CN108858949A - Ester moulding shaping dies and its method of adjustment, resin molding apparatus and resin forming product manufacturing method - Google Patents
Ester moulding shaping dies and its method of adjustment, resin molding apparatus and resin forming product manufacturing method Download PDFInfo
- Publication number
- CN108858949A CN108858949A CN201810442170.3A CN201810442170A CN108858949A CN 108858949 A CN108858949 A CN 108858949A CN 201810442170 A CN201810442170 A CN 201810442170A CN 108858949 A CN108858949 A CN 108858949A
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- China
- Prior art keywords
- mentioned
- shaping dies
- ester moulding
- peripher wall
- wall member
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
Abstract
The present invention provides ester moulding shaping dies and its method of adjustment, resin molding apparatus and resin forming product manufacturing method.Ester moulding shaping dies (10) has：4 peripher wall members (11A~11D) are respectively provided with 3 mutually orthogonal planes that is, the 1st surface (111), the 2nd surface (112) and the 3rd surface (113)；And floor members (12), it is loaded to the inside in the columnar space in quadrangle (C) formed when 4 peripher wall members configure in such a way that the 1st surface configuration of each peripher wall member is contacted on same plane and the 2nd surface with a part on the 3rd surface of adjacent peripher wall member by each 3rd surface of 4 peripher wall members, a bottom in the space is blocked.It is only mobile by the relative position of 4 peripher wall members, the flat shape of die cavity just can be changed, therefore, peripher wall member only prepares a kind, and can be reduced shaping dies site of storage ensures or manage required cost and working hour.
Description
Technical field
The present invention relates to a kind of ester moulding shaping dies of manufacture for resin forming product, resin molding apparatus,
Ester moulding shaping dies method of adjustment and resin forming product manufacturing method.
Background technique
In order to protect the influence of electronic component not environment such as light, heat, moisture, electronic component is normally sealed in resin.
For this purpose, carrying out ester moulding by compression forming method or transfer forming process etc..In compression forming method, using by lower die and upper mold
The shaping dies constituted supplies resin material to the die cavity of lower die, by the substrate for being installed with electronic component be installed on upper mold it
Afterwards, one heating one side is carried out in face of lower die and upper mold mold the two, thus carry out ester moulding.In transfer forming process, in
After a die cavity installation base plate in upper mold and lower die, one, which carries out heating one side in face of lower die and upper mold, molds the two, benefit
Resin is supplied to die cavity with plunger, thus carries out ester moulding.
In the resin forming product obtained by ester moulding, cooperation is sealed in the shape, a of the electronic component of resin
Number, configuration etc., and the size of resin forming product is different.Therefore, for the ruler of each resin forming product production and resin forming product
Very little corresponding shaping dies, must prepare a large amount of shaping dies thus.If it does, then the production of shaping dies needs cost,
And a large amount of shaping dies must be taken care of, site of storage ensures or manages to need working hour.
In patent document 1, a kind of resin molding apparatus is recorded, is releasably arranged in flat 1st mold
Have the insertion component for the bottom for being equivalent to shaping dies, in the 1st mold it is opposite flat 2nd mold that configures can load and unload
The flat shape that ground is provided with the space of the peripheral wall for being equivalent to shaping dies and inside has planar shaped identical with insertion component
The damming tectosome of shape.Insertion component is loaded into damming tectosome with being embedded in component when by the 1st mold with 2 mold clamping
The fixed mutual position of the mode in the space on the inside of to damming tectosome.According to this constitution, being only by the way that component replacement will be embedded in
The different component of thickness just can make the different resin forming product of thickness.When only changing the situation of thickness like this, damming
Common tectosome can be used in tectosome, therefore, for all for each resin forming product production shaping dies, energy
Enough inhibit cost.
[existing technical literature]
[patent document]
[patent document 1]：Japanese Patent Laid-Open 11-105053
Summary of the invention
(technical problems to be solved by the inivention)
In the resin molding apparatus documented by patent document 1, although only the different resin forming product of thickness can be used altogether
Logical peripheral wall is made, but when making the situation of the different resin forming product of the size other than thickness, it is necessary to production and institute
State width or the corresponding peripheral wall of length, therefore, it is necessary to situation that shape mold entirety is sized to according to resin forming product
When identical cost and working hour.
The of the invention project to be solved is to provide a kind of in making the different resin forming product of the size other than thickness
When can reduce shaping dies needed for cost or ester moulding shaping dies, resin molding apparatus, the ester moulding in working hour
With shaping dies method of adjustment and resin forming product manufacturing method.
(technical solution for solving technical problem)
1st mode of ester moulding shaping dies of the invention completed to solve the above problems is characterized in that
Have：
4 peripher wall members are respectively provided with 3 mutually orthogonal planes that is, the 1st surface, the 2nd surface and the 3rd surface；
And
Floor members are loaded to when above-mentioned 4 peripher wall members with the 1st surface configuration of each peripher wall member in same
By 4 peripher wall members when the mode that in plane and the 2nd surface is contacted with a part on the 3rd surface of adjacent peripher wall member configures
The inside in the columnar space in quadrangle that is formed of each 3rd surface, the bottom of the side in the space is blocked.
2nd mode of ester moulding shaping dies of the invention is characterized in that：In the 1st mode ester moulding at
In shape mold, it is also equipped with：
Resin supply line, at least one component being set in above-mentioned 4 peripher wall members and above-mentioned floor members are right
Die cavity made of being surrounded as 4 peripher wall members and the floor members supplies resin material.
1st mode of resin molding apparatus of the invention is characterized in that having：
The ester moulding shaping dies of above-mentioned 1st mode；
Clamping molds above-mentioned ester moulding with shaping dies；
Elastic component is set to the lower part of above-mentioned 4 peripher wall members；And
Resin material feed mechanism supplies die cavity made of being surrounded as above-mentioned 4 peripher wall members and above-mentioned floor members
To resin material.
2nd mode of resin molding apparatus of the invention is characterized in that having：
The ester moulding shaping dies of above-mentioned 2nd mode；
Clamping molds above-mentioned ester moulding with shaping dies；
Resin material maintaining part is connected to above-mentioned resin supply line, and keeps resin material；And
Resin material in above-mentioned resin material maintaining part is injected into via above-mentioned resin supply line above-mentioned by plunger
Die cavity.
1st mode of ester moulding shaping dies method of adjustment of the invention is characterized by having：
Peripher wall member moving step, in above-mentioned 4 peripher wall members of the ester moulding shaping dies of above-mentioned 1st mode
It is each in, keep above-mentioned 1st surface configuration in the state of on above-mentioned same plane, make above-mentioned 2nd surface and the 2nd surface
The relative position on the 3rd surface of the peripher wall member contacted is mobile；And
Floor members are packed into step, and above-mentioned floor members are packed into and are formed to each 3rd surface by 4 peripher wall members
The inside in the columnar space in quadrangle.
2nd mode of ester moulding shaping dies method of adjustment of the invention is characterized by having：
Peripher wall member moving step, in above-mentioned 4 peripher wall members of the ester moulding shaping dies of above-mentioned 2nd mode
It is each in, keep above-mentioned 1st surface configuration in the state of on above-mentioned same plane, make above-mentioned 2nd surface and the 2nd surface
The relative position on the 3rd surface of the peripher wall member contacted is mobile；And
Floor members are packed into step, and above-mentioned floor members are packed into each 3rd surface by 4 peripher wall members and are formed
The columnar space in quadrangle inside.
