JP2018157196A5 - - Google Patents
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- Publication number
- JP2018157196A5 JP2018157196A5 JP2018013532A JP2018013532A JP2018157196A5 JP 2018157196 A5 JP2018157196 A5 JP 2018157196A5 JP 2018013532 A JP2018013532 A JP 2018013532A JP 2018013532 A JP2018013532 A JP 2018013532A JP 2018157196 A5 JP2018157196 A5 JP 2018157196A5
- Authority
- JP
- Japan
- Prior art keywords
- width
- gas
- degrees
- curved
- injection channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022099299A JP7407867B2 (ja) | 2017-02-06 | 2022-06-21 | 改良型の半角ノズル |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762455282P | 2017-02-06 | 2017-02-06 | |
| US62/455,282 | 2017-02-06 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022099299A Division JP7407867B2 (ja) | 2017-02-06 | 2022-06-21 | 改良型の半角ノズル |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018157196A JP2018157196A (ja) | 2018-10-04 |
| JP2018157196A5 true JP2018157196A5 (enExample) | 2021-03-04 |
| JP7094113B2 JP7094113B2 (ja) | 2022-07-01 |
Family
ID=63039157
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018013532A Active JP7094113B2 (ja) | 2017-02-06 | 2018-01-30 | 改良型の半角ノズル |
| JP2022099299A Active JP7407867B2 (ja) | 2017-02-06 | 2022-06-21 | 改良型の半角ノズル |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022099299A Active JP7407867B2 (ja) | 2017-02-06 | 2022-06-21 | 改良型の半角ノズル |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US10752991B2 (enExample) |
| JP (2) | JP7094113B2 (enExample) |
| KR (2) | KR102555394B1 (enExample) |
| CN (2) | CN108400102B (enExample) |
| TW (3) | TWM569933U (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10752991B2 (en) * | 2017-02-06 | 2020-08-25 | Applied Materials, Inc. | Half-angle nozzle |
| USD924825S1 (en) * | 2018-01-24 | 2021-07-13 | Applied Materials, Inc. | Chamber inlet |
| US10636626B2 (en) * | 2018-01-25 | 2020-04-28 | Applied Materials, Inc. | Dogbone inlet cone profile for remote plasma oxidation chamber |
| CN113196444B (zh) * | 2018-12-20 | 2024-07-02 | 应用材料公司 | 用于供应改良的气流至处理腔室的处理空间的方法和设备 |
| US11486038B2 (en) * | 2019-01-30 | 2022-11-01 | Applied Materials, Inc. | Asymmetric injection for better wafer uniformity |
| US11032945B2 (en) * | 2019-07-12 | 2021-06-08 | Applied Materials, Inc. | Heat shield assembly for an epitaxy chamber |
| TWI861210B (zh) | 2019-09-09 | 2024-11-11 | 美商應用材料股份有限公司 | 輸送反應氣體之處理系統與方法 |
| TWI747490B (zh) * | 2019-09-19 | 2021-11-21 | 日商斯庫林集團股份有限公司 | 曝光裝置 |
| FI128855B (en) * | 2019-09-24 | 2021-01-29 | Picosun Oy | FLUID DISTRIBUTOR FOR THIN FILM GROWING EQUIPMENT, RELATED EQUIPMENT AND METHODS |
| KR20220076343A (ko) * | 2020-11-30 | 2022-06-08 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치의 반응 챔버 내에 배열되도록 구성된 인젝터 |
| TWI765571B (zh) * | 2021-02-09 | 2022-05-21 | 華邦電子股份有限公司 | 熱板冷卻系統 |
| CN116646231A (zh) * | 2023-06-06 | 2023-08-25 | 北京屹唐半导体科技股份有限公司 | 反应腔室及氧化设备 |
| US20250087506A1 (en) * | 2023-09-08 | 2025-03-13 | Applied Materials, Inc. | Targeted gas delivery via side gas injection |
| CN119050005A (zh) * | 2024-08-08 | 2024-11-29 | 江苏天芯微半导体设备有限公司 | 一种衬套组件及具有该衬套组件的半导体外延设备 |
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| US4993360A (en) * | 1988-03-28 | 1991-02-19 | Kabushiki Kaisha Toshiba | Vapor growth apparatus having a diffuser section containing a flow regulating member |
| JP2839720B2 (ja) * | 1990-12-19 | 1998-12-16 | 株式会社東芝 | 熱処理装置 |
| JP3354747B2 (ja) * | 1995-05-22 | 2002-12-09 | 株式会社フジクラ | Ｃｖｄ反応装置および酸化物超電導導体の製造方法 |
| US6143081A (en) | 1996-07-12 | 2000-11-07 | Tokyo Electron Limited | Film forming apparatus and method, and film modifying apparatus and method |
| JP2001118799A (ja) * | 1999-10-22 | 2001-04-27 | Matsushita Electric Ind Co Ltd | ガスの導入と流れの制御方法およびその装置 |
| US20010032588A1 (en) * | 2000-04-21 | 2001-10-25 | Kenji Harafuji | Semiconductor film deposition apparatus |
| US6534401B2 (en) | 2000-04-27 | 2003-03-18 | Applied Materials, Inc. | Method for selectively oxidizing a silicon/metal composite film stack |
| US6467704B2 (en) | 2000-11-30 | 2002-10-22 | Foseco International Limited | Nozzle for guiding molten metal |
