TW201900379A - Molding die for resin molding, resin molding device, molding die adjustment method for resin molding, and resin molded article manufacturing method - Google Patents

Abstract

Provided is a mold for molding a resin, capable of reducing costs and labor when producing resin molded articles having different dimensions except for thickness. To this end, the mold (10) for molding the resin comprises: four peripheral wall members (11A-11D) each having a first surface (111), a second surface (112), and a third surface (113) which are three planes perpendicular to each other; and a lower surface member (12) blocking the bottom of one direction of a space by being inserted into the square pillar-like space (C) formed by each third surface (113) of the four peripheral wall members (11A-11D) when the four peripheral wall members (11A-11D) are disposed while the first surface (111) of each peripheral wall member is disposed on the same plane and is brought into contact with some portions of the third surface (113) of the peripheral wall member close to the second surface (112). Since a planar shape of a cavity can be changed only by altering a relative position of the four peripheral wall members (11A-11D), only one kind of peripheral wall member is to be prepared, and costs and labor required for securing and managing storage places for the mold can be reduced.

Description

   Resin molding mold, resin molding device, resin molding molding mold adjustment method, and resin molded product manufacturing method   

The present invention relates to a molding die for resin molding, a resin molding apparatus, a method for adjusting a molding die for resin molding, and a method for manufacturing a resin molded product, which are used for manufacturing a molded resin product.

In order to protect electronic parts from light, heat, moisture and other environments, electronic parts are generally sealed in resin. For this reason, resin molding is performed by a compression molding method, a transfer molding method, or the like. In the compression molding method, a forming mold composed of a lower mold and an upper mold is used, and a resin material is supplied to the cavity of the lower mold. After the substrate on which the electronic components are mounted is mounted on the upper mold, it faces the lower mold and the upper mold. The resin is molded by heating the mold while closing the two. In the transfer molding method, after the substrate is installed in the cavity of one of the upper mold and the lower mold, the lower mold and the upper mold are heated while heating the two molds together, and the plunger is used to supply the resin to the mold cavity. Thereby, resin molding is performed.

In the resin molded product obtained by resin molding, the shape, number, arrangement, etc. of the electronic parts sealed in the resin are matched, and the size of the resin molded product is different. Therefore, a molding die corresponding to the size of the resin molded article is prepared for each resin molded article, and a large number of molding dies must be prepared for this purpose. If this is the case, the production of forming dies requires costs, and a large number of such forming dies must be stored, and labor hours are required to secure or manage the storage place.

Patent Document 1 describes a resin molding apparatus in which a flat plate-shaped first mold is detachably provided with an inserting member corresponding to the bottom of the molding mold, and a flat plate-shaped mold disposed opposite to the first mold. The second mold is detachably provided with a dam structure having a planar shape corresponding to the peripheral wall of the forming mold and an inner space having the same planar shape as the insert member. The insert member and the dam structure system are fixed to each other so that the insert member is inserted into a space inside the dam structure when the first mold and the second mold are closed. According to this configuration, it is possible to produce resin molded articles having different thicknesses only by replacing the insert members with those having different thicknesses. In such a case where only the thickness is changed, a common member can be used for the dam structure, so that the cost can be reduced compared to the entire production of a mold for each resin molded product.

[Prior technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 11-105053

In the resin molding apparatus described in Patent Document 1, although only resin moldings having different thicknesses can be manufactured using a common peripheral wall, when manufacturing resin moldings having dimensions other than the thickness, it is necessary to produce the same widths as those. Or the peripheral wall corresponding to the length, it requires the same cost and man-hours as in the case where the entire molding mold is produced based on the size of the resin molded product.

The problem to be solved by the present invention is to provide a resin molding die, a resin molding apparatus, and a resin molding die adjustment that can reduce the cost or man-hours required for a molding die when manufacturing resin molded products with different sizes other than thickness. A method and a method for manufacturing a resin molded article.

The first aspect of the resin molding molding die of the present invention completed in order to solve the above-mentioned problems is characterized by including: a) four peripheral wall members, each of which has three planes orthogonal to each other, that is, a first surface and a first surface; 2nd surface and 3rd surface; and b) a bottom surface member which is incorporated into the above-mentioned 4 peripheral wall members when the first surface of each peripheral wall member is arranged on the same plane, and the second surface and the third surface of the adjacent peripheral wall member When a part of the surface is arranged in a contact manner, the inside of a quadrangular columnar space formed by each of the third surfaces of the four peripheral wall members blocks the bottom of one side of the space.

The second aspect of the molding die for resin molding of the present invention is characterized in that, in the molding die for resin molding of the first aspect, further comprising: a resin supply flow path provided in the four peripheral wall members and the bottom member. At least one of the members is supplied with a resin material to a cavity surrounded by the four peripheral wall members and the bottom member.

A first aspect of the resin molding apparatus of the present invention includes: the first aspect of the resin molding forming mold; a mold clamping mechanism for clamping the resin molding molding mold; and an elastic member provided on the above. Lower portions of the four peripheral wall members; and a resin material supply mechanism that supplies a resin material to a cavity surrounded by the four peripheral wall members and the bottom surface member.

The second aspect of the resin molding apparatus of the present invention is characterized by comprising: the above-mentioned second aspect of the resin molding forming mold; a mold clamping mechanism for clamping the above-mentioned resin molding molding mold; and a resin material holding portion connected to A resin material is held in the resin supply flow path, and a plunger injects a resin material in the resin material holding portion into the cavity through the resin supply flow path.

The first aspect of the method for adjusting a molding die for resin molding according to the present invention is characterized by having a peripheral wall member moving step among each of the four peripheral wall members of the above-mentioned first molding die for resin molding, The relative position of the second surface and the third surface of the peripheral wall member in contact with the second surface is maintained while the first surface is arranged on the same plane; The bottom surface member is inserted into a quadrangular columnar space formed by the third surfaces of the four peripheral wall members.

The second aspect of the method for adjusting a molding die for resin molding of the present invention is characterized by having a peripheral wall member moving step which is included in each of the four peripheral wall members of the above-mentioned second molding resin molding die, The relative position of the second surface and the third surface of the peripheral wall member in contact with the second surface is maintained while the first surface is arranged on the same plane; The bottom surface member is inserted into a quadrangular columnar space formed by the third surfaces of the four peripheral wall members.

A first aspect of the method for manufacturing a resin molded product according to the present invention is characterized in that a cavity formed by surrounding the four peripheral wall members and the bottom surface member is adjusted by the method for adjusting a molding die for resin molding of the first aspect. After the shape of the above-mentioned first aspect of the resin molding molding mold, a resin material is supplied to the cavity, and the resin material is heated to a temperature at which the resin material softens or melts, and then the resin molding molding mold is closed, and thereafter This resin material is hardened.

