.

  In Patent Document 1, an insert member corresponding to the bottom of the molding die is detachably provided on the flat plate-shaped first die, and the flat plate-shaped second die arranged to face the first die, There is described a resin molding apparatus in which a damming structure corresponding to a peripheral wall of a molding die and having a planar shape of an inner space having the same planar shape as an insert member is detachably provided. The positions of the insert member and the damming structure are determined so that the insert member is inserted into the space inside the damming structure when the first mold and the second mold are clamped. ing. According to this configuration, resin molded products having different thicknesses can be produced simply by replacing the insert members with different thicknesses. Thus, when only thickness is changed, since a common weir structure can be used, cost can be suppressed rather than producing the whole shaping | molding die for every resin molded product.

JP 11-105053 A

  In the resin molding apparatus described in Patent Document 1, resin molded products having different thicknesses can be manufactured using a common peripheral wall. However, when resin molded products having different dimensions other than thickness are manufactured, their widths are used. In addition, since the peripheral wall according to the length must be manufactured, the same cost and labor as in the case of manufacturing the entire mold according to the dimensions of the resin molded product are required.

  The problem to be solved by the present invention is a resin molding die, a resin molding device, and a resin molding that can reduce the cost and labor required for the molding die when producing resin molded products having different dimensions other than thickness. It is providing the shaping | molding die adjustment method for resin, and the resin molding product manufacturing method.

The first aspect of the molding die for resin molding according to the present invention made to solve the above problems is as follows:
a) four peripheral wall members each having a first surface, a second surface and a third surface which are three planes orthogonal to each other;
b) When the four peripheral wall members are disposed such that the first surface of each peripheral wall member is disposed on the same plane and the second surface is in contact with a part of the third surface of the adjacent peripheral wall member. And a bottom surface member that is inserted into a quadrangular columnar space formed by the third surfaces of the two peripheral wall members and closes one bottom portion of the space.

According to a second aspect of the resin molding die according to the present invention, in the resin molding die according to the first aspect,
A resin supply channel is provided in at least one of the four peripheral wall members and the bottom surface member, and supplies a resin material to a cavity surrounded by the four peripheral wall members and the bottom surface member. And

The first aspect of the resin molding apparatus according to the present invention is:
A molding die for resin molding according to the first aspect;
A mold clamping mechanism for clamping the mold for resin molding;
An elastic member provided at a lower part of the four peripheral wall members;
And a resin material supply mechanism for supplying a resin material to a cavity surrounded by the four peripheral wall members and the bottom surface member.

The second aspect of the resin molding apparatus according to the present invention is:
A molding die for resin molding according to the second aspect;
A mold clamping mechanism for clamping the mold for resin molding;
A resin material holding part for holding a resin material connected to the resin supply flow path;
And a plunger for injecting the resin material in the resin material holding portion into the cavity through the resin supply channel.

The first aspect of the mold adjustment method for resin molding according to the present invention is as follows.
In each of the four peripheral wall members of the molding die for resin molding according to the first aspect, the peripheral wall member in which the second surface and the second surface are in contact with each other while the first surface is disposed on the same plane. A peripheral wall member moving step of moving the relative position of the third surface of
And a bottom surface member inserting step of inserting the bottom surface member into a quadrangular columnar space formed by the third surfaces of the four peripheral wall members.

The second aspect of the mold adjustment method for resin molding according to the present invention is as follows.
In each of the four peripheral wall members of the molding die for resin molding according to the second aspect, the peripheral wall member that contacts the second surface and the second surface while the first surface is disposed on the same plane. A peripheral wall member moving step of moving the relative position of the third surface of
And a bottom surface member inserting step of inserting the bottom surface member into a quadrangular columnar space formed by the third surfaces of the four peripheral wall members.

The first aspect of the resin molded product manufacturing method according to the present invention is:
In the cavity of the resin molding die of the first aspect, the shape of the cavity surrounded by the four peripheral wall members and the bottom surface member is adjusted by the resin molding die adjustment method of the first aspect. A resin material is supplied, the resin material is heated to a temperature at which the resin material is softened or melted, the mold for resin molding is clamped, and then the resin material is cured.

The second aspect of the resin molded product manufacturing method according to the present invention is:
The resin molding mold according to the second aspect, the shape of the cavity of which is adjusted by the resin molding mold adjusting method according to the second aspect, is clamped to a temperature at which the resin material is softened or melted. The resin material is supplied from the resin supply flow path to the cavity, and then the resin material is cured.

  According to the present invention, when producing resin molded products having different dimensions other than thickness, the cost and labor required for the mold can be reduced.

The top view (a) which shows the lower mold | type in 1st Embodiment of the shaping | molding die for resin molding which concerns on this invention, and AA 'sectional drawing (b) which shows a lower mold | type and an upper mold | type. The front view (a) which shows one of the surrounding wall members in the shaping | molding die for resin molding of 1st Embodiment, a top view (b), a left side view (c), and a right side view (d). It is a figure which shows the adjustment method of the planar shape in the shaping | molding die for resin molding of 1st Embodiment, Comprising: BB 'sectional drawing (a) of the surrounding wall member before a planar shape change, and BB' cross section after a change Figure (b). It is a figure which shows the adjustment method of the planar shape in the shaping | molding die for resin molding of 1st Embodiment, Comprising: The perspective view (a) of the surrounding wall member before a planar shape change, and the perspective view (b) after a change. The schematic block diagram which shows the resin molding apparatus (resin molding apparatus of 1st Embodiment) which has the shaping | molding die for resin molding of 1st Embodiment. The principal part enlarged view of the resin molding apparatus of 1st Embodiment. Schematic which shows the resin molded product manufacturing method using the shaping | molding die for resin molding of 1st Embodiment. The top view which shows the lower mold | type in the modification of the shaping | molding die for resin molding of 1st Embodiment, and the surrounding wall. Schematic which shows the structure of the resin molding unit which has the resin molding apparatus of 1st Embodiment. The bottom view (a) and longitudinal cross-sectional view (b) which show the upper mold | type in 2nd Embodiment of the shaping | molding die for resin molding which concerns on this invention, and the top view (c) and longitudinal cross-sectional view (d) which show a lower mold | type. The front view (a) and bottom view (b) of the 1st surrounding wall member in the shaping | molding die for resin molding of 2nd Embodiment, and the front view (c) and bottom view (d) of a 3rd surrounding wall member. It is a figure which shows the adjustment method of the planar shape in the shaping | molding die for resin molding of 2nd Embodiment, Comprising: The bottom view (a) of the surrounding wall member before a planar shape change, and the bottom view (b) after a change. The schematic block diagram which shows the resin molding apparatus (resin molding apparatus of 2nd Embodiment) which has the shaping | molding die for resin molding of 2nd Embodiment. Schematic which shows the resin molded product manufacturing method using the shaping | molding die for resin molding of 2nd Embodiment.