| US6820570B2 (en) | 2001-08-15 | 2004-11-23 | Nobel Biocare Services Ag | Atomic layer deposition reactor |
| US6753506B2 (en) * | 2001-08-23 | 2004-06-22 | Axcelis Technologies | System and method of fast ambient switching for rapid thermal processing |
| KR101090895B1 (ko) | 2003-05-09 | 2011-12-08 | 에이에스엠 아메리카, 인코포레이티드 | 화학적 비활성화를 통한 반응기 표면의 패시베이션 |
| US8152922B2 (en) | 2003-08-29 | 2012-04-10 | Asm America, Inc. | Gas mixer and manifold assembly for ALD reactor |
| JP2005353665A (ja) * | 2004-06-08 | 2005-12-22 | Komatsu Electronic Metals Co Ltd | 気相成長装置およびエピタキシャル気相成長装置用ガス導入口の仕切り部材の傾斜角度設定方法 |
| KR101332739B1 (ko) | 2005-01-18 | 2013-11-25 | 에이에스엠 아메리카, 인코포레이티드 | 박막 성장용 반응 시스템 |
| US20070084406A1 (en) | 2005-10-13 | 2007-04-19 | Joseph Yudovsky | Reaction chamber with opposing pockets for gas injection and exhaust |
| US7794667B2 (en) | 2005-10-19 | 2010-09-14 | Moore Epitaxial, Inc. | Gas ring and method of processing substrates |
| TWI320432B (en) | 2006-06-16 | 2010-02-11 | Hon Hai Prec Ind Co Ltd | Apparatus and method for synthesizing carbon nanotube film |
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| EP2084304B1 (en) | 2006-11-22 | 2013-06-26 | Soitec | Method and apparatus for the epitaxial deposition of monocrystalline group iii-v semiconductor material using gallium trichloride |
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| KR20120094112A (ko) * | 2010-02-03 | 2012-08-23 | 샤프 가부시키가이샤 | 증착 마스크, 증착장치 및 증착 방법 |
| JP5490584B2 (ja) * | 2010-03-18 | 2014-05-14 | スタンレー電気株式会社 | 気相成長装置 |
| US9410248B2 (en) * | 2010-03-29 | 2016-08-09 | Koolerheadz | Modular gas injection device |
| JP5815967B2 (ja) * | 2011-03-31 | 2015-11-17 | 東京エレクトロン株式会社 | 基板洗浄装置及び真空処理システム |
| JP2013187236A (ja) | 2012-03-06 | 2013-09-19 | Tokyo Electron Ltd | 太陽電池製造用のスリットノズル及び薬液塗布装置 |
| TWI565825B (zh) * | 2012-06-07 | 2017-01-11 | 索泰克公司 | 沉積系統之氣體注入組件及相關使用方法 |
| CN104334775B (zh) * | 2012-06-07 | 2017-05-10 | 索泰克公司 | 沉积系统的气体注入组件、包括这种组件的沉积系统和相关方法 |
| US20140137801A1 (en) * | 2012-10-26 | 2014-05-22 | Applied Materials, Inc. | Epitaxial chamber with customizable flow injection |
| JP6087621B2 (ja) | 2012-12-27 | 2017-03-01 | 昭和電工株式会社 | 成膜装置 |
| JP6377642B2 (ja) * | 2013-02-06 | 2018-08-22 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | ガス注入装置及びその装置を組み込む基板プロセスチャンバ |
| US9217201B2 (en) | 2013-03-15 | 2015-12-22 | Applied Materials, Inc. | Methods for forming layers on semiconductor substrates |
| US10047457B2 (en) * | 2013-09-16 | 2018-08-14 | Applied Materials, Inc. | EPI pre-heat ring |
| US10053777B2 (en) | 2014-03-19 | 2018-08-21 | Applied Materials, Inc. | Thermal processing chamber |
| US20150280051A1 (en) * | 2014-04-01 | 2015-10-01 | Tsmc Solar Ltd. | Diffuser head apparatus and method of gas distribution |
| US10260149B2 (en) * | 2016-04-28 | 2019-04-16 | Applied Materials, Inc. | Side inject nozzle design for processing chamber |
| JP6717758B2 (ja) * | 2017-01-10 | 2020-07-01 | ファナック株式会社 | 複合加工方法及び複合加工プログラム |
| US10752991B2 (en) | 2017-02-06 | 2020-08-25 | Applied Materials, Inc. | Half-angle nozzle |
-
2018
- 2018-01-22 US US15/877,048 patent/US10752991B2/en not_active Expired - Fee Related
- 2018-01-25 CN CN201810073162.6A patent/CN108400102B/zh active Active
- 2018-01-25 CN CN201820126568.1U patent/CN208208720U/zh not_active Withdrawn - After Issue
- 2018-01-30 TW TW107201440U patent/TWM569933U/zh unknown
- 2018-01-30 TW TW109124932A patent/TWI735293B/zh not_active IP Right Cessation
- 2018-01-30 JP JP2018013532A patent/JP7094113B2/ja active Active
- 2018-01-30 TW TW107103148A patent/TWI702672B/zh not_active IP Right Cessation
- 2018-02-06 KR KR1020180014448A patent/KR102555394B1/ko active Active
-
2020
- 2020-08-24 US US17/001,276 patent/US11220746B2/en not_active Expired - Fee Related
-
2021
- 2021-11-30 US US17/539,080 patent/US11634813B2/en active Active
-
2022
- 2022-06-21 JP JP2022099299A patent/JP7407867B2/ja active Active
-
2023
- 2023-07-10 KR KR1020230089151A patent/KR102714879B1/ko active Active
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