JP2018159581A - 状態検出装置 - Google Patents
状態検出装置 Download PDFInfo
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- 239000007787 solid Substances 0.000 claims abstract description 23
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- 238000005476 soldering Methods 0.000 claims description 4
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- 238000004891 communication Methods 0.000 description 12
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- 239000005486 organic electrolyte Substances 0.000 description 2
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- 239000002470 thermal conductor Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- G—PHYSICS
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
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- G—PHYSICS
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
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- G—PHYSICS
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
- G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
- G01M5/0041—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining deflection or stress
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/138—Primary casings; Jackets or wrappings adapted for specific cells, e.g. electrochemical cells operating at high temperature
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10037—Printed or non-printed battery
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Aviation & Aerospace Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Secondary Cells (AREA)
Abstract
Description
充電可能な全固体電池と、
前記全固体電池に充電電力を供給する発電機と、
前記全固体電池からの供給電力で動作するセンサと、
前記全固体電池、前記発電機及び前記センサを設けたフレキシブル基板と、を備える。
前記熱伝導パターンは、前記フレキシブル基板の前記センサを設けた側の面上において前記センサの近傍に位置し又は延在してもよい。
図1〜図5を参照し、本発明の実施の形態1に係る状態検出装置1について説明する。状態検出装置1は、フレキシブル基板10と、発電機としての圧電素子20と、二次電池である全固体電池30と、各種センサを包含する集積回路(IC:Integrated Circuit)40と、を備える。
図6は、本発明の実施の形態2に係る状態検出装置2及びそれを装着した物体50の拡大断面図である。状態検出装置2は、実施の形態1に示したものと比較して、フレキシブル基板10に熱伝導パターン11が設けられる点で相違し、その他の点で一致する。熱伝導パターン11は、フレキシブル基板10の下面(物体50側の面)の少なくとも一部に設けられた第1部分11aと、第1部分11aから延びてフレキシブル基板10を貫通する第2部分11bと、フレキシブル基板10の上面に設けられ、第2部分11bに接続されると共に集積回路40の近傍(温度センサの近傍)に至る第3部分11cと、を含む。本実施の形態によれば、実施の形態1の効果に加え、物体50の熱が熱伝導パターン11の第1部分11a、第2部分11b、第3部分11cに順に伝達されて集積回路40に含まれる温度センサの近傍まで移動するため、物体50の温度をより正確に測定することができる。
図7は、本発明の実施の形態3に係る状態検出装置3及びそれを装着した物体50の拡大断面図である。状態検出装置3は、実施の形態1に示したものと比較して、フレキシブル基板10に、物体50の内部に入り込んだ(挿入された)熱伝導体51と接触する熱伝導パターン12が設けられる点で相違し、その他の点で一致する。熱伝導体51は、熱伝導率の高い例えば銅等の金属からなる部品である。熱伝導体51は、好ましくは集積回路40の近傍(温度センサの近傍)においてフレキシブル基板10を貫通し、物体50の内部に入り込む。
図8は、本発明の実施の形態4に係る状態検出装置4及びそれを装着した物体50の拡大断面図である。状態検出装置4は、実施の形態1に示したものと比較して、フレキシブル基板10に、物体50の内部に例えば一体成型により埋め込まれた(埋設された)熱伝導体52と接触する熱伝導パターン13が設けられる点で相違し、その他の点で一致する。熱伝導体52は、熱伝導率の高い例えば銅等の金属からなる部品である。熱伝導体52は、好ましくは集積回路40の近傍(温度センサの近傍)において、物体50のフレキシブル基板10側の面に部分的に露出する。
Claims (8)
- 充電可能な全固体電池と、
前記全固体電池に充電電力を供給する発電機と、
前記全固体電池からの供給電力で動作するセンサと、
前記全固体電池、前記発電機及び前記センサを設けたフレキシブル基板と、を備える、状態検出装置。 - 被測定物である又は被測定空間の内面の少なくとも一部を構成する、可撓性を有する物体に、前記フレキシブル基板が取り付けられる、請求項1に記載の状態検出装置。
- 前記フレキシブル基板が移動体に取り付けられる、請求項2に記載の状態検出装置。
- 前記フレキシブル基板の、測定対象である物体側の面の少なくとも一部に、熱伝導パターンが設けられている、請求項1から3のいずれか一項に記載の状態検出装置。
- 前記熱伝導パターンは、前記フレキシブル基板の反物体側の面に延出し、反物体側の面に設けられた前記センサの近傍に至る、請求項4に記載の状態検出装置。
- 前記フレキシブル基板に、測定対象である物体の内部に入り込んだ熱伝導体と接触する熱伝導パターンが設けられ、