1st mode of resin forming product manufacturing method of the invention is characterized in that：
Ester moulding by above-mentioned 1st mode shaping dies method of adjustment is adjusted by above-mentioned 4 peripher wall members and
The die cavity of the ester moulding shaping dies of above-mentioned 1st mode after the shape of die cavity made of above-mentioned floor members surround supplies
To resin material, after which to be heated to the temperature that the resin material is softened or melted, by above-mentioned ester moulding at
Shape mold clamping later hardens the resin material.
2nd mode of resin forming product manufacturing method of the invention is characterized in that：
It will be upper after the shape for adjusting above-mentioned die cavity with shaping dies method of adjustment by the ester moulding of above-mentioned 2nd mode
The ester moulding for stating the 2nd mode is molded with shaping dies, and the resin material is heated to the temperature that resin material is softened or melted
After degree, the resin material is supplied to above-mentioned die cavity from above-mentioned resin supply line, later hardens the resin material.
(The effect of invention)
According to the present invention, it when making the different resin forming product of the size other than thickness, can reduce needed for shaping dies
Cost or working hour.
Detailed description of the invention
Fig. 1 (a) is the top view of the lower die in the 1st embodiment for indicate ester moulding shaping dies of the invention,
Fig. 1 (b) is the A-A' sectional view for indicating lower die and upper mold.
Fig. 2 (a) is 1 forward sight in the peripher wall member in the ester moulding shaping dies for indicate the 1st embodiment
Figure, Fig. 2 (b) is top view, and Fig. 2 (c) is left side view, and Fig. 2 (d) is right side view.
Fig. 3 (a) is the figure for indicating the method for adjustment of the flat shape of ester moulding shaping dies of the 1st embodiment,
And be the B-B' sectional view of the peripher wall member of flat shape before changing, Fig. 3 (b) is the B-B' sectional view after change.
Fig. 4 (a) is the figure for indicating the method for adjustment of the flat shape of ester moulding shaping dies of the 1st embodiment,
And be the perspective view of the peripher wall member of flat shape before changing, Fig. 4 (b) is the perspective view after change.
Fig. 5 is resin molding apparatus (the 1st embodiment party for indicating the ester moulding shaping dies with the 1st embodiment
The resin molding apparatus of formula) schematic configuration diagram.
Fig. 6 is the enlarged view of the main part of the resin molding apparatus of the 1st embodiment.
Fig. 7 (a) to Fig. 7 (f) is the resin forming product system for indicating the ester moulding shaping dies using the 1st embodiment
Make the skeleton diagram of method.
Fig. 8 is lower die and surrounding wall in the variation for indicate the ester moulding shaping dies of the 1st embodiment
Top view.
Fig. 9 is the skeleton diagram for indicating the composition of ester moulding unit of the resin molding apparatus with the 1st embodiment.
Figure 10 (a) is the bottom view of the upper mold in the 2nd embodiment for indicate ester moulding shaping dies of the invention,
Figure 10 (b) is the profilograph of upper mold, and Figure 10 (c) is the top view for indicating lower die, and Figure 10 (d) is the profilograph of lower die.
Figure 11 (a) is the front view of the 1st peripher wall member in the ester moulding shaping dies of the 2nd embodiment, Figure 11
(b) be the 1st peripher wall member bottom view, Figure 11 (c) is the front view of the 3rd peripher wall member, and Figure 11 (d) is the 3rd peripher wall member
Bottom view.
Figure 12 (a) is the figure for indicating the method for adjustment of the flat shape of ester moulding shaping dies of the 2nd embodiment,
And be the bottom view of the peripher wall member of flat shape before changing, Figure 12 (b) is the bottom view after change.
Figure 13 is resin molding apparatus (the 2nd embodiment party for indicating the ester moulding shaping dies with the 2nd embodiment
The resin molding apparatus of formula) schematic configuration diagram.
Figure 14 (a) to Figure 14 (d) is the resin forming product for indicating the ester moulding shaping dies using the 2nd embodiment
The skeleton diagram of manufacturing method.
Symbol description
10,40：Ester moulding shaping dies；101,101A,101B,402,402A,402B：Lower die；102,102A,
102B,401,401A,401B：Upper mold；10A：1st ester moulding shaping dies；10B：2nd ester moulding shaping dies；
11：Peripher wall member；11A,41A：1st peripher wall member；11B,41B：2nd peripher wall member；11C,41C：3rd peripher wall member；11D,
41D：4th peripher wall member；111,411：The lower surface (the 1st surface) of peripher wall member；112,412：The left side (of peripher wall member
2 surfaces)；113,413：The inner surface (the 3rd surface) of peripher wall member；114：The upper surface (the 4th surface) of peripher wall member；116,
416：Tapered portion；117,417：Eaves shape portion；12,42：Floor members；131,431：Sliding component；132,432：Guide hole；141,
141A,441：Gas pump orifice；142,442：Gas suction tube；143,443：Connector；16：Wall is arranged in gas pump orifice；20,
50：Resin molding apparatus；211：Lower movable pressure plate；212：Upper movable pressure plate；22,52：Fixation clip；231,531：Basal disc；
232,532：Connecting rod；233,533：Toggle；241A：1st lower part heat insulating component；241B：2nd lower part heat insulating component；242A：The
1 top heat insulating component；242B：2nd top heat insulating component；251A：1st inferior part inferior part；251B：2nd inferior part inferior part；
252A：1st upper Heating Plate；252B：2nd upper Heating Plate；26A,26B：Elastic component；27：Resin material transfers disk；271：
The framework of resin material transfer disk；272：The resin receiving portion of resin material transfer disk；273：The gas of resin material transfer disk
Pump orifice；30：Ester moulding unit；31：Material receiving module；310：Resin material feedway；311：Substrate receiving unit；
32：Shaping module；33：Take out module；331：Resin forming product maintaining part；36：Main carrying device；37：Secondary carrying device；
4011：Substrate；4012：Bolt；45：Chute；451：Chute resistor；452：Resin material supply line；46：Substrate-placing platform；
47：Hole slot；471：Hole slot resistor；48：Plunger；491：Box thread；492,494：Bolt；493：Through hole；51：Movable pressure plate；
C：Die cavity；F：Mould release film；P：Resin material；PM：Resin forming product；S：Substrate.
Specific embodiment
In the present invention, make 4 peripher wall members to keep the 1st surface configuration waited in the state on same plane
Under, the changed mode in relative position on the 3rd surface of the peripher wall member that the 2nd surface is contacted with the 2nd surface is mutually moved
Dynamic, thus, it is possible to change the flat shape in the columnar space in quadrangle formed by each 3rd surface of 4 peripher wall members, (oneself is with the 1st
The shape in the space that the vertical direction in surface is observed).Moreover, passing through the bottom for the side that will block the columnar space in the quadrangle
The floor members in portion are packed into the space, and be formed in manufacture resin forming product when supply resin material space by 4 week
Die cavity made of wall member and floor members surround.The thickness (size in the direction vertical with above-mentioned 1st surface) of die cavity can lead to
The position on the surface for the floor members for crossing change die cavity side is adjusted.
According to the present invention, the planar shaped of die cavity can just only be changed by keeping the relative position of 4 peripher wall members mobile
Shape, therefore, peripher wall member only prepare a kind.Therefore, just (though needing to prepare multiple floor members) only prepares a kind of peripheral wall
For the aspect of component, can reduce the site of storage of shaping dies ensures or manages required cost and working hour.
Among ester moulding shaping dies of the invention, the 1st mode for compression molding has above-mentioned 4 peripheral wall structures
Part and above-mentioned floor members.In addition, the 2nd mode for transferring forming has among ester moulding shaping dies of the invention
There are above-mentioned 4 peripher wall members and above-mentioned floor members, and at least one component in 4 peripher wall members and floor members
With the resin supply line to die cavity supply resin material.