The second aspect of the method for manufacturing a resin molded product according to the present invention is characterized in that the resin for the second aspect after the shape of the cavity is adjusted by the method for adjusting a molding die for the resin molding of the second aspect, After the molding die is closed, the resin material is heated to a temperature at which the resin material softens or melts, the resin material is supplied from the resin supply flow path to the mold cavity, and then the resin material is hardened.

According to the present invention, it is possible to reduce costs or man-hours required for forming a mold when producing resin molded products having different sizes other than thickness.

10、40‧‧‧Forming mold for resin molding

101, 101A, 101B, 402, 402A, 402B

102, 102A, 102B, 401, 401A, 401B‧‧‧

10A‧‧‧The first mold for resin molding

10B‧‧‧The second mold for resin molding

11‧‧‧ week wall member

11A, 41A‧‧‧The first week wall member

11B, 41B‧‧‧Second week wall member

11C, 41C‧th third week wall member

11D, 41D‧‧‧4th week wall member

111, 411‧‧‧ lower surface of the peripheral wall member (first surface)

112, 412‧‧‧ the left side of the peripheral wall member (second surface)

113,413‧‧‧Inner surface of peripheral wall member (third surface)

114‧‧‧ Upper surface of peripheral wall member (4th surface)

116, 416‧‧‧ cone

117, 417‧‧‧ eaves

12, 42‧‧‧ Underside members

131, 431‧‧‧ sliding members

132, 432‧‧‧ guide holes

141, 141A, 441‧‧‧ gas suction port

142, 442‧‧‧ Gas suction tube

143, 443‧‧‧ connection port

16‧‧‧ Gas suction port wall

20, 50‧‧‧ resin molding device

211‧‧‧ lower movable platen

212‧‧‧on the movable platen

22, 52‧‧‧Fixed plate

231, 531‧‧‧basket

232, 532‧‧‧ tie rods

233, 533‧‧‧ Torque arm

241A‧‧‧The first lower heat insulation member

241B‧‧‧Second lower heat insulation member

242A‧‧‧The first upper insulation member

242B‧‧‧The second upper heat insulation member

251A‧‧‧The first lower heating plate

251B‧‧‧The second lower heating plate

252A‧‧‧The first upper heating plate

252B‧‧‧ 2nd upper heating plate

26A, 26B‧‧‧Elastic member

27‧‧‧Resin material transfer tray

271‧‧‧Resin material transfer tray frame

272‧‧‧Resin storage section of resin material transfer tray

273‧‧‧Gas suction port for resin material transfer tray

30‧‧‧Resin molding unit

31‧‧‧Material receiving module

310‧‧‧Resin material supply device

311‧‧‧Substrate receiving section

32‧‧‧forming module

33‧‧‧Remove the module

331‧‧‧Resin molded product holding section

36‧‧‧Main Transfer Device

37‧‧‧Deputy transfer device

4011‧‧‧ substrate

4012‧‧‧Bolt

45‧‧‧ flume

451‧‧‧ Flow channel resistance

452‧‧‧Resin material supply channel

46‧‧‧ substrate mounting table

47‧‧‧hole slot

471‧‧‧Hole resistance

48‧‧‧ plunger

491‧‧‧female thread

492, 494‧‧‧bolts

493‧‧‧through hole

51‧‧‧ movable platen

C‧‧‧Cavity

F‧‧‧Release film

P‧‧‧Resin material

PM‧‧‧Resin molding

S‧‧‧ substrate

FIG. 1 is a plan view (a) showing a lower mold and a cross-sectional view (A) of an AA ′ showing a lower mold and an upper mold in a first embodiment of a molding mold for resin molding according to the present invention.

FIG. 2 is a front view (a), a plan view (b), a left side view (c), and a right side view (d) of one of the peripheral wall members in the resin-molding mold of the first embodiment.

FIG. 3 is a view showing a method for adjusting a planar shape of a molding die for resin molding according to the first embodiment, and is a cross-sectional view (a) of the peripheral wall member (a) before the planar shape is changed and B-B 'after the change Sectional view (b).

FIG. 4 is a view showing a method for adjusting a planar shape of a molding die for resin molding according to the first embodiment, and is a perspective view (a) of a peripheral wall member before a planar shape change and a perspective view (b) after a change.

Fig. 5 is a schematic configuration diagram showing a resin molding apparatus (a resin molding apparatus according to the first embodiment) having a resin molding mold according to the first embodiment.

Fig. 6 is an enlarged view of a main part of the resin molding apparatus according to the first embodiment.

FIG. 7 is a schematic view showing a method for manufacturing a resin molded product using a resin molding mold according to the first embodiment.

FIG. 8 is a plan view showing a lower mold and surrounding walls in a modification example of the resin molding mold according to the first embodiment.

FIG. 9 is a schematic diagram showing a configuration of a resin molding unit having the resin molding apparatus of the first embodiment.

Fig. 10 is a bottom view (a) and a longitudinal sectional view (b) of an upper die and a plan view (c) and a longitudinal sectional view (d) of an upper die in a second embodiment of a resin-molding mold according to the present invention; ).

11 is a front view (a) and a bottom view (b) of a first peripheral wall member and a front view (c) and a bottom view (d) of a third peripheral wall member in a resin mold for a second embodiment.

FIG. 12 is a diagram showing a method for adjusting the planar shape of a molding die for resin molding according to the second embodiment, and is a bottom view (a) of the peripheral wall member before the plane shape change and a bottom view (b) after the change.

FIG. 13 is a schematic configuration diagram showing a resin molding apparatus (a resin molding apparatus according to a second embodiment) having a resin molding mold according to a second embodiment.

FIG. 14 is a schematic view showing a method for producing a resin molded product using a resin mold for a resin molding according to the second embodiment.

In the present invention, the relative positions of the second surface and the third surface of the peripheral wall member in contact with the second surface are changed while maintaining the first surfaces of the four peripheral wall members on the same plane. By moving each other in this manner, the planar shape of the quadrangular columnar space formed by the third surfaces of the four peripheral wall members (the shape of the space viewed from a direction perpendicular to the first surface) can be changed. In addition, by mounting a bottom surface member that blocks the bottom of one side of the rectangular columnar space into the space, four peripheral wall members and a bottom surface member are formed to form a space for supplying a resin material when manufacturing a resin molded product. Into the mold cavity. The thickness of the cavity (the size perpendicular to the first surface) can be adjusted by changing the position of the surface of the bottom member on the cavity side.

According to the present invention, the planar shape of the cavity can be changed only by moving the relative positions of the four peripheral wall members. Therefore, only one type of peripheral wall member can be prepared. Therefore, the cost and man-hours required for securing or managing the storage place of the molding die can be reduced (only a single type of peripheral wall member is required (although a plurality of bottom surface members need to be prepared).