  In the present invention, the four peripheral wall members are arranged so that the relative positions of the second surface and the third surface of the peripheral wall member in contact with the second surface change while the first surfaces thereof are arranged on the same plane. By moving, the planar shape of the quadrangular columnar space formed by the third surfaces of the four peripheral wall members (the shape of the space viewed from the direction perpendicular to the first surface) can be changed. Then, four peripheral wall members and a bottom surface member, which are spaces to which a resin material is supplied when a resin molded product is manufactured by inserting a bottom surface member that closes one bottom portion of the square columnar space into the space. A cavity surrounded by is formed. The thickness of the cavity (the size in the direction perpendicular to the first surface) can be adjusted by changing the position of the surface of the bottom member on the cavity side.

  According to the present invention, the plane shape of the cavity can be changed by simply moving the relative positions of the four peripheral wall members, so only one type of peripheral wall member needs to be prepared. Therefore, although only one type of peripheral wall member needs to be prepared (although it is necessary to prepare a plurality of bottom surface members), it is possible to reduce the cost and labor required for securing and managing the mold storage location.

  Of the resin molding molds according to the present invention, the first embodiment used for compression molding includes the four peripheral wall members and the bottom surface member. Further, among the resin molding molds according to the present invention, the second embodiment used for transfer molding has the four peripheral wall members and the bottom surface member, and among the four peripheral wall members and the bottom surface member. At least one member has a resin supply channel for supplying a resin material to the cavity.

  In the molding die for resin molding according to the first aspect, a gas suction port for sucking gas to one or both of the fourth surface and the third surface opposite to the first surface of the four peripheral wall members Can be provided. Alternatively, in the molding die for resin molding according to the first aspect, a gas suction port for sucking gas may be provided on the surface on the cavity side surrounded by the four peripheral wall members and the bottom surface member. A gas suction port may be provided on both the third surface, the fourth surface, and the surface on the cavity side. By providing such a gas suction port in the resin molding die of the first aspect, the third surface and the bottom surface of the peripheral wall member that previously constitutes the cavity in order to facilitate the release of the molded resin molding after molding. When the surface of the member on the cavity side is covered with a release film, the release film can be adhered to the surface by sucking gas from the gas suction port.

  In the resin molding molds according to the first and second aspects, a portion of the third surface of the four peripheral wall members on a part of the fourth surface side of the quadrangular columnar space as approaching the fourth surface. It can take the structure that the taper which goes outside is formed. Thereby, the molded resin molded body can be easily released from the molding mold for resin molding.

  Hereinafter, with reference to FIG. 1 to FIG. 14, more specific embodiments of the resin molding die, the resin molding device, the resin molding die adjusting method, and the resin molded product manufacturing method according to the present invention will be described. .

(1) First embodiment
(1-1) Mold for Resin Molding of First Embodiment FIG. 1 shows a mold for resin molding 10 of the first embodiment. The resin molding die 10 is a compression molding die. The mold 10 for resin molding includes a lower mold 101 including four peripheral wall members including a first peripheral wall member 11A, a second peripheral wall member 11B, a third peripheral wall member 11C, and a fourth peripheral wall member 11D, and a bottom surface member 12. It has the upper mold | type 102 which consists of one member.

  FIG. 2 shows the configuration of the first peripheral wall member 11A. The third peripheral wall member 11C has the same configuration as the first peripheral wall member 11A, except that the second peripheral wall member 11B and the fourth peripheral wall member 11D are shorter in the left-right direction than the first peripheral wall member 11A. It has the same configuration as the first peripheral wall member 11A.

  Each peripheral wall member 11A-11D consists of a rectangular plate-shaped member, and is arrange | positioned in the state which stood the plate | board surface with one of the end surfaces of the long side of this rectangle facing down. The lower surface 111 of each of the peripheral wall members 11A to 11D is on the first surface, the left side surface 112 that is one of the end surfaces on the short side is the second surface, and the inner surface 113 that is one of the rectangular plate surfaces is It corresponds to each of the third surfaces. The lower surface 111, the left side surface 112, and the inner surface 113 are orthogonal to each other. The lower surfaces (first surfaces) 111 of the peripheral wall members 11A to 11D have the same height and are arranged on the same plane. As shown in FIG. 1A, the first peripheral wall member 11A, the second peripheral wall member 11B, the third peripheral wall member 11C, and the fourth peripheral wall member 11D change the direction of the inner surface 113 by 90 ° in this order as viewed from above. Thus, they are arranged in a counterclockwise direction so as to form a square columnar space inside. Hereinafter, the left neighbor and right neighbor as viewed from above are simply referred to as “left neighbor” and “right neighbor”. The inner surfaces 113 of the peripheral wall members 11A to 11D face the square columnar space. Further, the left side surface (second surface) 112 of each of the peripheral wall members 11A to 11D is in contact with a part of the inner surface (third surface) 113 of the adjacent left peripheral wall member.

  In FIG. 2 (a), the front of one peripheral wall member 11 is indicated by a solid line, the right side of the left peripheral wall member is indicated by a one-dot chain line, and the left end portion of the left side surface of the right peripheral wall member is indicated by two. Each is indicated by a dotted line. The relative positions of the inner surface (third surface) 113 of the peripheral wall member of interest and the left side surface (second surface) of the right adjacent peripheral wall member 11 are movable (described later), and in FIG. Two examples in which the position of the left side surface of the peripheral wall member 11 is different are indicated by a single two-dot chain line.