In the ester moulding shaping dies of the 1st mode, can be with above-mentioned 1st surface in above-mentioned 4 peripher wall members
Any of the 4th surface and above-mentioned 3rd surface of opposite side or both have the gas pump orifice of intake-gas.Alternatively, in
It, also can be made of being surrounded as above-mentioned 4 peripher wall members and the floor members in the ester moulding shaping dies of 1st mode
The surface of die cavity side has the gas pump orifice of intake-gas.It also can be in the 3rd surface or the surface on the 4th surface and die cavity side
The two be arranged gas pump orifice.By the shaping dies of the ester moulding in the 1st mode, such gas pump orifice is set, and energy
Enough demouldings in for the resin molded body after being easy to be formed and advance with the coating peripheral wall for constituting die cavity of mould release film
When the surface of the die cavity side on the 3rd surface and floor members of component, by keeping the demoulding thin from gas pump orifice intake-gas
Film is close contact in the surface.
In the ester moulding shaping dies of the 1st and the 2nd mode, it can take in the above-mentioned of above-mentioned 4 peripher wall members
A part of above-mentioned 4th surface side on the 3rd surface is formed with close to the 4th surface and towards the columnar sky in above-mentioned quadrangle
Between outside tapered portion composition.Thereby, it is possible to easily by the resin molded body after forming from ester moulding finishing die
Tool demoulding.
Hereinafter, using Fig. 1 (a)~Figure 14 (d), to ester moulding shaping dies of the invention, resin molding apparatus, tree
The more specific embodiment of rouge forming shaping dies method of adjustment and resin forming product manufacturing method is illustrated.
(1) the 1st embodiment
The ester moulding shaping dies of (1-1) the 1st embodiment
In Fig. 1 (a) and Fig. 1 (b), the ester moulding shaping dies 10 of the 1st embodiment is indicated.The ester moulding is used
Shaping dies 10 is the shaping dies of compression molding.Ester moulding has with shaping dies 10 by 4 peripher wall members and bottom
The lower die 101 that surface member 12 is constituted and the upper mold 102 being made of single component, above-mentioned 4 peripher wall members were by the 1st week
Wall member 11A, the 2nd peripher wall member 11B, the 3rd peripher wall member 11C and the 4th peripher wall member 11D are constituted.
In Fig. 2 (a) into Fig. 2 (d), the composition of the 1st peripher wall member 11A is indicated.In addition, the 3rd peripher wall member 11C have with
The identical composition of 1st peripher wall member 11A, the 2nd peripher wall member 11B and the 4th peripher wall member 11D are shorter in length than the except left and right directions
Except 1 peripher wall member 11A, there is composition identical with the 1st peripher wall member 11A.
Each peripher wall member 11A~11D is made of the component of rectangular plate, so that the rectangular long side
One in the end face state for downward erecting plate face configures.Respectively, the lower surface 111 of each peripher wall member 11A~11D is suitable
In above-mentioned 1st surface, the left side 112 as the one side in the end face of short side is equivalent to above-mentioned 2nd surface, as rectangle
One inner surface 113 of plate face be equivalent to above-mentioned 3rd surface.Lower surface 111, left side 112 and inner surface 113 are mutually just
It hands over.The height of the lower surface (the 1st surface) 111 of each peripher wall member 11A~11D is consistent, is configured on same plane.Such as Fig. 1 (a)
Shown, the 1st peripher wall member 11A, the 2nd peripher wall member 11B, the 3rd peripher wall member 11C and the 4th peripher wall member 11D are sequentially from top
Make the direction of inner surface 113 is each in the counterclockwise direction to change 90 ° and form the mode in the columnar space in quadrangle in inside when observation
Configuration.Hereinafter, left adjacent and right neighbour when observing from top is only recorded as " left neighbour " and " right neighbour ".Each peripher wall member 11A~11D
Inner surface 113 towards the columnar space side in quadrangle.In addition, the left side (the 2nd surface) 112 of each peripher wall member 11A~11D with
A part contact of the inner surface (the 3rd surface) 113 of the peripher wall member of left neighbour.
In Fig. 2 (a), respectively, the front of 1 peripher wall member 11 is indicated with solid line, indicate left neighbour's with one-dot chain line
The right side of peripher wall member indicates the part of the left end of the figure in the left side of the peripher wall member of right neighbour with 2 chain lines.It is closed
The relative position of the left side (the 2nd surface) of the peripher wall member 11 of the inner surface (the 3rd surface) 113 and right neighbour of the peripher wall member of note
(following) can be moved, in Fig. 2 (a), indicate the position of the left side of the peripher wall member 11 of right neighbour with 1 two chain-dotted line respectively
2 different examples.
It is provided in each peripher wall member 11A~11D from the columned sliding component vertically outstanding of the left side 112
131 (Fig. 2 (a)).In addition, being provided with height identical with sliding component 131 in the peripheral wall in each peripher wall member 11A~11D
The guide hole 132 (Fig. 2 (a)) penetrated through on the thickness direction of the plate of component.Guide hole 132 extends in left and right directions, length
Shorter than it is provided with the thickness of each peripher wall member 11A~11D in the height of guide hole 132.Longitudinal size of guide hole 132 is removed
The both ends of left and right are roughly the same with the diameter of the cylinder of sliding component 131 other than around (the slightly larger than diameter).Each peripheral wall structure
The shape that the sliding component 131 of part 11A~11D is contacted in left side 112 with a part of the inner surface 113 of the peripher wall member of left neighbour
The guide hole 132 of the peripher wall member of left neighbour is inserted under state.In addition, being represented by dotted lines in Fig. 2 (a) in the guide hole 132
It is inserted into the sliding component 1 of the 2nd peripher wall member 11B of the guide hole 132 of the 1st peripher wall member 11A.
In the upper surface (the 4th surface) 114 of peripher wall member 11A~11D, to be arranged on the length direction of the upper surface 114
It arranges multiple modes and is provided with gas pump orifice 141.In being provided with gas suction tube 142 in peripher wall member, the gas suction tube
142 branches and connect with each gas pump orifice 141.The gas suction tube 142 and the right side for being set to each peripher wall member 11A~11D
The connector 143 of side connects, the connector 143 and the gas suction pump being set to except ester moulding shaping dies 10
(not shown) is connected.
In the upper end of the inner surface 113 of each peripher wall member 11A~11D, it is provided with to the upper surface 114 with peripher wall member
Angle carries out tapered portion 116 formed by chamfering.Tapered portion 116 is in close to upper surface 114 and towards the columnar space in quadrangle
The shape in outside.In addition, being provided with has and is located at left neighbour's in the upper end of the left side 112 of each peripher wall member 11A~11D
The eaves shape portion 117 (Fig. 2 (a)) in the face that the tapered portion 116 of peripher wall member contacts.
Floor members 12 are plate, are loaded to the quadrangular prism formed by 4 peripher wall members towards up and down direction with plate face
In the space of shape.Floor members 12 are prepared with the vertical of plate face and horizontal of different sizes multiple.By each peripher wall member 11A~
The inner surface 113 of 11D and the upper surface of floor members 12 form die cavity C.
Upper mold 102 is tabular as shown in Fig. 1 (b).