Among the molding dies for resin molding of the present invention, the first aspect for compression molding includes the four peripheral wall members and the bottom surface member. In the molding die for resin molding of the present invention, the second aspect for transfer molding includes the four peripheral wall members and the bottom surface member, and at least one of the four peripheral wall members and the bottom surface member. The member has a resin supply flow path for supplying a resin material to the cavity.

In the molding die for resin molding of the first aspect, suction gas may be provided on any one or both of the fourth surface and the third surface of the four peripheral wall members opposite to the first surface. Gas suction port. Alternatively, in the molding mold for resin molding of the first aspect, a gas suction port for suctioning gas may be provided on a cavity side surface surrounded by the four peripheral wall members and the bottom member. A gas suction port may be provided on both the third surface or the fourth surface and the surface on the cavity side. By providing such a gas suction port in the molding mold for resin molding of the first aspect, it is possible to cover the peripheral wall members constituting the cavity with a release film in advance in order to facilitate the mold release of the resin molded body after molding. When the third surface and the surface on the cavity side of the bottom surface member, the release film is brought into close contact with the surfaces by sucking gas from the gas suction port.

In the molding dies for resin molding of the first and second aspects, a part of the fourth surface side of the third surface of the four peripheral wall members can be taken and formed toward the fourth surface toward the fourth surface. The configuration of the tapered portion on the outer side of the quadrangular columnar space. Thereby, the molded resin body can be easily released from the molding die for resin molding.

Hereinafter, more specific embodiments of the resin-molding mold, the resin-molding device, the resin-molding mold adjustment method, and the resin-molded product manufacturing method according to the present invention will be described with reference to FIGS. 1 to 14.

(1) First embodiment

(1-1) Mold for resin molding of the first embodiment

FIG. 1 shows a molding die 10 for resin molding according to the first embodiment. This resin molding mold 10 is a molding mold for compression molding. The resin mold 10 has a lower mold 101 composed of four peripheral wall members and a bottom member 12, and an upper mold 102 composed of a single member. The four peripheral wall members include a first peripheral wall member 11A and a second peripheral wall. The member 11B, the third peripheral wall member 11C, and the fourth peripheral wall member 11D are configured.

FIG. 2 shows the configuration of the first peripheral wall member 11A. In addition, the third peripheral wall member 11C has the same configuration as the first peripheral wall member 11A. The second peripheral wall member 11B and the fourth peripheral wall member 11D have the same length as the first peripheral wall member except that the length in the left-right direction is shorter than the first peripheral wall member 11A. 11A has the same structure.

Each of the peripheral wall members 11A to 11D is composed of a rectangular plate-shaped member, and is arranged in a state where one of the end faces of the long side of the rectangle faces down. The lower surface 111 of each of the peripheral wall members 11A to 11D corresponds to the first surface, and the left side 112, which is one of the end faces on the short side, corresponds to the second surface, which is one of the rectangular plate surfaces. The surface 113 corresponds to the third surface. The lower surface 111, the left side surface 112, and the inner surface 113 are orthogonal to each other. The heights of the lower surfaces (first surfaces) 111 of the peripheral wall members 11A to 11D are the same, and they are arranged on the same plane. As shown in FIG. 1 (a), the first peripheral wall member 11A, the second peripheral wall member 11B, the third peripheral wall member 11C, and the fourth peripheral wall member 11D are oriented in a counterclockwise direction when viewed from above. It is arranged so as to form a quadrangular columnar space on the inside by changing 90 ° each. In the following, the left and right neighbors are only referred to as "left neighbors" and "right neighbors" when viewed from above. The inner surface 113 of each of the peripheral wall members 11A to 11D faces the space side of a rectangular column shape. Further, the left side surface (second surface) 112 of each of the peripheral wall members 11A to 11D is in contact with a part of the inner surface (third surface) 113 of the left adjacent peripheral wall member.

In FIG. 2 (a), the front surface of one peripheral wall member 11 is indicated by a solid line, the right side of the peripheral wall member of the left neighbor is indicated by a single-point chain line, and the peripheral wall member of the right neighbor is indicated by a two-point chain line. The left part of the figure on the left. The relative position of the inner surface (third surface) 113 of the peripheral wall member of interest and the left side (second surface) of the right adjacent peripheral wall member 11 can be moved (described below). In FIG. The two-dot chain line shows two examples in which the positions of the left side of the peripheral wall member 11 adjacent to the right are different.

Each of the peripheral wall members 11A to 11D is provided with a cylindrical sliding member 131 protruding vertically from the left side surface 112 (FIG. 2 (a)). In addition, in each of the peripheral wall members 11A to 11D, guide holes 132 (see FIG. 2 (a)) penetrating in the thickness direction of the plate material of the peripheral wall member are provided at the same height as the sliding member 131. The guide hole 132 extends in the left-right direction, and its length is shorter than the thickness of each of the peripheral wall members 11A to 11D at the height where the guide hole 132 is provided. The length of the guide hole 132 in the longitudinal direction is substantially the same as the diameter of the cylinder of the sliding member 131 except for the vicinity of the left and right ends (slightly larger than the diameter). The sliding member 131 of each of the peripheral wall members 11A to 11D is inserted into the guide hole 132 of the peripheral wall member on the left side in a state where the left side surface 112 is in contact with one of the inner surfaces 113 of the peripheral wall member on the left side. In addition, in FIG. 2 (a), the slide member 1 of the second peripheral wall member 11B inserted into the guide hole 132 of the first peripheral wall member 11A is indicated by a dotted line in the guide hole 132.

A gas suction port 141 is provided on the upper surface (fourth surface) 114 of the peripheral wall members 11A to 11D so as to be aligned in the longitudinal direction of the upper surface 114. A gas suction pipe 142 is provided in the peripheral wall member, and the gas suction pipe 142 is branched and connected to each gas suction port 141. The gas suction pipe 142 is connected to a connection port 143 provided on the right side of each of the peripheral wall members 11A to 11D, and the connection port 143 is connected to a gas suction pump (not shown) provided outside the resin molding mold 10. connection.

On the upper end of the inner surface 113 of each of the peripheral wall members 11A to 11D, a tapered portion 116 formed by chamfering an angle with the upper surface 114 of the peripheral wall member is provided. The tapered portion 116 has a shape toward the outer side of the quadrangular columnar space as it approaches the upper surface 114. Further, an eaves-shaped portion 117 having a surface contacting the tapered portion 116 of the peripheral wall member located on the left side is provided on the upper end of the left side surface 112 of each peripheral wall member 11A to 11D (FIG. 2 (a)).

The bottom surface member 12 has a plate shape, and is inserted into the space of a rectangular prism formed by four peripheral wall members with the plate surface facing up and down. The bottom member 12 is provided with a plurality of plate members having different vertical and horizontal sizes. The cavity C is formed by the inner surface 113 of each of the peripheral wall members 11A to 11D and the upper surface of the bottom member 12.

The upper mold 102 is flat as shown in FIG. 1 (b).