  Each of the peripheral wall members 11A to 11D is provided with a columnar slide member 131 that protrudes perpendicularly from the left side surface 112 (FIG. 2A). Each of the peripheral wall members 11A to 11D is provided with a guide hole 132 penetrating in the thickness direction of the plate member of the peripheral wall member at the same height as the slide member 131 (FIG. 2 (a)). The guide hole 132 extends in the left-right direction, and the length thereof is shorter than the thickness of each of the peripheral wall members 11A to 11D at the height at which the guide hole 132 is provided. The vertical size of the guide hole 132 is substantially the same as the diameter of the cylinder of the slide member 131 except for the vicinity of both left and right ends (slightly larger than the diameter). The slide member 131 of each of the peripheral wall members 11A to 11D is inserted into the guide hole 132 of the left adjacent wall member with the left side surface 112 in contact with a part of the inner surface 113 of the left adjacent wall member. . In FIG. 2A, the slide member 1 of the second peripheral wall member 11B inserted into the guide hole 132 of the first peripheral wall member 11A is shown in the guide hole 132 by a broken line.

  A plurality of gas suction ports 141 are provided on the upper surface (fourth surface) 114 of the peripheral wall members 11 </ b> A to 11 </ b> D so as to be arranged in the longitudinal direction of the upper surface 114. A gas suction pipe 142 is provided in the peripheral wall member, and the gas suction pipe 142 is branched and connected to each gas suction port 141. The gas suction pipe 142 is connected to a connection port 143 provided on the right side surface of each of the peripheral wall members 11 </ b> A to 11 </ b> D, and the gas suction pump provided outside the connection port 143 and the molding die 10 for resin molding. (Not shown) is connected.

  At the upper end of the inner surface 113 of each of the peripheral wall members 11A to 11D, a taper 116 having a chamfered corner with the upper surface 114 of the peripheral wall member is provided. The taper 116 has a shape toward the outside of the square columnar space as it approaches the upper surface 114. Moreover, the upper part of the left side surface 112 of each surrounding wall member 11A-11D is provided with the hook-shaped part 117 which has the surface which contacts the taper 116 of the surrounding wall member on the left side seeing from the top (FIG. 2 (a). )).

  The bottom surface member 12 has a plate shape, and is inserted into a quadrangular columnar space formed by four peripheral wall members with the plate surface directed in the vertical direction. As the bottom surface member 12, a plurality of bottom surface members having different vertical and horizontal sizes are prepared. A cavity C is formed by the inner surface 113 of each of the peripheral wall members 11A to 11D and the upper surface of the bottom surface member 12.

  The upper mold 102 has a flat plate shape as shown in FIG.

(1-2) Adjustment Method of Resin Molding Mold of First Embodiment An adjustment method of the resin molding mold 10 of the first embodiment will be described with reference to FIGS. 3 and 4. 3 is a sectional view of each of the peripheral wall members 11A to 11D in the BB ′ section shown in FIGS. 1B and 2C, and FIG. 4 is a perspective view. 3 does not include the taper 116 but includes the slide member 131 and the guide hole 132. Below, the case where the adjustment which changes from the state where the planar shape of the cavity C in the molding die 10 for resin molding is the maximum to the state smaller than that is performed is demonstrated to an example. First, the bottom member 12 is taken out from the molding die 10 for resin molding. FIG. 3A shows a state after the bottom surface member 12 is taken out, and the planar shape of the cavity C is a rectangle, and a long side (side extending in the figure) and a short side (side extending in the figure). ) Is the maximum. In FIG. 3A, although the taper 116 does not appear, each peripheral wall member 11A-11D is arrange | positioned in the same position as shown in FIG.

  From this state, the relative positions of the peripheral wall members 11 </ b> A to 11 </ b> D with respect to the guide hole 132 of the slide member 131 are moved to the right side toward the guide hole 132. Along with this movement, the relative positions of the left side surfaces (second surface) 112 of the peripheral wall members 11A to 11D with respect to the inner surface (third surface) 113 of the left peripheral wall member move toward the inside of the cavity C. (Thick arrow in FIG. 3 (b)). As a result, the planar shape of the cavity C is maintained to be rectangular, and both the long side and the short side are shorter than before the movement.

  From the state in which the long side and the short side of the planar shape of the cavity C are not maximum, the relative positions of the peripheral wall members 11A to 11D with respect to the guide hole 132 of the slide member 131 are on the right side, that is, the left sides of the peripheral wall members 11A to 11D. By moving the relative position of the surface (second surface) 112 with respect to the inner surface (third surface) 113 of the peripheral wall member adjacent to the left to the outside of the cavity C, the long side and the short side of the planar shape of the cavity C are changed. Can be long. In addition, the two peripheral wall members facing each other may be moved, but only one of them may be moved. Furthermore, the length of only one of the long side and the short side of the planar shape of the cavity C is changed by moving only two or only one of the four peripheral wall members 11A to 11D. You can also.

  The length of the guide hole 132 is shorter than the thickness of each of the peripheral wall members 11A to 11D at the height at which the guide hole 132 is provided, and the relative position of the slide member 131 with respect to the guide hole 132 is determined. Even in the position, the guide hole 132 and the cavity C do not communicate with each other.

  After changing the planar shape of the cavity C as described above, the bottom surface member 12 having a plate surface having the same shape as the planar shape is inserted into a place surrounded by the inner surfaces 113 of the peripheral wall members 11A to 11D. Thereby, the space surrounded by the inner surface 113 of each of the peripheral wall members 11 </ b> A to 11 </ b> D and the upper surface of the bottom surface member 12 becomes the cavity C after adjustment of the molding die 10 for resin molding. Also, the upper mold 102 is replaced with one corresponding to the shape of the cavity C.

(1-3) Resin molding apparatus including the resin molding die according to the first embodiment (resin molding apparatus according to the first embodiment)
Next, referring to FIGS. 5 and 6, a resin molding apparatus including two sets of resin molding molds 10 (first resin molding mold 10 </ b> A, second resin molding mold 10 </ b> B) of the first embodiment. 20 will be described. In the resin molding apparatus 20, two tie bars 232 are erected on a base 231 and a toggle link 233 is provided. A tie bar 232 holds a lower movable platen 211 and an upper movable platen 212 so as to be movable up and down, and a fixed platen 22 is fixed to an upper end of the tie bar 232. The base 231, the tie bar 232, the toggle link 233, the lower movable platen 211, the upper movable platen 212, and the fixed platen 22 correspond to a mold clamping mechanism.