The method of adjustment of the ester moulding shaping dies of (1-2) the 1st embodiment
Using Fig. 3 (a) to Fig. 4 (b), the ester moulding of the 1st embodiment is carried out with the method for adjustment of shaping dies 10
Explanation.Each peripher wall member 11A~11D in B-B' section shown in Fig. 1 (b) and Fig. 2 (c) is indicated in Fig. 3 (a) and Fig. 3 (b)
Sectional view, perspective view is indicated in Fig. 4 (a) and Fig. 4 (b).The B-B' section of Fig. 3 (a) and Fig. 3 (b) is free of tapered portion 116,
Include sliding component 131 and guide hole 132.Hereinafter, to carry out from the ester moulding planar shaped of the die cavity C in shaping dies 10
The maximum Status Change of shape is to be illustrated for situation compared with the adjustment of its small state.Firstly, being shaped from ester moulding
Mold 10 takes out floor members 12.Fig. 3 (a) indicates that the state after taking out floor members 12, the flat shape of die cavity C are rectangular
Shape and long side (figure be laterally extended while) and short side (figure longitudinally extend while) become maximum.In Fig. 3 (a), though not
Indicate tapered portion 116, but each peripher wall member 11A~11D is configured at position identical with position represented by Fig. 1 (a).
From the state, make the sliding component 131 of each peripher wall member 11A~11D relative to the relative position court of guide hole 132
It is moved to the left to guide hole 132.With the movement, the left side (the 2nd surface) 112 of each peripher wall member 11A~11D it is opposite
In the peripher wall member of left neighbour inner surface (the 3rd surface) 113 relative position towards die cavity C medial movement (in Fig. 3 (b)
Block arrow).The flat shape of die cavity C makes to become before the more above-mentioned movement of longer side and a shorter side when maintaining rectangle as a result,
It is short.
Longer side and a shorter side and off-peak state from the flat shape of die cavity C, make the cunning of each peripher wall member 11A~11D
Dynamic component 131 to the right, namely makes the left side of each peripher wall member 11A~11D relative to the relative position of guide hole 132
The relative position of the inner surface (the 3rd surface) 113 of the peripher wall member relative to left neighbour on (the 2nd surface) 112 is to the outside of die cavity C
Mobile, thereby, it is possible to keep the longer side and a shorter side of the flat shape of die cavity C elongated.In addition, 2 opposite peripher wall members can both make
The two is mobile, also can only make one of movement.It in turn, also can be by only making the opposite direction in 4 peripher wall member 11A~11D
2 or only 1 movement, and only change one length in the longer side and a shorter side of the flat shape of die cavity C.
In addition, being relatively provided with each peripher wall member in the height of guide hole 132 as the length of guide hole 132 is as described above
The thickness of 11A~11D is short, no matter is located at the situation of which position relative to the relative position of guide hole 132 in sliding component 131
When, guide hole 132 will not be connected to die cavity C.
As above after the flat shape of change die cavity C, by the plate face with shape identical with the flat shape
Floor members 12 are packed by the inner surface 113 of each peripher wall member 11A~11D and surround place.As a result, by each peripher wall member 11A
Space made of the inner surface 113 of~11D and the upper surface of floor members 12 surround, becomes ester moulding shaping dies 10
Die cavity C adjusted.In addition, upper mold 102 is also changed to the shape corresponding person with die cavity C.
(1-3) have the ester moulding shaping dies of the 1st embodiment resin molding apparatus (the 1st embodiment
Resin molding apparatus)
Then, using Fig. 5 and Fig. 6, to the ester moulding for having 2 group of the 1st embodiment (the 1st resin of shaping dies 10
Forming shaping dies 10A, the 2nd ester moulding shaping dies 10B) resin molding apparatus 20 be illustrated.Ester moulding
Device 20 is provided with toggle 233 in erecting 2 connecting rods 232 on basal disc 231.It can be towards up or down in connecting rod 232
Lower movable pressure plate 211 and upper movable pressure plate 212 are maintained, is fixed with fixation clip 22 in the upper end of connecting rod 232.The basal disc
231, connecting rod 232, toggle 233, lower movable pressure plate 211, upper movable pressure plate 212 and fixation clip 22 are equivalent to clamping.
On lower movable pressure plate 211, the 1st lower part heat insulating component 241A, the 1st inferior part inferior part are sequentially provided under
The lower die 101A of 251A, the 1st ester moulding shaping dies 10A.Under upper movable pressure plate 212, from being above sequentially provided with the 1st
The upper mold 102A of top heat insulating component 242A, the 1st upper Heating Plate 252A, the 1st ester moulding shaping dies 10A.Similarly,
On upper movable pressure plate 212, the 2nd lower part heat insulating component 241B, the 2nd inferior part inferior part 251B, the 2nd tree are sequentially provided under
The rouge forming lower die 101B of shaping dies 10B, under fixation clip 22, from being above sequentially provided with the 2nd top heat insulating component
The upper mold 102B of 242B, the 2nd upper Heating Plate 252B, the 2nd ester moulding shaping dies 10B.1st lower part heat insulating component
241A, the 1st top heat insulating component 242A, the 2nd lower part heat insulating component 241B and the 2nd top heat insulating component 242B respectively will be columnar
Heat insulating component configures more in two dimension shape and forms.
In lower die 101A and 101B, around floor members 12 and the lower part of each peripher wall member 11A~11D is arranged
Elastic member 26A and 26B.Floor members 12 are fixed, in contrast, each peripher wall member 11A~11D can be in elastic component
It is moved along the vertical direction on 26A and 26B.The cross (approximate horizontal) of elastic component 26A and 26B to position can be according to peripheral wall structure
The cross (approximate horizontal) of part 11A~11D to position it is mobile.
In addition, resin molding apparatus 20 in the 1st ester moulding with the lower die 101A and upper mold 102A of shaping dies 10A it
Between, the 2nd ester moulding between the lower die 101B and upper mold 102B of shaping dies 10B, be respectively provided with the resin moved in from side
Material transfers disk (resin material feed mechanism) 27.As shown in fig. 6, resin material transfer disk 27 has：Framework 271, by plate
The central portion of shape component is dug out；Resin receiving portion 272, the part dug out and is surrounded by framework 271；And gas is taken out
Suction inlet 273, is set to the lower surface of framework 271, and adsorbs mould release film F.Resin material transfers disk 27 in by adsorbing certainly
Mouth 272 is aspirated air and mould release film F is adsorbed in the lower surface of framework 271 and is received using mould release film F blocking resin
Resin material P is contained in resin receiving portion 272 in the state of the downside in appearance portion 272.Moreover, resin material transfer disk 27 is removed
Enter between lower die 101A (101B) and upper mold 102A (102B).Then, it is taken out from the gas pump orifice 141 of lower die 101A (101B)
Air-breathing body, and the absorption of the mould release film F carried out using the gas pump orifice 273 of resin material transfer disk 27 is released, by
This, mould release film F is deformed in a manner of corresponding with the shape of the inner surface of die cavity C and is coated on the inner surface, and by resin
Material P is supplied to die cavity C.
(1-4) uses resin forming product manufacturing method (the 1st implementation of the ester moulding shaping dies of the 1st embodiment
The movement of the resin forming product manufacturing method, the resin molding apparatus of the 1st embodiment of mode)
Resin forming product using Fig. 7 (a) to Fig. 7 (f), to the ester moulding shaping dies for using the 1st embodiment
The movement of the resin molding apparatus of 1st embodiment of manufacturing method (the resin forming product manufacturing method of the 1st embodiment) into
Row explanation.Though in addition, indicating the movement of the 1st ester moulding shaping dies 10A, the 2nd resin in Fig. 7 (a) to Fig. 7 (f)
Forming is also identical with the movement of shaping dies 10B.
Firstly, the method for adjustment of the ester moulding shaping dies by the 1st embodiment, becomes specific with die cavity C
The mode of shape adjusts lower die 101A and 101B.It is accompanied by this, is matched with the position with each peripher wall member 11A~11D adjusted
The position of the mode of conjunction mobile elastic component 26A and 26B.