(1-2) Method for adjusting a molding die for resin molding of the first embodiment

A method of adjusting the molding die 10 for resin molding according to the first embodiment will be described with reference to FIGS. 3 and 4. 3 is a cross-sectional view of each of the peripheral wall members 11A to 11D in the BB ′ cross section shown in FIGS. 1 (b) and 2 (c), and FIG. 4 is a perspective view. The section BB ′ in FIG. 3 does not include the tapered portion 116 and includes the sliding member 131 and the guide hole 132. Hereinafter, a case where the adjustment from the state in which the planar shape of the cavity C in the molding die 10 for resin molding is maximized to a state smaller than that is performed will be described as an example. First, the bottom surface member 12 is taken out from the resin mold 10. FIG. 3 (a) shows the state after the bottom surface member 12 is taken out. The planar shape of the cavity C is rectangular and the long side (the side extending horizontally in the figure) and the short side (the side extending vertically in the figure) are the largest. Although the tapered portion 116 is not shown in FIG. 3 (a), the peripheral wall members 11A to 11D are arranged at the same positions as those shown in FIG. 1 (a).

From this state, the relative position of the sliding member 131 of each of the peripheral wall members 11A to 11D with respect to the guide hole 132 is moved to the left of the guide hole 132. With this movement, the relative position of the left side surface (second surface) 112 of each peripheral wall member 11A to 11D with respect to the inner surface (third surface) 113 of the left adjacent peripheral wall member moves toward the inside of the cavity C (FIG. 3 (b) thick arrow). Thereby, while the planar shape of the cavity C is kept rectangular, both the long side and the short side become shorter than before the movement.

Since the long and short sides of the planar shape of the cavity C are not the largest, the relative position of the sliding member 131 of each of the peripheral wall members 11A to 11D with respect to the guide hole 132 is to the right, that is, the position of each of the peripheral wall members 11A to 11D. The relative position of the left side surface (second surface) 112 with respect to the inner surface (third surface) 113 of the peripheral wall member to the left is shifted to the outside of the cavity C, whereby the long side of the planar shape of the cavity C can be made. And the short sides become longer. In addition, the two peripheral wall members facing each other may move both of them or only one of them. Furthermore, it is also possible to change the length of only one of the long side and the short side of the planar shape of the cavity C by moving only two of the four peripheral wall members 11A to 11D, or only one of them. .

In addition, the length of the guide hole 132 is shorter than the thickness of the peripheral wall members 11A to 11D at the height where the guide hole 132 is provided as described above, regardless of the position of the sliding member 131 relative to the guide hole 132. At this time, neither the guide hole 132 nor the cavity C communicates.

After the planar shape of the cavity C is changed as described above, the bottom surface member 12 having a plate surface having the same shape as the planar shape is incorporated in the place surrounded by the inner surface 113 of each of the peripheral wall members 11A to 11D. Thereby, a space surrounded by the inner surface 113 of each of the peripheral wall members 11A to 11D and the upper surface of the bottom member 12 becomes the adjusted cavity C of the resin mold 10. In addition, the upper mold 102 is also changed to correspond to the shape of the cavity C.

(1-3) Resin molding apparatus provided with the molding mold for resin molding of the first embodiment (resin molding apparatus of the first embodiment)

Next, a resin molding apparatus 20 including two sets of resin molding molds 10 (the first resin molding mold 10A, the second resin molding mold 10B) of the first embodiment will be described with reference to FIGS. 5 and 6. . The resin molding apparatus 20 is provided with two tie rods 232 standing on a base plate 231 and is provided with a torsion arm 233. A lower movable platen 211 and an upper movable platen 212 are held on the tie bar 232 so as to be movable upward and downward, and a fixed platen 22 is fixed to the upper end of the tie bar 232. The base plate 231, the tie bar 232, the torque arm 233, the lower movable platen 211, the upper movable platen 212, and the fixed platen 22 correspond to a mold clamping mechanism.

Above the lower movable platen 211, a first lower heat insulating member 241A, a first lower heating plate 251A, and a lower mold 101A of a first resin molding mold 10A are provided in this order from the bottom. Below the upper movable platen 212, a first upper heat insulating member 242A, a first upper heating plate 252A, and a first resin molding mold 10A upper mold 102A are provided in this order from above. Similarly, a second lower heat insulating member 241B, a second lower heating plate 251B, and a second resin molding mold 10B lower mold 101B are provided on the upper movable platen 212 in this order from the bottom. From the bottom, a second upper heat-insulating member 242B, a second upper heating plate 252B, and a second resin molding mold 10B upper mold 102B are provided in this order. The first lower heat-insulating member 241A, the first upper heat-insulating member 242A, the second lower heat-insulating member 241B, and the second upper heat-insulating member 242B are formed by arranging a plurality of columnar heat-insulating members in a two-dimensional manner.

On the lower molds 101A and 101B, elastic members 26A and 26B are respectively provided around the bottom surface member 12 and below the peripheral wall members 11A to 11D. The bottom surface member 12 is fixed, while the peripheral wall members 11A to 11D are movable on the elastic members 26A and 26B in the vertical direction. The lateral (substantially horizontal) position of the elastic members 26A and 26B can be moved in accordance with the lateral (substantially horizontal) position of the peripheral wall members 11A to 11D.

In addition, the resin molding apparatus 20 has a side surface between the lower mold 101A and the upper mold 102A of the first resin molding mold 10A and between the lower mold 101B and the upper mold 102B of the second resin molding mold 10B. The resin material transfer tray (resin material supply mechanism) 27 carried in. As shown in FIG. 6, the resin material transfer tray 27 includes a frame body 271 which is obtained by digging out a central portion of a plate-like member, and a resin accommodation portion 272 which is a portion which is dug out and is surrounded by the frame body 271. And a gas suction port 273, which is disposed on the lower surface of the frame 271 and adsorbs the release film F. The resin material transfer tray 27 sucks air from the suction port 272 to suck the release film F on the lower surface of the frame 271, and the resin material is blocked by the release film F under the resin storage portion 272. P is housed in the resin containing portion 272. The resin material transfer tray 27 is carried between the lower mold 101A (101B) and the upper mold 102A (102B). Then, the gas is sucked from the gas suction port 141 of the lower mold 101A (101B), and the adsorption of the release film F by the gas suction port 273 of the resin material transfer tray 27 is released, thereby releasing the film F The inner surface of the cavity C is deformed so as to cover the inner surface, and a resin material P is supplied to the cavity C.

(1-4) A method for manufacturing a resin molded product using a resin molding mold according to the first embodiment (the method for manufacturing a resin molded product according to the first embodiment, and the operation of the resin molding apparatus according to the first embodiment)

The operation of the resin molding apparatus of the first embodiment using the resin molding product manufacturing method (the resin molding product manufacturing method of the first embodiment) using the resin molding molding die of the first embodiment will be described with reference to FIG. 7. In addition, although the operation of the first resin molding mold 10A is shown in FIG. 7, the operation of the second resin molding mold 10B is the same.