  On the lower movable platen 211, a first lower heat insulating member 241A, a first lower heater plate 251A, and a lower mold 101A of the first resin molding die 10A are provided in order from the bottom. Below the upper movable platen 212, a first upper heat insulating member 242A, a first upper heater plate 252A, and an upper die 102A of the first resin molding die 10A are provided in this order from the top. Similarly, on the upper movable platen 212, the second lower heat insulating member 241B, the second lower heater plate 251B, and the lower mold 101B of the second resin molding mold 10B are arranged below the fixed platen 22 in order from the bottom. A second upper heat insulating member 242B, a second upper heater plate 252B, and an upper mold 102B of the second resin molding mold 10B are provided in order from the top. Each of the first lower heat insulating member 241A, the first upper heat insulating member 242A, the second lower heat insulating member 241B, and the second upper heat insulating member 242B is formed by arranging a plurality of columnar heat insulating members in a two-dimensional manner.

  The lower molds 101A and 101B are respectively provided with elastic members 26A and 26B around the bottom surface member 12 and below the peripheral wall members 11A to 11D. While the bottom surface member 12 is fixed, the peripheral wall members 11A to 11D are movable in the vertical direction on the elastic members 26A and 26B. The positions of the elastic members 26A and 26B in the lateral (substantially horizontal) direction are movable according to the positions of the peripheral wall members 11A to 11D in the lateral (substantially horizontal) direction.

  Further, the resin molding apparatus 20 is arranged from the side between the lower mold 101A and the upper mold 102A of the first resin molding mold 10A and between the lower mold 101B and the upper mold 102B of the second resin molding mold 10B. A resin material transfer tray (resin material supply mechanism) 27 to be carried in is provided. As shown in FIG. 6, the resin material transfer tray 27 includes a frame body 271 in which a central portion of a plate-like member is wound, and a resin storage portion surrounded by the frame body 271. 272 and a gas suction port 273 provided on the lower surface of the frame body 271 for adsorbing the release film F. The resin material transfer tray 27 is in a state in which the lower side of the resin container 272 is blocked by the release film F while adsorbing the release film F to the lower surface of the frame body 271 by sucking air from the suction port 272. Thus, the resin material P is accommodated in the resin accommodating portion 272. In addition, the resin material transfer tray 27 is carried between the lower mold 101A (101B) and the upper mold 102A (102B). The release film F is released from the cavity C by releasing the suction of the release film F by the gas suction port 273 of the resin material transfer tray 27 while sucking the gas from the gas suction port 141 of the lower mold 101A (101B). The resin material P is supplied to the cavity C while being deformed so as to correspond to the shape of the inner surface of the resin and covering the inner surface.

(1-4) Resin molded product manufacturing method using the resin molding mold of the first embodiment (Resin molded product manufacturing method of the first embodiment, operation of the resin molding apparatus of the first embodiment)
The operation of the resin molding apparatus of the first embodiment, which is a resin molded product manufacturing method (resin molded product manufacturing method of the first embodiment) using the resin molding die of the first embodiment, will be described with reference to FIG. To do. FIG. 7 shows the operation of the first resin molding die 10A, but the operation of the second resin molding die 10B is the same.

  First, the lower molds 101A and 101B are adjusted so that the cavity C has a predetermined shape by the method for adjusting a mold for resin molding according to the first embodiment. At the same time, the positions of the elastic members 26A and 26B are moved so as to match the positions of the adjusted peripheral wall members 11A to 11D.

  Next, the substrate S on which a plurality of electronic components are mounted is attached to the lower surfaces of the upper molds 102A and 102B, respectively, with the mounting surface facing downward (FIG. 7 (a)). Subsequently, after the resin material transfer tray 27 holding the resin material P and the release film F is carried between the lower mold 101A (101B) and the upper mold 102A (102B), the resin material transfer tray 27 is lowered and the gas is sucked from the gas suction port 141. At the same time, the gripping part releases the release film F. Thus, the inner surfaces of the cavities C of the lower molds 101A and 101B are covered with the release film F, and the resin material P is supplied to the cavities C (FIG. 7B). The gas suction port 141 is provided only on the upper surface 114 of the peripheral wall members 11A to 11D, and is not provided in the cavity C. However, since the upper surface 114 is slightly rough, the gas suction port 141 is separated from the upper surface 114. The air between the inner surface of the cavity C and the release film F can be sucked from the gas suction port 141 through the gap of the film F. Therefore, the inner surface of the cavity C and the release film F can be adhered.

  Next, the resin material P in the cavities C of the lower molds 101A and 101B is heated by the first lower heater plates 251A and 252A to melt or soften the resin material P (FIG. 7C). At the same time, the substrate S is heated to the same temperature as the resin material P by the first upper heater plates 252A and 252B. This is to prevent the resin material P from being rapidly cooled due to the temperature difference between the resin material P and the substrate S immediately after the mold clamping described below. During the heating, a first lower heat insulating member 241A is provided between the first lower heater plate 251A and the lower movable platen 211, and an upper heat insulating member 242A is provided between the first upper heater plate 252A and the upper movable platen 212. Therefore, heat is prevented from escaping to the lower movable platen 211 and the upper movable platen 212, and the resin material P in the cavity C of the lower mold 101A and the substrate S of the upper mold 102 can be efficiently heated. (The same applies to the lower mold 101B and the upper mold 102B).

  Next, the lower movable platen 211 is raised by the toggle link 233. As a result, first, the lower mold 101A of the first resin molding mold 10A and the upper mold 102A come into contact with each other, the upper movable platen 212 to which the upper mold 102A is attached rises, and the lower mold of the second resin molding mold 10B. The mold 101B and the upper mold 102B abut. Further, the lower movable platen 211 is raised by the toggle link 233, whereby the first resin molding die 10A and the second resin molding die 10B are clamped (FIG. 7 (d)). By holding in this state, the resin material P in the first resin molding die 10A and the second resin molding die 10B is cured, so that a resin molded product (resin-sealed product) is formed on the surface of the substrate S. PM is formed (FIG. 7 (e)).

  Thereafter, the heating by the first lower heater plates 251A and 252A and the first upper heater plates 252A and 252B is stopped, and the lower movable platen 211 is lowered by the toggle link 233, whereby the first resin molding die 10A and the second The mold 2 for resin molding 10B is opened (FIG. 7 (f)). At that time, the inner surface of the cavity C is covered with the release film F, and the taper 116 is formed on the upper ends of the inner surfaces of the peripheral wall members 11A to 11D of the lower molds 101A and 101B, thereby forming a resin molded product. PM can be easily released from the lower molds 101A and 101B. Thereafter, the substrate S on which the resin molded product PM is formed is removed from the upper molds 102A and 102B, and the release film F is removed from the lower molds 101A and 101B. An inclined surface corresponding to the taper 116 of the resin molding die 10 is formed at the end of the resin molded product PM, but the substrate S on which the resin molded product PM is formed is divided into a plurality of pieces thereafter. The singulation process is performed, and at that time, the portion of the inclined surface is removed.