Then, in the lower surface of upper mold 102A and 102B, the substrate S for being equipped with multiple electronic components is allowed respectively, with assembly
Mode facing towards downside installs (Fig. 7 (a)).Then, the resin material for maintaining resin material P and mould release film F is transferred
Disk 27 is moved in after between lower die 101A (101B) and upper mold 102A (102B) and is allowed to decline, and aspirates gas from gas pump orifice 141
Body, and handle part discharges mould release film F.The inner surface of the die cavity C of lower die 101A and 101B is by mould release film F quilt as a result,
It covers and resin material P is supplied to die cavity C (Fig. 7 (b)).In addition, gas pump orifice 141 be only arranged at peripher wall member 11A~
The upper surface 114 of 11D and it is not set in die cavity C, but because slightly there is roughness in upper surface 114, therefore can be via upper surface
Sky of the gap of 114 and mould release film F from the suction of gas pump orifice 141 between the inner surface and mould release film F of die cavity C
Gas.Therefore, the inner surface and mould release film F that can make die cavity C touch.
Then, using the 1st inferior part inferior part 251A and 252A to the resin material P in the die cavity C of lower die 101A and 101B
It is heated, melts resin material P or soften (Fig. 7 (c)).It is accompanied by this, utilizes the 1st upper Heating Plate 252A and 252B
Substrate S is heated to the temperature with resin material P same degree.This be after just carrying out molding as described below in order to prevent because
The temperature difference of resin material P and substrate S leads to resin material P quick refrigeration.When the heating, due to respectively under the 1st
The 1st lower part heat insulating component 241A is provided between portion heating plate 251A and lower movable pressure plate 211, in the 1st upper Heating Plate 252A
Top heat insulating component 242A is provided between upper movable pressure plate 212, thus can inhibit heat dissipation to lower movable pressure plate 211 or on can
Dynamic pressure plate 212, and the substrate S of resin material P or upper mold 102 in the die cavity C of lower die 101A can efficiently be heated (under
Mould 101B and upper mold 102B are also identical).
Then, increase lower movable pressure plate 211 using toggle 233.As a result, firstly, the 1st ester moulding shaping dies
The lower die 101A and upper mold 102A of 10A is abutted against, and the upper movable pressure plate 212 for being equipped with upper mold 102A rises, and the 2nd ester moulding
It is abutted against with the lower die 101B of shaping dies 10B and upper mold 102B.Being further advanced by toggle 233 makes lower movable pressure plate 211
Rise, as a result, by shaping dies 10A and the 2nd ester moulding shaping dies 10B molding (Fig. 7 (d)) of the 1st ester moulding.It is logical
It crosses with state holding, and makes the resin in the 1st ester moulding shaping dies 10A and the 2nd ester moulding shaping dies 10B
Material P hardening, forms resin forming product (resin seal product) PM (Fig. 7 (e)) in the surface of substrate S as a result,.
Later, stop carrying out using the 1st inferior part inferior part 251A and 252A and the 1st upper Heating Plate 252A and 252B
Heating, and decline lower movable pressure plate 211 using toggle 233, make the 1st ester moulding shaping dies 10A and the as a result,
2 ester mouldings are opened (Fig. 7 (f)) with shaping dies 10B.At this point, by the inner surface of die cavity C be coated with mould release film F and
Tapered portion 116, resin forming product PM energy are formed in the upper end of the inner surface of peripher wall member 11A~11D of lower die 101A, 101B
It is enough easily to be demoulded from lower die 101A, 101B.Later, will be formed in surface the substrate S of resin forming product PM from upper mold 102A,
102B removal, and remove mould release film F from lower die 101A, 101B.Though in addition, in resin forming product PM end formed with
The corresponding inclined surface of tapered portion 116 of ester moulding shaping dies 10, but will do it will be formed with resin forming product PM later
Substrate S be divided into multiple singualtions to handle, the part of inclined surface is removed at this time.
After, by the way that movement before this is repeated, and resin forming product PM can be manufactured repeatedly.
The effect of (1-5) the 1st embodiment
According to the ester moulding shaping dies 10 of the 1st embodiment, only by making the phase of 4 peripher wall member 11A~11D
It is mobile to position, the flat shape of die cavity C just can be changed, therefore, peripher wall member 11A~11D only prepares a kind, is not necessarily to
Replacement.Therefore, can reduce the site of storage of shaping dies ensures or manages required cost and working hour.
In addition, the ester moulding of the 1st embodiment is with shaping dies 10 in the inner surface 113 of peripher wall member 11A~11D
Upper end is formed with tapered portion 116, therefore, can easily demould resin forming product PM.It is accompanied by this, the 1st embodiment
Ester moulding is just able to use the gas pump orifice 141 for being set to peripher wall member 11A~11D with shaping dies 10 and utilizes demoulding
Film F is coated for the aspect of the inner surface of die cavity C, also can easily be demoulded resin forming product PM.
The variation of (1-6) the 1st embodiment
In the 1st embodiment ester moulding in shaping dies 10,4 peripher wall member 11A~11D can all be moved
It is dynamic, but 1 in described 4 can also fix position.In the 1st embodiment ester moulding in shaping dies 10, in week
The upper end of the inner surface 113 of wall member 11A~11D is formed with tapered portion 116, but tapered portion 116 can also be omitted.Implement in the 1st
Gas pump orifice 141 is set to the upper surface of peripher wall member 11A~11D in shaping dies 10 by the ester moulding of mode
114, but together or can also be taken and the inner surface 113 or bottom surface structure in peripher wall member 11A~11D in generation with gas pump orifice 141
Gas pump orifice is arranged in the upper surface of part 12.Alternatively, as shown in figure 8, also can be in ester moulding shaping dies 10 (wherein, not
Gas pump orifice 141 is set) peripher wall member 11A~11D around erect gas pump orifice setting wall 16, and in the gas take out
Gas pump orifice 141A is arranged in the upper surface that wall 16 is arranged in suction inlet.In addition, the ester moulding shaping dies 10 of the 1st embodiment
Be configured to made various changes in the range of purport of the invention.
It is set as that (lower movable pressure plate 211 above may be used using 2 movable pressure plates in the resin molding apparatus 20 of the 1st embodiment
Dynamic pressure plate 212) and 1 fixation clip 22 by 2 ester mouldings shaping dies (the 1st ester moulding shaping dies 10A, the 2nd
Ester moulding shaping dies 10B) mold simultaneously, but also can be used 1 movable pressure plate and 1 fixation clip by 1 resin at
Shape is molded with shaping dies 10.Alternatively, the movable pressure plate and 1 fixation clip that also can be used 3 or more are by 3 or more resins
Forming shaping dies molds simultaneously.
The ester moulding unit 30 of another variation of the resin molding apparatus as the 1st embodiment is indicated in Fig. 9.
The ester moulding unit 30 of this variation has material receiving module 31, shaping module 32 and takes out module 33.Material receives mould
Block 31 is to receive resin material P and substrate S and the device for being sent to shaping module 32 to certainly external, and have to resin material
Transfer resin material feedway 310 and substrate receiving unit 311 that disk 27 supplies resin material P.1 shaping module 32 has 1
The above-mentioned resin molding apparatus 20 of group.3 shaping modules 32 are indicated in Fig. 9, but settable any in ester moulding unit 30
The shaping module 32 of number of units.In addition, can also increase and decrease finishing die after beginning to use convenient for assembling ester moulding unit 30
Block 32.It takes out module 33 resin forming product manufactured in shaping module 32 is moved in and kept from shaping module 32, and has
There is resin forming product maintaining part 331.
