JP2018158399A5 - - Google Patents

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Publication number
JP2018158399A5
JP2018158399A5 JP2017055976A JP2017055976A JP2018158399A5 JP 2018158399 A5 JP2018158399 A5 JP 2018158399A5 JP 2017055976 A JP2017055976 A JP 2017055976A JP 2017055976 A JP2017055976 A JP 2017055976A JP 2018158399 A5 JP2018158399 A5 JP 2018158399A5
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JP
Japan
Prior art keywords
polishing
substrate
conditioning
shape
polishing member
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JP2017055976A
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English (en)
Japanese (ja)
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JP6884015B2 (ja
JP2018158399A (ja
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Priority claimed from JP2017055976A external-priority patent/JP6884015B2/ja
Priority to JP2017055976A priority Critical patent/JP6884015B2/ja
Priority to CN201880018928.9A priority patent/CN110461542A/zh
Priority to PCT/JP2018/000233 priority patent/WO2018173421A1/ja
Priority to US16/495,010 priority patent/US20200269383A1/en
Priority to KR1020197028236A priority patent/KR102482181B1/ko
Priority to SG11201908381R priority patent/SG11201908381RA/en
Priority to TW107101152A priority patent/TWI763765B/zh
Publication of JP2018158399A publication Critical patent/JP2018158399A/ja
Publication of JP2018158399A5 publication Critical patent/JP2018158399A5/ja
Publication of JP6884015B2 publication Critical patent/JP6884015B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017055976A 2017-03-22 2017-03-22 基板の研磨装置および研磨方法 Active JP6884015B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法
KR1020197028236A KR102482181B1 (ko) 2017-03-22 2018-01-10 기판의 연마 장치 및 연마 방법
PCT/JP2018/000233 WO2018173421A1 (ja) 2017-03-22 2018-01-10 基板の研磨装置および研磨方法
US16/495,010 US20200269383A1 (en) 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method
CN201880018928.9A CN110461542A (zh) 2017-03-22 2018-01-10 基板的研磨装置及研磨方法
SG11201908381R SG11201908381RA (en) 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method
TW107101152A TWI763765B (zh) 2017-03-22 2018-01-12 基板的研磨裝置及研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法

Publications (3)

Publication Number Publication Date
JP2018158399A JP2018158399A (ja) 2018-10-11
JP2018158399A5 true JP2018158399A5 (enExample) 2020-03-19
JP6884015B2 JP6884015B2 (ja) 2021-06-09

Family

ID=63584243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017055976A Active JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法

Country Status (7)

Country Link
US (1) US20200269383A1 (enExample)
JP (1) JP6884015B2 (enExample)
KR (1) KR102482181B1 (enExample)
CN (1) CN110461542A (enExample)
SG (1) SG11201908381RA (enExample)
TW (1) TWI763765B (enExample)
WO (1) WO2018173421A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250085835A (ko) * 2018-12-19 2025-06-12 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7387471B2 (ja) * 2020-02-05 2023-11-28 株式会社荏原製作所 基板処理装置および基板処理方法
KR102781684B1 (ko) * 2021-02-26 2025-03-18 주식회사 케이씨텍 기판 이송 시스템

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EP3053704A4 (en) * 2013-10-04 2017-07-19 Fujimi Incorporated Polishing device, processing method of polishing member, modification method of polishing member, shape processing cutting tool, and surface modification tool
JP6454326B2 (ja) * 2014-04-18 2019-01-16 株式会社荏原製作所 基板処理装置、基板処理システム、および基板処理方法
JP2015205359A (ja) * 2014-04-18 2015-11-19 株式会社荏原製作所 基板処理装置
JP6307428B2 (ja) * 2014-12-26 2018-04-04 株式会社荏原製作所 研磨装置およびその制御方法
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KR102535628B1 (ko) * 2016-03-24 2023-05-30 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
JP2018134710A (ja) * 2017-02-22 2018-08-30 株式会社荏原製作所 基板の研磨装置および研磨方法

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