  Thereafter, the resin molded product PM can be repeatedly manufactured by repeating the above operations.

(1-5) Effects of the First Embodiment According to the resin molding die 10 of the first embodiment, the planar shape of the cavity C is changed only by moving the relative positions of the four peripheral wall members 11A to 11D. Therefore, only one type of peripheral wall members 11A to 11D need be prepared, and replacement is not necessary. Therefore, it is possible to reduce the cost and labor required for securing and managing the storage location of the mold.

  Moreover, since the taper 116 is formed in the upper end of the inner surface 113 of the peripheral wall members 11A to 11D, the resin molding die 10 of the first embodiment can easily release the resin molded product PM. At the same time, the resin molding die 10 of the first embodiment can cover the inner surface of the cavity C with the release film F using the gas suction ports 141 provided in the peripheral wall members 11A to 11D. In this case, the resin molded product PM can be easily released.

(1-6) Modification of First Embodiment In the resin molding die 10 of the first embodiment, all the four peripheral wall members 11A to 11D are movable, but one of these four is fixed in position. May be. In the resin molding die 10 of the first embodiment, the taper 116 is formed at the upper ends of the inner surfaces 113 of the peripheral wall members 11A to 11D, but the taper 116 may be omitted. In the resin molding die 10 of the first embodiment, the gas suction port 141 is provided on the upper surface 114 of the peripheral wall members 11A to 11D, but together with or instead of the inner surface 113 and the bottom surface member of the peripheral wall members 11A to 11D. A gas suction port may be provided on the upper surface of 12. Alternatively, as shown in FIG. 8, a gas suction port installation wall 16 is erected around the peripheral wall members 11 </ b> A to 11 </ b> D of the resin molding die 10 (however, the gas suction port 141 is not provided). A gas suction port 141 </ b> A may be provided on the upper surface of the installation wall 16. In addition, the configuration of the resin molding die 10 of the first embodiment can be variously modified within the scope of the gist of the present invention.

  The resin molding apparatus 20 according to the first embodiment uses two movable platens (lower movable platen 211, upper movable platen 212) and one fixed platen 22 to form two resin molding molds (first resin molding mold). Although the mold 10A and the second resin molding mold 10B are clamped at the same time, one resin molding mold 10 may be clamped using one movable platen and one fixed platen. Alternatively, three or more movable molds and one fixed platen may be used to simultaneously clamp three or more resin molding molds.

  In FIG. 9, the resin molding unit 30 which is another modification of the resin molding apparatus of 1st Embodiment is shown. The resin molding unit 30 according to this modification includes a material receiving module 31, a molding module 32, and a dispensing module 33. The material receiving module 31 is an apparatus for receiving the resin material P and the substrate S from the outside and sending them to the molding module 32. The material receiving module 31 receives the resin material P to the resin material transfer tray 27 and receives the substrate. Part 311. One molding module 32 includes one set of the resin molding apparatus 20 described above. Although three molding modules 32 are shown in FIG. 9, an arbitrary number of molding modules 32 can be provided in the resin molding unit 30. Even after the resin molding unit 30 is assembled and used, the molding module 32 can be increased or decreased. The payout module 33 carries the resin molded product manufactured by the molding module 32 from the molding module 32 and holds it, and has a resin molded product holding portion 331.

  The resin molding unit 30 includes a material receiving module 31, one or a plurality of molding modules 32, and a delivery module 33 so as to pass through the substrate S, the resin material transfer tray 27, and a main transport device 36 that transports the resin molded product. Is provided. Further, in each module, a substrate S, a resin material transfer tray 27, and a sub-transport device 37 for transporting the resin molded product are provided between the main transport device 36 and the devices in the module. In addition, the resin molding unit 30 includes a power source and a control unit (none of which are shown) for operating each of the modules.

  The operation of the resin molding unit 30 will be described. The board | substrate S is hold | maintained at the board | substrate receiving part 311 of the material reception module 31 by the operator. The main transport device 36 and the sub transport device 37 transport the substrate S from the substrate receiving portion 311 to the resin molding device 20 in one of the molding modules 32, and the substrate S is the upper mold 102A of the resin molding device 20. , 102B.

  Subsequently, the main transport device 36 and the sub transport device 37 carry the resin material transfer tray 27 into the resin material supply device 310. In the resin material supply device 310, the resin material P is supplied onto the release film F held by the holding portion as described above.

  The main transport device 36 and the sub transport device 37 transport the resin material transfer tray 27 supplied with the resin material P to the resin molding device 20 of the molding module 32 in which the substrate S is attached to the upper molds 102A and 102B. Then, after the resin material transfer tray 27 is disposed on the lower molds 101A and 101B of the resin molding apparatus 20, the release film F is coated on the inner surfaces of the cavities C of the lower molds 101A and 101B from the resin material transfer tray 27. At the same time, the resin material P is supplied to the cavity C. Thereafter, the resin material transfer tray 27 is unloaded from the resin molding apparatus 20 by the main conveyance device 36 and the sub-conveyance device 37, and then compression molding is performed in the resin molding device 20. While the resin molding apparatus 20 is performing compression molding, the same operation as before is performed on the resin molding apparatuses 20 in the other molding modules 32, thereby shifting the time among the plurality of molding modules 32. However, compression molding can be performed in parallel.

  The resin molded product obtained by the compression molding is carried out from the resin molding device 20 by the main conveyance device 36 and the sub conveyance device 37, and is carried into the resin molded product holding portion 331 of the dispensing module 33 and held therein. The user appropriately takes out the resin molded product from the resin molded product holding portion 331.

(2) Second embodiment
(2-1) Resin Molding Mold of Second Embodiment FIG. 10 shows a resin molding mold 40 of the second embodiment. The resin molding die 40 is a transfer molding die. The molding die 40 for resin molding includes four peripheral wall members including a first peripheral wall member 41A, a second peripheral wall member 41B, a third peripheral wall member 41C, and a fourth peripheral wall member 41D, a bottom surface member 42, a runner 45, and these parts. It consists of an upper mold 401 having a base 4011 for attaching two groups to the lower surface, and a lower mold 402 having two substrate mounting tables 46 and two pots 47. A plunger 48 is inserted into the pot 47 from below. 10A is a bottom view of the upper die 401, FIG. 10B is a longitudinal sectional view of the upper die 401 in a longitudinal section passing through the runner 45, and FIG. 10C is a top view of the lower die 402. (d) shows a longitudinal sectional view of the lower mold 402 in a longitudinal section passing through the pot 47.