First, the lower molds 101A and 101B are adjusted so that the cavity C becomes a specific shape by the method for adjusting a molding mold for resin molding according to the first embodiment. With this, the positions of the elastic members 26A and 26B are moved so as to match the positions of the adjusted peripheral wall members 11A to 11D.

Next, on the lower surfaces of the upper molds 102A and 102B, the substrates S on which a plurality of electronic components are mounted are respectively mounted with the mounting surfaces facing the lower side (FIG. 7 (a)). Next, the resin material transfer tray 27 holding the resin material P and the release film F is moved between the lower mold 101A (101B) and the upper mold 102A (102B) and lowered, and the gas is sucked from the gas suction port 141 And the holding part releases the release film F. Thereby, the inner surface of the cavity C of the lower molds 101A and 101B is covered with the release film F and the resin material P is supplied to the cavity C (FIG. 7 (b)). In addition, the gas suction port 141 is provided only on the upper surface 114 of the peripheral wall members 11A to 11D and is not provided on the mold cavity C. However, since the upper surface 114 has a slight roughness, it can pass through the upper surface 114 and the release film F. The gap sucks air between the inner surface of the mold cavity C and the release film F from the gas suction port 141. Therefore, the inner surface of the cavity C can be brought into close contact with the release film F.

Next, the first lower heating plates 251A and 252A are used to heat the resin material P in the cavity C of the lower molds 101A and 101B to melt or soften the resin material P (FIG. 7 (C)). With this, the substrate S is heated to the same temperature as the resin material P by the first upper heating plates 252A and 252B. This is to prevent the resin material P from being rapidly cooled due to the temperature difference between the resin material P and the substrate S immediately after the mold clamping described below. During such heating, a first lower heat insulating member 241A is provided between the first lower heating plate 251A and the lower movable platen 211, and an upper portion is provided between the first upper heating plate 252A and the upper movable platen 212. The heat insulation member 242A can suppress heat dissipation to the lower movable platen 211 or the upper movable platen 212, and can efficiently heat the resin material P in the cavity C of the lower mold 101A or the substrate S of the upper mold 102 (lower mold 101B and upper mold 102B are the same).

Next, the lower movable platen 211 is raised by the torsion arm 233. Thus, first, the lower mold 101A of the first resin molding mold 10A abuts on the upper mold 102A, the movable platen 212 on which the upper mold 102A is mounted rises, and the lower mold 101B of the second resin molding mold 10B and The upper mold 102B abuts. Further, the lower movable platen 211 is raised by the torsion arm 233, thereby clamping the first resin molding mold 10A and the second resin molding mold 10B (FIG. 7 (d)). By holding in this state, the resin material P in the first resin molding mold 10A and the second resin molding mold 10B is hardened, thereby forming a resin molded product (resin-sealed product) on the surface of the substrate S. PM (Figure 7 (e)).

Thereafter, the heating by the first lower heating plates 251A and 252A and the first upper heating plates 252A and 252B is stopped, and the lower movable platen 211 is lowered by the torsion arm 233, thereby making the first resin molding mold 10A. And the second resin molding mold 10B is opened (FIG. 7 (f)). At this time, the inner surface of the cavity C is covered with the release film F, and the tapered portion 116 is formed on the upper end of the inner surfaces of the peripheral wall members 11A to 11D of the lower molds 101A and 101B, so that the resin molded product PM can be easily formed. Demolding is performed from the lower molds 101A and 101B. After that, the substrate S having the resin molded product PM formed on the surface is removed from the upper molds 102A and 102B, and the release film F is removed from the lower molds 101A and 101B. In addition, although an inclined surface corresponding to the tapered portion 116 of the resin-molding mold 10 is formed at the end of the resin-molded product PM, the substrate S on which the resin-molded product PM is formed is divided into a plurality of single pieces. Chemical treatment, at this time the part of the inclined surface is removed.

Thereafter, by repeating the previous operation, the resin molded product PM can be repeatedly produced.

(1-5) Effects of the first embodiment

According to the molding mold 10 for resin molding according to the first embodiment, the planar shape of the cavity C can be changed only by moving the relative positions of the four peripheral wall members 11A to 11D. Therefore, only one type of the peripheral wall members 11A to 11D is prepared. No need to replace. Therefore, it is possible to reduce costs and man-hours required for securing or managing the storage place of the molding die.

In addition, since the molding die 10 for resin molding of the first embodiment has the tapered portion 116 formed on the upper end of the inner surface 113 of the peripheral wall members 11A to 11D, the resin molded product PM can be easily demolded. With this, the resin-molding mold 10 of the first embodiment can use the gas suction port 141 provided in the peripheral wall members 11A to 11D to cover the inner surface of the cavity C with the release film F. The resin molded product PM can be easily released.

(1-6) Modification of the first embodiment

In the resin-molding mold 10 of the first embodiment, all of the four peripheral wall members 11A to 11D can be moved, but one of these four can also be fixed in position. In the resin mold 10 of the first embodiment, the tapered portion 116 is formed on the upper end of the inner surface 113 of the peripheral wall members 11A to 11D, but the tapered portion 116 may be omitted. In the mold 10 for resin molding of the first embodiment, the gas suction port 141 is provided on the upper surface 114 of the peripheral wall member 11A to 11D. However, the gas suction port 141 may be combined with the gas suction port 141 or replaced with the peripheral wall member 11A to A gas suction port is provided on the inner surface 113 of the 11D or the upper surface of the bottom member 12. Alternatively, as shown in FIG. 8, a gas suction port installation wall 16 may be provided around the peripheral wall members 11A to 11D of the resin molding mold 10 (wherein the gas suction port 141 is not provided), and the gas A gas suction port 141A is provided on the upper surface of the suction port setting wall 16. In addition, the configuration of the molding die 10 for resin molding of the first embodiment can be variously changed within the scope of the gist of the present invention.

In the resin molding apparatus 20 according to the first embodiment, two resin molds (for the first resin molding) are formed using two movable platens (the lower movable platen 211 and the upper movable platen 212) and one fixed platen 22. The molding die 10A and the second resin molding die 10B) are closed at the same time, but it is also possible to use one movable platen and one fixed platen to close one resin molding die 10. Alternatively, three or more movable mold plates and one fixed platen may be used to simultaneously mold three or more resin molding molds.