In ester moulding unit 30, through material receiving module 31,1 or more shaping modules 32 and taking-up module
33 mode is provided with conveying substrate S, resin material transfer disk 27 and the main carrying device 36 for transporting resin forming product.Separately
Outside, in be provided in each module between the device in main carrying device 36 and the module transport substrate S, resin material transfer disk
27 and resin forming product secondary carrying device 37.In addition, ester moulding unit 30 has the electricity to make above-mentioned each module action
Source and control unit (not shown).
The movement of ester moulding unit 30 is illustrated.Substrate S is that material receiving module 31 is held in by operator
Substrate receiving unit 311.The conveying of substrate S self-reference substrate receiving unit 311 is extremely located at by main carrying device 36 and secondary carrying device 37 to be shaped
1 resin molding apparatus 20 in module 32, and substrate S is installed on to upper mold 102A, 102B of the resin molding apparatus 20.
Then, resin material transfer disk 27 is moved in resin material to supply by main carrying device 36 and secondary carrying device 37 fills
Set 310.In resin material feedway 310, as described above as resin material P is supplied it is thin to the demoulding held by handle part
On film F.
Main carrying device 36 and secondary carrying device 37 will be supplied with resin material transfer disk 27 conveying of resin material P extremely
The resin molding apparatus 20 of the shaping module 32 of substrate S is installed in upper mold 102A, 102B.Moreover, being transferred in by resin material
In the case that disk 27 is configured at lower die 101A, 101B of the resin molding apparatus 20, it will be demoulded from resin material transfer disk 27 thin
Film F is coated on the inner surface of the die cavity C of lower die 101A, 101B and supplies resin material P to die cavity C.Later, it is removed using master
Device 36 and secondary carrying device 37 is sent to transfer resin material in the case that disk 27 moves out from resin molding apparatus 20, in the resin
Compression molding is carried out in forming device 20.During the resin molding apparatus 20 carries out compression molding, to positioned at other finishing dies
The resin molding apparatus 20 of block 32 carries out and identical operation before this, and thereby, it is possible to be staggered on one side between multiple shaping modules 32
Time one side concurrently carries out compression molding.
The resin forming product obtained by compression molding, by main carrying device 36 and secondary carrying device 37 from ester moulding
Device 20 moves out, and moves in the resin forming product maintaining part 331 of taking-up module 33 in keep.User is suitably by resin
Formed products take out from resin forming product maintaining part 331.
(2) the 2nd embodiments
The ester moulding shaping dies of (2-1) the 2nd embodiment
The ester moulding shaping dies 40 of the 2nd embodiment is indicated in Figure 10 (a) to Figure 10 (d).This ester moulding
The shaping dies of forming is transferred with shaping dies 40.Ester moulding is with shaping dies 40 by 402 structures of upper mold 401 and lower die
At the upper mold 401 has by the 1st peripher wall member 41A, the 2nd peripher wall member 41B, the 3rd peripher wall member 41C and the 4th peripher wall member
4 peripher wall members that 41D is constituted, floor members 42, chute 45 and 2 groups are installed in lower surface be made of each portion
Group substrate 4011, the lower die 402 have 2 substrate-placing platforms 46 and 2 hole slots 47.In hole slot 47, column is inserted into from downside
Plug 48.Respectively, the bottom view that upper mold 401 is indicated in Figure 10 (a) indicates the vertical profile that chute 45 passes through in Figure 10 (b)
The profilograph of upper mold 401 in face indicates the top view of lower die 402 in Figure 10 (c), indicates hole slot in Figure 10 (d)
The profilograph of lower die 402 in 47 vertical sections passed through.
The chute 45 of upper mold 401 is with the hole slot 47 of lower die 402 in the state for abutting upper mold 401 with about 402 lower die
The mode of lower connection sets mutual position.Respectively, around the chute 45 of upper mold 401 (chute 45 of Figure 10 (a) it is upper
Side and downside) be provided with chute resistor 451, around the hole slot 47 of lower die 402 (upside of the hole slot 47 of Figure 10 (c) and under
Side) it is provided with hole slot resistor 471, so that the surrounding resin in chute 45 and hole slot 47 will not flow out.
Respectively, the front view that the 1st peripher wall member 41A is indicated in Figure 11 (a) indicates the 3rd peripheral wall structure in Figure 11 (c)
The front view of part 41C.In addition, " front view " of the peripher wall member refers to the plane area from made of being surrounded by 4 peripher wall members
Observe resulting figure in the outside in domain.1st peripher wall member 41A has the upper surface for the lower surface 111 being equivalent in the 1st embodiment
(the 1st surface) 411.In addition, the 1st peripher wall member 41A has left side (the 2nd surface) 412 identical with the 1st embodiment, interior
Surface (the 3rd surface) 413, tapered portion 416 and eaves shape portion 417.But tapered portion 416 and eaves shape portion 417 are in and the 1st embodiment party
The shape that formula inverts upside down.In addition, there is sliding component 431 identical with the 1st embodiment and draw in the 1st peripher wall member 41A
Guide hole 432.On the other hand, gas pump orifice 141, gas of the 1st peripher wall member 41A in not set 1st embodiment aspirate
The aspect of pipe 142 and connector 143 and the aspect for being provided with resin as shown below material supply line 452, implement with the 1st
1st peripher wall member 11A of mode is different.
The a part of resin material supply line 452 in the lower surface (the 4th surface) 414 of the 1st peripher wall member 41A forms recessed
Portion forms, and is connected to chute 45.Resin material supply line 452 on the length direction of the 1st peripher wall member 41A have width
And be arranged, it is as described below as be connected to always with chute 45 in the mobile range of the 1st peripher wall member 41A.On the other hand, it removes and stream
Other than the connection place of slot 45, resin material supply line 452 is blocked by hole slot resistor 471, so that gravity tank 45 flows into resin
The resin material of material supply line 452 will not leak out.
1st peripher wall member 41A is provided with the box thread 491 (Figure 11 (a)) extended downward from upper surface 411, utilizes this
Box thread 491 and bolt 492 (Figure 10 (b)) in the hole by being set to substrate 4011 and, are fixed on substrate 4011.In substrate
4011, multiple holes that the depth direction in Figure 10 (b) lines up 1 row are provided with, by changing the hole for passing through bolt 492, thus
1st peripher wall member 41A integrally can be mobile in length direction.
3rd peripher wall member 41C, which has, inverts upside down formed composition for the 3rd peripher wall member 11C of the 1st embodiment.
3rd peripher wall member 41C is different from the 1st peripher wall member 41A, is provided with gas pump orifice 441 identical with the 1st embodiment, gas
Body suction tube 442 and connector 443 (still, upper and lower direction reversion, gas pump orifice 441 are located at lower surface 414), another party
Face, not set resin material supply line 452.In addition, being provided with instead of the box thread 491 of the 1st peripher wall member 41A from appearance
Face is penetrated through to the through hole 493 of inner surface 413.
2nd peripher wall member 41B and the 4th peripher wall member 41D in addition to the length of left and right directions is short compared with the 3rd peripher wall member 41C,
With composition identical with the 3rd peripher wall member 41C.1st peripher wall member 41A is mutually differed with the 2nd peripher wall member 41B length direction
90 °, therefore, moving direction also mutually differs 90 °.
Floor members 42 are plate (rectangular-shape), are loaded to towards up and down direction by 4 peripher wall member shapes with plate face
At the columnar space in quadrangle in.Floor members 42 are prepared with the vertical of plate face and horizontal of different sizes multiple.By each peripheral wall structure
The inner surface 413 of part 41A~41D and the lower surface of floor members 12 form die cavity C.In addition, being provided in substrate 4011 for spiral shell
The through hole that bolt 4012 passes through is provided with box thread in the upper surface of floor members 42 and the consistent position in the hole.Utilize the mother
Floor members 42 are fixed on substrate 4011 by screw thread and bolt 4012.