  The positions of the runner 45 of the upper mold 401 and the pot 47 of the lower mold 402 are set so that they are connected in a state where the upper mold 401 and the lower mold 402 are in contact with each other vertically. A runner block 451 is disposed around the runner 45 of the upper mold 401 (upper side and lower side of the runner 45 in FIG. 10A), and around the pot 47 of the lower mold 402 (upper side of the pot 47 in FIG. 10C). Pot blocks 471 are respectively provided on the lower side so that the resin does not flow out around the runner 45 and the pot 47.

  FIG. 11A shows a front view of the first peripheral wall member 41A, and FIG. 11B shows a front view of the third peripheral wall member 41C. The “front view” of these peripheral wall members is a view seen from the outside of a planar region surrounded by four peripheral wall members. The first peripheral wall member 41A has an upper surface (first surface) 411 corresponding to the lower surface 111 in the first embodiment. The first peripheral wall member 41 </ b> A includes a left side surface (second surface) 412, an inner surface (third surface) 413, a taper 416, and a flange-shaped portion 417 similar to those of the first embodiment. However, the taper 416 and the hook-shaped portion 417 have a shape that is vertically inverted from that of the first embodiment. Further, the first peripheral wall member 41A has the same slide member 431 and guide hole 432 as in the first embodiment. On the other hand, the first peripheral wall member 41A is not provided with the gas suction port 141, the gas suction tube 142, and the connection port 143 in the first embodiment, and is provided with a resin material supply channel 452 described below. Thus, it is different from the first peripheral wall member 11A of the first embodiment.

  The resin material supply channel 452 is formed by forming a recess in a part of the lower surface (fourth surface) 414 of the first peripheral wall member 41 </ b> A and communicates with the runner 45. The resin material supply flow path 452 is provided with a width in the longitudinal direction of the first peripheral wall member 41A, and always communicates with the runner 45 within a range in which the first peripheral wall member 41A moves as will be described later. ing. On the other hand, the resin material supply channel 452 is blocked by the pot block 471 outside the place communicating with the runner 45 so that the resin material flowing into the resin material supply channel 452 from the runner 45 does not leak. .

  The first peripheral wall member 41A is provided with an internal thread 491 (FIG. 11 (a)) on the upper surface 411, and a bolt 492 (FIG. 10 (b)) passing through the internal thread 491 and a hole provided in the base 4011. The base 4011 is fixed. The base 4011 is provided with a plurality of holes arranged in a line in the depth direction of FIG. 10B. By changing the holes through which the bolts 492 are passed, the entire first peripheral wall member 41A is in the longitudinal direction. Can be moved to.

  The third peripheral wall member 41C has a configuration in which the top and bottom of the third peripheral wall member 11C of the first embodiment are inverted. Unlike the first peripheral wall member 41A, the third peripheral wall member 41C has the same gas suction port 441, gas suction pipe 442, and connection port 443 as in the first embodiment (however, the up and down directions are reversed and the gas While the suction port 441 is provided on the lower surface 414, the resin material supply channel 452 is not provided. Further, a through hole 493 that penetrates from the outer surface to the inner surface 413 is provided instead of the female screw 491 of the first peripheral wall member 41A.

  The second peripheral wall member 41B and the fourth peripheral wall member 41D have the same configuration as the third peripheral wall member 41C, except that the length in the left-right direction is shorter than the third peripheral wall member 41C. Since the first circumferential wall member 41A and the second circumferential wall member 41B have 90 ° different longitudinal directions, the moving directions are also 90 ° different from each other.

  The bottom surface member 42 has a plate shape (a rectangular parallelepiped shape), and is inserted into a quadrangular columnar space formed by four peripheral wall members with the plate surface directed in the vertical direction. As the bottom surface member 12, a plurality of bottom surface members having different vertical and horizontal sizes are prepared. A cavity (cavity) C is formed by the inner surface 413 of each of the peripheral wall members 41 </ b> A to 41 </ b> D and the lower surface of the bottom surface member 12. The base 4011 is provided with a through hole through which the bolt 4012 is passed, and a female screw is provided on the upper surface of the bottom member 42 at a position corresponding to the hole. The bottom member 42 is fixed to the base 4011 by the female screw and the bolt 4012.

  Further, of the four side surfaces of the second peripheral wall member 41B, the surface that contacts the second peripheral wall member 41B, the third peripheral wall member 41C, and the fourth peripheral wall member 41D is provided with a female screw at a position facing the through hole 493 of each peripheral wall member. Is provided. Each peripheral wall member is fixed to the bottom surface member 42 by a bolt 494 (FIG. 10B) that has passed through the through hole 493.

(2-2) Adjustment Method of Resin Molding Mold of Second Embodiment A method of adjusting the resin molding mold 40 of the second embodiment will be described with reference to FIG. 12 shows a bottom view of the upper die 401, (a) in FIG. 12 shows a state in which the planar shape of the cavity C is the maximum before adjustment, and (b) shows a plane of the cavity C after adjustment. The shape is smaller than (a).

  In adjusting the resin molding die 40, first, the bottom member 42 is removed from the upper die 401. From this state, each peripheral wall member 41A-41D is moved as follows. The first peripheral wall member 41A is moved in the longitudinal direction (vertical direction in FIG. 12), and after aligning one of the plurality of holes provided in the base 4011 with the position of the female screw 491, the first peripheral wall member 41A is allowed to pass through the hole. It is fixed to the base 4011 with a bolt 492.

  The second peripheral wall member 41 </ b> B, the third peripheral wall member 41 </ b> B, and the fourth peripheral wall member 41 </ b> D move adjacent positions of the slide member 431 relative to the guide hole 432 toward the right side toward the guide hole 432, thereby adjacent peripheral wall members. Move the relative position with respect to. At this time, the second peripheral wall member 41B moves in the vertical direction of FIG. 12 and in the opposite direction to the first peripheral wall member 41A. The third peripheral wall member 41C moves in the vertical direction in the same direction as the second peripheral wall member 41B, and moves in the horizontal direction so as to approach the first peripheral wall member 41A. The fourth peripheral wall member 41D moves in the same direction as the first peripheral wall member 41A in the vertical direction and moves in the same direction as the third peripheral wall member 41C in the horizontal direction.