FIG. 9 shows a resin molding unit 30 as another modified example of the resin molding apparatus of the first embodiment. The resin molding unit 30 according to this modification includes a material receiving module 31, a molding module 32, and a take-out module 33. The material receiving module 31 is a device for receiving the resin material P and the substrate S from the outside and sending the resin material P to the molding module 32. The material receiving module 31 includes a resin material supplying device 310 for supplying the resin material P to the resin material transfer tray 27 and a substrate receiving section 311. One molding module 32 includes one set of the above-mentioned resin molding device 20. Although three forming modules 32 are shown in FIG. 9, an arbitrary number of forming modules 32 may be provided in the resin forming unit 30. In addition, even after the resin molding unit 30 is assembled and used, the molding module 32 can be increased or decreased. The take-out module 33 is a person who carries in and holds a resin molded product manufactured in the molding module 32 from the molding module 32 and has a resin molded product holding portion 331.

In the resin molding unit 30, a substrate S, a resin material transfer tray 27, and a resin molded product are provided so as to penetrate the material receiving module 31, one or a plurality of molding modules 32, and the take-out module 33. Main transfer device 36. In addition, in each module, a substrate S, a resin material transfer tray 27, and a sub-transport device 37 for transferring the substrate S between the main transfer device 36 and the devices in the module are provided. In addition, the resin molding unit 30 includes a power source and a control unit (none of which is shown) for operating the modules.

The operation of the resin molding unit 30 will be described. The substrate S is held by the operator in the substrate receiving portion 311 of the material receiving module 31. The main transfer device 36 and the sub transfer device 37 transfer the substrate S from the substrate receiving section 311 to the resin molding device 20 located in one of the molding modules 32, and mount the substrate S on the resin molding device 20 on the mold 102A, 102B.

Then, the main conveying device 36 and the sub conveying device 37 carry the resin material transfer tray 27 into the resin material supply device 310. In the resin material supply device 310, the resin material P is supplied onto the release film F held by the holding portion as described above.

The main transfer device 36 and the sub transfer device 37 transfer the resin material transfer tray 27 supplied with the resin material P to the resin molding device 20 of the molding module 32 on which the substrate S is mounted on the upper molds 102A and 102B. When the resin material transfer tray 27 is arranged in the lower molds 101A and 101B of the resin molding apparatus 20, the release film F is covered from the resin material transfer tray 27 in the cavity C of the lower molds 101A and 101B. The cavity C is supplied with a resin material P on its surface. After that, when the resin material transfer tray 27 is carried out from the resin molding device 20 by the main transfer device 36 and the sub transfer device 37, compression molding is performed in the resin molding device 20. During the compression molding of the resin molding apparatus 20, the resin molding apparatus 20 located in the other molding module 32 is operated in the same manner as before, so that compression can be performed in parallel while shifting the time between the plurality of molding modules 32. Forming.

The resin molded product obtained by compression molding is carried out from the resin molding apparatus 20 by the main conveying device 36 and the sub conveying device 37, and is carried into the resin molded product holding portion 331 of the take-out module 33 to be held. The user appropriately takes out the resin molded product from the resin molded product holding portion 331.

(2) Second embodiment

(2-1) Mold for resin molding of the second embodiment

FIG. 10 shows a molding die 40 for resin molding according to the second embodiment. This resin molding mold 40 is a molding mold for transfer molding. The molding die 40 for resin molding is composed of an upper mold 401 and a lower mold 402. The upper mold 401 includes a first peripheral wall member 41A, a second peripheral wall member 41B, a third peripheral wall member 41C, and a fourth peripheral wall member 41D. The peripheral wall member, the bottom surface member 42, the flow groove 45, and two sets of bases 4011 made of these sections are mounted on the lower surface. The lower mold 402 has two substrate mounting tables 46 and two hole slots 47. The plunger 48 is inserted into the hole groove 47 from the lower side. A bottom view of the upper mold 401 is shown in FIG. 10 (a), a vertical cross-sectional view of the upper mold 401 is shown in (b) in the longitudinal section through which the flow groove 45 passes, and a lower mold is shown in (c). A top view of 402 is a vertical cross-sectional view of the lower die 402 in the vertical cross-section of the perforated groove 47 through (d).

The flow groove 45 of the upper mold 401 and the hole groove 47 of the lower mold 402 are set to mutually position such that the upper mold 401 and the lower mold 402 are in contact with each other. Respectively, a flow groove resistance 451 is provided around the flow groove 45 of the upper mold 401 (above and below the flow groove 45 of FIG. 10 (a)), and around the hole groove 47 of the lower mold 402 (FIG. 10 (C) The upper and lower sides of the hole groove 47 are provided with a hole groove resisting member 471 so that the resin does not flow out around the flow groove 45 and the hole groove 47.

A front view of the first peripheral wall member 41A is shown in FIG. 11 (a), and a front view of the third peripheral wall member 41C is shown in FIG. 11 (c). In addition, the "front view" of these peripheral wall members refers to a figure viewed from the outside of a planar area surrounded by four peripheral wall members. The first peripheral wall member 41A has an upper surface (first surface) 411 corresponding to the lower surface 111 in the first embodiment. The first peripheral wall member 41A has the same left side surface (second surface) 412, inner surface (third surface) 413, tapered portion 416, and eaves-shaped portion 417 as in the first embodiment. However, the tapered portion 416 and the eaves-shaped portion 417 have a shape reversed up and down from the first embodiment. The first peripheral wall member 41A includes a sliding member 431 and a guide hole 432 similar to those in the first embodiment. On the other hand, the first peripheral wall member 41A is not provided with the gas suction port 141, the gas suction pipe 142, and the connection port 143 in the first embodiment, and is provided with a resin material supply flow path 452 described below. This is different from the first peripheral wall member 11A in the first embodiment.

The resin material supply flow path 452 is formed by forming a recess in a portion of the lower surface (the fourth surface) 414 of the first peripheral wall member 41A, and communicates with the flow groove 45. The resin material supply flow path 452 is provided with a width in the length direction of the first peripheral wall member 41A, and is always in communication with the flow groove 45 within a range where the first peripheral wall member 41A moves, as described below. On the other hand, the resin material supply flow path 452 is blocked by the hole groove resisting member 471 except where it communicates with the flow groove 45 so that the resin material flowing from the flow groove 45 into the resin material supply flow path 452 does not leak out.

The first peripheral wall member 41A is provided with a female screw 491 (FIG. 11 (a)) extending downward from the upper surface 411, and the female screw 491 and a bolt 492 (FIG. 10 (b)) provided through a hole in the base 4011 are used. Fixed to the base 4011. The base 4011 is provided with a plurality of holes arranged in a row in the depth direction of FIG. 10 (b). By changing the holes through which the bolts 492 pass, the entire first peripheral wall member 41A can be moved in the longitudinal direction.

The third peripheral wall member 41C has a structure in which the third peripheral wall member 11C of the first embodiment is turned upside down. The third peripheral wall member 41C is different from the first peripheral wall member 41A, and has the same gas suction port 441, gas suction pipe 442, and connection port 443 as the first embodiment (however, the up and down directions are reversed, and the gas suction port is reversed. 441 is located on the lower surface 414). On the other hand, the resin material supply flow path 452 is not provided. In addition, instead of the female screw 491 of the first peripheral wall member 41A, a through hole 493 is provided that penetrates from the outer surface to the inner surface 413.