In addition, in 4 sides of floor members 42 with the 2nd peripher wall member 41B, the 3rd peripher wall member 41C and the 4th week
The face that wall member 41D connects is provided with box thread in the position opposite with the through hole 493 of each peripher wall member.Each peripher wall member
By being fixed on floor members 42 by the bolt 494 (Figure 10 (b)) of through hole 493.
The method of adjustment of the ester moulding shaping dies of (2-2) the 2nd embodiment
Using Figure 12 (a) and Figure 12 (b), to the method for adjustment of the ester moulding shaping dies 40 of the 2nd embodiment into
Row explanation.It is preceding in the middle expression adjustment of Figure 12 (a) and die cavity C in the middle bottom view for indicating upper mold 401 of Figure 12 (a) and Figure 12 (b)
The maximum state of flat shape indicates after adjusting in Figure 12 (b) and the flat shape of die cavity C becomes smaller than the state of (a).
When adjusting ester moulding shaping dies 40, firstly, from upper mold 401 by 42 removal of floor members.From the state,
Move each peripher wall member 41A~41D as follows.1st peripher wall member 41A is in length direction (Figure 12 (a) and Figure 12 (b)
Longitudinal direction) it is mobile, make be set in multiple holes of substrate 4011 1 with the position of box thread 491 it is identical after, using passing through
The bolt 492 in the hole and be fixed on substrate 4011.
2nd peripher wall member 41B, the 3rd peripher wall member 41C and the 4th peripher wall member 41D by make sliding component 431 relative to
The relative position of guide hole 432 is moved to the right towards guide hole 432, and makes the relative position relative to adjacent peripher wall member
It is mobile.At this point, longitudinal direction and with 1st peripher wall member 41A opposite direction of the 2nd peripher wall member 41B in Figure 12 (a) and Figure 12 (b)
It is mobile.3rd peripher wall member 41C is in longitudinally upper mobile to direction identical with the 2nd peripher wall member 41B, with the close 1st on laterally
The mode of peripher wall member 41A is mobile.4th peripher wall member 41D is moved in longitudinally upper to direction identical with the 1st peripher wall member 41A,
In mobile to direction identical with the 3rd peripher wall member 41C in transverse direction.
By the movement of each peripher wall member 41A~41D, and in left side (the 2nd table of each peripher wall member 41A~41D
Face) 412 with the inner surface (the 3rd surface) 413 of the peripher wall member of left neighbour a part contact in the state of move relative position.With
This mode, the flat shape of die cavity C shorten before the more above-mentioned movement of longer side and a shorter side when maintaining rectangle.
If moving peripher wall member 41A as above, the resin material supply line of chute 45 and peripher wall member 41A
452 relative position changes, but since resin material supply line 452 is set on the length direction of the 1st peripher wall member 41A
It is set to width, therefore chute 45 is also connected with resin material supply line 452 after movement.In addition, in mobile front and back, it is sharp
With the chute resistor 451 being present in around chute 45, make the resinous wood of 451 side of chute resistor other than place corresponding with chute 45
The opening of material supply line 452 is blocked by the chute resistor 451.
After making each peripher wall member 41A~41D mobile by this method, will there is shape identical with the flat shape of die cavity C
The floor members 42 of plate face be packed into the space to made of being surrounded as the inner surface 413 of each peripher wall member 41A~41D, and should
Floor members 42 are fixed on substrate 4011 using bolt 4012.In addition, by the 2nd peripher wall member 41B, the 3rd peripher wall member 41C and
4 peripher wall member 41D are fixed on floor members 42 using bolt 494.In addition, without cooperating the adjustment of upper mold 401 to carry out lower die 402
Adjustment.By above operation, the adjustment of ester moulding shaping dies 40 is completed.
(2-3) have the ester moulding shaping dies of the 2nd embodiment resin molding apparatus (the 2nd embodiment
Resin molding apparatus)
The resin molding apparatus 50 for having the ester moulding shaping dies 40 of the 2nd embodiment is indicated in Figure 13.Tree
Rouge forming device 50 has the conjunction being made of basal disc 531, connecting rod 532, toggle 533, movable pressure plate 51 and fixation clip 52
Mold mechanism.In the ester moulding of the 1st embodiment in shaping dies 10, being provided with lower movable pressure plate 211 and upper movable pressure plate
212 2 movable pressure plates, but the movable pressure plate 51 for being set to the resin molding apparatus 50 of present embodiment is only 1.It can dynamic pressure
The composition of clamping other than plate 51 is identical with shaping dies 10 as the ester moulding of the 1st embodiment.In movable pressure plate 51
On be placed with lower die 402.In lower die 402 be provided with make plunger 48 towards the driving portion moved up and down and in hole slot 47 into
The heater (not shown) of row heating.Upper mold 401 is installed under fixation clip 52.
(2-4) uses resin forming product manufacturing method (the 2nd implementation of the ester moulding shaping dies of the 2nd embodiment
The movement of the resin forming product manufacturing method, the resin molding apparatus of the 2nd embodiment of mode)
Using Figure 14 (a) to Figure 14 (d), the movement of resin molding apparatus 50 is illustrated.Firstly, in by upper mold
After 401 carry out above-mentioned adjustment from the state of 50 removal of resin molding apparatus, upper mold 401 is installed on to the following table of fixation clip 52
Face.
Then, on the substrate-placing platform 46 of lower die 402, in the mode for keeping the assembly for being equipped with electronic component face-up
Substrate S is loaded, and puts into the resin material P (Figure 14 (a)) of solid to hole slot 47.Secondly, to cover each peripheral wall of upper mold 401
The mode of the downside of component 41A~41D and floor members configures mould release film F.At this point, in floor members 42 and the 1st peripheral wall structure
Gap (not shown) is slightly arranged in part 41A between mould release film F.Moreover, in each peripher wall member 41A~41D except the
3 peripher wall member 41B~41D other than 1 peripher wall member 41A, from 441 intake-gas of gas pump orifice, and in floor members
42 and the 1st peripher wall member 41A, from above-mentioned gap and 441 intake-gas of gas pump orifice being connected to the gap.The 1st is removed as a result,
The inner surface of die cavity C other than the inner surface 413 of peripher wall member 41A is coated (Figure 14 (b)) by mould release film F.
Then, hole slot 47 is heated using heater, melts the resin material P in hole slot 47.Later, torsion is utilized
The arm of force 533 rises movable pressure plate 51, and upper mold 401 and lower die 402 are molded.Then, using plunger 48 by the tree after melting
Rouge material P squeezes out (Figure 14 (c)) from hole slot 47.The resin material P squeezed out from hole slot 47 is supplied by chute 45 and resin material
Flow path 452 and be supplied in die cavity C.Later, resin material P cooling is allowed to harden, and declining movable pressure plate 51
It is opened (Figure 14 (d)).It is attained at resin forming product PM made of the surface resin material P hardening of substrate S as a result,.Yu Kai
When mould, by being formed with tapered portion 416 in each peripher wall member 41A~41D and (except the inner surface 413 of the 1st peripher wall member 41A
The inner surface of die cavity C is coated by mould release film F in addition), and can easily be demoulded resin forming product PM.
The effect of (2-5) the 2nd embodiment
In the 2nd embodiment ester moulding in shaping dies 40, also in a same manner as in the first embodiment, only by making 4
The relative position of a peripher wall member 41A~41D is mobile, just can change the flat shape of die cavity C, therefore, peripher wall member 41A~
41D only prepares a kind, and no replacement is required.Therefore, can reduce the site of storage of shaping dies ensure or needed for managing at
Sheet and working hour.