  With the movement of each of the peripheral wall members 41A to 41D, the left side surface (second surface) 412 of each of the peripheral wall members 41A to 41D is in a relative position with a part of the inner surface (third surface) 413 of the adjacent left peripheral wall member. Move. In this way, the planar shape of the cavity C maintains a rectangular shape, and both the long side and the short side are shorter than before the movement.

  When the peripheral wall member 41A is moved as described above, the relative positions of the runner 45 and the resin material supply flow path 452 of the peripheral wall member 41A change, but the resin material supply flow path 452 is in the longitudinal direction of the first peripheral wall member 41A. Therefore, the runner 45 and the resin material supply channel 452 are connected even after the movement. Further, the runner block 451 existing around the runner 45 both before and after the movement closes the opening of the resin material supply flow path 452 on the runner block 451 side other than that corresponding to the runner 45 by the runner block 451.

  After moving the peripheral wall members 41A to 41D in this way, the bottom surface member 42 having a plate surface having the same shape as the planar shape of the cavity C is inserted into the space surrounded by the inner surfaces 413 of the peripheral wall members 41A to 41D, The bottom member 42 is fixed to the base 4011 with bolts 4012. Further, the second peripheral wall member 41 </ b> B, the third peripheral wall member 41 </ b> B, and the fourth peripheral wall member 41 </ b> D are fixed to the bottom surface member 42 with bolts 494. It is not necessary to adjust the lower die 402 in accordance with the adjustment of the upper die 401. With the above operation, the adjustment of the resin molding die 40 is completed.

(2-3) Resin molding apparatus including the resin molding die of the second embodiment (resin molding apparatus of the second embodiment)
In FIG. 13, the resin molding apparatus 50 provided with the shaping | molding die 40 for resin molding of 2nd Embodiment is shown. The resin molding apparatus 50 includes a mold clamping mechanism including a base 531, a tie bar 532, a toggle link 533, a movable platen 51, and a fixed platen 52. In the resin molding die 10 of the first embodiment, the two movable platens of the lower movable platen 211 and the upper movable platen 212 are provided, but only one movable platen 51 is provided in the resin molding apparatus 50 of the present embodiment. . The configuration of the mold clamping mechanism other than the movable platen 51 is the same as that of the resin molding die 10 of the first embodiment. A lower die 402 is placed on the movable platen 51. The lower mold 402 is provided with a drive unit that moves the plunger 48 up and down and a heater that heats the inside of the pot 47 (both not shown). An upper die 401 is attached under the fixed platen 52.

(2-4) A resin molded product manufacturing method using the resin molding mold of the second embodiment (the resin molded product manufacturing method of the second embodiment, the operation of the resin molding apparatus of the second embodiment)
The operation of the resin molding apparatus 50 will be described with reference to FIG. First, after the above adjustment is performed with the upper mold 401 removed from the resin molding apparatus 50, the upper mold 401 is attached to the lower surface of the fixed platen 52.

  Next, the substrate S is placed on the substrate mounting table 46 of the lower mold 402 with the mounting surface on which the electronic components are mounted facing upward, and the solid resin material P is put into the pot 47 (a). Next, the release film F is arrange | positioned so that each peripheral wall member 41A-41D of the upper mold | type 401 and the lower side of a bottom face member may be covered. At that time, a slight gap is provided between the bottom member 42 and the first peripheral wall member 41A and the release film F (not shown). In addition, among the peripheral wall members 41A to 41D, the three peripheral wall members 41B to 41D excluding the first peripheral wall member 41A suck the gas from the gas suction port 441, and the bottom surface member 42 and the first peripheral wall member 41A include the gap and the gap. A gas is sucked from a gas suction port 441 communicating with the gap. Thereby, the inner surface of the cavity C excluding the inner surface 413 of the first peripheral wall member 41A is covered with the release film F (b).

  Next, the pot 47 is heated with a heater, and the resin material P in the pot 47 is melted. Thereafter, the movable platen 51 is raised by the toggle link 533, and the upper mold 401 and the lower mold 402 are clamped. Then, the molten resin material P is pushed out from the pot 47 by the plunger 48 (c). The resin material P pushed out from the pot 47 passes through the runner 45 and the resin material supply channel 452 and is supplied into the cavity C. Thereafter, the resin material P is cooled and cured, and the mold is opened by lowering the movable platen 51 (d). Thereby, the resin molded product PM in which the resin material P is cured on the surface of the substrate S is obtained. When the mold is opened, each of the peripheral wall members 41A to 41D is formed into a taper 416, and the inner surface of the cavity C (excluding the inner surface 413 of the first peripheral wall member 41A) is covered with the release film F. The resin molded product PM can be easily released.

(2-5) Effects of Second Embodiment In the resin molding die 40 of the second embodiment, as in the first embodiment, the cavity C can be obtained simply by moving the relative positions of the four peripheral wall members 41A to 41D. Therefore, only one type of peripheral wall members 41A to 41D need be prepared, and replacement is unnecessary. Therefore, it is possible to reduce the cost and labor required for securing and managing the storage location of the mold.

  In addition, since the taper 416 is formed at the lower end of the inner surface 413 of the peripheral wall members 41A to 41D, and the inner surface of the cavity C (excluding the inner surface 413 of the first peripheral wall member 41A) is covered with the release film F, The resin molded product PM can be easily released.

(2-6) Modifications of Second Embodiment The resin molding die 40 of the second embodiment can be variously modified in the same manner as the resin molding die 10 of the first embodiment. For example, in the resin molding die 40 of the second embodiment, all the four peripheral wall members 41A to 41D are movable, but one of these four members may be fixed in position. When the position of the first peripheral wall member 41A is fixed, the relative position between the runner 45 and the resin material supply flow path 452 does not change, so that the resin material supply flow path 452 has the same diameter as the runner 45. be able to. Further, the taper 416 may be omitted. The gas suction port 441 may be provided on the lower surface (fourth surface) 414 of the first peripheral wall member 41A. In that case, the gas suction pipe 442 and the connection port 443 are configured in the same manner as the peripheral wall members 41B to 41D. The gas suction port 441 may be provided on the inner surfaces 413 of the peripheral wall members 41 </ b> A to 41 </ b> D and the lower surface of the bottom surface member 42. Or you may use the gas suction port installation wall similar to FIG. The resin material supply channel 452 may be provided in the bottom member 42. In addition, the configuration of the resin molding die 40 of the second embodiment can be variously modified within the scope of the gist of the present invention.