前記熱伝導パターンは、前記フレキシブル基板の前記センサを設けた側の面上において前記センサの近傍に位置し又は延在する、請求項1から3のいずれか一項に記載の状態検出装置。 - 前記全固体電池、前記発電機及び前記センサが、前記フレキシブル基板にリフロー半田付けにより搭載されている、請求項1から6のいずれか一項に記載の状態検出装置。
- 前記センサが、温度センサ、加速度センサ、圧力センサ、及び歪みセンサ、の少なくともいずれかを含む、請求項1から7のいずれか一項に記載の状態検出装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017055958A JP6790950B2 (ja) | 2017-03-22 | 2017-03-22 | 状態検出装置 |
US16/494,809 US10905011B2 (en) | 2017-03-22 | 2018-03-16 | State detecting device |
CN201880017895.6A CN110431385A (zh) | 2017-03-22 | 2018-03-16 | 状态检测装置 |
EP18772335.8A EP3605027A4 (en) | 2017-03-22 | 2018-03-16 | STATUS DETECTION DEVICE |
PCT/JP2018/010536 WO2018173956A1 (ja) | 2017-03-22 | 2018-03-16 | 状態検出装置 |
Applications Claiming Priority (1)
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JP2017055958A JP6790950B2 (ja) | 2017-03-22 | 2017-03-22 | 状態検出装置 |
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JP2018159581A true JP2018159581A (ja) | 2018-10-11 |
JP6790950B2 JP6790950B2 (ja) | 2020-11-25 |
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US (1) | US10905011B2 (ja) |
EP (1) | EP3605027A4 (ja) |
JP (1) | JP6790950B2 (ja) |
CN (1) | CN110431385A (ja) |
WO (1) | WO2018173956A1 (ja) |
Cited By (1)
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WO2023129424A1 (en) * | 2021-12-29 | 2023-07-06 | Lenlok Holdings, Llc | Sensor device for fluid fitting |
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US10559864B2 (en) | 2014-02-13 | 2020-02-11 | Birmingham Technologies, Inc. | Nanofluid contact potential difference battery |
GB2595640A (en) * | 2020-05-26 | 2021-12-08 | Edwards Vacuum Llc | Vacuum apparatus temperature sensor assembly |
US11417506B1 (en) * | 2020-10-15 | 2022-08-16 | Birmingham Technologies, Inc. | Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods |
DE102022204045A1 (de) * | 2022-04-27 | 2023-11-02 | Contitech Ag | Sensoranordnung zur Verwendung mit einem Artikel, vorzugsweise mit einer Medienführung |
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- 2018-03-16 EP EP18772335.8A patent/EP3605027A4/en active Pending
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WO2015029103A1 (ja) * | 2013-08-26 | 2015-03-05 | 富士通株式会社 | 全固体型二次電池、その製造方法及び電子機器 |
JP2015047436A (ja) * | 2013-09-04 | 2015-03-16 | 公益財団法人三重県産業支援センター | 身体装着具 |
JP2015076158A (ja) * | 2013-10-07 | 2015-04-20 | 富士通株式会社 | 全固体二次電池、全固体二次電池の製造方法、及びセンサシステム |
JP2015220103A (ja) * | 2014-05-19 | 2015-12-07 | Tdk株式会社 | 蓄電装置およびそれを用いた電子機器並びに蓄電ユニット |
JP2016025777A (ja) * | 2014-07-22 | 2016-02-08 | オムロン株式会社 | 電源装置 |
WO2016030869A1 (en) * | 2014-08-29 | 2016-03-03 | Ecole Polytechnique Federale De Lausanne (Epfl) | Wearable, multi-parametric wireless system-in-patch for hydration level monitoring |
JP2016086599A (ja) * | 2014-10-28 | 2016-05-19 | パナソニックIpマネジメント株式会社 | 発電装置 |
CN204697952U (zh) * | 2015-05-29 | 2015-10-14 | 深圳市上古光电有限公司 | 一种太阳能发热手套 |
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WO2023129424A1 (en) * | 2021-12-29 | 2023-07-06 | Lenlok Holdings, Llc | Sensor device for fluid fitting |
Also Published As
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WO2018173956A1 (ja) | 2018-09-27 |
US10905011B2 (en) | 2021-01-26 |
EP3605027A4 (en) | 2021-01-13 |
EP3605027A1 (en) | 2020-02-05 |
JP6790950B2 (ja) | 2020-11-25 |
CN110431385A (zh) | 2019-11-08 |
US20200100363A1 (en) | 2020-03-26 |
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