The second peripheral wall member 41B and the fourth peripheral wall member 41D have the same configuration as the third peripheral wall member 41C except that the length in the left-right direction is shorter than that of the third peripheral wall member 41C. The first peripheral wall member 41A and the second peripheral wall member 41B are different from each other in the longitudinal direction by 90 °, and therefore, the moving directions are also different from each other by 90 °.

The bottom surface member 42 has a plate shape (cuboid shape), and is inserted into the space of a rectangular prism formed by four peripheral wall members with the plate surface facing up and down. The bottom member 42 is provided with a plurality of plate members having different vertical and horizontal sizes. A cavity C is formed by the inner surface 413 of each of the peripheral wall members 41A to 41D and the lower surface of the bottom member 12. In addition, a through hole through which the bolt 4012 passes is provided in the base 4011, and a female screw is provided at a position where the upper surface of the bottom surface member 42 coincides with the hole. The bottom surface member 42 is fixed to the base 4011 by the female screw and the bolt 4012.

In addition, on the four side surfaces of the bottom surface member 42 that are in contact with the second peripheral wall member 41B, the third peripheral wall member 41C, and the fourth peripheral wall member 41D, positions facing the through holes 493 of the peripheral wall members are provided. Female thread. Each peripheral wall member is fixed to the bottom surface member 42 by the bolt 494 (FIG.10 (b)) which passed through the through-hole 493.

(2-2) Method for adjusting a molding die for resin molding of the second embodiment

A method for adjusting the molding die 40 for resin molding according to the second embodiment will be described with reference to FIG. 12. A bottom view of the upper mold 401 is shown in FIG. 12, (a) of the figure shows a state before the adjustment and the planar shape of the cavity C is the largest, and (b) shows an adjusted and the planar shape of the cavity C changes. It is less than (a).

When adjusting the mold 40 for resin molding, first, the bottom member 42 is removed from the upper mold 401. From this state, each of the peripheral wall members 41A to 41D is moved as follows. The first peripheral wall member 41A is moved in the longitudinal direction (longitudinal direction in FIG. 12) so that one of a plurality of holes provided in the base 4011 coincides with the position of the female thread 491, and then is fixed to the base 4011 by a bolt 492 passing through the hole .

The second peripheral wall member 41B, the third peripheral wall member 41C, and the fourth peripheral wall member 41D move the relative position of the sliding member 431 with respect to the guide hole 432 toward the guide hole 432 to the right, so that relative to the adjacent peripheral wall member Relative position movement. At this time, the second peripheral wall member 41B moves in the longitudinal direction of FIG. 12 and in a direction opposite to the first peripheral wall member 41A. The third peripheral wall member 41C moves in the same direction as the second peripheral wall member 41B in the longitudinal direction, and moves closer to the first peripheral wall member 41A in the lateral direction. The fourth peripheral wall member 41D moves in the same direction as the first peripheral wall member 41A in the longitudinal direction, and moves in the same direction as the third peripheral wall member 41C in the lateral direction.

By the movement of each of the peripheral wall members 41A to 41D, the left side surface (second surface) 412 of each of the peripheral wall members 41A to 41D is in contact with a part of the inner surface (third surface) 413 of the left adjacent peripheral wall member. Move down relative position. In this way, the planar shape of the cavity C is kept rectangular while the long and short sides are shorter than before the movement.

When the peripheral wall member 41A is moved as described above, the relative position of the flow groove 45 and the resin material supply flow path 452 of the peripheral wall member 41A changes. However, the resin material supply flow path 452 is provided in the longitudinal direction of the first peripheral wall member 41A. Since it has a width, the flow groove 45 is also connected to the resin material supply flow path 452 after the movement. In addition, before and after the movement, the flow channel resistance member 451 existing around the flow channel 45 is used to open the opening of the resin material supply flow path 452 on the side of the flow channel resistance member 451 other than the portion corresponding to the flow channel 45 from the flow channel. The resistance member 451 is blocked.

After moving the peripheral wall members 41A to 41D in this manner, the bottom surface member 42 having a plate surface having the same shape as the planar shape of the cavity C is inserted into the surrounding surface 413 of the peripheral wall members 41A to 41D. Space, and the bottom member 42 is fixed to the base 4011 by bolts 4012. The second peripheral wall member 41B, the third peripheral wall member 41C, and the fourth peripheral wall member 41D are fixed to the bottom surface member 42 with bolts 494. In addition, there is no need to adjust the lower mold 402 in cooperation with the adjustment of the upper mold 401. With the above operations, the adjustment of the resin mold 40 is completed.

(2-3) A resin molding apparatus provided with a molding mold for resin molding of the second embodiment (resin molding apparatus of the second embodiment)

FIG. 13 shows a resin molding apparatus 50 including a resin molding mold 40 according to the second embodiment. The resin molding apparatus 50 includes a mold clamping mechanism including a base plate 531, a tie rod 532, a torque arm 533, a movable platen 51, and a fixed platen 52. In the molding die 10 for resin molding of the first embodiment, two movable platens of a lower movable platen 211 and an upper movable platen 212 are provided, but only one movable platen 51 is provided in the resin molding apparatus 50 of this embodiment. . The structure of the mold clamping mechanism other than the movable platen 51 is the same as that of the molding mold 10 for resin molding of the first embodiment. A lower die 402 is placed on the movable platen 51. The lower die 402 is provided with a driving unit for moving the plunger 48 upward and downward, and a heater (not shown) for heating the inside of the hole 47. An upper mold 401 is mounted below the fixed platen 52.

(2-4) A method for manufacturing a resin molded product using a resin molding mold according to the second embodiment (the method for manufacturing a resin molded product according to the second embodiment, and the operation of the resin molding apparatus according to the second embodiment)

The operation of the resin molding apparatus 50 will be described using FIG. 14. First, after the above-mentioned adjustment is performed with the upper mold 401 removed from the resin molding apparatus 50, the upper mold 401 is mounted on the lower surface of the fixed platen 52.

Next, the substrate S is placed on the substrate mounting table 46 of the lower mold 402 so that the mounting surface on which the electronic components are mounted faces upward, and a solid resin material P (a) is put into the hole 47. Next, the release film F is arranged so as to cover each of the peripheral wall members 41A to 41D of the upper mold 401 and the lower side of the bottom member. At this time, a slight gap (not shown) is provided between the bottom surface member 42 and the first peripheral wall member 41A and the release film F. In addition, the three peripheral wall members 41B to 41D other than the first peripheral wall member 41A of each of the peripheral wall members 41A to 41D suck gas from the gas suction port 441, and the bottom surface member 42 and the first peripheral wall member 41A. The gap and the gas suction port 441 communicating with the gap suck gas. Thereby, the inner surface of the cavity C other than the inner surface 413 of the first peripheral wall member 41A is covered with the release film F (b).