In addition, being formed with tapered portion 416 in the lower end of the inner surface 413 of peripher wall member 41A~41D, and (remove the 1st week
Other than the inner surface 413 of wall member 41A) inner surface of die cavity C is coated by mould release film F, and it therefore, can be easily by resin
Formed products PM demoulding.
The variation of (2-6) the 2nd embodiment
The ester moulding shaping dies 10 of the ester moulding of 2nd embodiment shaping dies 40 and the 1st embodiment
Similarly it is able to carry out various modifications.For example, in the 2nd embodiment ester moulding in shaping dies 40,4 peripher wall members
41A~41D can all be moved, but also can 1 in described 4 position is fixed.In by the position of the 1st peripher wall member 41A
When fixed situation, chute 45 and the relative position of resin material supply line 452 are constant, therefore, resin material supply line
452 can be used and 45 same diameter person of chute.In addition, tapered portion 416 can also be omitted.Gas pump orifice 441 also may be disposed at the 1st
The lower surface (the 4th surface) 414 of peripher wall member 41A.When the situation, gas suction tube 442 is set as with connector 443 and peripheral wall
The identical composition of component 41B~41D.In addition, gas pump orifice 441 also may be disposed at the inner surface of peripher wall member 41A~41D
413 or floor members 42 lower surface.Alternatively, also gas pump orifice identical with Fig. 8 can be used that wall is arranged.Resin material supply
Flow path 452 also may be disposed at floor members 42.In addition, the ester moulding shaping dies 40 of the 2nd embodiment is configured to
It is made various changes in the range of purport of the invention.
The resin molding apparatus 50 of 2nd embodiment is also able to carry out 20 phase of resin molding apparatus with the 1st embodiment
Same various changes.In turn, be also able to use the shaping module for having the resin molding apparatus 50 of the 2nd embodiment, constitute with
The identical ester moulding unit of ester moulding unit 30 of 1st embodiment.
Claims (11)
1. a kind of ester moulding shaping dies, it is characterised in that have：
4 peripher wall members are respectively provided with 3 mutually orthogonal planes that is, the 1st surface, the 2nd surface and the 3rd surface；And
Floor members are loaded to when above-mentioned 4 peripher wall members with the 1st surface configuration of each peripher wall member in same plane
When upper and the 2nd surface is configured with a part of mode contacted on the 3rd surface of adjacent peripher wall member, by 4 peripher wall members
The inside in the columnar space in quadrangle that each 3rd surface is formed blocks the bottom of the side in the space.
2. ester moulding shaping dies according to claim 1, wherein in above-mentioned 4 peripher wall members and the above-mentioned 1st
Surface is any of the 4th surface of opposite side and above-mentioned 3rd surface or both, has the gas pump orifice of intake-gas.
3. ester moulding shaping dies according to claim 1, wherein in above-mentioned floor members by above-mentioned 4 peripheral walls
The surface of die cavity side made of component and the floor members surround, has the gas pump orifice of intake-gas.
4. ester moulding shaping dies according to claim 1, wherein in above-mentioned 3rd table of above-mentioned 4 peripher wall members
The a part with the 4th surface side that above-mentioned 1st surface is opposite side in face, is formed with close to the 4th surface and towards upper
State the tapered portion in the outside in the columnar space in quadrangle.
5. ester moulding shaping dies according to any one of claim 1 to 4, is also equipped with：
Resin supply line, at least one component being set in above-mentioned 4 peripher wall members and above-mentioned floor members, to by this 4
Die cavity made of a peripher wall member and the floor members surround supplies resin material.
6. a kind of resin molding apparatus, it is characterised in that have：
Ester moulding shaping dies described in any one of Claims 1-4；
Clamping molds above-mentioned ester moulding with shaping dies；
Elastic component is set to the lower part of above-mentioned 4 peripher wall members；And
Resin material feed mechanism, to die cavity supply tree made of being surrounded as above-mentioned 4 peripher wall members and above-mentioned floor members
Rouge material.
7. a kind of resin molding apparatus, it is characterised in that have：
Ester moulding shaping dies described in claim 5；
Clamping molds above-mentioned ester moulding with shaping dies；
Resin material maintaining part is connected to above-mentioned resin supply line, and keeps resin material；And
Resin material in above-mentioned resin material maintaining part is injected into above-mentioned mould via above-mentioned resin supply line by plunger
Chamber.
8. a kind of ester moulding shaping dies method of adjustment, it is characterised in that have：
Peripher wall member moving step, in above-mentioned the 4 of ester moulding shaping dies described in any one of Claims 1-4
A peripher wall member it is each in, keep above-mentioned 1st surface configuration in the state of on above-mentioned same plane, make above-mentioned 2nd surface
And the 2nd the relative position on the 3rd surface of peripher wall member that is contacted of surface it is mobile；And
Floor members be packed into step, by above-mentioned floor members be packed into each 3rd surface by 4 peripher wall members formed four
The inside in the space of corner post shape.
9. a kind of ester moulding shaping dies method of adjustment, it is characterised in that have：
Peripher wall member moving step, above-mentioned 4 peripher wall members of the ester moulding shaping dies described in claim 5
In each, keep above-mentioned 1st surface configuration in the state of on above-mentioned same plane, make above-mentioned 2nd surface and the 2nd surface institute
The relative position on the 3rd surface of the peripher wall member of contact is mobile；And
Floor members be packed into step, by above-mentioned floor members be packed into each 3rd surface by 4 peripher wall members formed four
The inside in the space of corner post shape.
10. a kind of resin forming product manufacturing method, it is characterised in that：It is shaped to by ester moulding according to any one of claims 8
The claim of the shape of die cavity made of die regulating method adjustment is surrounded as above-mentioned 4 peripher wall members and above-mentioned floor members
The die cavity of ester moulding shaping dies described in any one of 1 to 4 supplies resin material, which is heated to this
After the temperature that resin material is softened or melted, above-mentioned ester moulding is molded with shaping dies, later hardens the resin material.
11. a kind of resin forming product manufacturing method, it is characterised in that：It will be shaped by ester moulding as claimed in claim 9
Die regulating method adjusts ester moulding described in the claim 5 of the shape of above-mentioned die cavity and is molded with shaping dies, and should
Resin material is heated to after the temperature that resin material is softened or melted, should to the supply of above-mentioned die cavity from above-mentioned resin supply line
Resin material later hardens the resin material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-094231 | 2017-05-10 | ||
| JP2017094231A JP6886341B2 (en) | 2017-05-10 | 2017-05-10 | Molding mold for resin molding, resin molding equipment, molding mold adjustment method for resin molding, and manufacturing method for resin molded products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108858949A true CN108858949A (en) | 2018-11-23 |
| CN108858949B CN108858949B (en) | 2021-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810442170.3A Active CN108858949B (en) | 2017-05-10 | 2018-05-10 | Molding die for resin molding, method of adjusting the same, resin molding apparatus, and method of manufacturing resin molded article |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6886341B2 (en) |
| KR (1) | KR102157601B1 (en) |
| CN (1) | CN108858949B (en) |
| TW (1) | TWI680047B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116100753B (en) * | 2023-02-13 | 2023-08-22 | 广州市旭胜模具有限公司 | Adjustable automobile shell injection mold |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6886341B2 (en) | 2021-06-16 |
| CN108858949B (en) | 2021-05-28 |
| KR102157601B1 (en) | 2020-09-18 |
| JP2018187884A (en) | 2018-11-29 |
| TWI680047B (en) | 2019-12-21 |
| KR20180123969A (en) | 2018-11-20 |
| TW201900379A (en) | 2019-01-01 |
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