  The resin molding apparatus 50 of the second embodiment can be modified in various ways similar to the resin molding apparatus 20 of the first embodiment. Furthermore, a resin molding unit similar to the resin molding unit 30 of the first embodiment can be configured using a molding module including the resin molding device 50 of the second embodiment.

10, 40 ... Resin molding molds 101, 101A, 101B, 402, 402A, 402B ... Lower mold 102, 102A, 102B, 401, 401A, 401B ... Upper mold 10A ... First resin molding mold 10B ... Second Resin-molding mold 11 ... peripheral wall members 11A, 41A ... first peripheral wall members 11B, 41B ... second peripheral wall members 11C, 41C ... third peripheral wall members 11D, 41D ... fourth peripheral wall members 111, 411 ... lower surface of the peripheral wall member ( First surface)
112, 412 ... Left side surface (second surface) of peripheral wall member
113, 413 ... Inner surface (third surface) of peripheral wall member
114 ... Upper surface (fourth surface) of the peripheral wall member
116, 416 ... taper 117, 417 ... bowl-shaped part 12, 42 ... bottom surface member 131, 431 ... slide member 132, 432 ... guide hole 141, 141A, 441 ... gas suction port 142, 442 ... gas suction pipe 143, 443 ... Connection port 16 ... Gas suction port installation walls 20 and 50 ... Resin molding device 211 ... Lower movable platen 212 ... Upper movable platen 22 and 52 ... Fixed platens 231 and 531 ... Bases 232 and 532 ... Tie bars 233 and 533 ... Toggle link 241A ... First lower heat insulating member 241B ... second lower heat insulating member 242A ... first upper heat insulating member 242B ... second upper heat insulating member 251A ... first lower heater plate 251B ... second lower heater plate 252A ... first upper heater plate 252B ... first 2 Upper heater plates 26A, 26B ... elastic member 27 ... resin material transfer tray 2 DESCRIPTION OF SYMBOLS 1 ... Resin material transfer tray frame 272 ... Resin material transfer tray resin container 273 ... Resin material transfer tray gas suction port 30 ... Resin molding unit 31 ... Material receiving module 310 ... Resin material supply device 311 ... Substrate receiving unit 32 ... Molding module 33 ... Discharge module 331 ... Resin molded product holder 36 ... Main transport device 37 ... Sub transport device 4011 ... Base 4012 ... Bolt 45 ... Runner 451 ... Runner block 452 ... Resin material supply channel 46 ... Substrate mounting table 47 ... Pot 471 ... Pot block 48 ... Plunger 491 ... Female screw 492, 494 ... Bolt 493 ... Through hole 51 ... Movable platen C ... Cavity F ... Release film P ... Resin material PM ... Resin molded product S ... Substrate

Claims (11)

a) four peripheral wall members each having a first surface, a second surface and a third surface which are three planes orthogonal to each other;
b) When the four peripheral wall members are disposed such that the first surface of each peripheral wall member is disposed on the same plane and the second surface is in contact with a part of the third surface of the adjacent peripheral wall member. A molding die for resin molding, comprising: a bottom surface member inserted into a quadrangular columnar space formed by each third surface of two peripheral wall members and closing one bottom portion of the space.   2. The gas suction port for sucking gas is provided on one or both of the fourth surface and the third surface opposite to the first surface of the four peripheral wall members. Mold for resin molding.   The molding for resin molding according to claim 1 or 2, wherein a gas suction port for sucking gas is provided on a surface of the bottom member on the cavity side surrounded by the four peripheral wall members and the bottom member. Type.   A taper toward the outside of the quadrangular columnar space is formed on a portion of the fourth surface of the four peripheral wall members on the fourth surface side opposite to the first surface as it approaches the fourth surface. The mold for resin molding according to any one of claims 1 to 3, wherein the mold is used. further,
A resin supply channel is provided in at least one of the four peripheral wall members and the bottom surface member, and supplies a resin material to a cavity surrounded by the four peripheral wall members and the bottom surface member. The molding die for resin molding according to any one of claims 1 to 4. A molding die for resin molding according to any one of claims 1 to 4,
A mold clamping mechanism for clamping the mold for resin molding;
An elastic member provided at a lower part of the four peripheral wall members;
A resin molding apparatus comprising: a resin material supply mechanism that supplies a resin material to a cavity surrounded by the four peripheral wall members and the bottom surface member. A molding die for resin molding according to claim 5,
A mold clamping mechanism for clamping the mold for resin molding;
A resin material holding part for holding a resin material connected to the resin supply flow path;
A resin molding apparatus comprising: a plunger that injects the resin material in the resin material holding portion into the cavity through the resin supply channel. 5. In each of the four peripheral wall members of the molding die for resin molding according to claim 1, the second surface and the second surface member are disposed on the same plane while the first surface is disposed on the same plane. A peripheral wall member moving step of moving the relative position of the third surface of the peripheral wall member in contact with the two surfaces;
A method for adjusting a molding die for resin molding, comprising: a bottom member inserting step of inserting the bottom member into a quadrangular columnar space formed by each third surface of four peripheral wall members. 6. Each of the four peripheral wall members of the molding die for resin molding according to claim 5, wherein the second surface and the second surface are in contact with each other while the first surface is disposed on the same plane. A peripheral wall member moving step of moving the relative position of the third surface of
A method for adjusting a molding die for resin molding, comprising: a bottom member inserting step of inserting the bottom member into a quadrangular columnar space formed by each third surface of four peripheral wall members.   5. The resin molding according to claim 1, wherein the shape of the cavity surrounded by the four peripheral wall members and the bottom surface member is adjusted by the method for adjusting a molding die for resin molding according to claim 8. Supplying a resin material to the cavity of the mold, heating the resin material to a temperature at which the resin material softens or melts, then clamping the resin mold, and then curing the resin material A resin molded product manufacturing method characterized by the above.   The resin molding mold according to claim 5, wherein the shape of the cavity is adjusted by the resin molding mold adjusting method according to claim 9, and the resin material is heated to a temperature at which the resin material is softened or melted. The resin material is supplied from the resin supply flow path to the cavity, and then the resin material is cured.

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