Then, the hole groove 47 is heated by a heater, and the resin material P in the hole groove 47 is melted. Thereafter, the movable platen 51 is raised by the torsion arm 533, and the upper mold 401 and the lower mold 402 are closed. Then, the molten resin material P is extruded from the hole groove 47 by the plunger 48 (c). The resin material P extruded from the hole groove 47 is supplied into the cavity C through the flow groove 45 and the resin material supply flow path 452. Thereafter, the resin material P is cooled and hardened, and the movable platen 51 is lowered to perform mold opening (d). Thus, a resin molded product PM obtained by curing the resin material P on the surface of the substrate S is obtained. When the mold is opened, the tapered portion 416 is formed in each of the peripheral wall members 41A to 41D, and the inner surface of the cavity C (except the inner surface 413 of the first peripheral wall member 41A) is covered with a release film F, and The resin molded product PM can be easily released.

(2-5) Effects of the second embodiment

In the resin molding mold 40 of the second embodiment, as in the first embodiment, the planar shape of the cavity C can be changed by merely moving the relative positions of the four peripheral wall members 41A to 41D. Only one kind of peripheral wall members 41A to 41D can be prepared, and no replacement is required. Therefore, it is possible to reduce costs and man-hours required for securing or managing the storage place of the molding die.

A tapered portion 416 is formed at the lower end of the inner surface 413 of the peripheral wall members 41A to 41D, and the inner surface of the cavity C (except the inner surface 413 of the first peripheral wall member 41A) is covered with a release film F. It is possible to easily release the resin molded product PM.

(2-6) Modification of the second embodiment

The molding die 40 for resin molding of the second embodiment can be variously deformed in the same manner as the molding die 10 for resin molding of the first embodiment. For example, in the molding die 40 for resin molding of the second embodiment, all of the four peripheral wall members 41A to 41D can be moved, but one of these four may be fixed in position. When the position of the first peripheral wall member 41A is fixed, the relative position of the flow groove 45 and the resin material supply flow path 452 does not change. Therefore, the resin material supply flow path 452 may be the same diameter as the flow groove 45. The tapered portion 416 may be omitted. The gas suction port 441 may be provided on the lower surface (fourth surface) 414 of the first peripheral wall member 41A. In this case, the gas suction pipe 442 and the connection port 443 have the same configuration as the peripheral wall members 41B to 41D. The gas suction port 441 may be provided on the inner surface 413 of the peripheral wall members 41A to 41D or the lower surface of the bottom member 42. Alternatively, a wall may be provided using the same gas suction port as in FIG. 8. The resin material supply flow path 452 may be provided in the bottom surface member 42. The configuration of the resin-molding mold 40 according to the second embodiment can be variously changed within the scope of the gist of the present invention.

The resin molding apparatus 50 of the second embodiment can also be modified in various ways similar to the resin molding apparatus 20 of the first embodiment. Furthermore, a resin molding unit similar to the resin molding unit 30 of the first embodiment can be configured using a molding module provided with the resin molding device 50 of the second embodiment.

Claims (11)

    A molding die for resin molding, comprising: a) four peripheral wall members each having three planes that are orthogonal to each other, that is, a first surface, a second surface, and a third surface; and b) a bottom surface member, It is installed so that when the four peripheral wall members are arranged such that the first surface of each peripheral wall member is arranged on the same plane and the second surface is in contact with a part of the third surface of an adjacent peripheral wall member, the four peripheral wall members are arranged. Inside the quadrangular columnar space formed on each of the third surfaces of the members, the bottom of one side of the space is blocked.         The molding die for resin molding according to claim 1, wherein one or both of the fourth surface and the third surface of the four peripheral wall members opposite to the first surface are provided with suction Gas suction port for gas.         The molding die for resin molding according to claim 1, wherein a gas suction port for sucking gas is provided on a surface of the cavity side of the bottom member surrounded by the four peripheral wall members and the bottom member.         The molding die for resin molding according to claim 1, wherein a portion of a fourth surface side of the third surface of the four peripheral wall members that is opposite to the first surface is formed as it approaches the fourth surface. The tapered portion facing the outside of the quadrangular columnar space.         The molding die for resin molding according to any one of claims 1 to 4, further comprising: a resin supply flow path provided in at least one of the four peripheral wall members and the bottom member, and A resin material is supplied to a cavity surrounded by the four peripheral wall members and the bottom member.         A resin molding apparatus, comprising: the molding mold for resin molding according to any one of claims 1 to 4; a mold clamping mechanism for clamping the above molding mold for resin molding; and an elastic member provided at A lower portion of the four peripheral wall members; and a resin material supply mechanism that supplies a resin material to a cavity surrounded by the four peripheral wall members and the bottom surface member.         A resin molding apparatus, comprising: the molding mold for resin molding according to claim 5; a mold clamping mechanism for clamping the molding mold for resin molding; and a resin material holding section connected to the resin supply stream. And a plunger that injects the resin material in the resin material holding portion into the cavity through the resin supply flow path.         A method for adjusting a molding die for resin molding, comprising a step of moving a peripheral wall member among each of the four peripheral wall members of the molding die for resin molding according to any one of claims 1 to 4. While keeping the first surface disposed on the same plane, moving the relative position of the second surface and the third surface of the peripheral wall member in contact with the second surface; and the step of installing the bottom surface member, which is The above-mentioned bottom surface member is incorporated into a quadrangular columnar space formed by each of the third surfaces of the four peripheral wall members.         A method for adjusting a molding die for resin molding, comprising: a step of moving a peripheral wall member, wherein the first surface is held by each of the four peripheral wall members of the molding die for resin molding according to claim 5; The relative position of the second surface and the third surface of the peripheral wall member contacted by the second surface is moved in a state of being arranged on the same plane; and a bottom surface member mounting step is to install the bottom surface member to The inside of a quadrangular columnar space formed by the third surfaces of the four peripheral wall members.         A method for manufacturing a resin molded product, comprising: adjusting the shape of a cavity surrounded by the four peripheral wall members and the bottom surface member by the method for adjusting a molding die for resin molding according to claim 8 as requested After supplying the resin material to the cavity of the resin mold for the mold according to any one of items 1 to 4, heating the resin material to a temperature at which the resin material softens or melts, and closing the mold for the resin mold, This resin material is then hardened.         A method for manufacturing a resin molded product, comprising: closing the mold for the resin molding according to claim 5 by adjusting the shape of the cavity by the method for adjusting the molding mold for the resin molding according to claim 9; After heating the resin material to a temperature at which the resin material softens or melts, the resin material is supplied from the resin supply flow path to the mold cavity, and then the resin material is hardened.